CN111403307B - Integrated circuit test module and preparation method thereof - Google Patents
Integrated circuit test module and preparation method thereof Download PDFInfo
- Publication number
- CN111403307B CN111403307B CN202010221789.9A CN202010221789A CN111403307B CN 111403307 B CN111403307 B CN 111403307B CN 202010221789 A CN202010221789 A CN 202010221789A CN 111403307 B CN111403307 B CN 111403307B
- Authority
- CN
- China
- Prior art keywords
- metal
- metal ball
- integrated circuit
- probe
- module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
- H01L22/34—Circuits for electrically characterising or monitoring manufacturing processes, e. g. whole test die, wafers filled with test structures, on-board-devices incorporated on each die, process control monitors or pad structures thereof, devices in scribe line
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Automation & Control Theory (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The invention provides an integrated circuit testing module and a preparation method thereof. The test circuit board comprises a plurality of joints, the elastic structure is arranged on the test circuit board and comprises a plurality of probe groups and an elastic rubber block, each probe group comprises a first metal ball, a second metal ball and a metal wire, the metal wires are connected between the first metal ball and the second metal ball, the second metal balls are electrically connected with the joints, the probe groups are vertically and locally coated in the elastic rubber block, and the first metal balls are used for electrically contacting an element to be tested. Therefore, the invention can replace the traditional double-ended probe by the elastic structure with the elastic rubber block and the probe group, thereby reducing the manufacturing and maintenance cost of the double-ended probe.
Description
Technical Field
The present invention relates to an integrated circuit testing module and a method for manufacturing the same, and more particularly, to an integrated circuit testing module using a bimetal ball to replace a probe and a method for manufacturing the same.
Background
In the fabrication of integrated circuits or chips, the integrated circuits or chips are tested for good or good electrical performance for each stage of the process.
The traditional integrated circuit testing module mainly utilizes the elastic contact of the probe to achieve the aim of multiple tests, however, the probe has the defects of high maintenance cost, complex mechanism, high processing difficulty, short service life, high electrical attenuation speed and the like, and the probe often causes trouble in maintenance cost consideration.
In view of this, it is an objective of related manufacturers to develop a probe that can replace the probes in the conventional test module, and that is easy and inexpensive to maintain.
Disclosure of Invention
An objective of the present invention is to provide an integrated circuit testing module and a method for manufacturing the same, wherein a bimetal ball replaces a conventional double-ended probe, and an elastic material is manufactured in an injection molding manner, so as to achieve the purpose of multiple contact testing.
An embodiment of the invention provides a method for manufacturing an integrated circuit testing module, which comprises providing a plurality of probe sets, performing a mold setting step, performing an injection drying step and performing a bonding step. Each probe group comprises a first metal ball, a second metal ball and a metal wire, wherein the metal wire is connected between the first metal ball and the second metal ball, and the volume of each second metal ball is larger than that of each first metal ball. The mould setting step is to pass the second metal ball through an aperture plate, and use a magnet to set up opposite to the aperture plate, and to set up the probe set by the first metal ball attracted by the magnet to form a mould setting module. The injection molding and drying step is to inject a liquid material into the vertical mold module and then dry the liquid material to form an elastic rubber block, and the probe group is vertically and locally coated in the elastic rubber block, so that the first metal ball is positioned right above the second metal ball, one end of the first metal ball, which is far away from the metal wire, and one end of the second metal ball, which is far away from the metal wire, are protruded out of the elastic rubber block, and an elastic structure is obtained. The bonding step is to bond a test circuit board with one side of the elastic structure to obtain an integrated circuit test module, wherein the other side of the elastic structure is used for electrically contacting a to-be-tested element.
According to the method for manufacturing the integrated circuit testing module of the foregoing embodiment, the opening plate may include a plurality of holes, and the second metal balls of each probe set are disposed corresponding to each hole.
According to the method for manufacturing the integrated circuit testing module of the foregoing embodiment, the liquid material may be a hot melt adhesive.
According to the method for manufacturing the integrated circuit testing module of the foregoing embodiment, the testing circuit board may include a plurality of contacts, each hole of the perforated plate is arranged according to the contacts of the testing circuit board, and the second metal balls are electrically connected to the contacts.
According to the method for manufacturing the integrated circuit testing module of the foregoing embodiment, the first metal balls electrically contact the device under test.
Another embodiment of the present invention provides an integrated circuit testing module, which is manufactured by the method for manufacturing an integrated circuit testing module.
According to the integrated circuit test module of the foregoing embodiment, the first metal balls, the second metal balls and the metal wires are made of copper metal.
According to the integrated circuit test module of the foregoing embodiment, the compression stroke of the elastomeric block may be 0.25 mm to 0.35 mm.
Therefore, the invention replaces the traditional probe by the probe group and the elastic rubber block, and performs electrical test on the integrated circuit, thereby improving the defects of high maintenance cost, short service life and the like of the traditional probe, and realizing the purposes of simple maintenance, long service life and low manufacturing cost of the probe.
Drawings
The foregoing and other objects, features, advantages and embodiments of the invention will be apparent from the following description taken in conjunction with the accompanying drawings in which:
FIG. 1 is a flow chart illustrating steps of a method for manufacturing an integrated circuit test module according to one embodiment of the present invention; and
fig. 2A, 2B, 2C and 2D are schematic diagrams illustrating a manufacturing process of a manufacturing method of the integrated circuit test module according to fig. 1, respectively.
Reference numerals illustrate:
100: method for preparing integrated circuit test module
110,120,130,140: step (a)
200: probe set
210: first metal ball
220: second metal ball
230: metal wire
300: perforated plate
310: holes and holes
400: magnet
500: elastic rubber block
600: elastic structure
700: integrated circuit test module
710: test circuit board
711: contact point
720: element to be tested
Detailed Description
Embodiments of the present invention will be described below with reference to the accompanying drawings. For purposes of clarity, many practical details will be set forth in the following description. However, the reader should appreciate that these practical details should not be used to limit the invention. That is, in some embodiments of the invention, these practical details are unnecessary. Furthermore, for the sake of simplicity of the drawing, some of the existing conventional structures and elements are shown in the drawing in a simplified schematic manner; and repeated elements will likely be indicated by identical reference numerals.
Referring to fig. 1, fig. 2A, fig. 2B, fig. 2C, and fig. 2D, fig. 1 is a flowchart illustrating a method 100 for manufacturing an integrated circuit test module according to an embodiment of the invention. Fig. 2A, 2B, 2C, and 2D are schematic diagrams illustrating a process of manufacturing the integrated circuit test module 100 according to fig. 1. The method 100 for manufacturing the integrated circuit test module includes a step 110, a step 120, a step 130, and a step 140.
In step 110, a plurality of probe sets 200 are provided, as shown in fig. 2A, each probe set 200 includes a first metal ball 210, a second metal ball 220, and a metal wire 230, wherein the metal wire 230 is connected between the first metal ball 210 and the second metal ball 220. In detail, the diameter of the first metal ball 210 may be 20mil to 100mil, the diameter of the second metal ball 220 may be 60mil to 140mil, the volume of the second metal ball 220 is larger than that of the first metal ball 210, and the metal wire 230 is connected between the first metal ball 210 and the second metal ball 220 by soldering. The metal materials of the first metal balls 210, the second metal balls 220 and the metal wires 230 may be metals with high conductivity and low cost, and the first metal balls 210, the second metal balls 220 and the metal wires 230 are made of copper metal, but the invention is not limited thereto.
In step 120, as shown in fig. 2B, a second metal ball 220 is inserted into an aperture plate 300, and a magnet 400 is disposed opposite to the aperture plate 300, and the first metal ball 210 is attracted by the magnet 400 to erect the probe set 200, so as to form a erecting module (not shown). In detail, the perforated plate 300 includes a plurality of holes 310, and the holes 310 may have a diameter of 40mil to 120mil, which allows the first metal balls 210 to pass therethrough, but cannot allow the second metal balls 220 to pass therethrough completely, and the second metal balls 220 of each probe set 200 are disposed corresponding to the holes 310, so that the second metal balls 220 partially pass through and are disposed in the holes 310 of the perforated plate 300. Then, the magnet 400 is disposed opposite to the perforated plate 300, and the first metal balls 210 are attracted by the magnet 400 to enable the probe set 200 to stand upright, so that the vertical die is completed.
In step 130, as shown in fig. 2C, a liquid material is injected into the vertical mold module and dried to form an elastic glue block 500, and the probe set 200 is vertically and partially wrapped in the elastic glue block 500, so that the first metal ball 210 is located right above the second metal ball 220, and one end of the first metal ball 210 away from the metal wire 230 and one end of the second metal ball 220 away from the metal wire 230 protrude out of the elastic glue block 500, so as to obtain an elastic structure 600. In detail, the liquid material may be, but not limited to, a hot melt adhesive, which has elastic, insulating and deformable properties after being dried, and the compression stroke of the elastic rubber block 500 is 0.25 mm to 0.35 mm, and the elastic force of the elastic rubber block 500 can be adjusted by changing the injection molding density so as to meet the requirements of different test products. In addition, since the perforated plate 300 cannot be completely penetrated by the second metal balls 220, when the plastic is dried, a part of the second metal balls 220 cannot be covered by the elastic rubber block 500 and protrude from the elastic rubber block 500, and by adjusting the injection height, a part of the first metal balls 210 may protrude from the elastic rubber block 500, so that the first metal balls 210 and the second metal balls 220 can be contacted, and after the drying, the perforated plate 300 needs to be removed.
In step 140, a bonding step is performed, as shown in fig. 2D, in which a test circuit board 710 is bonded to one side of the elastic structure 600 to obtain an integrated circuit test module 700, wherein the other side of the elastic structure 600 is used for electrically contacting a device to be tested 720. In detail, the test circuit board 710 includes a plurality of contacts 711, and the test circuit board 710 may be, but is not limited to, a printed circuit board (printed circuit board, PCB) or a circuit board manufactured through other processes. In addition, during the mold setting step, the hole plate 300 should be provided with holes 310 with different arrangements according to the arrangement of the contacts 711 of the test circuit board 710, so that the probe set 200 can be arranged through the hole plate 300, and after drying, the hole plate 300 is removed. Afterwards, the elastic structure 600 is disposed on the test circuit board 710, and the second metal balls 220 are electrically connected to the contacts 711, and the first metal balls 210 are electrically contacted with the device under test 720.
In more detail, since the elastic glue block 500 has a deformable property, the elastic structure 600 can deform according to the amount of force applied during the test, so as to ensure that the first metal ball 210 and the second metal ball 220 of the probe set 200 respectively contact the contact 711 of the device under test 720 and the test circuit board 710, so that the signal of the first metal ball 210 contacting the device under test 720 is transmitted to the second metal ball 220 via the metal wire 230, and then the signal is transmitted to the test circuit board 710 by the second metal ball 220. In addition, the elastic rubber block 500 has the advantages of simple process and low cost, only needs injection molding and drying steps, does not need additional complicated process, and reduces the production cost.
In addition, the device under test 720 may be, but not limited to, a chip or a wafer, and the first metal balls 210 of the probe set 200 are used for contacting the integrated circuit on the chip or the wafer, and after being electrically connected to the device under test 720 through the test circuit board 710, various tested signals are transmitted to the integrated circuit on the device under test 720, and then transmitted back to the test circuit board 710 from the integrated circuit, so as to determine whether the electrical characteristics of the integrated circuit in the device under test 720 and the integrated circuit are good.
The integrated circuit testing module 700 of the present invention can adjust the electrical parameters and the mechanical parameters according to the requirements, wherein the electrical parameters can be customized according to the thickness or length of the metal wires 230 and the materials of the first metal balls 210 and the second metal balls 220, and the mechanical parameters can be customized according to the injection molding height, density or the sizes of the first metal balls 210 and the second metal balls 220.
The probe set and the elastic rubber block of the invention can replace the traditional double-end probe, thereby improving the defects of high maintenance cost, short service life and the like of the traditional probe.
In summary, the integrated circuit testing module of the present invention generates the elastic structure with the elastic rubber block and the probe set by injection molding to replace the conventional double-ended probes, and electrically connects the device to be tested to the testing circuit board through the elastic structure, so that the integrated circuit testing module can electrically test the integrated circuit in the device to be tested, thereby reducing the manufacturing and maintenance costs of the double-ended probes and simplifying the production line replacement process.
Although the present invention has been described with reference to the above embodiments, it should be understood that the invention is not limited thereto, but may be modified and altered in various ways without departing from the spirit and scope of the invention.
Claims (8)
1. A method of manufacturing an integrated circuit test module, comprising:
providing a plurality of probe sets, wherein each probe set comprises a first metal ball, a second metal ball and a metal wire, the metal wire is connected between the first metal ball and the second metal ball, and the volume of each second metal ball is larger than that of each first metal ball;
performing a mould setting step, namely penetrating the second metal balls into an opening plate, arranging the second metal balls opposite to the opening plate by using a magnet, and enabling the first metal balls to be adsorbed by the magnet so as to set up the plurality of probe groups to form a mould setting module;
an injection molding and drying step is carried out, wherein a liquid material is injected into the vertical mold module and then dried to form an elastic rubber block, and the plurality of probe groups are vertically and partially coated in the elastic rubber block, so that the first metal ball is positioned right above the second metal ball, one end of the first metal ball, which is far away from the metal wire, and one end of the second metal ball, which is far away from the metal wire, are protruded out of the elastic rubber block, and an elastic structure is obtained; and
and performing a bonding step, namely bonding a test circuit board with one side of the elastic structure to obtain an integrated circuit test module, wherein the other side of the elastic structure is used for electrically contacting a to-be-tested element.
2. The method of claim 1, wherein the perforated plate comprises a plurality of holes, and the second metal balls of each probe set are disposed corresponding to the holes.
3. The method of manufacturing an integrated circuit test module of claim 1, wherein the liquid material is a hot melt adhesive.
4. The method of claim 2, wherein the test circuit board comprises a plurality of contacts, each hole of the opening plate is arranged according to the contacts of the test circuit board, and the second metal balls are electrically connected to the contacts.
5. The method of claim 1, wherein the first metal balls are in electrical contact with the device under test.
6. An integrated circuit test module prepared by the method of any one of claims 1 to 5.
7. The integrated circuit test module of claim 6, wherein the first metal ball, the second metal ball, and the metal wire are made of copper metal.
8. The integrated circuit testing module of claim 6, wherein the elastomeric block has a compression stroke of 0.25 mm to 0.35 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010221789.9A CN111403307B (en) | 2020-03-26 | 2020-03-26 | Integrated circuit test module and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010221789.9A CN111403307B (en) | 2020-03-26 | 2020-03-26 | Integrated circuit test module and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111403307A CN111403307A (en) | 2020-07-10 |
| CN111403307B true CN111403307B (en) | 2023-09-29 |
Family
ID=71431236
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010221789.9A Active CN111403307B (en) | 2020-03-26 | 2020-03-26 | Integrated circuit test module and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111403307B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02158071A (en) * | 1988-12-12 | 1990-06-18 | Fujitsu Ltd | Connector |
| US4998885A (en) * | 1989-10-27 | 1991-03-12 | International Business Machines Corporation | Elastomeric area array interposer |
| US5371654A (en) * | 1992-10-19 | 1994-12-06 | International Business Machines Corporation | Three dimensional high performance interconnection package |
| CN104422863A (en) * | 2013-08-20 | 2015-03-18 | 致茂电子股份有限公司 | Semiconductor test device |
-
2020
- 2020-03-26 CN CN202010221789.9A patent/CN111403307B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02158071A (en) * | 1988-12-12 | 1990-06-18 | Fujitsu Ltd | Connector |
| US4998885A (en) * | 1989-10-27 | 1991-03-12 | International Business Machines Corporation | Elastomeric area array interposer |
| US5371654A (en) * | 1992-10-19 | 1994-12-06 | International Business Machines Corporation | Three dimensional high performance interconnection package |
| US5821763A (en) * | 1992-10-19 | 1998-10-13 | International Business Machines Corporation | Test probe for high density integrated circuits, methods of fabrication thereof and methods of use thereof |
| CN104422863A (en) * | 2013-08-20 | 2015-03-18 | 致茂电子股份有限公司 | Semiconductor test device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN111403307A (en) | 2020-07-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7094065B2 (en) | Device for establishing non-permanent electrical connection between an integrated circuit device lead element and a substrate | |
| US20040155328A1 (en) | Wafer-interposer assembly | |
| KR101145886B1 (en) | Electical connection device and test socket having the electrical connection device | |
| JP2006269404A (en) | Contactor for electronic parts and contact method | |
| KR20000062209A (en) | Test socket for Ball Grid Array package and method for testing thereof | |
| CN207281106U (en) | Small lead pin pitch semiconductor devices bare chip aging test socket | |
| KR102007268B1 (en) | By-directional electrically conductive module | |
| US20020045293A1 (en) | Structure for mounting a bare chip using an interposer | |
| KR100810044B1 (en) | A apparatus and method of contact probe | |
| CN111403307B (en) | Integrated circuit test module and preparation method thereof | |
| JP2000241498A (en) | Semiconductor element connecting device, and semiconductor element inspection device and its method | |
| CN202929164U (en) | Testing arrangement and probe structure thereof | |
| US6703851B1 (en) | Test socket interposer | |
| KR100984682B1 (en) | Memory stack probe card and test method using it | |
| KR102671633B1 (en) | Test socket and test apparatus having the same, manufacturing method for the test socket | |
| KR200430815Y1 (en) | contact probe | |
| US7474113B2 (en) | Flexible head probe for sort interface units | |
| KR100356823B1 (en) | Probe card | |
| US20040257096A1 (en) | Back side probing method and assembly | |
| KR200316878Y1 (en) | Test socket for ball grid array package | |
| KR101391794B1 (en) | probe unit and probe card | |
| JP3596500B2 (en) | Method for manufacturing semiconductor inspection device, semiconductor inspection device, and method for inspecting semiconductor device | |
| CN101135706A (en) | Wafer testing module | |
| KR100836045B1 (en) | Contact probe | |
| KR100873581B1 (en) | Silicon contactor and method for manufacturing thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |