JP2007121222A - Semiconductor chip test socket - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a semiconductor chip test socket, in particular, suitable for testing a bare chip, in the semiconductor chip test socket easy to be handled and operated surely. <P>SOLUTION: The semiconductor chip test socket 1 is constituted of a socket receiving part 10 for positioning and holding two-dimensionally a semiconductor chip 23 within a horizontal plane, and a socket cover 40 provided with a plurality of probes 44 contacting with the semiconductor chip 23 from its upper side. Paired connectors 25L, 25R, 46L, 46R are provided in the socket receiving part 10 and the socket cover 40. The connectors in a socket receiving 10 side is connected to a test circuit, and the connectors in a socket cover 40 side is connected to the probes 44. The socket cover 40 is approached to the socket receiving part 10 from its upper side to fit the socket cover 40 with the socket receiving 10, and the connectors 25L, 25R are coupled thereby to the connectors 46L, 46R. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a semiconductor chip test socket.

  Semiconductors are tested in various aspects of the manufacturing process. The test is performed with a probe in contact with the electrode terminal. The wafer before dicing and dividing into individual semiconductor chips is tested by bringing a probe card into contact therewith. At the stage where the semiconductor chip is wire-bonded to the package, the probe is brought into contact with the electrode terminal on the package side for testing. The test may be performed in a bare chip state before bonding to the package.

Patent Document 1 describes a semiconductor chip socket for testing a bare chip. In this semiconductor chip socket, the bare chip is fixed to a stage that can move back and forth, right and left, and up and down, and the bare chip is brought into contact with a probe provided on the socket lid by moving the stage.
Japanese Patent Laid-Open No. 9-80116 (page 3-4, FIGS. 1-4)

  It is an object of the present invention to provide a semiconductor chip test socket that is easy to handle and reliable in operation, and is particularly suitable for a bare chip test.

  (1) In order to achieve the above-described object, the present invention provides a socket receiving portion that includes a socket receiving portion that two-dimensionally positions and holds a semiconductor chip in a horizontal plane, and a plurality of probes that contact the semiconductor chip from above. In the semiconductor chip test socket, a pair of connectors is provided on the socket receiving portion and the socket lid portion, the connector on the socket receiving portion side is connected to the test circuit, and the connector on the socket lid portion side is connected to the probe. At the same time, the socket lid portion is brought closer to the socket receiving portion from above, so that the fitting of the socket lid portion and the socket receiving portion is achieved and the connection of the connector is achieved.

  According to this configuration, since the socket lid is completely separated from the socket receiver, when setting the probe, the socket lid is inverted so that the lower surface to which the probe is to be attached faces upward. Can work easily. Further, since the socket lid portion is brought closer to the socket receiving portion from above, the fitting of the socket lid portion and the socket receiving portion and the coupling of the connector are executed as a series of operations, so that the operation procedure is simple. In addition, since the electrical connection between the socket lid and the socket receiving part is performed by a connector instead of a flat cable or the like, a reliable electrical connection can be obtained without fear of disconnection or the like.

  (2) In the semiconductor chip test socket having the above-described configuration, the present invention also includes a movement of the semiconductor chip positioning member in the socket receiving portion, and a lowering of the socket lid portion after the socket lid portion is fitted into the socket receiving portion. However, both are characterized by being performed by a lead screw.

  According to this configuration, the semiconductor chip can be accurately positioned by the feed screw. Moreover, since the lowering of the socket lid is also performed by the feed screw, it can be brought into contact slowly so that an excessive force is not applied to the probe and the electrode terminal. In addition, pneumatic piping or the like is not necessary for the operation, and a complicated test mechanism is not required, and the test socket can be made small and excellent in portability.

  According to the present invention, it is possible to obtain a semiconductor chip test socket in which preparatory work such as setting of a probe is easy, and the probe and the semiconductor chip can be accurately positioned and contacted with ease.

  Hereinafter, an embodiment of the present invention will be described with reference to FIGS. 1 is a front view of the semiconductor chip test socket, FIG. 2 is a top view of the socket receiving portion, FIG. 3 is a side view of the semiconductor chip test socket, FIG. 4 is a bottom view of the socket lid portion, and FIGS. FIG. 7 is a top view of the semiconductor chip test socket, showing a state different from FIG.

  The semiconductor chip test socket 1 includes a socket receiver 10 and a socket lid 40. First, the structure of the socket receiver 10 will be described.

  The frame 11 forms the center of the structure of the socket receiver 10. The gantry 11 is a planar rectangle, and is horizontally supported on a desk or a floor by legs (not shown). A stage 12 is installed at the center of the top surface of the gantry 11. The stage 12 includes a rectangular parallelepiped anvil block 13 and a planar rectangular enclosure 14 surrounding the upper surface of the anvil block 13. Of the four sides of the enclosure 14, sliders 17 and 18 are respectively installed on a side 15 extending along the longitudinal direction of the gantry 11 and a side 16 extending in a direction orthogonal thereto (see FIG. 2). The sliders 17 and 18 are connected to feed screws 19 and 20 arranged outside the enclosure 14.

  It is preferable to use a material having excellent corrosion resistance for the members constituting the stage 12, and apply gold plating to the material to improve the friction resistance and prevent the charging.

  Positioning hooks 21 and 22 each having a planar L shape are fixed to the sliders 17 and 18 inside the enclosure 14. When the feed screws 19 and 20 are rotated, the positioning hook 21 slides in the longitudinal direction of the mount 11 (this is referred to as the X-axis direction), and the positioning hook 22 is orthogonal to the positioning hook 22 (this is referred to as the Y-axis direction). Slide. The semiconductor chip 23 is placed in a space surrounded by the positioning hooks 21 and 22 and positioned.

  A pair of fitting guides 24 </ b> L and 24 </ b> R are installed on the upper surface of the gantry 11 so as to sandwich the stage 12. Each of the fitting guides 24L and 24R is configured by arranging two vertical walls extending in the Y-axis direction at intervals in the X-axis direction. Connectors 25L and 25R are installed in the fitting guides 24L and 24R. The connectors 25L and 25R are paired with a connector on the socket lid 40 side described later. A plurality of plug pins 26 protrude vertically upward from the connectors 25L and 25R.

  Angles 27 </ b> L and 27 </ b> R for receiving the socket lid portion 40 are disposed outside the fitting guide 23. Feed screws 29L and 29R screwed into female screw blocks 28L and 28R installed on the gantry 11 are connected to and supported by the angles 27L and 27R so as to be rotatable and non-separable in the axial direction. Thumb wheels 30L and 30R are fixed to the feed screws 29L and 29R on the lower surface of the gantry 11, respectively. When the thumb wheels 30L and 30R are turned with a finger, the feed screws 29L and 29R advance and retreat, that is, move up and down with respect to the nut blocks 28L and 28R.

  Timing pulleys 31L and 31R are fixed to the feed screws 29L and 29R below the thumb wheels 30L and 30R, and a timing belt 32 is wound around the timing pulleys 31L and 31R. With this structure, if one of the feed screws 29L and 29R rotates, the other rotates by the same angle, and the angles 27L and 27R are evenly raised and lowered.

  As shown in FIG. 3, the guide rod 33 hangs down from both ends of the angles 27L and 27R. The guide rod 33 vertically penetrates a guide block 34 installed on the upper surface of the gantry 11. With this structure, the angles 27L and 27R move up and down in a state in which they are always kept horizontal without rotating in a horizontal plane around the feed screws 29L and 29R or tilting left and right in FIG.

  Catch plates 35 are installed on the upper surfaces of the angles 27L and 27R. The catch plate 35 prevents the socket lid portion 40 received by the angles 27L and 27R from coming out upward. As shown in FIG. 2, the catch plate 35 is provided with a long hole 36 extending in the X-axis direction. Two elongated holes 36 are arranged in parallel, and a stud bolt 37 is screwed into the angles 27L and 27R through each elongated hole 36. With this configuration, the catch plate 35 can slide in the X-axis direction within the range of the length of the long hole 36.

  Next, the structure of the socket lid 40 will be described. The center of the socket lid 40 is a lid plate 41 having the same size as the gantry 11. At both ends in the longitudinal direction of the lid plate 41, notches 42 for receiving the vertical wall portions of the angles 25L and 25R are formed.

  A probe card 43 is attached to the lower surface of the lid plate 41. The probe card 43 is of a type adapted to the semiconductor chip 22 to be tested. A plurality of straight type vertical probes 44 are attached to the probe card 43 according to a predetermined arrangement pattern.

  A pair of fitting guides 45 </ b> L and 45 </ b> R are installed on the lower surface of the cover plate 41 so as to sandwich the probe card 43. Each of the fitting guides 45L and 45R is configured by arranging two vertical walls extending in the Y-axis direction at intervals in the X-axis direction. The fitting guides 45L and 45R enter into the fitting guides 24L and 24R of the socket receiving part 10.

  Connectors 46L and 46R are installed in the fitting guides 45L and 45R. The connectors 46L and 46R are paired with the connectors 25L and 25R of the socket receiving portion 10 and have socket holes for receiving the plug pins 26 of the connectors 25L and 25R.

  The connectors 46L and 46R are electrically connected to the probe card 43 via printed wiring boards 47L and 47R shown in FIG. The connectors 25L and 25R are electrically connected to a test circuit (not shown).

The semiconductor chip test socket is used as follows. The socket lid 40 is removed, and the test semiconductor chip 23 is placed in the space surrounded by the positioning hook 21 and the positioning hook 22. When the feed screws 19 and 20 are turned to bring the positioning hooks 21 and 22 closer to the semiconductor chip 23, the positioning hook 21 comes into contact with two adjacent sides of the semiconductor chip 23, and the positioning hook 22 comes into contact with the remaining two sides of the semiconductor chip 23. In contact, the semiconductor chip 23 is two-dimensionally positioned and held in the horizontal plane.

  Since the positioning hook 21 moves only in the X-axis direction and the positioning hook 22 moves only in the Y-axis direction, the semiconductor chip 23 is pushed in the X-axis direction and the Y-axis direction so that a specific angle is settled at one point. Become. In the configuration of FIG. 2, the lower right corner of the semiconductor chip 23 is a specific corner, and the point where the corner settles is the reference point. The probe card 43 is fixed to the socket lid 40 using this reference point as an index.

  After the semiconductor chip 23 is two-dimensionally positioned on the stage 12 as described above, the socket lid portion 40 is placed on the angles 27L and 27R. 3 and 5 correspond to this state. Needless to say, at this time, the catch plate 35 is slid outward so as not to hinder the placement.

  When the socket lid portion 40 is placed on the angles 27L and 27R, the vertical wall portions of the angles 27L and 27R are fitted into the notches 42 at both ends of the lid plate 41. At the same time, the fitting guides 45L and 45R are fitted into the fitting guides 24L and 24R. Thereby, fitting of the socket cover part 40 and the socket receiving part 10 is achieved.

  When the socket lid portion 40 and the socket receiving portion 10 are fitted, the plug pins 26 of the connectors 25L and 25R are also inserted into the connectors 46L and 46R. Thereby, the connection between the connectors 25L and 25R and the connectors 46L and 46R is achieved.

  When the fitting of the socket lid 40 and the socket receiver 10 is completed, the catch plate 35 is slid inward as shown in FIGS. 6 and 7 so that the socket lid 40 does not come off the angles 27L and 27R. Then, the feed screws 29L and 29R are rotated, and the angles 27L and 27R are lowered. If either one of the thumb wheels 30L, 30R is rotated, the feed screws 29L, 29R rotate synchronously, and the angles 27L, 27R descend while maintaining the same relative height.

  When the angles 27L and 27R are lowered, the slide lid portion 40 restrained by the catch plate 35 is also lowered, and the connectors 25L and 25R and the connectors 46L and 46R are deepened. When the probe 44 contacts the electrode terminal of the semiconductor chip 23, the rotation of the feed screws 29L and 29R is stopped, and the semiconductor chip 23 is tested.

  After the test is completed, the feed screws 29L and 29R are rotated in the reverse direction to push up the socket lid 40, and the probe 44 is pulled away from the semiconductor chip 23. After raising the socket lid 40 to the level shown in FIGS. 3 and 5, the catch plate 35 is opened outward, and the socket lid 40 is removed. Then, the feed screws 19 and 20 are reversely rotated to release the restraint of the semiconductor chip 23, and the semiconductor chip 23 is taken out.

    Although the embodiments of the present invention have been described above, the scope of the present invention is not limited to these embodiments, and various modifications can be made without departing from the spirit of the invention.

    The present invention can be widely used for semiconductor chip test sockets.

Front view of semiconductor chip test socket Top view of socket receptacle Side view of semiconductor chip test socket Bottom view of socket lid A front view of the semiconductor chip test socket, showing a state different from FIG. A front view of the semiconductor chip test socket showing different conditions Top view of semiconductor chip test socket

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Semiconductor chip test socket 10 Socket receiving part 12 Stage 19, 20 Feed screw 21, 22 Positioning hook 25L, 25R Connector 27L, 27R Angle 29L, 29R Feed screw 40 Socket cover part 44 Probe 46L, 46R Connector

Claims (2)

In a semiconductor chip test socket comprising a socket receiving part for positioning and holding a semiconductor chip two-dimensionally in a horizontal plane, and a socket lid part having a plurality of probes contacting the semiconductor chip from above,
The socket receiving portion and the socket lid portion are provided with a pair of connectors, the socket receiving portion side connector is connected to the test circuit, the socket lid portion side connector is connected to the probe, and the socket lid portion is connected to the socket. The semiconductor chip test socket, wherein the socket lid and the socket receiver are fitted together by being brought closer to the receiver from above, and the connector is connected.   The movement of the semiconductor chip positioning member in the socket receiving portion and the lowering of the socket lid portion after the socket lid portion is fitted to the socket receiving portion are both performed by a feed screw. 2. A semiconductor chip test socket according to 1.

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