CN1421911A

CN1421911A - Improved structure of integrated circuit test bench

Info

Publication number: CN1421911A
Application number: CN 01140063
Authority: CN
Inventors: 蔡炳根
Original assignee: Individual
Current assignee: Individual
Priority date: 2001-11-23
Filing date: 2001-11-23
Publication date: 2003-06-04

Abstract

The improved structure of IC test bench consists of test sockets with through holes, springs and tin beads and the springs and the tin beads are inserted into the through holes successively. The lower part is soldered to the base board to form tin pins, and the tin pins, the springs and the tin beads are connected to the circuit copper tracks on the base board for conducting of power supply signal. The spring enclosed inside make the tin beads contact elastically with the bottom tin pins of the tested article. The present invention is for the fast and accurate measurement of ICs. When the present invention is used in testing ICs in package, the tin pins will not be damaged. In addition, the present invention has shortened distance between the tested article and the base board and thus less interference and less measurement error.

Description

The integrated circuit testing abutment structure improves

Technical field

The present invention relates to a kind of integrated circuit testing abutment structure and improve, be meant that especially a kind of the detection for integrated circuit component to be measured reach accurately, fast, and can promote the structure that integrated circuit encapsulates good rate.

Technical background

Common integrated circuit detects the base station structure, as Fig. 4, shown in Figure 5, A group member wherein: after mainly being probe 1003 that will contact integrated circuit component (being determinand), stake body 1002 inside that spring 1005 is installed in tubulose in regular turn, make again stake body 1002 be inserted in the test pedestal 100 connected the seat hole 1001 in, pin 1004 protrudes from test pedestal 100 belows and is integral with machine plate 4 (consulting shown in Figure 1 in addition) mat soldering, and probe 1003 just convexedly stretches in 1001 tops, a hole and dwindles mouthful 10011 outer suitable lengths; When desire detects, with determinand 2 (that is: integrated circuit component, as IC etc.) as shown in Figure 1 correspondence be positioned over test pedestal 1 (wherein testing pedestal 1 is the schematic diagram that equates effect with common test pedestal 100), the fixed lever 41 that screws groove 31 corresponding machine plates 4 that again pressing plate 3 is had expanded hole 311, light power presses down to rotate after pressing plate 3 contacts determinand 2 and test pedestal 1 fully fixes it, so, can detect smoothly whether determinand 2 is complete non-defective unit, and aforementioned common probe 1003 head ends have three-pawl type, four-jaw type substantially, or circular inner concavity.

And for example B organizes member among Fig. 4, wherein probe 1003 ' is protuberance 10031 ', 10041 ' the cover postpone of mat spring 1005 ' with its corresponding end face with pin 1004 ', make the following protuberance 10042 ' plant of pin 1004 ' lower end go in the seat hole 40 of machine plate 4, establish with the molten welding of tin ball again.

For another example shown in the C of Fig. 4 group member, whether common detecting member can have the tin ball according to the bottom of determinand 2, and do the correction of equivalence member, wherein in the C group member, be directly with spring 1005 " be placed on pin 1004 " upper convex portion 10041 " after; will put in order the seat hole 1001 that group being placed through test pedestal 100; will descend protuberance 10042 again " be inserted in the seat hole 40 of machine plate 4, so, when if the bottom of determinand 2 has the tin ball, then detect member and promptly need not establish probe, and if determinand 2 bottoms are when establishing the tin pin with more smooth shape weldering, then need be set as the detecting member and have A as described above, the probe 1003 of B group member, 1003 '.

Yet, aforesaid A, B detecting member is when detecting, because of probe 1003,1003 ' head end have suitable sharpness, though the tin that the spring 1005 of its below, 1005 ' elasticity can avoid probe 1003,1003 ' direct rigid contact measured thing 2 welderings to establish connects (if tin pin) surface, still make tin ball surface puncture tin ball or tin pin surface easily because of acutance, start and cause integrated circuit component forms the good rates of reduction such as empty weldering, cold welding when encapsulation phenomenon, when serious even cause the integrated circuit short circuit, this is its principal disadvantage.

Detect the base station structure according to aforesaid common integrated circuit, wherein aforementioned A, B, C organizes member, because of test pedestal 100 is nested with probe 1003 for adapting to, 1003 ' or

spring

1005,1005 ', 1005 " with stake body 1002 or pin 1004; 1004 '; 1004 " etc. member, its whole height X (consulting Fig. 5) has 0.8 to 1.5 centimetre at least, when determinand 2 is put it and is gone up detection, because of whole height bigger, when connecting to detecting instrument, the signal of determinand 2 easily produces noise because of the external interference factor, signal attenuation, or be subjected to electromagnetic interference, cause the numerical value generation error that records determinand 2, this is its another shortcoming.

Summary of the invention

The objective of the invention is to propose a kind of integrated circuit testing abutment structure and improve, make it can avoid causing empty weldering, cold welding after the encapsulation, thereby promote its good rate, and the numerical error rate that records determinand is reduced.

The technical scheme that realizes above-mentioned purpose of the present invention and take is as described below: it mainly is to connect the test pedestal that is provided with a plurality of holes by one that this integrated circuit testing abutment structure improves, the spring that is provided with by respective amount, tin pin etc. are formed, wherein aforementioned spring and tin ball are in the sheathed in regular turn seat hole of going into aforementioned test pedestal, be connected to machine plate and form the tin pin with soldering in its lower side again, the tin pin, spring, and but the circuit copper rail of member such as tin ball and machine plate connects turn-on power signal when establishing, and sealing spring and tin ball and unlikely coming off, the elasticity of mat spring makes the tin ball on it be elastic shape contact measured thing bottom tin welding spot, and promptly form one this moment can be quick, accurately, and promote the test base station structure that integrated circuit encapsulates good rate.Tin ball in the aforementioned test pedestal can be provided with for than burnishing surface the time according to determinand bottom tin pin.Tin ball in the aforementioned test pedestal can be according to determinand bottom tin pin as not being provided with when spherical for protruding.

Because the elasticity of spring makes the tin ball on it be elastic shape contact measured thing bottom tin welding spot, and the determinand (that is: IC wafer or other integrated circuit components) of tin ball smooth surface order encapsulation is when detecting, unlikely being punctured of tin ball that its bottom weldering is established or tin pin surface, avoid the integrated circuit after tested when B.G.A. encapsulation mode (Ball Garry Array) is produced, to cause empty weldering, cold welding, thereby promote its good rate, and the unlikely integrated circuit encapsulation back of causing produces short circuit phenomenon.

Aforementioned test pedestal is simple and easy because of structures such as the tin ball in the seat hole, springs, the whole height Y that causes the test pedestal is reduced to only about below 0.25-0.4 centimetre, when determinand is put on it when detecting, because of whole height lower, when connecting to detecting instrument, the signal of determinand (that is: integrated circuit component) is difficult for causing the numerical error rate that records determinand and reducing because of the external interference factor produces noise, signal is weak or phenomenon such as electromagnetic interference.

(or claim: probe) can adapt to the determinand bottom is that weldering is established than the tin pin of burnishing surface or the tin ball of convex shape to wherein aforementioned tin ball, and whether decision adds, as the determinand bottom is when being the tin pin of burnishing surface, then can add the tin ball on the spring, if the bottom is the tin sphere of convex shape, then the spring top does not need to establish in addition the tin ball, but spring is located at the corresponding position of machine plate earlier with the weldering of tin pin, to test the corresponding spring position bonnet in seat hole of pedestal again and establish on it, can finish a splendid testboard.

In sum, integrated circuit testing abutment structure of the present invention improves, really have easy to use and can improve and commonly puncture that tin ball surface is caused the integrated circuit encapsulation empty weldering, cold welding the time to occur, easily produced that noise, signal are weak, can't move during high frequency, be subject to electromagnetic interference and cause the effect that good rate reduces, phenomenons such as more unlikely generation short circuit corrupted so just can fast, accurately detect integrated circuit component.

Description of drawings

As for detailed structure of the present invention, use effect and principle, then the accompanying drawing illustrated embodiment is described further and can be understood completely with reference to following.

Wherein:

Fig. 1 is the user mode three-dimensional exploded view of the present invention's one preferred embodiment;

Fig. 2 is the constructing stereo exploded view of this preferred embodiment of the present invention;

Fig. 3 is the plane local structure assembling section of this preferred embodiment of the present invention;

Fig. 4 is the constructing stereo exploded view that common integrated circuit detects base station; With

Fig. 5 is the plane local structure assembling section that common integrated circuit detects base station.

Piece number explanation among the figure:

1,100---test pedestal 10,1001---seat hole

1002---stake body 1003,1003 '---probe

11---tin balls 101,10011---dwindle mouth

12,1005---tin ball 10041 "---upper convex portion

1004,1004 ', 1004 "---pin 10041,10031 '---protuberance

10041 "---upper convex portion 10042 ', 10042 "---following protuberance

13---the tin pin

2---determinand 3---pressing plate

31---screwing groove 311---expanded hole

4---machine plates 40---seat hole

41---fixed lever 410---expansion section

42---connect winding displacement

Embodiment

Fig. 4, Fig. 5 are that the solid that common integrated circuit detects abutment structure is decomposed and plane local structure assembly drawing, its undesirable part as described above, in repeated description no longer herein.

Fig. 1 is the user mode three-dimensional exploded view of a preferred embodiment of the present invention, consult Fig. 2 simultaneously, by can finding out among the figure, the present invention mainly is made up of institutes such as the spring 12 that connects the test pedestal 1 that is provided with a plurality of holes 10, be provided with by respective amount, tin balls 11; When assembling, in the sheathed in regular turn seat hole 10 of going into to test pedestal 1 of aforementioned spring 12 and tin ball 11, be connected to machine plate (that is: circuit board) with soldering and form tin pin 13 in its lower side again, but make tin pin 13, spring 12, and the circuit copper rail of member such as tin ball 11 and machine plate 4 connect turn-on power signal when establishing, and sealing spring 12 and tin ball 11 make its unlikely coming off, the elasticity of mat spring 12 makes the tin ball 11 on it be elastic shape, forms the structure of an integrated circuit testing base station.

Wherein, aforesaid tin ball 11 can determine if do not establish according to the polycrystalline substance of determinand 2, as determinand 2 bottoms is when being than burnishing surface, then can be provided with tin ball 11 on the spring 12, be as determinand 2 bottoms and protrude tin when spherical, then tin ball 11 can omit and not establish, and after only spring 12 weldering earlier being placed the seat hole 40 of machine plate 4, will test pedestal 1 again and cover to establish on it and get final product.

When using, please consult Fig. 1 simultaneously, Fig. 2, shown in Figure 3, determinand 2 (that is: IC wafer or other integrated circuit components) before order prepares to produce places the top of test pedestal 1, the expanded hole 311 of pressing plate 3 is inserted for 41 times by the fixed lever with expansion section 410 and pressed and be located at determinand 2 tops, to screw groove 31 again according to after the certain orientation rotation, can fast determinand 2 be fixedly arranged on the test pedestal 1, to connect winding displacement 42 again and be connected with connector in detecting instrument, all signal transportings that make determinand 2 behind the open detection instrument promptly record all data of determinand 2 during to detecting instrument.

Again, when detecting, the tin ball surface of establishing because of the tested place weldering of determinand 2 bottoms touches tin ball 11 (or the title: surface probe) with round slip surface, the tin ball surface of the unlikely destruction determinand 2 of the sphere of this slyness shape, when the empty weldering of integrated circuit unlikely appearance when the B.G.A. encapsulation mode is produced, phenomenons such as cold welding and reduce good rate, more can not cause integrated circuit encapsulation back generation short circuit phenomenon because of tin ball surface is punctured, and because of the distance of the determinand 2 on the test pedestal 1 to 4 of machine plates shortens, cause the integrated circuit component of determinand 2 when tested its signal do not have that noise produces or the signal of transmission is weak, and can reduce phenomenons such as being subjected to electromagnetic interference when detecting, thereby reaching one has accurately, fast, promote the base station structure that integrated circuit encapsulates effects such as good rate.

Change or the modification done under this invention's idea it should be noted that above-described only is a preferred embodiment of the present invention, if then all should drop in protection scope of the present invention.

Claims

1. an integrated circuit testing abutment structure improves, mainly be to connect the test pedestal (1) that is provided with a plurality of holes (10) by one, the spring (12) that is provided with by respective amount, tin pin (13) etc. are formed, it is characterized in that, aforementioned spring (12) and tin ball (11) are in the sheathed in regular turn seat hole (10) of going into aforementioned test pedestal (1), be connected to machine plate (4) with soldering and form tin pin (13) in its lower side again, tin pin (13), spring (12), and tin ball members such as (11) and machine plate (4) but circuit copper rail connect turn-on power signal when establishing, and sealing spring (12) and tin ball (11) and unlikely coming off, the elasticity of mat spring (12) makes the tin ball (11) on it be elastic shape contact measured thing bottom tin welding spot, and promptly form one this moment can be quick, accurately, and promote the test base station structure that integrated circuit encapsulates good rate.

2. integrated circuit testing abutment structure as claimed in claim 1 improves, and it is characterized in that the tin ball (11) in the aforementioned test pedestal (1) can be provided with for than burnishing surface the time according to determinand bottom tin pin (13).

3. integrated circuit testing abutment structure as claimed in claim 1 improves, and it is characterized in that, the tin ball (11) in the aforementioned test pedestal (1) can be according to determinand bottom tin pin (13) as not being provided with when spherical for protruding.