JPH10106705A - Socket for electric part - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a socket for an electric part by enhancing conductivity and preventing adhesion of dusts to the lower face of a lead. SOLUTION: In an IC socket 11, a mounting portion 12a, on which an IC package 1 is mounted, is formed on a socket body 12, and a plurality of contact pins 13 which are brought into contact with or separation from a lead 2 projecting sideways of a circumferential edge 1a of the IC package 1 mounted. The contact pins 13 can be elastically deformed by free motion of an operating member 14, to be thus brought into contact with or separation from the lead 2. The contact pin 13 is provided with an upper contact piece 13e to be brought into contact with the upper face 2b of the lead 2 and a lower contact piece 13d to be brought into contact with the lower face 2a of the lead 2 in such a manner as to hold the lead 2 therebetween. During the free motion of the operating member 14, the upper and lower contact pieces 13e, 13d are deviated integrally. When the pieces 13e, 13d hold the lead 2 therebetween, the upper and lower contact pieces 13e, 13d slide on the upper and lower faces 2b, 2a of the lead 2, respectively.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a socket for an electrical component having a contact pin electrically connected to a lead of the electrical component in an elastically pressed state.

[0002]

2. Description of the Related Art FIG. 7 shows an example of this type (see Japanese Patent Publication No. Hei 6-32241). In the drawing, reference numeral 1 denotes a so-called gull-wing type IC package as an “electric component”, and the IC package 1 is formed with a lead 2 projecting laterally from a peripheral portion. In the figure, reference numeral 3 denotes an IC socket 3 as an “electric component socket”,
The IC socket 3 is put into a heating furnace for inspection (for example, a heat resistance test called a burn-in test) of the IC package 1 to determine whether the IC package 1 is good or defective. I have to.

In order to hold the IC package 1 in the IC socket 3, first, from the state shown in FIG. Then, as shown in FIG. 7B, the contact pin 6 is elastically deformed to retract the contact portion 6a. In this state, the IC package 1 is mounted on the mounting portion 7a of the socket body 7 from above. afterwards,
When the pressing force of the press cover 4 is released, as shown in FIG. 7C, the cover 4 is raised, and the contact portion 6a of the contact pin 6 comes into contact with the upper surface of the lead 2 of the IC package 1, whereby It will be conducted.

[0004]

However, in such a conventional device, since the contact pins 6 come into contact only with the upper surfaces of the leads 2 of the IC package 1, the conductivity is further improved. Hard to say. Also,
As shown in FIG. 7C, the lower surface of the lead 2 of the IC package 1 comes into contact with the socket main body mounting portion 7a, and dust on the mounting portion 7a adheres to the lower surface of the lead 2. When the IC package 1 is surface-mounted, the lower surface of the lead 2 serves as a contact surface with a printed circuit board, which may adversely affect the conductivity in the mounted state.

SUMMARY OF THE INVENTION It is an object of the present invention to provide an electrical component socket which improves conductivity and prevents dust from adhering to the lower surface of a lead.

[0006]

In order to achieve the above object, according to the first aspect of the present invention, a mounting portion for mounting an electric component on a socket body is formed and the mounting portion is provided. A plurality of contact pins are provided to be in contact with a lead protruding laterally from a peripheral portion of the electric component, and furthermore, by moving an operation member, the contact pin is elastically deformed so as to be separated from and connected to the lead. In the component socket, the contact pin has an upper contact piece that is in contact with the upper surface of the lead and a lower contact piece that is in contact with the lower surface of the lead, and is formed into a shape that holds the lead. When the operating member is movable, the upper and lower contact pieces are integrally displaced, and when holding the lead, the upper and lower surfaces of the lead are moved to the upper and lower portions.
It is characterized in that it is an electrical component socket set so that the lower contact piece slides.

According to a second aspect of the present invention, in addition to the configuration of the first aspect, a tip end of the upper contact piece on the lead side is formed as follows.
It is characterized in that the lower contact piece is protruded from the tip end portion so as to approach the peripheral edge side of the electric component.

[0008] The invention according to claim 3 is the invention according to claim 1 or 2.
In addition to the above configuration, the upper contact piece and the lower contact piece are formed so as to expand when separated from the lead, and to narrow when holding the lead.

The invention described in claim 4 is the first to third aspects of the present invention.
In addition to the configuration according to any one of the above, a plurality of the contact pins are provided in parallel, a connecting rod is hung over each of the contact pins, and by moving the operating member, the contact pins are connected to each other via the connecting rod. It is characterized in that both contact pieces are set to be displaced.

[0010]

Embodiments of the present invention will be described below.

[First Embodiment of the Invention] FIGS. 1 to 4 show a first embodiment of the present invention.

First, the structure will be described.
The IC socket 11 is an “electric component socket”. The IC socket 11 can hold the IC package 1 as an “electric component” in order to perform a performance test on the IC package 1.

This IC package 1 is of a so-called gull wing type, and has leads 2 protruding laterally from a peripheral portion 1a. As shown in FIG. 4, the lead 2 is inclined at an angle θ such that the tip is lowered.

The IC socket 11 has a socket body 12, on which a mounting portion 12a for mounting the IC package 1 is formed. When mounted on the mounting portion 12a, the peripheral wall 12b of the mounting portion 12a abuts on the peripheral edge 1a of the IC package 1 and is positioned, while the lead 2 projects laterally from the peripheral wall 12b. It has become.

The socket body 12 has an IC
A large number of contact pins 13 which are separated from and connected to the leads 2 of the package 1 are provided in parallel, and by moving the operation member 14, the contact pins 13 are elastically deformed and separated from and connected to the leads 2. .

More specifically, the contact pin 13 is inserted into the through hole 12c of the socket body 12, and
Is attached by being locked to the inner peripheral surface of the through hole 12c. The contact pin 13 has a terminal portion 13b projecting downward from the socket body 12 at a lower portion, and a curved portion 13c, a lower contact piece 13d, an upper contact piece 13e, and a pressed portion 13f are sequentially formed upward. Have been.

The curved portion 13c has a substantially C-shape.
It is elastically deformed. The contact pieces 13d and 13e are elastically deformable, so that the lower contact piece 13d is in contact with the lower surface 2a of the lead 2 and the upper contact piece 13e is in contact with the upper surface 2b of the lead 2. The contact pieces 13d and 13e are formed in such a shape as to hold the lead 2 by moving together. The tip 13h of the upper contact piece 13e is separated from the tip 13g of the lower contact piece 13d by the IC package 1.
Is protruded so as to approach the side of the peripheral edge 1a. The pressed portion 13f is protruded upward, and is slid by being pressed into contact with the cam portion 14a of the operation member 14.

On the other hand, the operating member 14 has a post portion 14b.
When the post portion 14b is inserted into the guide hole 12d of the socket body 12, the operating member 14 is guided to be vertically movable and urged upward by a spring 15. At the center of the operation member 14,
An opening 14c having a size into which the IC package 1 is inserted is formed. By lowering the operation member 14, the pressed portion 13f of the contact pin 13 is pressed via the cam portion 14a, and the curved portion 13c is elastically deformed.
When the contact pieces 13d and 13e are displaced outward with some upward rotation, and when the pressing force of the operating member 14 is released, the operating member 14 is raised by the spring 15, and the contact pieces 13d and 13e are moved. 13e returns, and both contact pieces 1
3e and 13d are set so as to slide and hold the upper surface 2b and the lower surface 2a of the lead 2 in order.

Next, a method of using the IC socket 11 having such a configuration will be described.

First, the terminal portions 13b of the contact pins 13 of the IC socket 11 are inserted into insertion holes of a printed wiring board (not shown) and soldered, so that a plurality of IC sockets 11 are arranged on the printed wiring board. Set it up.

Then, the IC package 1 is set in the IC socket 11 by, for example, an automatic machine and electrically connected.

That is, the operating member 14 is pressed downward against the urging force of the spring 15 and lowered while holding the IC package 1 by an automatic machine. Then, as shown in FIG. 2, the pressed portion 13f of the contact pin 13 is pressed by the cam portion 14a of the operation member 14, and the curved portion 13c is elastically deformed.
e is displaced outwardly with some rotation, and both contact pieces 13d and 13e are retracted from the IC package 1 insertion range. In this state, the held IC package 1 is released from the automatic machine and mounted on the mounting portion 12a of the socket body 12, and the side edge portion 1a of the IC package 1 is opened.
Is locked with the peripheral wall 12b of the socket body mounting portion 12a.

Thereafter, when the pressing force of the operating member 14 by the automatic machine is released, the operating member 14 is raised by the urging force of the spring 15, and the curved portion 13c of the contact pin 13 is returned by the elastic force. 13d, 13e
Returns to the original position, and the lead 2 of the IC package 1 is held.

Thus, a large number of contact pins 1
The lead 2 of the IC package 1 is sandwiched between the two contact pieces 13d and 13e of the third 3, so that the lead 2 and the contact pin 13 are conducted. In this state, the test of the IC package 1 is performed.

When the lead 2 is clamped, the tip 13h of the upper contact piece 13e projects from the tip 13g of the lower contact piece 13d.
The tip 13h of e contacts the upper surface 2b of the lead 2 of the IC package 1. After that, the lower contact piece 13 d contacts the lower surface 2 a of the lead 2. Thus, the upper contact piece 13
e contacts the upper surface 2b of the lead 2 of the IC package 1 first, so that when the lead 2 is held by the contact pieces 13d and 13e, a force acts on the lead 2 of the IC package 1 from the contact pin 13 side. However, the IC package 1 does not rise.

At the time of holding, both contact pieces 1
Since 3d and 13e slide on the upper and lower surfaces 2b and 2a of the lead 2, a so-called wiping effect is exhibited. Especially,
Conventionally, dust adheres to the lower surface 2a of the lead 2. In the present invention, the lead lower surface 2a does not contact the socket body mounting portion 12a, and the lower surface 2a of the lead 2 is Since the lower contact piece 13d of the slide 13 slides, adhesion of dust to the lower surface 2a is prevented. Therefore, when the IC package 1 after the test is surface-mounted, there is no adverse effect such as poor conduction.

It is necessary to adjust the movable direction of the contact pieces 13d and 13e so that the lead 2 can be held by the contact pieces 13d and 13e in accordance with the inclination angle θ of the lead 2. .

[Second Embodiment of the Invention] FIG. 5 shows a second embodiment of the invention.

In the second embodiment, the contact pins 13
When the operating member 14 is lowered and the pressed portion 13f is pressed by the cam portion 14a by forming the connecting portion 13i between the two contact pieces 13d and 13e thin, the two contact pieces 13d and 13e are pressed. It is designed to be movable while the space between them is slightly widened.

If the space between the contact pieces 13d and 13e is widened, the lead 2 can be more easily inserted when the lead 2 is inserted from both sides.

Of course, even in this case, both the contact pieces 13d, 1
The contact pieces 13d and 13e slide on the upper and lower surfaces 2b and 2a of the lead 2 and wipe the lead 2 between the time when the lead 2 is added and completely clamped by 3e.

Other configurations and operations are the same as those of the first embodiment.

[Third Embodiment of the Invention] FIG. 6 shows a third embodiment of the invention.

In the third embodiment, the contact pins 23
Are different from those of the above embodiments.

That is, the contact pins 23
A linear deformed portion 23a is formed, a lower contact piece 23b is connected to the upper side of the deformed portion 23a, and an upper contact piece is formed above the lower connective piece 23b via a C-shaped connecting portion 23c. 23d are formed.

The connecting rod 24 is inserted inside the connecting portion 23c of the plurality of contact pins 23 provided so as to be bridged.

When the operating member 14 is lowered, the cam portion 14
When the connecting rod 24 is pushed by a, the deformed portion 23a is elastically deformed via the rod 24, and the contact pieces 23b and 23d are displaced outward.

Since the contact pins 23 are displaced by pushing the connecting rods 24 straddling the plurality of contact pins 23 as described above, as in each of the above embodiments,
Unlike the case where each contact pin 23 is directly pressed, the number of cam portions 14a of the operation member 14 can be reduced, and both contact pieces 23b and 23d of each contact pin 23 can be used.
Can be suppressed from varying.

In each of the above embodiments, the operating member 1
4 is moved up and down, so that the contact pins 13 and 2 are moved.
3 is displaced, but the present invention is not limited to this. For example, a rotating lever 5 and a pressing cover 4 as shown in the conventional example of FIG. 7 can be used, or only the rotating lever 5 is used. Thus, the contact pins 13 and 23 can be displaced. Further, the present invention is applied to the IC socket 11. However, the present invention is not limited to this, but may be applied to other devices as long as the electrical connection with a lead protruding to the side of the electric component is achieved. Of course.

[0040]

As described above, according to the first aspect of the present invention, the upper and lower contact pieces of the contact pins come into contact with the upper and lower surface portions of the leads of the electric component, so that the conductivity is improved. At the same time, since both contact pieces slide while holding the upper and lower surfaces of the lead, a wiping effect can be obtained. Moreover, by wiping the lower surface of the lead, adhesion of dust can be suppressed, and there is no adverse effect even when an electric component is surface-mounted.

According to the invention of claim 2, according to claim 1,
In addition to the above effect, the tip of the upper contact piece on the lead side is
By protruding from the tip of the lower contact piece so as to approach the peripheral edge of the electric component, at the time of holding the lead, first, the tip of the upper contact piece contacts the upper surface of the lead of the electric component, and then Since the lower contact piece comes into contact with the lower surface of the lead, even when a force acts on the lead of the electrical component from the contact pin side when the lead is gripped by the two contact pieces, the electrical component may rise. Absent.

According to the invention described in claim 3, according to claim 1
In addition to the effect of 2, the upper contact piece and the lower contact piece are formed so as to expand when separated from the lead and to be narrowed when holding the lead, thereby holding the lead from both sides. In that case, it is more effective.

According to the invention described in claim 4, according to claim 1
In addition to the effects of any one of (1) to (3), a plurality of the contact pins are provided in parallel, a connecting rod is hung over each of the contact pins, and by moving the operation member, both of the contact pins are connected via the connecting rod. Since the contact piece is set to be displaced, unlike the case where each contact pin is directly pressed, the number of cams of the operating member can be reduced, and the displacement amount of both contact pieces of each contact pin varies. Can be suppressed.

[Brief description of the drawings]

FIG. 1 is a sectional view showing a state before a lowering of an operation member of an IC socket according to Embodiment 1 of the present invention.

FIG. 2 is a cross-sectional view showing a state where an operation member of the IC socket according to the first embodiment is lowered.

FIG. 3 is a cross-sectional view corresponding to FIG. 1, showing a state in which a lead of an IC package is held by a contact pin of the IC socket according to the first embodiment;

FIG. 4 is an enlarged view showing leads of the IC package according to the first embodiment;

FIG. 5 is a view showing contact pins and the like according to a second embodiment of the present invention.

FIG. 6 is a diagram showing contact pins and the like according to a third embodiment of the present invention.

7A and 7B are cross-sectional views of an IC socket showing a conventional example, and FIG.
Shows a state in which the holding cover is raised, (b) shows a state in which the contact pin is elastically deformed, and (c) shows a state in which the IC socket is held.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 IC package (electric part) 1a Peripheral part 2 Lead 11 IC socket (electric part socket) 12 Socket body 12a Placement part 13,23 Contact pin 13d, 23b Lower contact piece 13e, 23d Upper contact piece 13g.13h Tip 24 Connecting rod

Claims (4)

[Claims] 1. A mounting portion on which an electric component is mounted is formed on a socket body, and a plurality of contact pins which are separated from and contact with a lead protruding laterally from a peripheral portion of the mounted electric component are provided. Further, in an electrical component socket in which an operating member is moved to elastically deform the contact pin so as to be separated from and brought into contact with the lead, the contact pin has an upper portion which is in contact with an upper surface portion of the lead. A contact piece and a lower contact piece that is in contact with the lower surface of the lead are formed to hold the lead, and the upper and lower contact pieces are integrally displaced when the operating member is moved. An electric component socket characterized in that the upper and lower contact pieces are slid on upper and lower surfaces of the lead when the lead is held. 2. A lead-side tip of the upper contact piece,
The electrical component socket according to claim 1, wherein the lower contact piece protrudes from a tip portion of the lower contact piece so as to approach a peripheral edge side of the electrical component. 3. The device according to claim 1, wherein the upper contact piece and the lower contact piece are formed so as to expand when separated from the lead and to narrow when holding the lead. Socket for electrical components. 4. A plurality of contact pins are provided in parallel, a connecting rod is hung over each of the contact pins, and by moving the operation member, both contact pieces of each of the contact pins are displaced via the connecting rod. The electrical component socket according to any one of claims 1 to 3, wherein the electrical component socket is set to be operated.