CN2729717Y - Investigating module set for electronic component - Google Patents
Investigating module set for electronic component Download PDFInfo
- Publication number
- CN2729717Y CN2729717Y CN 200420012589 CN200420012589U CN2729717Y CN 2729717 Y CN2729717 Y CN 2729717Y CN 200420012589 CN200420012589 CN 200420012589 CN 200420012589 U CN200420012589 U CN 200420012589U CN 2729717 Y CN2729717 Y CN 2729717Y
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- CN
- China
- Prior art keywords
- circuit board
- switching circuit
- electrical junction
- machine plate
- plural
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses an investigating module group for electronic components, which is composed of a testing machine plate, at least one switching circuit board, and at least one supporting seat, wherein, the supporting seat is used for arbitrarily assembling the electronic components, such as wafers, etc.; the upper face of the testing machine plate, both faces of the switching circuit board and the bottom face of the supporting seat are respectively provided with corresponding electric contact points, which causes that the supporting seat can be assembled on the switching circuit board. The switching circuit board can be arbitrarily assembled with testing machines of different types to form the investigating module group for the electronic components, which achieves the effect that the testing machine plate and the supporting seat can be arbitrarily replaced.
Description
Technical field
The utility model relates to a kind of test module of electronic component, particularly a kind of test module that provides electronic components such as wafer to carry out the electronic component of yields and rate detection.
Background technology
Now electronic component such as wafer in encapsulation or form finish after, must see through a kind of wafer inspection machine and carry out attribute test, remove the electronic components such as wafer that have effects such as flaw or speed not cite to eliminate; The test module of known electronic component, generally include a test machine plate, be provided with plug-in electric connector in plate face chosen place, as the various electric connector on the computer motherboard, can provide the wafer that is installed in circuit board to peg graft by this, in order to do carrying out electronic components test work such as its wafer with this circuit board and electric connector.But known its electric connector of test machine plate mat provides the form of the circuit board grafting with electronic components such as wafers, because of its electric connector adopts fixing form, the design of must condescending to take this post of circuit board with electronic components such as wafers will be made, be difficult to go to find the circuit design problem by test job, further exploitation has more the wafer of function or usefulness enhancement or the circuit board of wafer assembling usefulness, and when having the circuit board change form of electronic components such as wafer, will make whole test machine plate not be inconsistent use.
The utility model content
The purpose of this utility model be to solve commonly see the wafer inspection machine plate because of electric connector be that solid form causes be difficult to test the problem of finding circuit design, and a kind of test module that overcomes the electronic component of above-mentioned shortcoming is provided, reach the effect that can change test machine plate and stacker arbitrarily.
The utility model is made up of a test machine plate, at least one switching circuit board, at least one stacker, wherein, the test machine plate is the circuit motherboard that uses of computer, electronic product, motor or machinery now, it is provided with and meets required circuit of this product and electronic component, is provided with the electrical junction of assembling for switching circuit board in the plate face;
Switching circuit board is assembled on the test machine plate, is provided with the electrical junction of the electrical junction of matching test machine plate in the bottom surface, and in the top electrical junction that is provided with the coupling stacker;
Stacker is the electric connection socket that can provide electronic component such as wafer to peg graft and remove arbitrarily, has an insulating base frame, is provided with electronic component in insulating base frame to plant portion, and is provided with the electrical junction of the electrical junction of coupling switching circuit board in the insulating base frame bottom surface;
Stacker is assembled on the switching circuit board, the electrical junction of the electrical junction of its bottom surface and switching circuit board plate face constitutes electric connection, switching circuit board is assembled on the test machine plate, and the electrical junction of the electrical junction of its bottom surface and test machine plate constitutes electric connection.
It is the form that plural terminals pin and plural jack are complementary that described test machine plate and switching circuit board constitute the electrical junction that electrically connects, or is the form that plural circuit junction and plural tin ball are complementary.
It is the form that plural terminals pin and plural jack are complementary that described switching circuit board and stacker constitute the electrical junction that electrically connects, or is the form that plural circuit junction and plural tin ball are complementary.
The utility model makes stacker can be assembled in switching circuit board, and switching circuit board can be arbitrarily and the assembling of the test machine plate of different types, to form the test module of electronic component, reaches the effect that can change test machine plate and stacker arbitrarily.
Description of drawings
Fig. 1 is a perspective exploded view of the present utility model.
Fig. 2 is the synoptic diagram that terminal pin and jack are complementary for electrical junction of the present utility model.
Fig. 3 is the synoptic diagram that circuit junction and tin ball are complementary for electrical junction of the present utility model.
Fig. 4 is embodiment one synoptic diagram in electrical junction of the present utility model.
Fig. 5 is embodiment two synoptic diagram in electrical junction of the present utility model.
Embodiment
See also shown in Figure 1, the utility model is made up of a test machine plate 1, at least one switching circuit board 2, at least one stacker 3 for electronic components such as any assembled wafers, wherein, test machine plate 1 is the circuit motherboard that uses of computer, electronic product, motor or machinery now, its chosen place is provided with and meets required circuit of this product and electronic component, and is provided with the electrical junction 11 of assembling for switching circuit board 2 in the plate face;
Stacker 3 is the electric connection sockets that can provide electronic component such as wafer to peg graft and remove arbitrarily, it has an insulating base frame 31, be provided with electronic component in insulating base frame 31 and plant portion 32, and be provided with the electrical junction 33 of the electrical junction 22 of coupling switching circuit board 2 in insulating base frame 31 bottom surfaces;
By this, make stacker 3 be assembled on the switching circuit board 2, make the electrical junction 33 of its bottom surface and the electrical junction 22 formation electric connections of switching circuit board 2 plate faces, and make switching circuit board 2 be assembled on the test machine plate 1, make the electrical junction 21 of its bottom surface and the electrical junction 11 formation electric connections of test machine plate 1, promptly form the test module of the electronic component of the utility model.
As mentioned above, the test machine plate 1 of the utility model, switching circuit board 2, stacker 3, be to be provided with the electrical junction 11 that to mate connection mutually respectively at chosen place, 21,22,33 etc., its embodiment as shown in Figure 2, be to make test machine plate 1 and switching circuit board 2 constitute the electrical junction 11 that electrically connects, 21, and stacker 3 constitutes the electrical junction 33 that electrically connects with switching circuit board 2,22, can be embodied as the form that plural terminals pin and plural jack are complementary, as shown in Figure 2, this test machine plate 1 is provided with plural jack 111, these switching circuit board 2 bottom surfaces are provided with plural terminals pin 211, and be provided with plural jack 221 in switching circuit board 2 plate faces, and make stacker 3 be embodied as being provided with plural terminals pin 331, get final product mat plural terminals pin and plural jack by this and be complementary, make test machine plate 1, switching circuit board 2, stacker 3 is formed the test module of electronic component.
See also shown in Figure 3, can make test machine plate 1 and switching circuit board 2 constitute the electrical junction 11 that electrically connects, 21, and stacker 3 constitutes the electrical junction 33 that electrically connects with switching circuit board 2,22, can be embodied as the form that plural circuit junction and plural tin ball are complementary, as shown in Figure 3, test machine plate 1 is provided with plural circuit junction 112, switching circuit board 2 bottom surfaces are provided with plural tin ball 212, be provided with plural circuit junction 222 in switching circuit board 2 plate faces, and make stacker 3 be embodied as being provided with plural tin ball 332, can making test machine plate 1 by this, switching circuit board 2, stacker 3 is formed the test module of electronic component.
See also shown in Figure 4, can make test machine plate 1 and switching circuit board 2 constitute the electrical junction 11 that electrically connects, 21, and stacker 3 constitutes the electrical junction 33 that electrically connects with switching circuit board 2,22, can be embodied as the form of above-mentioned electric connection mode cross-application, as shown in Figure 4, test machine plate 1 is provided with plural jack 111, switching circuit board 2 bottom surfaces are provided with plural terminals pin 211, constitute by this and electrically connect assembling, and switching circuit board 2 plate faces are provided with plural circuit junction 222, and stacker 3 is embodied as and is provided with plural tin ball 332, also can make test machine plate 1 by this, switching circuit board 2, stacker 3 is formed the test module of electronic component.Or as shown in Figure 5, wherein test machine plate 1 plate face is provided with plural circuit junction 112, switching circuit board 2 bottom surfaces are provided with plural tin ball 212, constitute by this and electrically connect assembling, switching circuit board 2 plate faces are provided with plural jack 221, and this stacker 3 is embodied as and is provided with plural terminals pin 331, also can form the test module of electronic component, as seen electrical junction the 11,21,22, the 33rd of the present utility model can the conversion according to actual demand, is not limited to an above-mentioned shaping type.
The utility model is when electronic components such as testing wafer, be that the electronic component that electronic components such as wafer are plugged in stacker 3 is planted portion 32, see through switching circuit board 2 by this and be connected, can carry out test events such as a series of quality, function and speed with test machine plate 1.Especially the utility model is tested module with electrical junction 11,21 designs of switching circuit board 2 with test machine plate 1 and form, so, can be subject to known electric connector integrated mode, and convenient test machine plate 1 or the switching circuit board 2 changed arbitrarily.
Claims (3)
1, a kind of test module of electronic component, it is characterized in that: it is made up of a test machine plate, at least one switching circuit board, at least one stacker, wherein, the test machine plate is provided with required circuit and electronic component, is provided with the electrical junction of assembling for switching circuit board in the plate face; Switching circuit board is assembled on the test machine plate, is provided with the electrical junction of the electrical junction of matching test machine plate in the bottom surface, and in the top electrical junction that is provided with the coupling stacker; Stacker is the electric connection socket that can provide electronic component such as wafer to peg graft and remove arbitrarily, it has an insulating base frame, be provided with electronic component in insulating base frame and plant portion, and be provided with the electrical junction of the electrical junction of coupling switching circuit board in the insulating base frame bottom surface; Stacker is assembled on the switching circuit board, the electrical junction of the electrical junction of its bottom surface and switching circuit board plate face constitutes electric connection, switching circuit board is assembled on the test machine plate, and the electrical junction of the electrical junction of its bottom surface and test machine plate constitutes electric connection.
2, the test module of a kind of electronic component according to claim 1, it is characterized in that: it is the form that plural terminals pin and plural jack are complementary that described test machine plate and switching circuit board constitute the electrical junction that electrically connects, or is the form that plural circuit junction and plural tin ball are complementary.
3, the test module of a kind of electronic component according to claim 1, it is characterized in that: it is the form that plural terminals pin and plural jack are complementary that described switching circuit board and stacker constitute the electrical junction that electrically connects, or is the form that plural circuit junction and plural tin ball are complementary.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200420012589 CN2729717Y (en) | 2004-10-12 | 2004-10-12 | Investigating module set for electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200420012589 CN2729717Y (en) | 2004-10-12 | 2004-10-12 | Investigating module set for electronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2729717Y true CN2729717Y (en) | 2005-09-28 |
Family
ID=35048492
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200420012589 Expired - Fee Related CN2729717Y (en) | 2004-10-12 | 2004-10-12 | Investigating module set for electronic component |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2729717Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112309486A (en) * | 2019-07-26 | 2021-02-02 | 第一检测有限公司 | Chip testing device |
-
2004
- 2004-10-12 CN CN 200420012589 patent/CN2729717Y/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112309486A (en) * | 2019-07-26 | 2021-02-02 | 第一检测有限公司 | Chip testing device |
| CN112309486B (en) * | 2019-07-26 | 2024-04-12 | 第一检测有限公司 | Chip testing device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: LIANG XIWEI Free format text: FORMER OWNER: ZI ZHONGXING Effective date: 20071109 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20071109 Address after: 100044, room 3, building 6, car 311, main street, Xicheng District, Beijing Patentee after: Liang Xiwei Address before: 226500 Rugao city of Jiangsu province Hangyuan Pu 207 building 303 room Patentee before: Zi Zhongxing |
|
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |