JP2001066345A - Burn-in board of semiconductor ic - Google Patents

Abstract

PROBLEM TO BE SOLVED: To easily and securely suppress noise which is easy to generate, specially, between a socket substrate and an inspection substrate as to the constitution of the burn-in board of a semiconductor IC. SOLUTION: This burn-in board is constituted including a socket substrate 22 on which an IC socket 222 is mounted, an inspection substrate 21 which is sized corresponding to multiple socket substrates, and a connector device 23 connecting the socket substrate 22 and inspection substrate 21. The connector device is composed of a plug connector 235 mounted on the socket substrate and a jack connector 231 mounted on the inspection substrate.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a burn-in test used in a burn-in test (hereinafter, simply referred to as a test) in which an accelerated test of a semiconductor IC (hereinafter, simply referred to as IC) is performed to generate and remove an initial failure of the IC.・ Especially and easily suppresses noise caused by an external electromagnetic field, which is likely to occur between the socket board on which the IC socket is mounted and the inspection board equipped with circuits required for inspection, in relation to the board configuration The present invention relates to a burn-in board for a semiconductor IC in which the productivity in an inspection process is improved.

[0002]

2. Description of the Related Art FIG. 40 schematically illustrates a conventional burn-in board.

FIG. 1 shows an example in which a socket board corresponding to one IC socket is connected to an inspection board by two sets of connectors.

Referring to FIG. 40 for explaining a general burn-in board for inspecting an IC, a burn-in board 1 includes an inspection board 11 provided with circuits required for inspection and a plurality of IC sockets 12 mounted on the board. Consists of

[0005] In this case, the test board 11 has conductor leads 11 formed by patterning between the burn-in waveform input terminal group 11a provided at one end for inputting a burn-in signal and the mounting area 11b of the IC socket 12.
are connected by c.

The inspection board 11 of the IC socket 12
(A) in which the corresponding mounting area is extracted
As shown in the figure, the connection pins 12a of the IC socket 12 are inserted into and connected to the through holes 11d provided in the mounting area 11b of the substrate 11.

In view of this, each IC socket 12 of the inspection board 11 is turned upside down as shown by the arrow A in FIG.
Then, by connecting the burn-in waveform input terminal group 11a of the inspection board 11 to an inspection device (not shown), there is an advantage that a plurality of ICs 10 can be inspected collectively.

[0008]

However, since the burn-in board 1 has a configuration in which a plurality of IC sockets 12 are mounted on the inspection board 11, the IC 1 has a high dimensional accuracy.
In addition, it is difficult to respond quickly to the increase in the number of pins and the narrow pitch of the package, and it is also difficult to respond quickly to the increase in the number of products of various types and small lots.

[0009]

The object of the present invention is to provide a socket board on which an IC socket is mounted, an inspection board having a size corresponding to the plurality of socket boards, and a connector device for connecting the socket board and the inspection board. The connector device is solved by a burn-in board of a semiconductor IC comprising a plug connector mounted on the socket substrate and a jack connector mounted on the inspection substrate.

[0010] Also, a socket board on which an IC socket is mounted, an inspection board having a size corresponding to the plurality of socket boards, and the same jack connector surface-mounted on each of the socket board and the inspection board are arranged. And a relay terminal plate for connecting between the socket substrate and the inspection substrate.The relay terminal plate has at least a conductor region of a size covering the entire surface thereof, and the jack connector has A semiconductor I comprising short-circuit means for short-circuiting the conductor region of the relay terminal plate to the ground electrode of each of the inspection substrate and the socket substrate when the relay terminal plate is inserted.
Solved by C burn-in board.

Further, the socket board on which the IC socket is mounted, an inspection board having a size corresponding to the plurality of socket boards, and the same jack connector surface-mounted on each of the socket board and the inspection board are arranged. And a relay terminal plate for connecting the socket substrate and the inspection substrate. The jack connector has an L-shaped cross section orthogonal to the longitudinal direction and has an outer surface parallel to the insertion direction of the relay terminal plate. Consisting of two connection terminal plates on which striped signal lead electrodes are formed and a ground electrode is formed on the entire inner surface, and a jack insulator for holding and fixing the connection terminal plates back to back at predetermined intervals. The relay terminal plate is configured such that a circuit board on which a signal lead electrode corresponding to the signal lead electrode of the connection terminal plate is formed is attached to a metal plate. There is solved by burn in board of the semiconductor IC that is formed to a thickness corresponding to the predetermined interval.

In general, when a burn-in board is configured so that the IC socket is detachable from the test board without directly mounting the IC socket on the test board, the IC
The IC to be inspected can be freely selected.

Therefore, in the present invention, a burn-in board is configured so that a small-sized socket board on which one IC socket is mounted can be connected to an inspection board via a connector device.

This is because by preparing only the small-sized socket substrate corresponding to the IC, it is possible to immediately respond to the increase in the number of pins and the narrow pitch of the package.
This shows that it is possible to correspond to ICs of various kinds and small lots.

Therefore, a burn-in board that can easily inspect any IC can be realized.

[0016]

FIG. 1 is a diagram for explaining a burn-in board of the present invention, FIG. 2 is a diagram for explaining each connector of FIG. 1, and FIG. 3 is a diagram for explaining a jack terminal of FIG. 4
FIG. 5 illustrates the plug insulator of FIG. 2, FIG. 6 illustrates the plug insulator of FIG. 2, FIG. 7 illustrates the plug insulator of FIG. 2, and FIG. FIG.

FIG. 8 is a view for explaining another burn-in board of the present invention together with a connector, FIG. 9 is a view for explaining a jack insulator of the jack connector of FIG. 8, and FIG.
FIG. 11 illustrates a ground terminal of the jack connector of FIG. 8, FIG. 11 illustrates a ground terminal holding piece of the jack connector of FIG. 8, FIG. 12 illustrates an assembly process of the jack connector of FIG. FIG. 14 is a diagram illustrating a ground terminal plate in the relay terminal plate of FIG. 8, FIG. 14 is a diagram illustrating a signal terminal plate in the relay terminal plate of FIG. 8, and FIG.
FIG. 3 is a diagram illustrating a connection state as a board.

FIG. 16 shows a third burn-in mode of the present invention.
FIG. 17 is a diagram illustrating a board together with a connector, FIG. 17 is a diagram illustrating a jack insulator of the jack connector of FIG. 16, FIG. 18 is a diagram illustrating a ground terminal of the jack connector of FIG. 16, and FIG. FIG. 20 illustrates a circuit board corresponding to the burn-in board of FIG. 16, FIG. 21 illustrates an application example of the jack connector of FIG. 16, and FIG.
And FIG. 23 is a diagram illustrating an assembling process of the jack connector.

FIG. 24 is a view for explaining another jack connector according to the present invention, FIG. 25 is a view for explaining a jack insulator in FIG. 24, and FIG. 26 is a view for explaining a ground terminal in FIG. 27 is a view for explaining an assembling process of the jack connector of FIG.

FIG. 28 shows a fourth burn-in mode of the present invention.
FIG. 29 is a diagram illustrating the board together with the connector, FIG. 29 is a diagram illustrating the ground plate of FIG. 28, FIG. 30 is a diagram illustrating the insulating plate of FIG. 28, and FIG. 31 is a diagram illustrating an assembly process of the jack connector of FIG. FIG. 32 is a view for explaining a fifth burn-in board of the present invention together with a connector, FIG. 33 is a view for explaining a jack insulator of the jack connector of FIG. 32, and FIG. Illustration to explain, FIG. 35
Is a diagram illustrating an assembly process of the jack connector of FIG. 32;
36 illustrates a circuit board corresponding to the burn-in board of FIG. 32, FIG. 37 illustrates a relay terminal board of FIG. 32, and FIG. 38 illustrates a connection state as a fifth burn-in board. FIG. 39 is a view for explaining another connection terminal plate corresponding to the jack insulator of FIG.

In the figure, the case where the present invention is applied to the burn-in board described with reference to FIG. 40 is shown as an example. Therefore, the same symbols are given to the same target members and parts as in FIG. Is omitted for.

FIG. 1 schematically illustrates a burn-in board according to the present invention. In FIG. 1, a burn-in board 2 includes an inspection board 21 provided with circuits required for inspection and one IC socket 222 corresponding to a required IC. The socket device 22 includes a connector device 23 including a jack connector 231 mounted on the inspection substrate 21 and a plug connector 235 mounted on the socket substrate 22.

The plug connector 235 on one side of the connector device 23 is connected to the socket board 22.
And two jack connectors 231 are provided on the inspection board 21 in the respective placement areas of the socket boards 22 on the inspection board 21.
1 is surface-mounted to correspond to 1.

The test board 21 is connected between a burn-in waveform input terminal group 21a provided at one end for inputting a burn-in signal and an arrangement area of the jack connector 231 by conductor leads 21b formed by patterning. Is what it is.

Then, the socket substrate 22 on which the IC socket 222 is mounted is brought close to the inspection substrate 21 as shown by an arrow b, and the plug connector 235 of the socket substrate 22 and the jack connector 231 of the inspection substrate 21 are fitted. , The socket board 22 and the inspection board 21 are connected.

FIG. 2 is a view for explaining each connector in the burn-in board 2. FIG. 2 (a) is a view in which both the jack connector 231 and the plug connector 235 are cross-sectionally viewed on a plane orthogonal to the terminal row. FIG. 3B is a diagram showing a state before connection, and FIG.

That is, in the drawing, the jack connector 231 is provided with a plurality of jack terminals 232 made of an elastic metal plate such as phosphor bronze, and the respective jack terminals 232 are implanted in two rows at a predetermined pitch "p ₁ ". The plug connector 235 is made of a metal plate and has the same number of plug terminals 236 as the jack terminals, and the plug terminals 236 are implanted in two rows at the pitch “p ₁ ”. 237.

To facilitate understanding, the jack connector 231 will be described in detail with reference to FIGS. 3 and 4 and FIG.
6, the plug connector 235 will be described in detail first.

That is, in FIG. 3, the jack terminal 232 formed in a comb blade shape with the pitch "p ₁ " on _one side 232 "of the connecting member 232 'is a contact located on the free end side. The other end side is formed on the board connection terminal 232c whose right end is bent at right angles in the thickness direction from the insulator fixing portion 232b following the area of 232a, and is connected to the connection member 232 'at the tip of the board connection terminal area. It is in the state where it was.

The area of the contact 232a is formed in an arc shape projecting in a direction opposite to the connecting member, and the area of the insulator fixing portion 232b is provided with bulges 232b 'projecting on both sides in the width direction. ing.

The jack terminal 232 can be easily separated from the connecting member 232 'by bending at the end 232c' of the board connecting terminal 232c.

In FIG. 4 for explaining the jack insulator,
(A) is an overall perspective view, (b) is a plan view, and (c) is a front view in partial cross section.

In the figure, the jack insulator 233 is such that the terminal holes 233a corresponding to the insulator fixing portions 232b of the jack terminals 232 described with reference to FIG. 3 maintain the predetermined row distance "p ₂ " at the above-mentioned pitch "p ₁ ". Terminal forming area 233 formed
The periphery of b is surrounded by a peripheral wall 233c having a height exceeding the length from the insulator fixing portion to the contact tip.

It should be noted above terminal hole 233a, the terminal column direction width "b _1" bulge 23 of the insulator attaching portion 232b
2b 'is configured so as to press-fit, also the terminal row direction of the height "b _2" is set to substantially correspond to the arc height of the contact 232a.

Further, on the outer side of the peripheral wall in the terminal hole row direction, a board mounting piece 233d protruding from the peripheral wall at a position corresponding to the terminal planting area is formed with a board mounting hole 233e. Lower surface, ie, the substrate mounting surface 233d '
Is formed on a step surface projecting from the lower surface 233b 'of the terminal hole forming region by an amount substantially corresponding to the thickness of the jack terminal 232.

Therefore, the two jack terminals 232 connected to the connecting member 232 'arranged on the board mounting surface side of the jack insulator 233 are connected with the arrow C ₁ so that the arc projecting sides of the respective contacts face each other. _, C ₂ , and after inserting into the terminal hole 233a of the jack insulator 233 and pressing the insulator fixing portion 232b into the terminal hole 233a,
The required jack connector 231 can be configured as shown in FIG. 2A by removing the connecting member 232 'by breaking.

In this jack connector 231, the arc-shaped apex of the contact 232a of each of the jack terminals 232 rises from the inner surface of the peripheral wall 233c, and the board connection terminal 232c of each of the jack terminals 232c.
Is located on a surface substantially coincident with the board mounting surface 233d 'of the jack insulator.

On the other hand, in FIG. 5, the plug terminal 236 formed in a comb blade shape with the pitch "p ₁ " on one side 236 "of one side of the connecting member 236 'is in the area of the contact 236a located on the free end side. The other end side from the insulator fixing portion 236b is formed on the board connection terminal 236c which is bent at a right angle in the thickness direction, and is connected to the connecting member 236 'at the end of the board connection terminal area. is there.

The region of the contact 236a is formed in a straight shape and the insulator fixing portion 236b is formed.
Are provided with bulges 236b 'protruding on both sides in the width direction.

The plug terminal 236 can be easily separated from the connecting member 236 'by bending at the end 236c' of the board connection terminal 236c, as in the case of the jack terminal 232.

In FIG. 6 for explaining the plug insulator,
(A) is an overall perspective view, and (b) is a cross-sectional view as viewed from the direction of arrow A.

In FIG. 6, the plug insulator 237 has the outer size in plan view, which is the jack insulator 23 described in FIG.
3 and the terminal hole 237b corresponding to the insulator fixing portion 236b of the plug terminal 236 described with reference to FIG.
₁ "while maintaining a predetermined inter-row distance" p ₃ ", and protruding from one side of the board mounting piece 237a between the terminal hole rows with a thickness corresponding to the inter-row distance. Partition 23
7c is formed.

The terminal hole 237b in this case is
The width “b ₃ ” in the terminal row direction is set so that the bulge 236 b ′ of the insulator fixing portion 236 b of the plug terminal 236 can be press-fitted, and the height “b ₄ ” in the terminal row direction is the same as that of the plug terminal 236. The thickness is set to substantially correspond to the thickness.

Further, the length c ₁ of the partition 237 c in the terminal row direction is determined by the peripheral wall 233 of the jack insulator 233.
substantially matching the clear width c ₂ terminal row direction in c, also above thickness is of the partition wall 237c is the jack connector 231
The height of the partition 237c from the substrate mounting piece is slightly smaller than the height of the peripheral wall 233c.

In the vicinity of both ends in the longitudinal direction of the board mounting piece 237a, the board mounting holes 2 of the jack insulator 233 are provided.
A substrate mounting hole 237d substantially similar to that of the substrate mounting surface 233d is formed.
Similarly to the case of the jack insulator 233, 7a 'is formed on the step surface protruding from the lower surface 237b' of the terminal hole 237b forming area by an amount substantially corresponding to the thickness of the plug terminal 236.

Therefore, the second connector 236 ′ connected to the connecting member 236 ′ disposed on the board mounting surface side of the plug insulator 237.
Of the plug terminals 236 to the respective contacts 2
36a is inserted into the terminal hole 237b of the plug insulator 237 as the contact-side of the arrow D _1, D ₂ so as to be positioned on the surface of the partition wall 237 c, planted in press-fit into the terminal hole 237b of the insulator fixing portion 236b Then, the connecting member 236 '
Of the plug connector 23 by breaking
5 can be configured as shown in FIG.

In the plug connector 235, the contact 236a of each plug terminal 236 is
c, and the outer surface of the board connection terminal 236c of each plug terminal substantially coincides with the board mounting surface 237a 'of the plug insulator.

FIG. 2B shows a state in which the jack connector 231 and the plug connector 235 having such a configuration are positioned so as to face each other, as viewed in cross section in the terminal row direction.

The partition 237c of the plug connector 235 is inserted into the inside of the peripheral wall 233c of the jack connector 231 by approaching the connectors. As described above, the length of the partition in the terminal row direction and the terminal row of the peripheral wall are Since the in-direction method corresponds, at least each contact 236a of the plug terminal and each contact 23a of the jack terminal
Since the connectors are inserted into each other while being in contact with the connector 2a, the state shown in (c) is obtained, so that connection between the connectors can be realized as a result.

FIGS. 7A and 7B for explaining a circuit board corresponding to each of the above connectors, FIG. 7A shows a circuit board for a socket board, and FIG. 7B shows a circuit board for an inspection board.

That is, in FIG. 7A, the circuit board 221 in which two jack connectors 231 described in FIG. 2A are mounted in parallel so as to correspond to the plug connectors 235 includes: A connection electrode 221a having a size corresponding to the substrate connection terminal is formed in a pattern at a position corresponding to the substrate connection terminal 236c of each plug terminal 236, and a substrate mounting hole 237d of the plug insulator 237 is formed.
A connector mounting hole 221b is formed at each position corresponding to.

[0052] Then, in the intermediate region of the two plug connector arrangement area indicated by a broken line E _1, the through hole 221c is provided for mounting the IC socket 222 shown in FIG. 1, and further respective through hole 221c The corresponding connection electrodes 221a are connected to the corresponding connection electrodes 221a by conductor leads 221d formed by patterning.

Therefore, the IC socket 222 and the plug connector 235 are positioned and mounted on the circuit board 221, and then, by utilizing a normal solder connection technique or the like, the I.
The socket board 22 on which the C socket and the plug connector are mounted can be configured as shown in FIG.

In FIG. 7B, the circuit board 211 in which two jack connectors 231 described in FIG. 2A are mounted in parallel in each of the arrangement areas of the socket board 22 is mounted on the circuit board 211 in this case. A connection electrode 211a having a size corresponding to the board connection terminal is formed at a position corresponding to the board connection terminal 232c of each jack terminal 232, and a board mounting hole 233e of the jack insulator 233 is formed.
A connector mounting hole 211b is formed at each position corresponding to.

[0055] Then, between the burn-wave input terminal group 21a (not shown) described in each connection electrode 211a and FIG. 1 in two jack connector arrangement area indicated by a broken line E ₂ are connected by a conductor lead 211c.

Then, by positioning and mounting the jack connector 231 on the circuit board 211 and using a normal solder connection technique or the like, the inspection board 21 on which the jack connector is mounted is configured as shown in FIG. can do.

Therefore, after the socket board 22 on which the IC 10 is mounted is connected to the test board 21 as shown in FIG. 1, the test board 21 is connected to the test apparatus (not shown) via the burn-in waveform input terminal group 21a. , A plurality of ICs 10 can be inspected collectively.

In the burn-in board 2, the jack connector arranged on the test board is changed according to the IC to be tested and the socket board, so that it is easy to immediately respond to the increase in the number of pins and the narrow pitch of the IC and the package. As a result, there is a merit that it is possible to cope with an increase in multi-product small-lot products.

On the other hand, recently, with the development of electronic technology, a variety of types that perform burn-in inspection at a low voltage are increasing. For example, an IC with a 5-V power supply as an acceleration test value has an allowable noise of about 0.2 V. In the case of an IC with a 3V power supply as a test value, the allowable noise width during inspection tends to be narrower because the allowable noise is below 0.2V.

The above-described burn-in board 2 has a drawback that the noise is liable to ride in the connection area between the connectors.

FIG. 8 shows a burn-in system in consideration of such a disadvantage.
It shows a board.

That is, in FIG. 8, another burn-in board 3 according to the present invention comprises an inspection board 31, a socket board 32, and a relay terminal plate 33 connecting between the boards 31, 32.

The test board 31 is the test board 2 shown in FIG.
1 except that only the jack connector 231 is replaced by a jack connector 311 according to the present invention, and the other configuration is the same as that of the inspection board 21 described above.

Therefore, the inspection board 31 is formed as shown in FIG.
Circuit board 211 described above and the jack connector 31
In particular, the jack connector 311 in this case includes a jack insulator 312, the jack terminal 232 mounted on the jack insulator, and a ground terminal suppressing piece 313 fixed to the jack insulator 312. And a ground terminal 314 fixed to the jack insulator.

The socket board 32 is obtained by replacing only the plug connector 235 in the socket board 22 of FIG. 1 with the jack connector 311 according to the present invention, and the other configuration is the same as that of the inspection board 21.

Accordingly, the socket board 32 is composed of the circuit board 221 described with reference to FIG. 7A, the IC socket mounted on the circuit board, and the jack connector 311.

Further, the relay terminal plate 33 is connected to the ground terminal plate 331.
And two signal terminal plates 3 fixed to both surfaces of the ground terminal plate.
32.

First, the jack connector 311 will be described in detail with reference to FIGS. 9 to 12, and the relay terminal plate 33 will be described in detail with reference to FIGS. 13 and 14.

In FIG. 9 illustrating the jack insulator, FIG.
1 is an overall perspective view, (b) is a plan view thereof, and (c) is a partially sectional front view.

In the figure, the jack insulator 312 in this case is
Peripheral wall 23 of jack insulator 233 described in FIG.
3c is cut into the middle area on both sides in the longitudinal direction with a predetermined width “d ₁ ” to reach the substrate mounting piece 233d from the opening side with a predetermined width “d ₁ ”.
This is changed to a peripheral wall 312b provided with 2a.

Therefore, the terminal holes 233a described above are formed in two rows at an adjacent pitch "p ₁ " in the terminal planting area 233b surrounded by the peripheral wall 312b.
The fact that a board mounting hole 233e is formed in 33d is the same as in the case of the jack insulator 233.

In FIG. 10 for explaining the ground terminal,
(A) is the whole perspective view, (b) is the front view.

The ground terminal 314 in this case, which is formed by bending a metal plate having elasticity such as phosphor bronze, is shown in FIG.
At both ends of the contact area 314a of predetermined length tip is formed by bending into a U-shape that narrows slightly "e _1", which is widened from the positioning portion 314b and the positioning portion of the flat predetermined width "e _2" ground connection piece 314c is formed in a state of being connected at the U-shaped root.

The contact region 314a is formed
The gap “e ₃ ” at the tip of the letter-shaped portion is formed so as to be slightly smaller than the thickness of the ground terminal plate 331 of the relay terminal plate 33 in FIG.

The predetermined length “e ₁ ” is formed slightly longer than the length of the signal terminal plate 332 in the relay terminal plate 33, and the predetermined width “e ₂ ” is formed in the jack insulator 312 of FIG. The width “d ₁ ” of the notch 312 a is slightly smaller than the width “d ₁ ”, and the distance “e ₄ ” between the ground connection pieces 314 c is the width of the peripheral wall 3 of the jack insulator 312.
Longitudinal length of 12b from "d _2" is slightly larger.

Further, each of the ground connection pieces 314 c is provided with each of the board mounting holes 2 in the jack insulator 312.
A board mounting hole 314d having substantially the same size as the board mounting hole is formed at a position corresponding to 33e.

Therefore, the positioning part 314 b of the grounding terminal 314 is inserted into the notch 31 of the jack insulator 312.
2a, the grounding terminal can be positioned and mounted on the surface of the board mounting piece 233d of the jack insulator by inserting the grounding terminal into the jack insulating body. And the board mounting hole 233e of the jack insulator.

In FIG. 11, the ground terminal holding piece 313 made of the same resin material as the jack insulator 312 is large enough to fit into the cut area of the peripheral wall 312b of the jack insulator without any gap, and in the height direction of the peripheral wall. Is formed to be shorter than the height of the peripheral wall by an amount slightly exceeding the thickness of the ground terminal 314.

A groove 313b having a width slightly exceeding the thickness of the ground terminal plate 331 in the relay terminal plate 33 is formed on one surface 313a along the longitudinal direction.

The relay terminal plate is guided in the region of the ground terminal plate 331 in a state where the two ground terminal holding pieces 313 are fitted into the notches 312a of the peripheral wall so that the respective grooves 313b face each other. It has become so.

Therefore, as shown in FIG. 12, the jack terminal 2 shown in FIG.
32 was planted as described above, cuts the ground terminal 314, as shown by the arrow F ₁ of the jack insulator 31
Inserted into 2a, further the jack insulator above the ground terminal restraining piece 313 inserted into the notch 312a of as the arrow F _2, F ₃ as the groove 313b is facing, then the ground terminal suppressed piece of adhesive The required jack connector 311 can be configured as shown in FIG. 8 by bonding to the body.

Thereafter, the plurality of jack connectors 311
Is mounted on the circuit board 211 described with reference to FIG. 7B, a required inspection board 31 can be realized as shown in FIG. 8, and the IC socket and the two jack connectors 311 are connected to each other. The circuit board 2 described with reference to FIG.
By mounting on the socket 21, the required socket board 32 can be realized as shown in FIG.

On the other hand, in FIG. 13, the relay terminal plate 3 shown in FIG.
The third ground terminal plate 331 is an insulating plate 331 made of resin or the like.
The conductor film 331b is applied to both surfaces of the substrate a by a normal conductor film forming technique.

In this case, the size of the ground terminal plate 331 is such that the length “f ₁ ” is equal to the length of the groove 3 formed facing the peripheral wall of the jack connector 311 as described above.
13b, and the width "f ₂ " is equal to the height of the peripheral wall of the jack connector minus the thickness of the ground terminal 314, in other words, approximately equal to the length of the ground terminal retaining piece 313. The thickness “f ₃ ” corresponds to the groove 3 described above.
It is adapted to correspond to the width "b _1" of 13b.

In FIG. 14, the relay terminal plate 3 shown in FIG.
The third signal terminal plate 332 is an insulating plate 332 made of resin or the like.
A straight conductor lead 332b is formed parallel to the width direction on one side by a normal conductor lead forming means.

The size of the insulating plate 332a is formed so that the length "f ₃ " can exceed at least the length of the row of jack terminals in the jack connector 311 and can enter the peripheral wall of the jack connector. ₄ "and width of the ground terminal plate 331 exceeds twice the distance from the peripheral wall open surface in the jack connector to the contact apex of the jack 232 'is sufficiently smaller than forming f _2", thickness the jack connector In this case, the thickness of the ground terminal plate 331 slightly exceeds 1/2 after the thickness of the ground terminal plate 331 is reduced due to the distance between the opposed contacts.

The width of each of the conductor leads 332b substantially corresponds to the contact width of the jack terminal 232, and the pitch between adjacent conductor leads is the pitch between adjacent terminals of the jack terminal, that is, the aforementioned "p ₁ ". It corresponds to.

Therefore, the required relay terminal plate 33 can be realized as shown in FIG. 8 by attaching the two signal terminal plates 332 to the center positions of both surfaces of the ground terminal plate 331 by a normal bonding technique. it can.

FIG. 15 for explaining a connection state as a burn-in board, (15-1) shows a state before connection.
(15-2) shows the state during connection, and (15-3) shows the state during connection.

In FIG. 15A, the inspection board 31 and the socket board 32 are separated from each other with the relay terminal plate 33 interposed therebetween.

Therefore, first, the relay terminal plate 33 is lowered and inserted into the inspection board 31. In this case, the relay terminal plate 33
Since the ground terminal plate 331 constituting the terminal board is guided and positioned by the groove 313b of the jack connector 311 constituting the test board, the relay terminal plate itself is eventually positioned with respect to the test board ( The state shown in 15-2) is obtained.

At this point, the ground terminal plate 331 of the relay terminal plate 33 is connected to the ground terminal 314 of the jack connector 311 on the inspection board 31 side, and each of the conductor leads 332b of the signal terminal plate 332 of the relay terminal plate is connected.
(Not shown) and the corresponding jack terminal 2 on the inspection board side
32 are connected.

Next, when the socket board 32 is lowered, the jack connector 311 of the socket board 32 is also positioned by the ground terminal board 331 of the relay terminal board 33. The connection between the two substrates can be realized in a state where the two substrates are positioned relative to each other.

Accordingly, the state shown in (15-3) is reached, and as a result, the socket board 32 and the inspection board 31 and the I board
The C socket and the inspection board are connected via the relay terminal plate 33.

In the above jack connector 311,
Although the contact region 314a of the ground terminal plate 314 is formed in a U-shape over substantially the entire length "e ₁ ", the same effect can be obtained by forming the U-shaped portion of the contact region with a plurality of opposing tongues. Can be obtained.

In the burn-in board 3 having such a configuration, at least the jack terminals facing each other in the terminal row direction are reliably cut off by the ground terminal plate 331 connected to the ground potential, so that noise is generated between the terminal rows. In addition to the advantage of being able to suppress, there is an advantage that the productivity can be improved because the same product is used for the connectors located on both sides sandwiching the relay terminal plate 33.

Further, each of the connector mounting holes 21 of each of the circuit boards 211 and 221 on the inspection board side and the socket board side, respectively.
The leads connected to the ground potential are patterned and formed on the back surface around 1b and 221b, so that the grounding to the grounding terminals 314 and the grounding terminal plate 331 can be achieved only by screwing the grounding connection pieces 314c of the jack connectors 311. There is also an advantage that a potential connection can be realized.

FIG. 16 shows a third burn-in mode according to the present invention.
The board 4 includes an inspection board 41, a socket board 42, and the relay terminal plate 33 described with reference to FIG. 8, and the inspection board 41 in this case is a jack connector 411 according to the present invention.
And a circuit board 415 corresponding to the jack connector.
11 and a circuit board 421 corresponding to the jack connector.

The jack connector 411 includes a jack insulator 412, a ground terminal 413 mounted on the jack insulator, the jack terminal 232 implanted in the jack insulator, and a jack fixed to the jack insulator. And the ground terminal holding piece 313 to be formed.

FIG. 1 illustrates the jack insulator in this case.
7, (a) is an overall perspective view, (b) is a plan view,
(C) is a front view in partial cross section.

In the figure, a jack insulator 412 according to the present invention is shown.
Is formed by cutting out only the region of the board mounting piece 233e in the jack insulator 312 described in FIG. 9 from the jack insulator 312.

Therefore, the periphery of the terminal planting area 233b in which the terminal holes 233a described in FIG. 9 are formed in two rows is surrounded by the peripheral wall 312b having the cutout 312a in FIG.

On the other hand, in FIG. 18, the ground terminal 413 according to the present invention is different from the ground terminal 314 explained in FIG.
After the area is changed to a, the area of the grounding piece 413a is offset-bent toward the bottom (downward in the figure) of the contact area 314a in the vicinity of the boundary with the positioning portion 314b connected thereto.

The offsets located at both ends in this case are
The distance between the bends₁"" Indicates the jack insulator 41
Length “g” at 2₁'”And offset songs
Height “g_Two"" Indicates an end of the jack insulator 312
The thickness “g” of the child transplanting area 233b _Two’”
ing.

[0105] Therefore, as shown in FIG. 19, first, after implanted the jack 232 as described above in the terminal holes 233a of the jack insulator 412, the said ground terminal 413 as shown in FIG. 12 similarly arrow G ₁ Insertion is made in the notch 312a of the jack insulator. In this case, since the offset bending interval “g ₁ ” corresponds to the total length “g ₁ ′” of the jack insulator 412, the insertion is necessarily performed. Done.

In this case, since the offset bending height “g ₂ ” of the ground terminal 413 corresponds to the thickness “g ₂ ′” of the terminal connecting area of the jack insulator 4312 as described above, At the time of completion of the jack terminal 2
The 32 board connection terminals 232c and the tip of the grounding piece 413a of the grounding terminal 413 are located on the same plane.

[0107] Then, the ground terminal restraining piece 313 is inserted into the notch 312a of as the peripheral wall 312b arrow G ₂ that allowed to secured to該是nine yen body, constituting the desired jack connector 311, as shown in FIG. 16 can do.

On the other hand, FIG. 20 for explaining a circuit board corresponding to the jack connector 411, FIG. 20 (a) shows a circuit board for a socket board, and FIG. 20 (b) shows a circuit board for an inspection board.

That is, in FIG. 20A, the jack connector 411 described with reference to FIG.
Similarly, two circuit boards 421 in this case are mounted in parallel.
In FIG. 7A, only the connector mounting hole 221b in the circuit board 221 described in FIG. 7A is replaced with a ground electrode 421a formed by patterning.

The ground electrode 421a in this case is
The ground terminal 413 is formed at a position corresponding to each ground piece 413a.

[0111] Incidentally, the through hole 221c for mounting the IC socket 222 to an intermediate region of the two plug connector arrangement area indicated by a broken line E ₁ is provided, said further corresponding to the respectively respective through hole 221c The connection between the connection electrode 221a and the ground electrode 421a via the conductive leads patterned is the same as in the case of the circuit board 221.

In FIG. 20B, the circuit board 415 in which the jack connector 411 described in FIG. 16 is mounted in the same manner as the test board 21 in FIG. 1 is the circuit board 415 described in FIG. Connector mounting hole 211b in 211
Only the ground electrode 415a formed by patterning is replaced.

In this case, the ground electrode 415a is
The ground terminal 413 is formed at a position corresponding to each ground piece 413a.

[0114] Incidentally, each connection in the jack connector arrangement region indicated by a broken line E ₂ electrode 211a and the ground electrode 415a
Are connected to the burn-in waveform input terminal group 11a described with reference to FIG. 40 as in the case of the circuit board 211.

Then, after the jack connector 411 is positioned and mounted on the circuit board 421, the jack connector 411 is used by using a normal solder connection technique or the like.
Can be configured as shown in FIG.

After the jack connector 411 is positioned and mounted on the circuit board 415, the inspection board 41 on which the jack connector 411 is mounted is configured as shown in FIG. can do.

Therefore, by connecting the socket substrate 42 on which the IC 10 is mounted to the inspection substrate 41 and connecting the inspection substrate 41 to an inspection device (not shown) via the burn-in waveform input terminal group 21a. , Multiple I
C10 can be inspected collectively.

The burn-in board 4 has an advantage that mounting on each of the circuit boards 421 and 415 as a jack connector can be realized only by a normal solder connection technique without screwing, and a screwing area is not required. Since the mounting density as a connector is increased, there is a merit that the number of IC sockets and thus the number of ICs to be tested can be increased as a result.

FIGS. 21A and 21B illustrate an application example of the jack connector 411. FIG. 21A is an overall perspective view, and FIG. 21B is a side view in cross section.

In the figure, a jack connector 41 as an application example is shown.
7 is a ground terminal 3 in the jack connector 411.
14 is changed to the ground terminal 418 according to the present invention.

Accordingly, the jack connector 417 includes the above-described jack insulator 412, jack terminal 232, ground terminal suppressing piece 313, and the above-mentioned ground terminal 418.

In this case, the ground terminal 418 is
As shown in FIG. 2A, the ground terminal 314 is cut at the contact area 314a and the length "g ₃ " from the offset bending position of the ground piece 413a to the end of the contact area is determined by the contact area 314a. It is shortened to a position at which it can be connected to the ground terminal plate 331 of the plate 33 at least.

It is to be noted that, as described above, the offset fly height “g ₂ ” in FIG. 13B of the grounding strip 413 a corresponds to the thickness of the terminal implant area 233 b in the jack insulator 412. is there.

[0124] Therefore, the notch 312a of the jack insulator 412 Jack terminal 232 as described above is implanted as shown in FIG. 23, after mounting the ground terminal 418, as shown by the arrow F _4, the ground terminal The required jack connector 417 can be configured as shown in FIG. 21 by fixing the holding piece 313 to the notch 312a.

In the jack connector 417, since the metal plate used for forming the ground terminal 418 can be small, there is an advantage that the productivity can be improved by reducing the price of the connector.

FIG. 24 is a view showing another embodiment of the jack connector in the second burn-in board 4.
(A) is an overall perspective view, (b) is a side sectional view.

The jack connector 431 in this case is shown in FIG.
Are the jack insulator 432 and the ground terminal 4 according to the present invention.
33 and the jack terminal 232.

As shown in the overall perspective view (a), plan view (b) and front view (c) of FIG. 25, the inner jack insulator 432 has the terminal holes 233a described in FIG. The peripheral area of the peripheral wall 312b is
, The inner wall surfaces 432a 'on both sides in the terminal row direction of the peripheral wall 432a have grooves 313 in the ground terminal suppressing piece 313 described with reference to FIG.
A groove 432b having the same size as b is formed,
Near the base of the inner wall surface 432a ', a slit hole 432c is formed in parallel with the inner wall surface and penetrates the terminal planting area.

On the other hand, as shown in FIG. 26, the ground terminal 433 mounted on the jack insulator 432 has at least a predetermined width formed on both sides of the contact region 314a in the ground terminal 314 described with reference to FIG. 233
This is formed by bending and forming a grounding piece 433a having a length exceeding the thickness of b at the bottom of the contact area.

In this case, the distance "h
₁ "gap slit Anakan in the jack insulator 432" h ₁ '' corresponding to, and the width of the ground piece 433a "h _2" is the length of the slit hole 432c "h ₂ ''
Is set to correspond to each.

Therefore, as shown in (27-1) of FIG. 27, each ground piece 433a of the ground terminal 433 is inserted into each slit hole 432c of the jack insulator 432 in which the jack terminal 232 is implanted. Then, the bottom surface of the contact region 314a of the ground terminal 433 contacts the surface of the terminal implant area of the jack insulator 432. At this time, the tip of the grounding piece 433a projects from the bottom surface of the jack insulator. From (27-2).

Next, the protruding portion of the grounding piece 433a is bent outwardly along the bottom surface as shown by the arrow H so as to be in the state shown by the broken line A, whereby the required jack connector 431 is configured as shown in FIG. can do.

Accordingly, the jack connector 431 is
By mounting on the circuit board 421 described in the above, a socket board similar to the socket board 42 of FIG. 16 can be configured, and the jack connector 431 is connected to the circuit board 41 of FIG.
5, an inspection board similar to the inspection board 41 of FIG. 16 can be obtained.

In the jack connector 431, FIG.
Since the installation terminal suppressing piece 313 required for the burn-in board 3 described in (1) and the second burn-in board 4 described in FIG. 16 is not required, the assembling as a connector and the cost reduction can be realized. There is.

FIG. 28 shows a fourth burn-in mode according to the present invention.
The board 5 includes a test board 51, a socket board 52, and the relay terminal plate 33. In this case, the test board 51 includes the jack connector 511 according to the present invention and the circuit board 415 described with reference to FIG. Socket board 52
Consists of the jack connector 511 and the circuit board 421 described with reference to FIG.

The jack connector 511 is provided in the area of the board connection terminal 232c in the jack connector 431 described with reference to FIG.
And an insulating plate 513.

The ground plate 512 in this case is
As shown in FIG. 7, a protruding conductive rubber 512b is formed in the vicinity of both ends of a strip-shaped metal plate 512a.

Then, the above-mentioned projecting conductive material of the metal plate 512a is formed.
Length "i" excluding the area where rubber 512b is formed ₁”And width“ i ”_Two"When
Is at least the base of the jack connector 511.
The size is set to cover the area where the board connection terminals 232c are arranged.
Is defined.

The length "i ₃ " of the insulating plate 512 shown in FIG. 30 is smaller than the length "i ₁ " of the ground plate 512, and the width i ₄ "is substantially equal to the width" i ₂ ". It is set to the corresponding size.

This means that the insulating plate 512 is located between the protruding conductive rubbers of the ground plate 512.

Here, FIG. 31 illustrates an example in which the assembling process of the jack connector 511 is applied to an inspection board, and (31-1) shows the jack connector on the circuit board 415 described in FIG. 411 is a diagram illustrating a case where 411 is mounted. FIG.

Therefore, the insulating plate 513 described with reference to FIG.
For example, the jack connector 41 is formed by using a normal bonding means.
The arrow “j ₁ ” is placed on the area where the first substrate connection terminal 232c is arranged.
The state of (31-2) can be obtained by placing and bonding as shown in FIG.

Next, the ground plate 512 described with reference to FIG.
An ordinary conductive adhesive is adhered and fixed to the circuit board 415 as shown by an arrow “j ₂ ” so as to cover both the insulating plate 513 and the board connection terminal 232c. The protruding conductive rubber 512 in 512
It can be easily realized by using the region b.

In the burn-in board 5 provided with such a jack connector 511, the board connection terminals to be connected to the circuit board are surrounded by the ground plate 512 and the conductive adhesive. Instead, noise from the mounted circuit board is suppressed, and as a result, there is an advantage that inspection / inspection without the influence of noise can be realized.

FIG. 32 shows a fifth burn-in method according to the present invention.
It is a figure explaining a board with a connector.

That is, the fourth burn-in board 6 according to the present invention comprises a test board 61, a socket board 62, and a relay terminal plate 63. In this case, the test board 61 is a jack connector 611 according to the present invention. And a circuit board 615 corresponding to the jack connector. The socket board 62 includes the jack connector 611 and a circuit board 621 corresponding thereto.

In this case, the jack connector 61
1 includes a jack insulator 612 and two connection terminal plates 613 mounted on the jack insulator. For easy understanding, the jack connector 61 is first shown in FIGS.
1 will be described in detail.

That is, FIG. 33 for explaining a jack insulator.
(A) is an overall perspective view in partial cross section, and (b)
Is a plan view, and (c) is a front sectional view.

In the figure, the jack insulator 612 is formed by changing each terminal hole 233a in the terminal row direction of the jack insulator 432 described in FIG. The hole 432c is eliminated.

That is, in FIG.
Is the jack insulator 432 larger inner longitudinal method than the longitudinal clear width in the corresponding peripheral wall 612a is the peripheral wall 432a in a peripheral wall 432a of simultaneously "m _1" to being formed, the longitudinal direction of the inner wall surface 612a ' Are formed in the elongated holes 612b connecting the respective terminal holes.

The same groove 612c as the groove 432b of the jack insulator 432 is formed on the inner wall surfaces 612a 'on both sides in the longitudinal direction of the peripheral wall 612a, similarly to the jack insulator 432.

[0152] On the other hand Fig 34 illustrating the connection terminal plate corresponding to the jack insulator 612, (a) is an overall perspective view, (b) is a front view seen from the A ₁ direction, (c) is A _Two
Side view from the direction, (d) is a bottom view seen from the A ₃ direction.

Connection terminal plate 613 having an L-shape in front view in FIG.
Includes a resin molded body 614 that is shaped to the substrate mounting piece 614 _-1 and connection piece 614 _-2 corresponding to the relay terminal plate 63 is substantially perpendicular corresponding to each of the circuit board 615,621, the It is composed of a lead electrode 616a patterned on the outer surface of the resin molding and a ground electrode 616b patterned on the inner surface of the resin molding.

[0154] The molded resin 614 has (in the drawing positions 3) a plurality of locations of intersection line inside the connecting piece 614 _-2 and the substrate mounting piece 614 _-1 protrusions 614a to provided substantially at right angles together, both longitudinal ends sides of the connection piece 614 _-2 6
14 _-2 bulge 614 _-2 "which protrudes slightly from the 'respective end edges 614 _-2 vicinity of the projection' is formed, further guide piece 614b is the tip of the connection piece 614 _-2 inclined slightly inward
Is formed.

The length “m ₂ ” of the resin molded body 614 is equal to the length of the long hole 61 in the jack insulator 612.
Corresponds to the length "m _1" of 2b, also the height from the connection piece surface of the protrusion 614c "m _3" is made to correspond to the width of the slots 612b.

When the resin molded body 614 is inserted into the elongated hole 612b from one side of the guide, the resin molded body 614 is positioned on the jack insulator 612 by the projection 614a, and at the same time, the bulge 6 is inserted.
The resin molded body 614 is adapted to be secured to the jack insulator by press-fitting into the long hole 14 _-2 ".

[0157] Further, the substrate mounting piece 614 _-1 and the connection piece 6
14 _-2 straight of the lead electrode 616a is patterned in parallel to the stripes in a direction connecting the outer surface of b, a corresponding signal lead electrodes 616a to 'substrate connection terminals 232c of the jack connector And ground lead electrodes 616a ″ located on both outer sides thereof.

[0158] Further, the ground electrode 616b above projection of the inside surfaces of the connection piece 614 _-2 and the substrate mounting piece 614 _-1 614a
The grounding lead electrode 616a ″ and the grounding electrode 616b are provided in a region where both are located on both surfaces, for example, through holes 616c and the like shown in the drawing. Are connected to each other.

The ground electrode 616b can be easily realized by, for example, a usual electroless plating technique.

Therefore, as shown in (35-1) of FIG. 35, first, one long hole 612 of the jack insulator 612 is formed.
b the connecting terminal plate 613 was inserted as shown by arrow H ₁ from the side of the guide piece 614b to, the connecting terminal plate 613 in a press-fit by the positioning and the bulge 614 _-2 "by the projection 614a (35-2) As shown in (5), it can be positioned and fixed to the jack insulator 612.

[0161] Then, the connection terminal plate 613 by inserting another connecting terminal plate 613 from the side of the guide piece 614b as indicated by the arrow H ₂ for positioning and fixing to the similarly jack insulator 612 on the other long hole 612b By that, (35-3)
As shown in the figure, a required jack connector 611 having two connection terminal plates 613 can be configured.

In the jack connector 611, two connection terminal plates 613 fixed to the jack insulator 612 are used.
Each connecting piece 614 _-2 ground and facing the signal lead electrodes 616a that are patterned in each of the respective connecting piece 614 _-2 simultaneously 'lead electrode 616
a "we are facing, further the signal lead electrodes 616a 'and the ground lead electrode 616a" in an exposed state (the lower surface in the drawing) the outer surface of the substrate mounting piece 614 _-1.

[0163] The ground electrode 616b formed on the entire inner surface of each said respective connection terminal plate 613 in the region of the substrate mounting piece 614 _-1 is in an exposed state shown top.

On the other hand, FIG. 36 for explaining a circuit board corresponding to the jack connector 611, FIG. 36 (a) shows a circuit board for a socket board, and FIG. 36 (b) shows a circuit board for an inspection board.

That is, in FIG. 36A, the circuit board 621 in which two jack connectors 611 described in FIG. 35 are mounted in parallel as described above is the same as the circuit board 621 described in FIG. Ground electrode 42 on substrate 421
Only 1a is changed to a ground electrode 621a that matches the ground lead electrode 616a ″ of the connection terminal plate 613 of the jack connector 611.

The ground electrode 621a in this case is
The connection terminal plate 613 is formed at each position corresponding to the ground lead electrode 616a ″.

[0167] Incidentally, the through hole 221c for mounting the IC socket 222 to an intermediate region of the two jack connector arrangement area indicated by a broken line E ₃ is provided, said further corresponding to the respectively respective through hole 221c The connection between the connection electrode 221a and the ground electrode 621a by the patterned conductor lead is the same as in the case of the circuit board 221.

Also, in FIG. 36B, the circuit board 415 in which the jack connector 611 described in FIG. 35 is mounted as described above is a ground electrode on the circuit board 415 described in FIG. 415a is replaced with a ground electrode 615a that matches the ground lead electrode 616a ″ of the connection terminal plate 613 of the jack connector 611.

The ground electrode 615a in this case is
The connection terminal plate 613 is formed at each position corresponding to the ground lead electrode 616a ″.

[0170] Incidentally, each of the connection electrodes 211a and the ground electrode 615a in the jack connector arrangement region indicated by a broken line E ₄
Are connected to the burn-in waveform input terminal group 11a described with reference to FIG. 40, similarly to the case of the circuit board 415.

Then, after the jack connector 611 is positioned and mounted on the circuit board 621, the jack connector 611 is used by using a normal solder connection technique or the like.
32 can be configured as shown in FIG.

Further, the inspection board 61 on which the jack connector 611 is mounted is constructed as shown in FIG. 32 by utilizing the ordinary solder connection technique or the like in which the jack connector 611 is positioned and mounted on the circuit board 615. can do.

Accordingly, by connecting the socket substrate 62 on which the IC 10 is mounted to the inspection substrate 61 and connecting the inspection substrate 61 to an inspection device (not shown) via the burn-in waveform input terminal group 21a. , Multiple I
C10 can be inspected collectively.

In FIG. 37, the relay terminal plate 63 has a signal lead electrode 632a and a ground lead electrode 63 on an insulating substrate.
2b is a circuit board 632 patterned and formed on both sides of a metal plate 631.

The signal lead electrode 632a and the ground lead electrode 632b are formed similarly to the signal lead electrode 616a 'and the ground lead electrode 616a "formed on the connection terminal plate 613 of the jack connector 611. And the thickness “t” as the relay terminal plate 63
Is set to correspond to the width of the groove 612c in the jack connector 611.

When the relay terminal plate 63 is inserted using the groove 612c of the jack connector 611 as a guide, the signal lead electrode 632a and the ground lead electrode 632b of the relay terminal plate 63 are respectively connected to the jack connector 611. And the corresponding signal lead electrode 616a 'and the ground lead electrode 616a "are brought into contact with each other to realize connection.

Therefore, in the state of (38-1) in FIG. 38 where the inspection board 61 and the socket board 62 are arranged opposite to each other, the relay terminal plate 63 which is arranged in the middle is connected to the inspection board 61 first.
In this case, the insertion of the relay terminal plate 63 can be easily realized since it is positioned by the guide by the groove 612c provided in the jack connector 611 on the inspection board 61 side.

At this time, the signal lead electrode 632a and the ground lead electrode 632b of the relay terminal plate 63 are respectively connected to the signal lead electrode 616a 'and the ground lead electrode 61 of the jack connector 611 on the inspection board side.
6a "is connected as described above.

Next, by connecting the socket substrate 62 to the inspection substrate 61 via the relay terminal plate 63, the state shown in FIG. 38B can be obtained. In this case, the inspection of the socket substrate is performed. The connection to the board and thus to the relay terminal board is also easy and reliable because the positioning is performed by the guide of the relay terminal board by the groove 612c of the jack connector 611 on the socket board side.

In this state, the signal lead electrode 616a 'and the ground lead electrode 616a "of the jack connector 611 on the socket board 62 are connected to the signal lead electrode 632a of the relay terminal plate 63.
And the signal lead electrode 616 of the jack connector 611 on the inspection board 61 side via the ground lead electrode 632b.
a ′ and the ground lead electrode 616a ″.

At the same time, each jack connector 611
Are separated by the metal plate 631 of the relay terminal plate 63, and at the same time, each signal of the connection terminal plate 613 is formed by the grounding lead electrode 616a ″ and the grounding electrode 616b which are mutually conductive through the through hole 616c. Since the lead electrodes are surrounded, a burn-in board can be configured that can surely suppress noise easily generated between the terminal rows.

In the burn-in board 6, the signal lead electrode 616 replaces the jack terminal 232 described above.
Since both a ′ and the signal lead electrode 632 d of the relay terminal plate 63 can be realized by the pattern forming technique on the surface of the resin molded body, which is a conventional technique, and the circuit board 632, burn-in
There is an advantage that productivity can be improved by further reducing the price as a board.

[0183] The application of the connecting terminal plate in Figure 39 illustrating FIG 34 Similarly, (a) shows the overall perspective view, (b) is a side view as viewed from arrow A ₂ direction, (c) the arrow A ₃ It is the bottom view seen from the direction.

In the figure, the connection terminal plate 617 is a lead electrode 61 formed on the resin molded body 614 of the connection terminal plate 613.
Only 6a is changed to a lead electrode 618 according to the present invention.

The lead electrode 618 in this case is
The signal lead electrode 6 in the resin molded body 614
16a 'is replaced with a signal lead electrode 618a formed except for the area of the guide piece 614b', and the ground lead electrode 616a "of the resin molded body 614 is replaced with the ground lead electrode 616a" and the signal lead electrode. 618a is replaced with a ground electrode 618b consisting of a linear ground line 618b 'provided between adjacent 618a. The ground electrode 616b is formed on the inner surface, that is, on the entire back surface. This is the same as the case of the terminal plate 613.

Each of the grounding lines 618b 'can be easily formed together with the signal lead electrodes 618a and the grounding electrodes 618b by ordinary pattern forming techniques and the like. The ground electrode 616 on the side is also short-circuited.

Therefore, the connection terminal plate 613 of the jack connector 611 is replaced with the connection terminal plate 617 to form a jack connector, and then, as described above, a socket board or an inspection board is formed to thereby provide a required burn-in board. Can be easily realized.

In the burn-in board provided with the connection terminal plate 617, the entire periphery of each of the signal lead electrodes 618a formed on the connection terminal plate 617 is connected to the ground line 618b 'and the ground lead electrode 616a ". And the ground electrode 616b, there is an advantage that the occurrence of noise not only between the terminal rows but also between adjacent terminals is suppressed, and a more reliable inspection result can be obtained.

[0189]

As described above, according to the present invention, noise caused by an external electromagnetic field which is likely to be generated between an IC socket and a circuit board having a circuit required for inspection can be easily and reliably suppressed. It is possible to provide a burn-in board for a semiconductor IC in which the productivity in the inspection process is improved.

In the above description, the case where the jack connector for connecting the socket board and the inspection board is a two-row terminal row is taken as an example, but the present invention is applied to a relay terminal board even with a single-row jack connector. It is clear that the same effect can be obtained by doing so.

[Brief description of the drawings]

FIG. 1 is a diagram illustrating a burn-in board of the present invention.

FIG. 2 is a view for explaining each connector of FIG. 1;

FIG. 3 is a view for explaining the jack terminal of FIG. 2;

FIG. 4 is a diagram illustrating the jack insulator of FIG. 2;

FIG. 5 is a view for explaining a plug terminal of FIG. 2;

FIG. 6 is a diagram illustrating the plug insulator of FIG. 2;

FIG. 7 is a view for explaining both the socket board and the inspection board in FIG. 1;

FIG. 8 is a diagram illustrating another burn-in board of the present invention together with a connector.

FIG. 9 is a view for explaining a jack insulator of the jack connector of FIG. 8;

FIG. 10 is a view for explaining a ground terminal of the jack connector of FIG. 8;

FIG. 11 is a view for explaining a ground terminal holding piece of the jack connector of FIG. 8;

FIG. 12 is a view for explaining an assembling process of the jack connector of FIG. 8;

FIG. 13 is a diagram illustrating a ground terminal plate in the relay terminal plate of FIG. 8;

FIG. 14 is a diagram illustrating a signal terminal plate in the relay terminal plate of FIG. 8;

FIG. 15 is an exemplary view for explaining a connection state as the burn-in board in FIG. 8;

FIG. 16 is a diagram illustrating a third burn-in board of the present invention together with a connector.

FIG. 17 is a view for explaining a jack insulator of the jack connector of FIG. 16;

FIG. 18 is a view for explaining a ground terminal of the jack connector of FIG. 16;

FIG. 19 is a diagram illustrating an assembling process of the jack connector in FIG. 16;

FIG. 20 is a diagram illustrating a circuit board corresponding to the burn-in board in FIG. 16;

FIG. 21 is a view for explaining an application example of the jack connector of FIG. 16;

FIG. 22 illustrates a ground terminal in FIG. 21;

FIG. 23 is a view for explaining an assembly process of the jack connector.

FIG. 24 is a view for explaining another jack connector according to the present invention.

FIG. 25 is a diagram illustrating the jack insulator in FIG. 24.

FIG. 26 is a view for explaining a ground terminal in FIG. 24;

FIG. 27 is a view for explaining an assembling step of the jack connector of FIG. 24;

FIG. 28 is a diagram illustrating a fourth burn-in board of the present invention together with a connector.

FIG. 29 is a view for explaining the ground plate of FIG. 28;

30 is a diagram illustrating the insulating plate in FIG. 28.

FIG. 31 is an exemplary view for explaining an assembling step of the jack connector of FIG. 28;

FIG. 32 is a diagram illustrating a fifth burn-in board of the present invention together with a connector.

FIG. 33 is a view for explaining a jack insulator of the jack connector of FIG. 32;

FIG. 34 is a view for explaining the connection terminal plate of FIG. 32;

FIG. 35 is a view for explaining an assembling process of the jack connector of FIG. 32;

FIG. 36 is a view for explaining a circuit board corresponding to the burn-in board of FIG. 32;

FIG. 37 is a view for explaining the relay terminal plate of FIG. 32;

FIG. 38 is an exemplary view for explaining a connection state as a fifth burn-in board;

FIG. 39 is an exemplary view for explaining another connection terminal plate corresponding to the jack insulator of FIG. 33;

FIG. 40 is a view schematically illustrating a conventional burn-in board. It is.

[Explanation of symbols]

2, 3, 4, 5, 6 Burn-in board 21a Burn-in waveform input terminal group 21b Conductor lead 23 Connector device 21, 31, 41, 51, 61 Inspection board 22, 32, 42, 52, 62 Socket board 33, 63 Relay Terminal plate 211, 221 Circuit board 211a, 221a Connection electrode 221 Circuit board 221c Through hole 222 IC socket 232 Jack terminal 232 'Connection member 232 "Side 232a Contact 232b Insulator fixing portion 232b' Bulge 232c Board connection terminal 233 Jack insulator 233a Terminal hole 233b Terminal planting area 233b 'Lower surface 233c Peripheral wall 233d Board mounting piece 233d' Board mounting surface 233e Board mounting hole 235 Plug connector 236 Plug terminal 236 'Connecting member 236 "Side 236a Con 236b Insulator fixing portion 236b 'Bulge 236c Board connection terminal 237 Plug insulator 237a Board mounting piece 237a' Board mounting surface 237b Terminal hole 237b 'Lower surface 237c Partition wall 237d Board mounting hole 231, 311, 411, 511, 611 Jack connector 312 , 412 Jack insulator 312a Notch 312b Peripheral wall 313 Ground terminal suppressing piece 313a One side 313b Groove 314 Ground terminal 314a Contact area 314b Positioning portion 314c Ground connection piece 314d Board mounting hole 331 Ground terminal plate 331a Insulating plate 331a Insulating plate 332b Insulating plate 332b Conductor lead 413 Ground terminal 413a Grounding piece 415,615 Circuit board 415a, 615a Ground electrode 421,621 Circuit board 421a, 62 a Ground electrode 417 Jack connector 418 Ground terminal 431 Jack connector 432 Jack insulator 432a Peripheral wall 432a 'Inner wall surface 432b Groove 432c Slit hole 433 Ground terminal 433a Grounding piece 512 Ground plate 512a Metal plate 512b Protruding conductive rubber insulating rubber plate 513 body 612a peripheral wall 612a ', 612a' in the wall 612b slot 612c groove 613 connecting terminal plate 614 molded resin 614 _-1 substrate mounting piece 614 _-2 connecting piece 614 _-2 'end side 614 _-2 "bulge 614a projecting 614b guide piece 616a Lead electrode 616a 'Signal lead electrode 616a "Ground lead electrode 616b Ground electrode 616c Through hole 617 Connection terminal plate 618 Lead electrode 618a Signal lead electrode 618b Ground electrode 6 18b 'ground wire 631 metal plate 632 circuit board 632a signal lead electrode 632b ground lead electrode

Continuation of the front page (72) Inventor Chikazu Kitaoka 4-1-1, Kamidadanaka, Nakahara-ku, Kawasaki-shi, Kanagawa Prefecture Inside Fujitsu Limited (72) Inventor Hiroyuki Yoshioka 4-1-1, Kamiodanaka, Nakahara-ku, Kawasaki-shi, Kanagawa No. F term in Fujitsu Limited (reference) 2G003 AA07 AC01 AE06 AG01 AG08 AH09

Claims (7)

[Claims] 1. A socket board on which an IC socket is mounted, an inspection board having a size corresponding to the plurality of socket boards, and a connector device for connecting the socket board and the inspection board. A burn-in board for a semiconductor IC, wherein the connector device comprises a plug connector mounted on the socket substrate and a jack connector mounted on the inspection substrate. 2. A socket board having an IC socket mounted thereon, an inspection board having a size corresponding to the plurality of socket boards, and the same jack connector surface-mounted on each of the socket board and the inspection board. And a relay terminal plate for connecting between the socket substrate and the inspection substrate.The relay terminal plate has at least a conductor region of a size covering the entire surface thereof, and the jack connector has A burn-in board for a semiconductor IC, comprising short-circuit means for short-circuiting the conductor region of the relay terminal plate to ground electrodes of the test board and the socket board when the relay terminal board is inserted. 3. The short-circuit means according to claim 2, wherein the ground terminal provided on the jack connector corresponding to the conductor area of the relay terminal plate is screwed to each of the mounting boards. Burn-in board for semiconductor ICs. 4. The short-circuit means according to claim 2, wherein a ground terminal provided on the jack connector so as to correspond to a conductor area of the relay terminal plate is soldered to each of the mounting boards. Burn-in board for semiconductor ICs. 5. The burn-in board for a semiconductor IC according to claim 2, wherein the board connection terminal areas of the jack connector exposed on the respective surfaces of the socket board and the test board are covered with a ground plate via an insulating plate. A burn-in board for a semiconductor IC, wherein the burn-in board is a semiconductor IC. 6. A socket board on which an IC socket is mounted, an inspection board having a size corresponding to the plurality of socket boards, and the same jack connector surface-mounted on each of the socket board and the inspection board. And a relay terminal plate for connecting between the socket board and the inspection board. The jack connector has a cross section orthogonal to a longitudinal direction having a length L.
Two connection terminal plates having striped signal lead electrodes formed on the outer surface parallel to the insertion direction of the relay terminal plate and ground electrodes formed on the entire inner surface; A jack insulator that is held and fixed back-to-back with an interval, wherein the relay terminal plate is formed by attaching a circuit board on which a signal lead electrode corresponding to the signal lead electrode of the connection terminal plate is formed to a metal plate. Wherein the relay terminal plate is formed to have a thickness corresponding to the predetermined interval.
board. 7. A burn-in board for a semiconductor IC, wherein a ground wire connected to the ground electrode is provided between adjacent signal lead electrodes formed on the connection terminal plate according to claim 6.