JP3377338B2 - IC socket with IC package mounting jig - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC package mounting jig used for performance tests of IC packages.
The present invention relates to an IC socket .

[0002]

2. Description of the Related Art The performance test of an IC package is carried out by using an IC socket mounted on a wiring board such as a printed wiring board.
It is done by mounting the package, but I
It is necessary to be able to quickly attach and detach the IC package to and from the C socket.

For example, the one provided in Japanese Patent Laid-Open No. 64-65782 has an IC socket and a cover attached to the IC socket so as to be movable up and down, and is attached to the IC socket by pushing down the cover. The contact pin is pressed and bent so that the IC pin can be set in the IC socket by bending the contact pin, and the bending of the contact pin is restored by releasing the pressing down of the cover, and the IC package becomes the IC with the contact pin. It is fixed to the package.

[0004]

However, the above-mentioned Japanese Unexamined Patent Publication No.
In the case of Japanese Patent Laid-Open No. 4-65782, if the width (mil width) or the like of the IC package is different, the IC package cannot be mounted in the IC socket.
There is a problem that it is necessary to manufacture a C socket.
Further, even if the number of lead pins of the IC package is different, it cannot be attached to the IC socket, and it is necessary to manufacture an IC socket in which a number of contact pins corresponding to the number of lead pins of the IC package are attached. There was also a problem.

As described above, the IC socket is conventionally used as an IC socket.
There is a problem that a large number of types corresponding to the width dimension of the C package and the number of pins must be prepared and dealt with. Accordingly, the present invention, IC which may correspond to the mounting of the few types of members in various IC packages
An object is to provide an IC socket with a package mounting jig .

[0006]

According to claim 1 of the present invention
The IC socket with the IC package mounting jig includes a contact holding piece 2 and a bending piece 3 that bends to open and close the contact holding piece 2.
And a contact pin 4 formed by attaching to the socket base 1 to form a socket body 11, and a plurality of socket bodies 11 arranged opposite to each other on the wiring board 5 to form an IC socket 6. By pressing, the bending piece 3 of the contact pin 4 is bent to open the contact holding piece 2, and by releasing this pressing, the contact holding piece 2 is closed, and the opposing socket body 11
By interposing the leads 8 of the IC package 7 disposed between them with the contact clamping piece 2 of each socket body 11, the IC package 7
An IC package in which a mounting jig 9 for operating to mount the IC socket 6 on the IC socket 6 is mounted.
An IC socket with a mounting jig is characterized in that the socket main body 11 is formed by connecting a plurality of socket bases 1 to which the contact pins 4 are attached.

An IC package device according to claim 2 of the present invention
In an IC socket with a mounting jig, a contact pin 4 formed by providing a contact holding piece 2 and a bending piece 3 that bends to open and close the contact holding piece 2 is attached to a socket base 1 to form a socket body 11. At the same time, the IC socket 6 is formed by mounting a plurality of socket bodies 11 on the wiring board 5 so as to face each other, and the bending piece 3 of the contact pin 4 is bent by pressing to open the contact holding piece 2. Contact clamping piece 2 by releasing the pressure
ICs placed between the opposing socket bodies 11 by closing the
The leads 8 of the package 7 are clamped by the contact clamp pieces 2 of each socket body 11 so that the IC package 7 is held by the IC socket 6
With an IC package mounting jig that is mounted on the IC socket 6 with a mounting jig 9 for operating so as to be mounted on the IC socket 6.
The IC socket is characterized in that a larger number of contact pins 4 than the leads 8 of the IC package 7 are attached to the socket base 1 to form the socket body 11.

According to a third aspect of the present invention, a large number of pin insertion holes 10 are provided in the socket base 1 in a row at regular intervals,
It is characterized in that the contact pin 4 is inserted and attached to each pin insertion hole 10 at a position corresponding to the lead 8 of the IC socket 6. The invention according to claim 4 is such that the socket base 1 is provided between the contact pins 4.
In addition, a concave portion 26 for accommodating the electric component 25 mounted on the wiring board 5 is provided.

According to the invention of claim 5, the contact pin 4
In between, the socket base 1 is provided with a cutout portion 27 that can divide the socket base 1 freely. Further, according to the invention of claim 6, a spacer protrusion 28 for forming a gap for introducing solder is provided between the lower surface of the socket base 1 and the wiring substrate 5, and the wiring substrate 5 is provided on the lower surface of the spacer protrusion 28. It is characterized in that a positioning protrusion 30 fitted in a positioning hole 29 provided in the above is provided in a protruding manner.

Further, the invention of claim 7 is the contact pin 4
It is characterized in that a guard body 31 for covering the above is detachably attached to the socket body 11.

[0011]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below. The socket base 1 is formed of a resin molded product having electrical insulation and has an L-shaped cross section composed of a vertical piece 1a and a horizontal piece 1b. The socket base 1 has a thin slit-like shape that opens vertically from the vertical piece 1a to the horizontal piece 1b. A pin insertion hole 10 is provided. The pin insertion holes 10 are provided when the socket base 1 is molded with resin, and are arranged in a row in the longitudinal direction of the socket base 1 so that a large number of them are provided in parallel.

The contact pin 4 is made of a metal material. As shown in FIG. 4, the receiving piece 15 is integrally extended upward at the tip of the fixed piece 14, and the base of the receiving piece 15 is C-shaped. -Shaped bending piece 3 is integrally extended, the passive piece 16 is integrally extended upward at the tip of the bending piece 3, and the contact holding piece 2 is integrally extended at the base of the passive piece 16. There is. The tip end of the contact pinching piece 2 is opposed to the upper end of the receiving piece 15 so as to elastically contact with the elastic force of the bending piece 3, and the upper end of the passive piece 16 is shown in FIG.
When pressed downward as shown by the arrow, the bending piece 3 elastically bends so that its diameter becomes smaller, and the tip of the contact holding piece 2 is displaced so as to rotate upward as shown by the arrow in FIG. Then, the contact holding piece 2 is separated from the upper end of the receiving piece 15 and opens. Further, the engaging projection 17 is provided on the lower surface of the fixed piece 14.
Is projected.

The contact body 4 can be manufactured as shown in FIG. 3 by press-fitting and mounting the contact pins 4 into the respective pin insertion holes 10 provided in the socket base 1. Pin 4 receiving piece 1
The upper end of 5, the tip of the contact holding piece 2, and the upper end of the passive piece 16 are projected above the upper surface of the socket base 1.

The wiring board 5 is formed of a printed wiring board or the like, and is manufactured as a burn-in board by providing a circuit pattern for testing or the like. When a SOP formed by providing a plurality of leads 8 on both sides of the IC package 7 is tested, two socket bodies 11 are used as a set and each socket body 1 is used.
1 are arranged in parallel with their vertical pieces 1a facing each other, and each socket body 11 is mounted on the wiring board 5 by soldering or the like. The IC socket 6 as shown in FIG. 6A is configured. Wiring board 5 and socket body 11
The electrical connection with the contact pin 4 provided on the contact pin 4 can be performed by inserting the engaging protrusion 17 of the contact pin 4 into the through hole 18 or the like provided on the wiring board 5 and engaging with the through hole 18.

As shown in FIG. 5, the mounting jig 9 is formed in a rectangular frame shape in plan view, and the pressing frame pieces 20, 2 on both sides are formed.
0 is provided with a narrow slit-shaped pressing groove 21 whose bottom surface is open. A large number of the holding grooves 21 are arranged in one row on each holding frame piece 20 so as to correspond to the contact pins 4 of the socket base 1. 1 and 2 show an embodiment of the invention according to claim 1, in which the socket body 11 is formed of a plurality of socket bases 1. That is,
In the example of FIG. 1A, two socket bases 1 to which three contact pins 4 are attached are connected to the wiring board 5 in a row in the arrangement direction of the contact pins 4 to have six contact pins 4. The socket main body 11 is formed, and the IC socket 6 having the 12 contact pins 4 is formed by the pair of socket main bodies 11 composed of the two socket bases 1. Further, in the example of FIG. 2A, the three contact pins 4
Attach the 3 socket bases 1 with the contact pins 4
The socket main body 11 having the nine contact pins 4 is formed by attaching the socket main body 11 to the wiring board 5 in a row in the arrangement direction. An IC socket 6 having a book contact pin 4 is formed.

As described above, in FIG. 1, two socket bases 1 are connected to form the socket main body 11 to produce a 12-pin SOP (6 pins on one side) as shown in FIG. 1B. IC to install the IC package 7
The socket 6 can be formed, and in the case of FIG. 2, three socket bases 1 are connected to form the socket main body 11 to form an 18-pin SO as shown in FIG. 2B.
It is possible to form an IC socket 6 into which an IC package 7 manufactured as P (9 pins on one side) is mounted, and an IC corresponding to an IC package 7 having a different number of pins.
The socket 6 can be formed by the socket base 1 of the same type. In addition, the IC socket 6 includes a pair of socket bodies 11 spaced apart by a predetermined distance.
Since it is formed by mounting the same on the socket, the space between the socket bodies 11 can be freely set, and by adjusting the mounting space of the socket bodies 11 to the width (mil width) of the IC package 7, the same socket can be formed. The main body 11 can be used to form the IC socket 6 into which the IC packages 7 having different width dimensions can be mounted.

When mounting the IC package 7 made of SOP having leads 8 on both sides to the IC socket 6 mounted on the wiring board 5 as shown in FIGS. 1 and 2, first, as shown in FIG. As described above, the mounting jig 9 is arranged above the IC socket 6, and the mounting jig 9 is mounted on the IC socket 6 and attached. When the mounting jig 9 is covered in this way,
The upper end of the passive piece 16 of the contact pin 4 of each socket body 11 of the IC socket 6 is inserted into the holding groove 21 of each holding frame piece 20 of the mounting jig 9. Then, in this state, each holding frame piece 20 of the mounting jig 9 is indicated by the arrow in FIG.
When pressing down, the passive piece 1
6 is pressed, the bending piece 3 is elastically bent downward, and along with this, the tip of the contact holding piece 2 is displaced so as to rotate upward, and from the upper end of the receiving piece 15 to the tip of the contact holding piece 2. Are separated from each other and the contact pinching piece 2 is opened.

In the state where the contact jig 2 is opened by pressing the mounting jig 9 in this manner, the IC is mounted inside the mounting jig 9.
The IC package 7 is arranged on each socket body 11 of the socket 6. IC package 7 has leads 8 on both sides
Is a receiving piece 15 for the contact pin 4 of each socket body 11.
It is arranged so as to be placed on the upper end of the
When the pressing of the mounting jig 9 is released as shown by the arrow in (c) and then pulled up, the contact pin 4 releases the pressing force of the passive piece 16 and the bending of the bending piece 3 returns to the original state. The tip of the contact pinching piece 2 is displaced so as to rotate downward, the contact pinching piece 2 is closed, and the tip of the contact pinching piece 2 is pressed onto the lead 8 on the receiving piece 15 to fix the lead 8. It can be clamped by the contact clamping piece 2. In this way, by sandwiching the lead 8 by the contact sandwiching piece 2 of the contact pin 4 of each socket body 11, the IC package 7 can be mounted in the IC socket 6 in a state of being connected to the contact pin 4. . As described above, the wiring board 5 in which the IC package 7 is mounted on the IC socket 6 is housed in a tester, and a test such as a burn-in test can be accelerated under high temperature and high humidity.

When removing the IC package 7 from the IC socket 6, the mounting jig 9 is mounted over the IC socket 6 as shown in FIG. 6B, and the contact pin 4 is pressed down.
This can be performed by releasing the holding of the lead 8 by the contact holding piece 2. The mounting jig 9 is detachably mounted on the IC package 7 and can be easily removed from the IC package 7 by pulling up the mounting jig 9.

FIG. 7 shows an embodiment of the invention according to claim 2 of the present invention, in which the socket base 1 is formed in an elongated shape, and a large number of socket bases 1 are provided along the longitudinal direction thereof. The socket body 11 is formed by attaching the contact pins 4 of FIG. The contact pins 4 are arranged on the socket base 1 continuously arranged in one row at regular intervals without interruption, and the number of the contact pins 4 is the number of leads 8 provided on one side of the IC package 7. It is set to several times. Then, the two socket bodies 11 to which a large number of contact pins 4 are attached are arranged in parallel at a predetermined interval and attached to the surface of the wiring board 5 to form the IC socket 6.

In this case, for example, a 20-pin SOP
It is possible to arrange four IC packages 7 manufactured as (one side of 10 pins) in the IC socket 6 and simultaneously mount them. Therefore, one IC socket 6 can handle multiple I
The C package 7 can be mounted, the number of IC sockets 6 attached to the wiring board 5 can be reduced, and the number of components can be reduced. When the IC package 7 is, for example, a 10-pin SOP (5-pin on one side), four IC packages 7 can be mounted in the IC socket 6 side by side, and the IC packages 7 having different pin numbers can be mounted on the same IC. It is possible to mount the socket 6. When mounting a plurality of IC packages 7 on the IC socket 6 as described above, the mounting jig 9 is formed in a size to cover the entire IC socket 6, and the mounting jig 9 is pressed by a single operation. The plurality of IC packages 7 can be mounted (or removed) at the same time, and the mounting time of the IC packages 7 can be shortened.

FIG. 8 shows an embodiment of the invention according to claim 3 of the present invention, in which the socket base 1 is formed in a slender shape, and the socket base 1 is provided at regular intervals along its longitudinal direction. A large number of pin insertion holes 10 are formed in a row. Then, the contact pin 4 is inserted into the pin insertion hole 10 only at a position necessary to mount the IC package 7.
The socket body 11 is formed by press-fitting and mounting (the contact pins 4 mounted in the pin insertion holes 10 in FIG. 8 and FIG. 9 are indicated by diagonal lines), and the socket bodies 11 are arranged in parallel. The IC socket 6 is formed by being attached to the surface of the wiring board 5.

In the example of FIG. 8, among the pin insertion holes 10 provided in the socket base 1, four are set as one set, that is, three sets, that is, the contact pins 4 are press-fitted into the 12 pin insertion holes 10. Therefore, the IC package 7 is mounted on the IC socket 6 while the leads 8 of the IC package 7, which is manufactured as an 8-pin SOP (4 pins on one side), are connected to the contact pins 4 of each set. It is possible to install 3 of them side by side and to install them simultaneously. Further, in the example of FIG. 9A, among the pin insertion holes 10 provided in the socket base 1,
2 sets of 7 pieces as one set, that is, 14 pin insertion holes 1
The contact pin 4 is press-fitted and attached to 0. Therefore, the lead 8 of the IC package 7 manufactured as a 14-pin SOP (7-pin on one side) is connected to the contact pin 4 of each set. Then, two IC packages 7 can be mounted in the IC socket 6 side by side. Further, in the example of FIG. 9 (b), of the pin insertion holes 10 provided in the socket base 1, two of them are made up of eight, that is, the contact pins 4 are press-fitted into the 16 pin insertion holes 10. Therefore, the IC package 7 is manufactured as a 16-pin SOP (8-pin on one side), and the leads 8 of the IC package 7 are connected to the contact pins 4 of each set. Two can be placed side by side on 6 and installed at the same time. In this way, it is possible to mount a plurality of IC packages 7 having different numbers of pins with one IC socket 6, but the contact pins 4 are attached only in the required number at the required locations, so the contact The material loss of the pin 4 can be reduced, and the loss of the work of press-fitting the contact pin 4 into the pin insertion hole 10 can be reduced.

FIGS. 10 and 11 show an embodiment of the invention according to claim 4 of the present invention, in which the socket base 1 is formed in an elongated shape and is provided on one side of the IC socket 6. The number of contact pins 4 corresponding to the leads 8 is set as one set, and a plurality of sets of contact pins 4 are attached to the socket base 1 to form the socket body 1.
1 is formed, and the IC socket 6 is formed by arranging a pair of the socket bodies 11 in parallel and mounting them on the surface of the wiring board 5.
Then, as shown in FIG. 10, the socket base 1 of each socket body 11 is provided with a recess 26 at the inner edge thereof between each set of contact pins 4. The recess 26 is formed so as to open to the inner side surface and the upper and lower surfaces, and the socket base 1 is integrated by the bridging portion 33 on the back of the recess 26. In this way, by providing the recesses 26 facing each socket body 11 of the IC socket 6, the recesses 2
Since the electric parts 25 such as resistors and capacitors can be mounted on the wiring board 5 even inside the IC socket 6 by being housed in the IC socket 6, the mounting density on the wiring board 5 can be increased. is there.

Further, in the example of FIG. 11, the bridging portion 33 is formed on the upper part of the socket base 1 so that the concave portion 26 also opens on the outer surface of the socket base 1. Therefore, in this structure, the electrical component 25 is passed through the lower side of the bridge 33.
Can be disposed in the recess 26, and the electric component 25 can be mounted on the wiring board 5 by penetrating the IC socket 6.

FIG. 12 shows an embodiment of the invention according to claim 5 of the present invention, in which the socket base 1 is formed in an elongated shape and corresponds to the leads 8 provided on one side of the IC socket 6. A plurality of sets of contact pins 4 are set as one set, and a plurality of sets of contact pins 4 are attached to the socket base 1 to form the socket body 11. The socket bodies 11 are arranged in parallel to each other to form the wiring board 5. The IC socket 6 is formed by being attached to the surface of the IC socket. And each socket body 1
The socket base 1 of No. 1 is provided with a notch 27 between each set of the contact pins 4, and the socket main body 11 is divided by folding the socket base 1 at the notch 27. The IC socket 6 can be divided. In this way, by dividing the IC socket 6, the IC of the IC socket 6
The part that does not need to be mounted with the package 7 can be divided and removed, and the IC package 7 in the IC socket 6 can be removed.
The mounting density can be increased.

FIG. 13 shows an embodiment of the invention according to claim 6 of the present invention. The socket body 11 of the IC socket 6 is attached to the surface of the wiring board 5 by soldering, but it is necessary to form a gap between the lower surface of the socket body 11 and the upper surface of the wiring board 5 for solder to enter. To this end, a spacer protrusion 28 is provided on the lower surface of the socket body 11 so that a gap is formed between the lower surface of the socket body 11 and the upper surface of the wiring board 5 by the dimension of the spacer protrusion 28 protruding. There is. Further, when the socket body 11 is mounted on the wiring board 5, it is necessary to position the both. Therefore, the positioning protrusion 30 is provided on the lower surface of the socket body 11, and the positioning hole 29 provided on the wiring board 5 is provided with the positioning protrusion 30. The socket body 11 is positioned with respect to the wiring board 5 by fitting the positioning protrusions 30. When the spacer protrusions 28 and the positioning protrusions 30 are separately provided on the lower surface of the socket base 1 forming the socket body 11, the spacer protrusions 28
Since it is necessary to provide a plurality of (for example, three) positioning protrusions 30 each, it may be difficult to provide them all on the lower surface of the socket base 1 from the area of the lower surface of the socket base 1. Particularly, in the case of the examples of FIGS. 1 and 2, it becomes more difficult because the socket base 1 is formed small.

Therefore, as shown in FIG. 13A, a spacer protrusion 28 is provided on the lower surface of the socket base 1, and
A positioning projection 30 is provided on the lower surface of the spacer projection 28, and the spacer projection 28 and the positioning projection 30 are provided at the same location. Therefore, the spacer projection 28 and the positioning projection 30 can be provided on the lower surface of the socket base 1 without increasing the area as in the case where the spacer projection 28 and the positioning projection 30 are provided separately. Then, as shown in FIG.
The socket body 11 can be positioned with respect to the wiring board 5 by fitting the positioning protrusions 30 into the positioning holes 29 provided on the surface of the wiring board 5, and the lower surface of the spacer protrusion 28 is the wiring. By abutting on the surface of the board 5, a gap for introducing solder can be formed between the lower surface of the socket body 11 and the surface of the wiring board 5 depending on the thickness of the spacer protrusion 28. It is possible to prevent the solder from rising when the wiring is attached to the wiring board 5.

FIG. 14 shows an embodiment of the invention according to claim 7 of the present invention, in which the guard body 31 is provided so as to cover the contact pins 4 of the socket body 11.
It is designed to be detachably attached to the. IC socket 6
Since the mounting jig 9 is removed from the IC socket 6 before and after mounting the IC package 7 on the contact pin 4, the contact pin 4 of the socket body 11 is exposed, and the contact pin 4 is exposed to the external force. 4 may be broken or bent. Therefore, as shown in FIG. 14A, the socket body 11 is covered with the guard body 31 to protect the contact pin 4. Here, the guard body 31 is formed in an inverted L-shape in cross section with the front surface and the lower surface opened, and fitting pieces 36 are projected from the lower ends of the side pieces 35 at both ends thereof. Then, the fitting piece 36 is detachably fitted into the fitting hole 37 provided in the wiring board 5 to attach the guard body 31 to the wiring board 5, whereby the guard body 31 is mounted on the socket body 11.

In each of the above examples, the IC socket 6 in which the SOP IC package 7 having the leads 8 on both sides is mounted is explained, but the leads 8 are provided on the four sides like the QFP.
When mounting the IC package 7 provided with, the socket bodies 11 are used in a set of four, and the socket bodies 11 are arranged in a rectangular frame shape so that the vertical pieces 1a thereof face inward, and are mounted on the wiring board 5. The IC socket 6 is formed by mounting. And in this case, the mounting jig 9
As a holding frame piece 20 provided on each side and formed in a rectangular frame shape, the IC package 7 to the IC socket 6 is used.
Is to be attached.

[0031]

As described above, according to the invention of claim 1, the contact pin formed by providing the contact holding piece and the bending piece bent to open and close the contact holding piece is attached to the socket base to mount the socket body. An IC socket is formed by mounting and forming a plurality of socket bodies on the wiring board so as to face each other. By pressing, the bending piece of the contact pin is bent to open the contact holding piece, and this pressing is released. By doing so, the contact gripping piece is closed, and the leads of the IC package disposed between the opposing socket bodies are gripped by the contact gripping pieces of each socket body, and the IC package is mounted on the IC socket. Since the tools are attached to the IC socket, the attachment interval of the socket body to the wiring board is adjusted to the width of the IC package. And the same type of using a socket body can width to form an IC socket corresponding to different IC package, in which may correspond to the mounting of the few types of members in various IC packages. Moreover, since the socket main body is formed by connecting a plurality of socket bases to which the contact pins are attached, an IC socket corresponding to an IC package having a different number of pins can be formed by the same kind of socket bases. It is possible to mount various IC packages with a small number of members.

According to a second aspect of the present invention, a contact pin formed by providing a contact holding piece and a bending piece that bends so as to open and close the contact holding piece is attached to a socket base to form a socket body, and wiring is provided. An IC socket is formed by mounting a plurality of socket bodies so as to face each other on a substrate, and the contact pin is opened by opening the contact pin by bending the bent part of the contact pin by pressing, and the contact pin is released by releasing this press. And the leads of the IC package disposed between the opposing socket bodies are clamped by the contact clamping pieces of each socket body, and the IC package is
The mounting jig for operating the C socket is mounted on the IC socket.
As in the case of 1, the mounting of various IC packages can be supported with a small number of members. Moreover, I
Since the socket main body is formed by attaching the contact pins, which are larger in number than the leads of the C socket, to the socket base, it becomes possible to mount a plurality of IC packages with one IC socket, and wiring is possible. It is possible to reduce the number of parts by reducing the number of IC sockets attached to the board.

According to a third aspect of the present invention, a large number of pin insertion holes are provided in a row on the socket base at regular intervals, and contact pins are provided in the respective pin insertion holes at positions corresponding to the leads of the IC socket. Since it is inserted and attached, it is only necessary to attach the required number of contact pins at the required places, and it is possible to reduce the material loss of the contact pins and to press-fit the contact pins into the pin insertion holes. The loss can be reduced.

Further, according to the invention of claim 4, a recess for accommodating the electrical parts to be mounted on the wiring board is provided in the socket base between the contact pins, so that the position inside the IC socket can be accommodated in the recess. In addition, the electric component can be mounted on the wiring board, and the mounting density of the electric component on the wiring board can be increased. According to the invention of claim 5, in the socket base between the contact pins,
Since the socket base is provided with the notch that can be divided, the IC socket can be divided by folding the socket base at the notch and dividing the socket body.

According to a sixth aspect of the present invention, a spacer protrusion is provided on the lower surface of the socket base for forming a gap for introducing solder between the socket base and the lower surface of the spacer protrusion. Since the positioning protrusion that fits into the positioning hole is provided so that the spacer protrusion and the positioning protrusion can be provided on the lower surface of the socket base at the same location, the socket base can be installed without increasing the area. A spacer protrusion and a positioning protrusion can be provided on the lower surface of the.

Further, according to the invention of claim 7, the guard body for covering the contact pin is detachably attached to the socket body, so that the contact pin can be protected by the guard body, and the contact pin can be bent or bent. It is something that can be prevented.

[Brief description of drawings]

FIG. 1 shows an embodiment of the present invention, (a)
Is a schematic plan view of the IC socket, and (b) is a schematic plan view of the IC socket with the IC package mounted.

FIG. 2 shows another example of the above embodiment,
(A) is a schematic plan view of an IC socket, and (b) is a schematic plan view of an IC socket with an IC package mounted.

FIG. 3 is a perspective view of a part of an IC socket.

FIG. 4 is a perspective view of a contact pin.

FIG. 5 is a perspective view of a mounting jig.

FIG. 6 shows a procedure of mounting an IC package in an IC socket, and (a), (b) and (c) are sectional views.

FIG. 7 shows another embodiment of the present invention,
(A) is a schematic plan view of an IC socket, and (b) is a schematic plan view of an IC socket with an IC package mounted.

8A and 8B show another embodiment of the present invention, in which FIG. 8A is a schematic plan view of an IC socket, and FIG.
It is a schematic plan view of an IC socket with a package mounted.

FIG. 9 shows another example of the above embodiment,
(A), (b) is a schematic plan view of an IC socket with an IC package mounted.

FIG. 10 shows still another embodiment of the present invention, (a) is a schematic plan view of an IC socket with an IC package mounted, and (b) is a front view.

FIG. 11 shows another example of the above embodiment,
(A) is a schematic plan view of an IC socket with an IC package mounted, and (b) is a front view.

12A and 12B show still another embodiment of the present invention, wherein FIG. 12A is a schematic plan view of an IC socket with an IC package mounted, and FIG. 12B is a front view.

13A and 13B show still another embodiment of the present invention, in which FIG. 13A is a partial perspective view seen from below the socket body, and FIG. 13B is a partial front view.

14A and 14B show still another embodiment of the present invention, FIG. 14A is a schematic plan view of an IC socket with an IC package mounted, and FIG. 14B is an exploded perspective view of a guard body attached state. is there.

[Explanation of symbols]

1 socket base 2 contact clamps 3 bent pieces 4 contact pins 5 wiring board 6 IC socket 7 IC package 8 leads 9 Mounting jig 10 pin insertion hole 11 Socket body 25 electrical components 26 recess 27 Notch 28 Spacer protrusion 29 Positioning hole 30 Positioning protrusion 31 Guard body

─────────────────────────────────────────────────── ─── Continuation of the front page (56) Reference Japanese Unexamined Patent Publication No. 6-203936 (JP, A) Actually open 1-130291 (JP, U) Actually open 63-114073 (JP, U) Actually open 2- 128392 (JP, U) (58) Fields investigated (Int.Cl. ⁷ , DB name) H01L 23/32

Claims (7)

(57) [Claims] 1. A contact pin formed by providing a contact holding piece and a bending piece bent to open and close the contact holding piece is attached to a socket base to form a socket body, and a plurality of socket bodies are provided on a wiring board. IC sockets are formed by mounting the ICs facing each other, and by pressing, the bending pieces of the contact pins are bent to open the contact holding pieces, and by releasing this pressing, the contact holding pieces are closed to face each other. IC package mounting formed by attaching the mounting jig for operating such that the lead of the IC package is disposed between the socket body by sandwiching the contact holding pieces of the socket body is mounted an IC package on the IC socket IC socket Oite <br/> the jig with the IC socket, and lined plurality of socket base fitted with a contact pin the IC package mounting jig with IC socket, characterized in that by forming a socket body. 2. A contact pin formed by providing a contact holding piece and a bending piece bent to open and close the contact holding piece is attached to a socket base to form a socket body, and a plurality of socket bodies are provided on a wiring board. IC sockets are formed by mounting the ICs facing each other, and by pressing, the bending pieces of the contact pins are bent to open the contact holding pieces, and by releasing this pressing, the contact holding pieces are closed to face each other. IC package mounting formed by attaching the mounting jig for operating such that the lead of the IC package is disposed between the socket body by sandwiching the contact holding pieces of the socket body is mounted an IC package on the IC socket IC socket <br/> Oite the jig with the IC socket, the number of contact pins is greater than the number of IC sockets lead Seo Attached to Tsu preparative base IC package mounting, characterized by comprising forming said socket body
IC socket with jig . 3. The socket base is provided with a large number of pin insertion holes arranged in a row at regular intervals, and contact pins are inserted into the pin insertion holes at positions corresponding to the leads of the IC socket. The IC socket with an IC package mounting jig according to claim 2, wherein 4. The IC package mounting jig according to claim 1, wherein a recess for accommodating an electrical component to be mounted on the wiring board is provided on the socket base between the contact pins. IC socket with tools . 5. The IC according to any one of claims 1 to 4, wherein the socket base is provided with a cutout portion that can divide the socket base between the contact pins.
IC socket with package mounting jig . 6. A spacer protrusion is provided on the lower surface of the socket base to form a gap for introducing solder between the socket base and the lower surface of the spacer protrusion and is fitted into a positioning hole provided on the wiring substrate. The IC package according to any one of claims 1 to 5, characterized in that a positioning protrusion to be fitted is provided in a protruding manner.
IC socket with package mounting jig . 7. The IC package mounting jig according to claim 1, wherein a guard body covering the contact pin is detachably mounted on the socket body.
IC socket with .