JP2848281B2 - Testing equipment for semiconductor devices - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a test device for a semiconductor device, and more particularly to a test device for screening a semiconductor device.

[0002]

2. Description of the Related Art Conventionally, as a method for improving the reliability of a semiconductor device, there has been adopted a method in which a manufactured semiconductor device is subjected to a long-term burn-in test (BT) at a high temperature to remove an initial failure. For this reason, various BT test apparatuses have been proposed. Further, a device for measuring the electrical characteristics of each semiconductor device after BT and removing the defective semiconductor device is also required.

A conventional test apparatus of this type is disclosed in
There is one described in JP-A-161167. This is shown in FIG.
And the BT is mounted on the socket 22 and the semiconductor device 2
3 is installed. Further, a BT board 24 on which components for performing BT are mounted is prepared, and the holding board 21 is
A connector 26 provided on a BT substrate 24 with connection pins 25 that are superimposed on a T substrate 24 and protrude from the back surface of the holding substrate 21
To perform electrical connection, and execute BT in that state. When measuring the electrical characteristics after the BT, FIG.
As shown in (b), the BT substrate 24 is removed and the BT substrate 2 is removed.
4. A connector 28 in which the holding substrate 21 is superimposed on the measurement substrate 27 configured in the same manner as in FIG.
To make electrical connection, and measure the electrical characteristics of the semiconductor device 23.

A similar test apparatus is disclosed in Japanese Patent Application Laid-Open No. 2-190774.
In this case, when the measurement board is electrically connected to a plurality of sockets provided on the holding board, a method of making an electrical connection for each socket and measuring the electrical characteristics is also described. Proposed. This publication also proposes a configuration in which a connector provided on a holding substrate separately from a socket is used to electrically connect to a measurement substrate.

[0005]

SUMMARY OF THE INVENTION Such a conventional BT
In the test apparatus, the holding substrate and the BT substrate or the measurement substrate are electrically connected to each other by fitting with connection pins or connectors. Therefore, when the holding substrate is integrated with the BT substrate or the measurement substrate, or when the two are separated,
Work for removing and inserting the connection pins and connectors is required. In this case, it is often necessary to simultaneously insert and remove a plurality of connection pins and connectors, which makes the work difficult and requires skill in the BT test. In addition, if any one of a large number of connection pins and connector pins is displaced or the like, the connection pins or connector pins may bend, resulting in breakage or poor conduction. An object of the present invention is to provide a test apparatus which does not require the work of inserting and removing connection pins and connector pins and enables electrical connection to a measurement board, a BT board, or the like.

[0006]

According to the present invention, there is provided a test apparatus comprising: a test board on which a socket for mounting a semiconductor device for performing a burn-in test is mounted; a burn-in circuit provided on the test board; Disconnecting means for connecting the burn-in circuit and disconnecting both during the electrical characteristic test.

In the present invention, for example, a socket circuit is provided on one surface of a test board, and a burn-in circuit is provided on the other surface opposite to the socket circuit. Of movable pins,
One end of the movable pin is in electrical contact with the socket circuit, the other end is in electrical contact with the burn-in circuit, and the movable pin is moved in the penetrating direction of the test board to disconnect the other end from the burn-in circuit. Is preferred. In this case, it is preferable that the movable pin is biased by an elastic member in a direction in which the other end is in electrical contact with the burn-in circuit, and is moved against the biasing force and separated from the burn-in circuit during an electrical characteristic test. .

[0008]

Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is an external perspective view of a test board according to the present invention, and FIG. 2 is a cross-sectional view of the test board in a normal state. The test board 1 has a socket 2 on which a semiconductor device to be tested can be mounted. Various components 3 required for the BT test are mounted on the test board 1, and the required BT wiring 4 is formed on the back surface of the test board 1 by a conductive film or the like. The BT wiring 4 and the socket 2
The socket wiring 5 formed on the front surface of the test board 1 in the normal state is connected to each of the front and back surfaces of the test board 1, and both are electrically connected to each other by movable pins 6.

The movable pin 6 is formed by bending a linear conductive material. An intermediate portion of the movable pin 6 penetrates the test board 1, and a front end 6 a of the movable pin 6 faces the surface of the test board 1. The rear end 6b is projected substantially perpendicularly, and is bent at a substantially right angle so as to overlap a part of the BT wiring 4.
A tension coil spring 7 is mounted on the movable pin 6 on the back side of the test board 1, and the movable pin 6 is urged toward the front side of the test board 1 by the tension coil spring 7, and the back side end thereof. The portion 6b is configured to be closely connected to the BT wiring 4 and electrically connected to each other.

Accordingly, in the configuration of the test board 1,
The front end 6a of the movable pin 6 is in electrical contact with the socket wiring 5, and the rear end 6b is in electrical contact with the BT wiring 4 by the urging force of the extension coil spring 7, whereby the socket 2 is electrically connected to the BT wiring 4. Have been. Therefore, when the semiconductor device 8 is mounted on the socket 2 and the test board 1 is set in a BT tank (not shown), the socket 2 is passed through the BT wiring 4.
Alternatively, the BT can be executed by connecting the semiconductor device 8 to the BT circuit 4.

[0013] Then, in the electrical characteristic test of the semiconductor device after the BT, as shown in FIG. 3, the test substrate 1 taken out of the BT tank is set at a predetermined position facing the measuring device 9. The measuring device 9 is provided with a pressing pin 10 and a measuring pin 11 which are integrally moved downward from above to below, and these pins are lowered during measurement.
Then, since the pressing pin 10 comes into contact with the front end 6 a of the movable pin 6, the movable pin 6 is moved downward against the urging force of the extension coil spring 7. Thereby, the movable pin 6
The backside end 6b is separated from the BT wiring 4 to lose the electrical connection state, and the BT wiring 4 and the socket wiring 5, ie, the semiconductor device 8, are electrically disconnected via the movable pin 6.

At the same time, the measuring pin 11 is brought into contact with the surface of the socket wiring 5, so that the measuring device 9 is electrically connected to the socket 2, that is, the semiconductor device 8. Therefore, by inputting and outputting a signal for measurement from the measuring device 9 to the semiconductor device 8, the semiconductor device 8 can be measured. At this time, the semiconductor device 8 is not affected because the electrical connection with the BT wiring 4 is disconnected.

As described above, in the BT and characteristic measurement using this test board, there is no need to provide a pin member for inserting and removing the test board, and naturally, there is no need for an operation for inserting and removing this pin member. Become. Therefore,
No need to insert and remove pins when executing BT,
BT can be easily performed. Further, even when performing BT on a large number of semiconductor devices at the same time, there is no need to insert and remove the pin member at all, and there is no problem.

In the above embodiment, a movable pin which penetrates the test board and is urged by a tension coil spring is provided as a means for connecting and disconnecting the BT circuit and the socket circuit. You may. For example, a part of the socket circuit is penetrated to the back surface of the test board, the BT circuit and the socket circuit are electrically connected by a leaf spring piece provided on the back surface of the test board, and a through hole provided in the test board during the measurement test. It is also possible to adopt a structure in which both circuits are separated by causing a pressing pin to enter into and deforming the leaf spring piece against its urging force. Alternatively, the BT circuit and the socket circuit provided on the front side of the test board may be separated from each other by providing a leaf spring piece on the front side of the test board and causing the pressing pin to abut and bend.

[0015]

As described above, according to the present invention, a BT circuit used at the time of BT is provided on a test board having a socket on which a semiconductor device for performing BT is mounted, and the socket and the burn-in circuit are disconnected at the time of BT. Since the BT circuit and the socket are electrically disconnected by operating the connecting / disconnecting means at the time of the measurement test, and the measurement test device is electrically connected to the socket.
There is no need to insert and remove the pin member provided on the test board between the time T and the measurement test, which simplifies the test operation and does not cause problems such as breakage of the pin member.

[Brief description of the drawings]

FIG. 1 is an external perspective view of a test board according to an embodiment of the present invention.

FIG. 2 is a normal side view of the test board of FIG. 1;

FIG. 3 is a side view of the test board of FIG. 1 in a state of a measurement test.

FIG. 4 is a side view for explaining a conventional test apparatus.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Test board 2 Socket 4 BT wiring 5 Socket wiring 6 Movable pin 7 Tension coil spring 8 Semiconductor device 9 Measurement device 10 Push-down pin 11 Measurement pin

Claims (5)

(57) [Claims] 1. A test board on which a socket on which a semiconductor device to be subjected to a burn-in test is mounted is mounted; a burn-in circuit provided on the test board; A test apparatus for a semiconductor device, comprising: a disconnecting means for disconnecting both. Wherein the socket circuit connected to the socket, and connecting the burn circuit by the movable member of electrically conductive,
2. The test apparatus for a semiconductor device according to claim 1 , wherein at the time of an electrical characteristic test, the movable member is forcibly moved to disconnect a connection state between the two circuits. Wherein the is one of the the face socket circuit test board provided, which said Bai <br/> down circuit on the other surface that faces is provided, through the test substrate in the opposing position of these circuits a conductive movable pins provided, moving the one end of the movable pin is in electrical contact with the socket circuit, to electrical contact with the <br/> burn circuit at the other end, the movable pin in the through direction of the test substrate The test apparatus for a semiconductor device according to claim 2, wherein the electrical contact between the other end of the movable pin and the burn-in circuit is disconnected. Wherein said movable pin is urged by an elastic member in a direction in which the other end is electrically in contact with the burn-circuit,
4. The semiconductor device test apparatus according to claim 3 , wherein during the electrical characteristic test, the semiconductor device is moved against the urging force and separated from the burn-in circuit. 5. A pressing pin for moving against the movable pin in the biasing force of the elastic member, which with the <br/> comprising a measuring pin being in electrical contact with the socket circuit simultaneously, the measuring pin The test apparatus for a semiconductor device according to claim 4, further comprising a measurement device that supplies a measurement signal to the semiconductor device via the measurement device.