JP2003045592A - Ic socket - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an IC socket capable of stably engaging a contact piece of a terminal with a lead terminal of an IC package. SOLUTION: This IC socket is provided with a socket body 2, having a seating surface 6 capable of placing the IC package, a plurality terminals 3 installed in the socket body 2 so as to face each other, that is, a plurality of terminals 3 having respectively the contact piece engageable with the lead terminal of the IC package, and a cover 4 for displacing the contact piece of the terminal 3 between a withdrawal position for going away from the seating surface 6 and a position for engaging with the lead terminal by approaching the seating surface 6. The contact piece of the terminal 3 is composed of a first contactor 16, having an engaging surface 16d opposed to the end part upper surface of the lead terminal and a second contactor 17, having an engaging inclined face 17d which faces the tip lower edge of the lead terminal.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC socket, and more particularly, to an IC provided with a plurality of terminals individually engageable with a large number of lead terminals protruding outward from the side edge of the IC package. Regarding sockets.

[0002]

2. Description of the Related Art Conventionally, an IC socket having a large number of terminals engageable with lead terminals of an IC package has been used in various tests such as a burn-in test of the IC package. This IC socket is disclosed in JP-A-9-2660.
No. 24, JP-A-10-50441, JP-A-11-54.
Various configurations are known, as disclosed in Japanese Patent No. 233, etc. They are generally a socket body having a seating surface on which an IC package can be placed, and a plurality of terminals attached to the socket body so as to face each other, and can be engaged with lead terminals of the IC package. A plurality of terminals each having a contact piece, a contact piece of the terminal, a retracted position away from the seating surface,
And a manipulating member for displacing between a position close to the seating surface and engaging with the lead terminal.

FIG. 9 shows an example of a conventional IC socket. In the figure, 101 is an IC package, and 102 is a socket body. Socket body 10
2 to form the seating surface 103 of the IC package 101
A C accommodation unit 104 is provided. A plurality of terminals 105 are attached to the socket body 102 so as to face each other. IC housed in the IC housing unit 104
Lead terminals 106 extending from both side edges of the package 101
A contact piece 107 is provided so that it can be engaged with. The contact piece 107 of the terminal 105 can be displaced between a position in which the contact piece 107 is close to the seating surface 103 and engages with the lead terminal 106, and a retracted position that is away from the seating surface 103, as illustrated. There is. Due to such displacement of the contact piece 107, a cover 108 as an operating member is provided on the socket body 102 so as to be movable in the vertical direction in the drawing.

[0004]

SUMMARY OF THE INVENTION Such a conventional IC
In the socket, the IC housing portion forming the seating surface is I
In consideration of the dimensional error in manufacturing the C package, the IC package with the maximum allowable error can be accommodated. Therefore, when a standard size or minimum size IC package is accommodated, a gap is formed in the side portion of the IC accommodating portion by the difference from the maximum allowable error.
Due to such a gap, there is a problem in engagement between the lead terminal of the IC package and the contact piece of the terminal.

FIG. 10 shows a state where the IC package is accommodated in the IC accommodating portion while being offset to the left side. As shown in (a) of the figure, the left lead terminal 106
However, there is a problem in that the contact piece 107 of the terminal is engaged with the bent portion, which causes deformation and destruction of the lead terminal, impossibility of wiping at the time of engagement, unstable contact resistance, and the like. Further, as shown in (b) of the figure, the contact piece 107 is engaged with the tip of the lead terminal 106 on the right side, so that there is a problem that the lead terminal is deformed or non-contacted. .

The IC package 101 shown in FIG. 9 shows a case where the left lead terminal 106 and the contact piece 107 are not in contact with each other, and in some cases, one side of the IC package 101 is lifted up.

In this way, the present invention has the IC housing portion and the I
This is made in view of the problem that occurs at the engaging portion between the lead terminal and the contact piece of the terminal due to the unavoidable gap between the C packages, and the contact piece of the terminal can be stably engaged with the lead terminal of the IC package. The purpose is to provide an IC socket.

[0008]

In the IC socket of the present invention made based on the above object, when the contact piece of the terminal is displaced from the retracted position on the outside to the engaged position on the inside, the contact piece is contacted by the contact piece. The shifted IC package can be moved to the center position of the IC housing.

That is, the present invention relates to a socket main body having a seating surface on which an IC package can be placed, and a plurality of terminals mounted on the socket main body so as to face each other, which are related to the lead terminals of the IC package. For displacing a plurality of terminals each having a mating contact piece, and a contact piece of the terminal between a retracted position away from the seating surface and a position for engaging a lead terminal in the vicinity of the seating surface. And an operating member of the above, the contact piece of the terminal has a first contact having an engagement surface facing the upper surface of the end of the lead terminal, and the contact facing the lower edge of the tip of the lead terminal. It is an IC socket characterized by comprising a second contactor having an inclined surface.

[0010]

According to the IC socket of the present invention, since the IC package is moved to the center position of the IC housing through the contact piece of the terminal, the contact piece and the lead terminal are correctly opposed to each other and engaged with each other. be able to. Therefore, the lead terminals are not deformed or destroyed,
Further, it is possible to prevent non-contact.

[0011]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the accompanying drawings.

FIG. 1 shows an IC socket 1 of the embodiment. In the figure, 2 is a socket body, 3 is a terminal, and 4 is a cover which is a member for operating the terminal 3. The socket main body 2 has an IC housing 5 formed on the top thereof, and the bottom surface thereof serves as a seating surface 6. The lower part of the inner wall of the IC housing portion 5 facing in the left-right direction in the drawing is the IC package 7
(See FIG. 3) as the positioning guide 8, and the facing interval is the maximum allowable size in manufacturing the IC package 7. A jig guide 10 having a tapered surface 9 that widens upward is provided above the positioning guide 8.

The terminals 3 are attached to the socket body 2 in parallel with the pitch of the lead terminals 11 of the IC package 7 in the direction in which the positioning guide 8 extends. The left side of the figure is also hidden by the cover 4, but the multiple terminals 3
Are in parallel. By inserting the mounting piece 12 provided on the terminal 3 into the mounting groove 13 provided on the side surface of the socket body 2 and engaging them, a fixed position is maintained.

A tail 14 is also provided below the mounting piece 12, and the tail 14 extends downward from the lower surface of the socket body 2. That is, the printed circuit board (not shown) can be inserted into a through hole and soldered.

The upper part of the mounting piece 12 of the terminal 3 passes over the positioning guide 8 via the S-shaped curved portion 15 and the IC.
The first contactor 1 extending in the lateral direction so as to project into the accommodating portion 5.
A contact piece composed of 6 and the second contactor 17 and an operation piece 18 extending upward are connected in series. The contact pieces of the terminals 3 attached to the left and right sides of the socket body 2 in a row face each other in the IC housing portion 5.

The cover 4 is attached to the socket body 2 so as to be movable in the vertical direction in the figure. The guide post 19 and the guide post 20 on the socket body 2 side are fitted in the guide post 21 and the guide groove 22 on the cover 4 side to guide the vertical movement. A resilient spring 23 is mounted between the socket body 2 and the cover 4, and the resilient spring 23 always biases the cover 4 upward.

The cover 4 is formed with a tapered surface 24 facing the tip of an operation piece 18 extending from the terminals 3 mounted in parallel on the left and right. The cover 4 springs 23
When pushed down against the elasticity of the taper surface 24
8, the bending portion 15 is elastically deformed in order to displace the contact piece composed of the first contactor 16 and the second contactor 17 toward the outer retracted position.

The contact piece composed of the first contact piece 16 and the second contact piece 17 is a base piece 16a extending substantially horizontally,
7a, and the tips of the base pieces 16a and 17a are
It is formed as shown enlarged in FIG. The first contact piece 16 has an inverted L-shaped rising piece 16b from the base piece 16a.
And a hanging piece 16c extending obliquely downward from the rising piece 16b are continuously provided, and the tip end of the hanging piece 16c is opposed to the lead terminal 11 of the IC package 7 with the engaging surface 16d. Are formed.

The second contact 17 has a base piece 17a, a rising piece 17b, and an extending piece 17c, which extends obliquely upward from the rising piece 17b so as to be substantially parallel to the hanging piece 16c. The inclined surface of the extension piece 17c forms an engaging inclined surface 17d facing the lower end of the tip with respect to the lead terminal 11 of the IC package 7.

As shown in FIG. 2, the first contact 16
The hanging piece 16c and the extension piece 17c of the second contactor 17,
The IC housing portion 5 formed in the socket body 2 projects beyond the positioning guide 8.

The manner in which the IC package 7 is connected to the IC socket 1 configured as described above will be described below with reference to FIG.

First, as shown in FIG. 3, the cover 4 is pressed to displace the contact piece of the terminal 3 to the outer retracted position (see also FIGS. 4 and 5). In this state, the IC package 7 is loaded into the IC housing portion 5 of the socket body 2 manually or by an automatic machine as shown by an arrow 25.

In the IC package 7, the tip ends of the lead terminals 11 extending from the both side edges are guided by the guiding guides 10, and then, while being guided by the positioning guides 8, they fall and are seated on the seating surface 6.

In FIG. 5, the lead terminal 1 shown by the solid line
1 shows a state in which it is biased to the side of one of the positioning guides 8 shown in the drawing (therefore, there is a gap between the opposing positioning guide 8 and the tip of the lead terminal 11). , The lead terminal 11 indicated by the dotted line is I
The C package 7 is aligned with the center position of the IC housing portion 5 and is in a desired position.

After inserting the IC package 7, the cover 4
When the pressing force of is released, the cover 4 is raised by the elastic force of the elastic spring 23, and the contact piece retracted to the outer side is returned to the inner engagement position by the elastic force of the bending portion 15 to complete the connection. be able to. FIG. 7 shows a state in which this connection is completed.

At the time of the return movement of the contact piece toward the engagement position, the slanting hanging piece 16c of the first contact 16 is provided.
And the diagonal extension piece 17c of the second contactor 17 is shown in FIGS.
Move in the direction of arrow 26 shown in. That is, first, the engaging slope 17d formed by the slope of the extension piece 17c of the second contact 17 comes into contact with the lower edge of the tip of the lead terminal 11 on the side of the IC package 7 that is offset. The lead terminal 11 on the opposite side and the second
Since there is a gap between the engagement slopes 17d of the contactor 17, the second contactor 17 on the contacting side pushes the IC package 7 to the opposite side and engages with the lead terminal 11 on the opposite side. The IC package 7 is moved until the mating inclined surface 17d contacts, and the IC package 7 is automatically aligned with the center position of the seating surface 6. Figure 6
Indicates the state of being aligned to this center position.

Further, the return movement of the contact piece continues, and the engagement slope 17d continues to move while maintaining contact with the lower edge of the tip of the lead terminal 11, where wiping of the contact portion is performed.

At a certain point of this return movement, the first
Engagement surface 16 formed at the tip of hanging piece 16c of contact 16
d contacts the upper surface of the end of the lead terminal 11. Then, the contact portion is moved inward along the upper surface of the end portion of the lead terminal 11, so that the contact portion is also wiped.

The engaging sloped surface 17d of the second contactor 17 exerts a force to push the lead terminal 11 upward, while the engaging surface 16d of the first contactor 16 exerts a force to press down the lead terminal 11. Therefore, in the connection completed state of FIG.
Since the lead terminal 11 and the first and second contactors 16 and 17 contact with each other on the cleaned and wiped surface and are sandwiched by the first and second contactors 16 and 17 with an appropriate pressure, the lead terminal 11 and An electrically stable connection state can be reliably formed between the contact pieces.

In the embodiment described above, the terminals 3 facing each other in one direction are provided, and the IC package (SOP: Small Ou) having the lead terminals on the two side edges facing each other.
tline Package, TSOP: Thin Small Outline Package
It is an IC socket that can be used for In addition to the two opposite side edges, it can be used for an IC package (QFP: Quad Flatpack Package,) that has lead terminals on the other two opposite side edges, so that the terminals 3 facing each other are provided in two directions. It goes without saying that you can do it.

[0031]

As described above, in the IC socket of the present invention, the contact piece of the terminal has the first contactor having the engaging surface facing the upper surface of the end of the lead terminal, and the lower edge of the tip of the lead terminal. Since the second contactor has an engaging slant surface facing each other, when the contact piece comes into contact with the lead terminal, the IC package can be automatically aligned to the center position and can be brought into contact while wiping. An IC socket capable of reliably forming a stable connection state is provided.

[Brief description of drawings]

FIG. 1 is a front view showing a cross section of a part of an IC socket according to an embodiment of the present invention.

FIG. 2 is an enlarged front view showing a contact piece portion of the terminal in FIG.

FIG. 3 is a front view showing a part in section when the IC package cover is pushed down to insert the IC package.

FIG. 4 is an enlarged front view of a contact piece portion of the terminal in FIG.

FIG. 5 is a similar enlarged view showing a further enlarged front view.

FIG. 6 is an enlarged front view of the contact piece portion of the terminal during the return of the depressed cover.

FIG. 7 is a front view, partly in section, showing a state in which an IC package is connected to the IC socket of the embodiment.

8 is an enlarged front view of a contact piece portion of the terminal in FIG.

FIG. 9 is a sectional view of a conventional IC socket.

10A and 10B are explanatory views when an IC package is inserted into a conventional IC socket with an offset, in which FIG. 10A is an enlarged view of a left lead terminal and an engaging portion of a contact piece of the terminal, and FIG. It is an enlarged view of an engaging portion of a lead terminal and a contact piece of the terminal.

[Explanation of symbols]

1 IC socket 2 socket body 3 terminals 4 cover 6 Seating surface 7 IC package 11 Lead terminal 16 First contact 16d engagement surface 17 Second contact 17d engagement slope

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Manabu Doi             1-5-4 Fukami Higashi, Yamato City, Kanagawa Prefecture             Inside Molex Co., Ltd. F-term (reference) 2G003 AA07 AG01 AG12                 2G011 AA04 AA14 AB01 AB06 AB07                       AC14 AE03 AF02                 5E024 CA07 CB02

Claims (3)

[Claims] 1. A socket body 2 having a seating surface 6 on which an IC package 7 can be placed, and a plurality of terminals 3 attached to the socket body 2 so as to face each other, and leads of the IC package 7. A plurality of terminals 3 each having a contact piece capable of engaging with the terminal 11, a retracted position where the contact pieces of the terminal 3 move away from the seating surface 6, and a contact with the lead terminal 11 in the vicinity of the seating surface 6. In the IC socket 1 including an operating member 4 for displacing between the mating positions, the contact piece of the terminal 3 has a first contact having an engaging surface 16d facing the upper surface of the end of the lead terminal 11. Child 16
An IC socket comprising: a second contactor 17 having an engaging sloped surface 17d facing the lower edge of the tip of the lead terminal 11. 2. The engaging sloped surface 17d of the second contactor 17 is
The IC socket according to claim 1, wherein the IC socket is formed by an inclined surface that rises in a retracting direction of the contact piece. 3. The IC socket according to claim 1, wherein the plurality of terminals 3 mounted so as to face each other face each other in one direction or two directions.