JPH0546272Y2 - - Google Patents

Description

[Detailed description of the invention] [Industrial application field] The present invention relates to a socket for testing hybrid integrated circuits, particularly for COB (chip-on-board) lead frame-mounted hybrid integrated circuits (e.g. dual in-line package type hybrid integrated circuits). The present invention relates to a circuit testing socket suitable for use in checking the electrical characteristics of circuits.

[Prior Art] Among hybrid integrated circuits, a hybrid integrated circuit called a COB lead frame mounting type has a large number of lead mounting pads arranged side by side at equal intervals on the side edge of the circuit forming surface of a substrate made of ceramics or the like. External connection lead pins are connected and fixed to these pads facing downward, and a lead frame is used to increase the number of pins. 3 and 4 are a side view and a perspective view showing this type of hybrid integrated circuit and lead frame, in which 1 is a hybrid integrated circuit board (hereinafter simply referred to as a board), and 2 is a circuit forming surface of the board 1. The printed mutual conductor wiring pattern 3 is a lead attachment pad formed together with the wiring pattern 2. These are formed by printing conductors into a predetermined pattern by screen printing, and then converting this pattern into the required pattern by a baking process. It is formed by baking at high temperatures. The lead attachment pads 3 are arranged in parallel along the side edge of the substrate 1.

4 are various passive and active chip electronic components (e.g., ICs, transistors, etc.) mounted on the board 1;
After the mutual conductor wiring pattern 2 and the lead attachment pad 3 are fired, they are mounted by an automatic mounting device, and the electrode ends are electrically connected to the electrode ends of the mutual conductor wiring pattern 2 by soldering, wire bonding, etc. are connected and then sealed with a cover 5. The cover 5 is fixed onto the substrate 1 with cream solder or the like.

6 is a lead frame, this lead frame 6
is made of phosphor bronze, and a plurality of lead pins 7 connected to the lead attachment pad 3 are integrally formed at regular intervals. Furthermore, a U-shaped elastic clamping part 7A that clamps the side edge of the substrate 1 in the thickness direction is integrally formed at the tip of the lead pin 7 by bending. The lead pin 7 is attached to the lead attachment pad 3 by mounting the chip electronic component 4 and sealing it with the cover 5.
This is done by engaging the elastic holding portion 7A with the side edge of the board 1, pressing it against the lead attachment pad 3, and fixing it by soldering.

The dipping method is adopted as a method for soldering the lead pins 7 and the lead attachment pads 3, in which the side edges of the board 1 are held between the elastic clamping parts 7A, and the elastic clamping parts 7A and the lead attachment pads 3 are brought into contact with each other. immerse it in a molten solder bath and solder it. After the lead pins 7 are attached to the substrate 1, a hybrid integrated circuit is fabricated by cutting and separating each lead pin 7 from the lead frame 6, and then an electrical test of the hybrid integrated circuit is performed using the lead pins 7. be exposed. The electrical test is performed by inserting and connecting the connecting portion of the lead pin 7, that is, the end portion extending below the substrate 1, into the socket of the test jig.

[Problem to be solved by the invention] However, in the conventional hybrid integrated circuit configured in this way, an electrical test was conducted when the hybrid integrated circuit was completed, so if the test failed, the cover 5 had to be removed. It is necessary to troubleshoot, modify, or replace the chip electronic parts 4, so troubleshooting, reworking,
There was a problem that replacing parts was troublesome and time consuming. Another problem was that electrical test jigs used before and after lead frame attachment could not be used in common.

Therefore, the present invention was devised in view of the conventional problems as described above, and its purpose is to enable electrical tests to be performed before installing the cover and lead pins, and to facilitate troubleshooting. It is an object of the present invention to provide a socket for testing a hybrid integrated circuit which allows easy modification, parts replacement, etc., and allows common use of test jigs before and after mounting a lead frame.

[Means for Solving the Problems] In order to achieve the above object, the present invention provides a hybrid integrated circuit board in which a plurality of lead attachment pads are arranged side by side on the side edge of the circuit forming surface. A board to be mounted, a plurality of fixing contacts provided on the base in correspondence with the lead attachment pads, and a board that holds the side edge of the hybrid integrated circuit board together with the base. a holding plate; and a plurality of movable side contacts provided on the board holding part of the board holding plate, each having a pad contact part that contacts the lead mounting pad and a contact contact part that contacts the fixed side contact. It is composed of

[Operation] In the present invention, the side edge of the board is held between the base and the board holding plate in a state where the lead pin is not attached, and the pad contact part of the movable contact is brought into contact with the lead attachment pad, and the contact contact part When the contacts on the fixed side of the base are brought into contact, both of these contacts serve as lead pins.

[Example] Hereinafter, the present invention will be described in detail based on an example shown in the drawings.

FIG. 1 is a sectional view showing an embodiment of a hybrid integrated circuit testing socket according to the present invention in a state in which a substrate is held between the sockets, and FIG. 2 is a plan view showing a state in which the board holding plate of the socket is opened. In these figures, a hybrid integrated circuit testing socket 10 is equipped with a base 11 and a board holding plate 12 that hold the side edge of the board 1 where the lead attachment pads 3 are formed.

On the upper surface of the base 11 at the end on the substrate 1 side, there is a substrate 1.
A substrate receiving groove 13 for receiving and holding the side edge of the substrate 1 is formed with a depth approximately equal to the plate thickness of the substrate 1, and a large number of slit grooves 14 are formed in each lead attachment pad 3 of the substrate 1. They are arranged in parallel at predetermined intervals so as to correspond to each other. Further, a fixed side contact 15 is arranged in each slit groove 14.
The fixed side contact 15 has a plate thickness that is approximately equal to or slightly smaller than the groove width of the slit groove 14, and is formed by plating beryllium copper with nickel, for example, and includes a buried portion 15A buried in the base 11;
A substantially horizontal U protruding from the bottom surface of the slit groove 14
The elastic contact portion 15B bent in a letter shape and the base 11
The test jig socket (not shown) protrudes below the
The connecting portion 15C is inserted into and connected to the connecting portion 15C.

A pair of left and right bearing portions 16A, 16 are provided on the upper surface of the base 11 at the end opposite to the substrate receiving groove 13 side.
B is integrally protruded, and these bearing portions 16
A shaft 17 that pivotally supports the substrate holding plate 12 so as to be freely openable and closable is horizontally suspended between A and 16B.

The board holding plate 12 has a U-shape in plan view and has both arm portions 1.
The tips of 2A and 12B are rotatably supported by the shaft 17. The lower surface of the board holding plate 12,
In other words, a large number of movable side contacts 18 are arranged at predetermined intervals so as to correspond to the fixed side contacts 15 of the base 11 at the board holding part corresponding to the side edge of the board 1 on the lower surface when the board 1 is held. They are arranged side by side.

The movable contact 18 is formed by nickel-plating beryllium copper having approximately the same thickness as the fixed contact 15, and includes a plate-shaped base 18A fixed to the lower surface of the substrate holding plate 12;
A contact contact portion 18B is provided protrudingly on the plate-like base portion 18A and contacts the elastic contact portion 15B of the fixed side contact 15 from above, and a contact contact portion 18B is also provided on the base portion 18A in a substantially horizontal J-shape and has a tip portion for attaching a lead. A pad contact portion 18C that elastically contacts the pad 3 from above, and a connecting portion 1 that is integrally provided on the lower surface side of the base portion 18A and protrudes toward the surface side of the board holding plate 12.
8D, and this connecting portion 18D is adapted to be inserted and connected to the socket of the test jig instead of the connecting portion 15C of the fixed side contact 15, if necessary.

On the other hand, a semi-cylindrical engagement recess 20 having an appropriate length is formed in the center of the surface width direction of the substrate holding plate 12, and correspondingly, the substrate A stopper 21 is provided to lock the holding plate 12 in the substrate clamping position.

The stopper 21 is a rod-shaped body, and its base is rotatably supported in the front-rear direction by a support shaft 22, which is disposed on the base 11 with both ends pivotally supported, and the stopper 21 has a rod-like shape at its intermediate portion. On the side surface of the substrate 1, there is an arm portion 2 having a semi-cylindrical engagement protrusion 23 on the lower surface of the tip thereof that engages with the engagement recess 20 of the substrate holding plate 12 from above.
4 protrudes perpendicularly to the longitudinal direction of the stopper 21.

Note that 25 is a screw mounting hole for fixing the base 11 to the test jig.

In the test socket 10 having such a configuration, when electrically testing a hybrid integrated circuit, the state immediately after the chip electronic component 4 is mounted on the board 1,
That is, the process is carried out in a state where not only the lead frame but also the cover 5 (see FIG. 3) which seals the electronic component 4 is not yet attached.

When installing the board 1, place the socket 10 in the test jig in advance, connect the connecting part 15C of the fixed side contact 15 into the socket of the test jig, and connect the board holding plate 12 as shown by the two-dot chain line in FIG. At the same time, the stopper 21 is tilted toward the substrate holding plate 12 as shown by the two-dot chain line in FIG. In this state, the pad side edge of the board 1 is inserted into the board receiving groove 13 of the base 11. Then, when the board holding plate 12 is rotated approximately 180 degrees counterclockwise from the open state shown by the two-dot chain line in FIG. The contact portion 15B is contacted from above and elastically deformed upward, and the reaction force brings the contact portions 15B and 18B into contact with each other under a predetermined pressure. Furthermore, when the board holding plate 12 is closed, the pad contact portion 18C of the movable contact 18 is pressed against the lead attachment pad 3 of the board 1 from above and is elastically deformed.
A predetermined contact pressure with the pad 3 is obtained by the reaction force. Then, in this state, the stopper 21 is raised substantially vertically so that the engagement protrusion 23 is moved into the engagement recess 20 of the substrate holding plate 12.
When engaged from above, the substrate holding plate 12 is prevented from rotating in the opening direction and is locked at the substrate clamping position.
The side edge of the board 1 is held between the board receiving groove 13 and the movable contact 18, and the fixed contact 15 and the movable contact 18 function as lead pins used in conventional electrical tests, and the hybrid integrated circuit is It is subjected to electrical tests.

Thus, if the test socket 10 having such a configuration is used, the electrical test is performed before the process of attaching the lead frame, so the test can be performed even before the process of sealing the chip electronic component 4 with the cover. , troubleshooting, rework, and replacement of chip electronic components 4 in case of failure are easy. In addition, the test socket 10 has a simple structure,
Mounting of the board 1 is also simple and easy. Furthermore, the electrical test jig used after the lead frame is attached can be used as is.

It should be noted that the present invention is not limited to the structure of the above-mentioned embodiments, and various modifications and changes are possible. For example, a stopper 21 that locks the board holding plate 12 at the clamping position may be provided in a slidable manner. good.

[Effects of the invention] As explained above, the socket for testing hybrid integrated circuits according to the invention consists of a base that holds the side edge of the hybrid integrated circuit board where the lead attachment pads are provided, and a board holding plate. A fixed side contact is provided on the base, a movable side contact is provided on the board holding plate and has a pad contact portion that contacts the lead attachment pad and a contact contact portion that contacts the fixed side contact, and both of these contacts are attached to the lead pin. By using this instead, electrical tests can be performed before attaching the lead frame, and the electrical test jig after attaching the lead frame can be used in common. Troubleshooting is easy if you go to
The time required for rework, parts replacement, etc. can be reduced.

[Brief explanation of the drawing]

FIG. 1 is a cross-sectional view showing an embodiment of the hybrid integrated circuit testing socket according to the present invention in a test state, FIG. 2 is a plan view showing the socket with the board holding plate opened, and FIGS. FIG. 4 is a side view and a perspective view showing a hybrid integrated circuit and a lead frame. DESCRIPTION OF SYMBOLS 1... Hybrid integrated circuit board, 3... Lead attachment pad, 4... Chip electronic component, 5... Cover, 6... Lead frame, 7... Lead pin,
10... Test socket, 11... Base, 12...
... Board holding plate, 13... Board receiving groove, 15... Fixed side contact, 15B... Elastic contact part, 15C
... Connection part, 17 ... Shaft, 18 ... Movable side contact, 18B ... Contact contact part, 18C ...
Pad contact portion, 18D... Connection portion, 20... Engagement recess, 21... Stopper, 22... Support shaft, 23
...Engaging protrusion.

Claims (1)

[Scope of utility model registration request] A base on which a side edge of a hybrid integrated circuit board is placed, on which a plurality of lead attachment pads are arranged in parallel on the side edge of a circuit forming surface, and a base corresponding to the lead attachment pads. a plurality of fixed-side contacts provided on the base; a board holding plate that holds the side edge of the hybrid integrated circuit board together with the base; a pad contact portion that contacts the lead attachment pad; and the fixing pad. 1. A socket for testing a hybrid integrated circuit, comprising: a plurality of movable side contacts having contact contact portions that come into contact with the side contacts and provided on the substrate holding portion of the substrate holding plate.