CN111403307A - Integrated circuit test module and preparation method thereof - Google Patents
Integrated circuit test module and preparation method thereof Download PDFInfo
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- CN111403307A CN111403307A CN202010221789.9A CN202010221789A CN111403307A CN 111403307 A CN111403307 A CN 111403307A CN 202010221789 A CN202010221789 A CN 202010221789A CN 111403307 A CN111403307 A CN 111403307A
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- metal
- metal ball
- integrated circuit
- probe
- ball
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
- H01L22/34—Circuits for electrically characterising or monitoring manufacturing processes, e. g. whole test die, wafers filled with test structures, on-board-devices incorporated on each die, process control monitors or pad structures thereof, devices in scribe line
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
Abstract
The invention provides an integrated circuit test module and a preparation method thereof, wherein the integrated circuit test module comprises a test circuit board and an elastic structure. The test circuit board comprises a plurality of contacts, the elastic structure is arranged on the test circuit board and comprises a plurality of probe sets and an elastic rubber block, each probe set comprises a first metal ball, a second metal ball and a metal lead, the metal lead is connected between the first metal ball and the second metal ball, the second metal balls are electrically connected with the contacts, the probe sets are vertically and partially coated in the elastic rubber block, and the first metal balls are used for electrically contacting an element to be tested. Therefore, the invention can replace the traditional double-head probe by the elastic structure with the elastic rubber block and the probe group so as to reduce the manufacturing and maintenance cost of the double-head probe.
Description
Technical Field
The present invention relates to an integrated circuit test module and a method for manufacturing the same, and more particularly, to an integrated circuit test module using a bimetal ball instead of a probe and a method for manufacturing the same.
Background
In the manufacturing process of an integrated circuit or chip, the integrated circuit or chip is tested at each process stage to determine whether it is good or not or to determine its electrical properties.
The conventional integrated circuit test module mainly utilizes the elastic contact of the probe to achieve the purpose of multiple tests, however, the probe has the disadvantages of high maintenance cost, complex mechanism, high processing difficulty, short service life, high electrical attenuation speed and the like, and the trouble of considering the maintenance cost is often caused.
Therefore, how to develop a probe card that can replace the probe in the conventional test module, so that the probe card is easy to maintain and low in cost, is an objective of the related industry.
Disclosure of Invention
The invention aims to provide an integrated circuit test module and a preparation method thereof, which replace the traditional double-head probe with a bimetallic ball and manufacture an elastic material in an injection molding mode to realize the purpose of multiple contact tests.
An embodiment of the invention provides an integrated circuit testing module, which includes a testing circuit board and an elastic structure. The test circuit board comprises a plurality of contacts, the elastic structure is arranged on the test circuit board, and the elastic structure comprises a plurality of probe sets and an elastic rubber block. Each probe group comprises a first metal ball, a second metal ball and a metal wire, the metal wire is connected between the first metal ball and the second metal ball, the second metal ball is electrically connected with the contact, the probe group is erected and partially coated in the elastic rubber block, so that the first metal ball is positioned right above the second metal ball, one end of the first metal ball, far away from the metal wire, and one end of the second metal ball, far away from the metal wire, protrude out of the elastic rubber block, wherein the first metal ball is used for electrically contacting an element to be tested.
The integrated circuit testing module according to the aforementioned embodiments, wherein the volume of each second metal ball may be larger than the volume of each first metal ball.
The integrated circuit test module according to the foregoing embodiments, wherein the first metal balls, the second metal balls and the metal wires are made of copper metal.
The integrated circuit testing module according to the aforementioned embodiment, wherein the compression stroke of the elastic rubber block can be 0.25 mm to 0.35 mm.
Another embodiment of the present invention provides a method for manufacturing an integrated circuit testing module, which includes providing a plurality of probe sets, performing a mold-erecting step, performing an injection-molding and drying step, and performing a bonding step. Each probe group comprises a first metal ball, a second metal ball and a metal lead, wherein the metal lead is connected between the first metal ball and the second metal ball. And the step of erecting the mold is to penetrate the second metal ball into a perforated plate, utilize a magnet to be arranged opposite to the perforated plate, and adsorb the first metal ball through the magnet to erect the probe set so as to form a mold erecting module. And in the injection molding and drying step, a liquid material is injected into the vertical mold module and then dried to form an elastic rubber block, and the probe set is erected and partially coated in the elastic rubber block, so that the first metal ball is positioned right above the second metal ball, and one end of the first metal ball, which is far away from the metal wire, and one end of the second metal ball, which is far away from the metal wire, protrude out of the elastic rubber block to obtain an elastic structure. The attaching step is to attach a test circuit board to one side of the elastic structure to obtain an integrated circuit test module, wherein the other side of the elastic structure is used for electrically contacting a component to be tested.
The method for manufacturing an integrated circuit test module according to the foregoing embodiments, wherein the volume of each second metal ball may be larger than the volume of each first metal ball.
In the method for manufacturing an integrated circuit test module according to the aforementioned embodiment, the aperture plate may include a plurality of holes, and the second metal balls of each probe set are disposed corresponding to each hole.
The method for manufacturing an integrated circuit test module according to the foregoing embodiment, wherein the liquid material may be a hot melt adhesive.
According to the method for manufacturing the integrated circuit testing module of the aforementioned embodiment, the testing circuit board may include a plurality of contacts, the holes of the opening plate are arranged according to the contacts of the testing circuit board, and the second metal balls are electrically connected to the contacts.
In the method for manufacturing an integrated circuit test module according to the aforementioned embodiment, the first metal balls are electrically contacted with the device under test.
Therefore, the probe set and the elastic rubber block replace the traditional probe, and the integrated circuit is electrically tested, so that the defects of high maintenance cost, short service life and the like of the traditional probe are overcome, and the purposes of simple maintenance, long service life and low manufacturing cost of the probe are achieved.
Drawings
In order to make the aforementioned and other objects, features, and advantages of the invention, as well as others which will become apparent, reference is made to the following description taken in conjunction with the accompanying drawings in which:
FIG. 1 is a flow chart illustrating steps in a method for fabricating an integrated circuit test module according to an embodiment of the invention; and
fig. 2A, fig. 2B, fig. 2C and fig. 2D respectively show schematic diagrams of a manufacturing process of the manufacturing method of the integrated circuit test module according to fig. 1.
Description of reference numerals:
100: method for preparing integrated circuit test module
110,120,130,140: step (ii) of
200: probe set
210: first metal ball
220: second metal ball
230: metal wire
300: perforated plate
310: hole(s)
400: magnet
500: elastic rubber block
600: elastic structure
700: integrated circuit test module
710: test circuit board
711: contact point
720: device under test
Detailed Description
Embodiments of the present invention will be described below with reference to the accompanying drawings. For the purpose of clarity, numerous implementation details are set forth in the following description. However, the reader should understand that these implementation details should not be used to limit the invention. That is, in some embodiments of the invention, such implementation details are not necessary. In addition, some conventional structures and elements are shown in simplified schematic form in the drawings for the sake of simplifying the drawings; and repeated elements will likely be referred to using the same reference numerals.
Referring to fig. 1, fig. 2A, fig. 2B, fig. 2C and fig. 2D, wherein fig. 1 is a flowchart illustrating a method 100 for manufacturing an integrated circuit test module according to an embodiment of the invention. Fig. 2A, fig. 2B, fig. 2C and fig. 2D respectively show a schematic process diagram of the method 100 for manufacturing the integrated circuit test module according to fig. 1. The method 100 for manufacturing an integrated circuit test module includes steps 110,120,130 and 140.
In step 110, a plurality of probe sets 200 are provided, as shown in fig. 2A, each probe set 200 includes a first metal ball 210, a second metal ball 220, and a metal wire 230, wherein the metal wire 230 is connected between the first metal ball 210 and the second metal ball 220. In detail, the diameter of the first metal ball 210 may be 20mil to 100mil, the diameter of the second metal ball 220 may be 60mil to 140mil, the volume of the second metal ball 220 needs to be larger than the volume of the first metal ball 210, and the metal wire 230 is connected between the first metal ball 210 and the second metal ball 220 by soldering. The metal materials of the first metal ball 210, the second metal ball 220 and the metal wire 230 can be selected from metals with high conductivity and low cost, and the first metal ball 210, the second metal ball 220 and the metal wire 230 are made of copper metal in the invention, but the invention is not limited thereto.
Step 120 is to perform a mold erecting step, as shown in fig. 2B, in which the second metal balls 220 are inserted into an opening plate 300, and a magnet 400 is disposed opposite to the opening plate 300, and the first metal balls 210 are attracted by the magnet 400 to erect the probe set 200, so as to form a mold erecting module (not shown). In detail, the aperture plate 300 includes a plurality of holes 310, the holes 310 may have a diameter of 40-120 mil, which allows the first metal balls 210 to pass through but does not allow the second metal balls 220 to pass through completely, and the second metal balls 220 of each probe set 200 are disposed corresponding to the holes 310, so that the second metal balls 220 partially pass through and are disposed in the holes 310 of the aperture plate 300. Thereafter, the magnet 400 is disposed opposite to the aperture plate 300, and the first metal ball 210 is attracted by the magnet 400 so that the probe set 200 can be placed upright, thereby facilitating the completion of mold erection.
Step 130 is performing an injection molding and drying step, as shown in fig. 2C, a liquid material is injected into the vertical mold module and then dried to form an elastic rubber block 500, and the probe set 200 is erected and partially covered in the elastic rubber block 500, so that the first metal ball 210 is located right above the second metal ball 220, and one end of the first metal ball 210, which is far away from the metal wire 230, and one end of the second metal ball 220, which is far away from the metal wire 230, protrude out of the elastic rubber block 500, so as to obtain an elastic structure 600. In detail, the liquid material may be, but is not limited to, a hot melt adhesive, which has the characteristics of elasticity, insulation and deformability after being dried, the compression stroke of the elastic adhesive block 500 is 0.25 mm to 0.35 mm, and the elastic force of the elastic adhesive block 500 can be adjusted by changing the injection density to meet the requirements of different test products. In addition, since the perforated plate 300 cannot allow the second metal balls 220 to completely pass through, during injection molding and drying, part of the second metal balls 220 cannot be covered by the elastic rubber block 500 and protrude out of the elastic rubber block 500, and by adjusting the injection molding height, part of the first metal balls 210 can protrude out of the elastic rubber block 500, so that the first metal balls 210 and the second metal balls 220 can be in contact with each other, and after drying, the perforated plate 300 needs to be removed.
Step 140 is a bonding step, as shown in fig. 2D, in which a test circuit board 710 is bonded to one side of the elastic structure 600 to obtain an integrated circuit test module 700, wherein the other side of the elastic structure 600 is used to electrically contact a device 720 to be tested. In detail, the test circuit board 710 includes a plurality of contacts 711, and the test circuit board 710 may be, but not limited to, a Printed Circuit Board (PCB) or a circuit board manufactured by other processes. In addition, during the mold-erecting step, the hole-opening plate 300 should be provided with holes 310 arranged differently according to the arrangement of the contacts 711 of the test circuit board 710, so that the probe sets 200 can be arranged through the hole-opening plate 300, and after drying, the hole-opening plate 300 is removed. Then, the elastic structure 600 is disposed on the test circuit board 710, the second metal balls 220 are electrically connected to the contacts 711, and the first metal balls 210 are electrically contacted to the device to be tested 720.
More specifically, because the elastic rubber block 500 has a deformable characteristic, during testing, the elastic structure 600 can deform in response to the magnitude of the force applied thereto, so as to ensure that the first metal ball 210 and the second metal ball 220 of the probe set 200 respectively contact the contact 711 of the dut 720 and the testing circuit board 710, so that the signal generated by the first metal ball 210 contacting the dut 720 is transmitted to the second metal ball 220 via the metal wire 230, and then the signal is transmitted to the testing circuit board 710 by the second metal ball 220. In addition, the elastic rubber block 500 is simple in process and low in cost, only the step of injection molding and drying is needed, no additional complex process is needed, and the elastic rubber block has the advantage of reducing the production cost.
In addition, the device 720 to be tested can be, but not limited to, a chip or a wafer, and the first metal balls 210 of the probe set 200 are used for contacting an integrated circuit on the chip or the wafer, and after electrically connecting with the device 720 to be tested through the test circuit board 710, transmit various test signals to the integrated circuit on the device 720 to be tested, and then transmit the test signals back to the test circuit board 710 through the integrated circuit, so as to determine the electrical characteristics of the integrated circuit in the device 720 to be tested and whether the integrated circuit is good or not.
The integrated circuit testing module 700 of the present invention can further adjust the electrical parameters and the mechanical parameters according to the requirements, wherein the electrical parameters can be customized according to the thickness or length of the metal wires 230 and the materials of the first metal balls 210 and the second metal balls 220, and the mechanical parameters can be customized according to the height and density of the injection molding or the sizes of the first metal balls 210 and the second metal balls 220.
The probe set of the bimetallic ball has the resistance of less than 30 milliohm, the current of less than 6A and 40GHz and the attenuation of less than 1DB after the electrical test by utilizing the probe set of the bimetallic ball, and the resistance of less than 60 milliohm, the current of less than 3A and 40GHz and the attenuation of less than 0.2DB after the electrical test by utilizing the conventional double-ended probe, so that the probe set and the elastic rubber block can replace the conventional double-ended probe, and the defects of high maintenance cost, short service life and the like of the conventional probe are overcome.
In summary, the integrated circuit testing module of the present invention generates the elastic structure having the elastic rubber block and the probe set by injection molding to replace the conventional dual-head probe, and electrically connects the device to be tested to the testing circuit board via the elastic structure, so that the integrated circuit testing module can electrically test the integrated circuit in the device to be tested, thereby reducing the manufacturing and maintenance costs of the dual-head probe and simplifying the replacement process of the production line.
Although the present invention has been described with reference to the above embodiments, it should be understood that various changes and modifications can be made therein by those skilled in the art without departing from the spirit and scope of the invention.
Claims (10)
1. An integrated circuit test module, comprising:
a test circuit board including a plurality of contacts; and
an elastic structure disposed on the test circuit board, the elastic structure comprising:
a plurality of probe sets, each probe set comprising a first metal ball, a second metal ball and a metal wire, wherein the metal wire is connected between the first metal ball and the second metal ball, and the second metal ball is electrically connected to the plurality of contacts; and
the probe groups are vertically and partially coated in the elastic rubber block, so that the first metal ball is positioned right above the second metal ball, and one end of the first metal ball, which is far away from the metal wire, and one end of the second metal ball, which is far away from the metal wire, protrude out of the elastic rubber block;
the first metal ball is used for electrically contacting a component to be tested.
2. The integrated circuit test module of claim 1, wherein the volume of each of the second metal balls is greater than the volume of each of the first metal balls.
3. The integrated circuit test module of claim 1, wherein the first metal ball, the second metal ball, and the metal wire are made of copper metal.
4. The integrated circuit test module of claim 1, wherein the compression stroke of the resilient rubber block is 0.25 mm to 0.35 mm.
5. A method of fabricating an integrated circuit test module, comprising:
providing a plurality of probe groups, wherein each probe group comprises a first metal ball, a second metal ball and a metal lead, and the metal lead is connected between the first metal ball and the second metal ball;
performing a mold erecting step, namely, penetrating the second metal balls into a perforated plate, arranging a magnet opposite to the perforated plate, and adsorbing the first metal balls by the magnet to erect the probe groups so as to form a mold erecting module;
injecting a liquid material into the vertical mold module, drying to form an elastic rubber block, wherein the probe groups are vertically and partially coated in the elastic rubber block, so that the first metal ball is positioned right above the second metal ball, one end of the first metal ball, which is far away from the metal wire, and one end of the second metal ball, which is far away from the metal wire, protrude out of the elastic rubber block, and an elastic structure is obtained; and
and a bonding step of bonding a test circuit board to one side of the elastic structure to obtain an integrated circuit test module, wherein the other side of the elastic structure is used for electrically contacting an element to be tested.
6. The method according to claim 5, wherein the volume of each second metal ball is greater than the volume of each first metal ball.
7. The method according to claim 5, wherein the aperture plate comprises a plurality of holes, and the second metal ball of each probe set is disposed corresponding to each hole.
8. The method of manufacturing an integrated circuit test module according to claim 5, wherein the liquid material is a hot melt adhesive.
9. The method according to claim 7, wherein the test circuit board comprises a plurality of contacts, the holes of the perforated plate are arranged according to the plurality of contacts of the test circuit board, and the second metal balls are electrically connected to the plurality of contacts.
10. The method of claim 5, wherein the first metal balls are in electrical contact with the DUT.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010221789.9A CN111403307B (en) | 2020-03-26 | 2020-03-26 | Integrated circuit test module and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010221789.9A CN111403307B (en) | 2020-03-26 | 2020-03-26 | Integrated circuit test module and preparation method thereof |
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| CN111403307A true CN111403307A (en) | 2020-07-10 |
| CN111403307B CN111403307B (en) | 2023-09-29 |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02158071A (en) * | 1988-12-12 | 1990-06-18 | Fujitsu Ltd | Connector |
| US4998885A (en) * | 1989-10-27 | 1991-03-12 | International Business Machines Corporation | Elastomeric area array interposer |
| US5371654A (en) * | 1992-10-19 | 1994-12-06 | International Business Machines Corporation | Three dimensional high performance interconnection package |
| CN104422863A (en) * | 2013-08-20 | 2015-03-18 | 致茂电子股份有限公司 | Semiconductor test device |
-
2020
- 2020-03-26 CN CN202010221789.9A patent/CN111403307B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02158071A (en) * | 1988-12-12 | 1990-06-18 | Fujitsu Ltd | Connector |
| US4998885A (en) * | 1989-10-27 | 1991-03-12 | International Business Machines Corporation | Elastomeric area array interposer |
| US5371654A (en) * | 1992-10-19 | 1994-12-06 | International Business Machines Corporation | Three dimensional high performance interconnection package |
| US5821763A (en) * | 1992-10-19 | 1998-10-13 | International Business Machines Corporation | Test probe for high density integrated circuits, methods of fabrication thereof and methods of use thereof |
| CN104422863A (en) * | 2013-08-20 | 2015-03-18 | 致茂电子股份有限公司 | Semiconductor test device |
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| CN111403307B (en) | 2023-09-29 |
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