CN103262651B - 带有电流传播总线的大面积发光电封装 - Google Patents

带有电流传播总线的大面积发光电封装 Download PDF

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Publication number
CN103262651B
CN103262651B CN201180061487.9A CN201180061487A CN103262651B CN 103262651 B CN103262651 B CN 103262651B CN 201180061487 A CN201180061487 A CN 201180061487A CN 103262651 B CN103262651 B CN 103262651B
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China
Prior art keywords
light emitting
bus
layer
package
electrode layer
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CN201180061487.9A
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Chinese (zh)
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CN103262651A (zh
Inventor
D.奥隆泽布
J.M.科斯特卡
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BOE Technology Group Co Ltd
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BOE Technology Group Co Ltd
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/86—Series electrical configurations of multiple OLEDs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/805—Electrodes
    • H10K50/81—Anodes
    • H10K50/814—Anodes combined with auxiliary electrodes, e.g. ITO layer combined with metal lines
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/17—Passive-matrix OLED displays
    • H10K59/179—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/805—Electrodes
    • H10K59/8051—Anodes
    • H10K59/80516—Anodes combined with auxiliary electrodes, e.g. ITO layer combined with metal lines
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/351—Thickness

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
CN201180061487.9A 2010-12-20 2011-11-18 带有电流传播总线的大面积发光电封装 Active CN103262651B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US12/972,913 US8692457B2 (en) 2010-12-20 2010-12-20 Large area light emitting electrical package with current spreading bus
US12/972,913 2010-12-20
US12/972913 2010-12-20
PCT/US2011/061409 WO2012087468A1 (en) 2010-12-20 2011-11-18 Large area light emitting electrical package with current spreading bus

Publications (2)

Publication Number Publication Date
CN103262651A CN103262651A (zh) 2013-08-21
CN103262651B true CN103262651B (zh) 2016-06-29

Family

ID=45319387

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201180061487.9A Active CN103262651B (zh) 2010-12-20 2011-11-18 带有电流传播总线的大面积发光电封装

Country Status (7)

Country Link
US (1) US8692457B2 (enExample)
EP (1) EP2656686B1 (enExample)
JP (1) JP6285183B2 (enExample)
KR (1) KR101920509B1 (enExample)
CN (1) CN103262651B (enExample)
TW (1) TWI552403B (enExample)
WO (1) WO2012087468A1 (enExample)

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JP2015046391A (ja) * 2013-08-01 2015-03-12 株式会社半導体エネルギー研究所 発光装置、及び電子機器
JP2015052742A (ja) * 2013-09-09 2015-03-19 パナソニックＩｐマネジメント株式会社 画像表示装置およびその製造方法
US10513081B1 (en) * 2013-12-10 2019-12-24 Wells Fargo Bank, N.A. Method of making a transaction instrument
US10479126B1 (en) 2013-12-10 2019-11-19 Wells Fargo Bank, N.A. Transaction instrument
US10380476B1 (en) 2013-12-10 2019-08-13 Wells Fargo Bank, N.A. Transaction instrument
US10354175B1 (en) 2013-12-10 2019-07-16 Wells Fargo Bank, N.A. Method of making a transaction instrument
JPWO2015146495A1 (ja) * 2014-03-28 2017-04-13 コニカミノルタ株式会社 有機エレクトロルミネッセンスパネルとその製造方法、有機エレクトロルミネッセンスモジュール及び情報機器
US10573843B2 (en) 2015-08-05 2020-02-25 Apple Inc. Light-emitting device having an electrode with varying sheet resistance
US10482365B1 (en) 2017-11-21 2019-11-19 Wells Fargo Bank, N.A. Transaction instrument containing metal inclusions
US20240032357A1 (en) * 2020-12-18 2024-01-25 Sony Semiconductor Solutions Corporation Display device, electronic device, and method for driving display device
US12444729B2 (en) * 2022-01-14 2025-10-14 The Chinese University Of Hong Kong Preparation of LI and NA foils with {110} or {100} surface texturing

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CN101326655A (zh) * 2005-09-28 2008-12-17 皇家飞利浦电子股份有限公司 一种大面积有机二级管器件及其制造方法
US20100296261A1 (en) * 2009-05-21 2010-11-25 General Electric Company Electrical connectors for optoelectronic device packaging
US20100294526A1 (en) * 2009-05-21 2010-11-25 General Electric Company Hermetic electrical package

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JP3374405B2 (ja) * 1992-03-12 2003-02-04 日本ケミコン株式会社 固体電解コンデンサ及びその製造方法
JP2001244069A (ja) * 2000-02-25 2001-09-07 Seiko Epson Corp 有機エレクトロルミネッセンス素子
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CN1695257A (zh) * 2002-09-11 2005-11-09 通用电气公司 具有梯度组成的扩散阻挡涂层以及结合了该涂层的器件
CN101326655A (zh) * 2005-09-28 2008-12-17 皇家飞利浦电子股份有限公司 一种大面积有机二级管器件及其制造方法
US20100296261A1 (en) * 2009-05-21 2010-11-25 General Electric Company Electrical connectors for optoelectronic device packaging
US20100294526A1 (en) * 2009-05-21 2010-11-25 General Electric Company Hermetic electrical package

Also Published As

Publication number Publication date
KR101920509B1 (ko) 2018-11-20
WO2012087468A1 (en) 2012-06-28
US8692457B2 (en) 2014-04-08
KR20130129248A (ko) 2013-11-27
CN103262651A (zh) 2013-08-21
TWI552403B (zh) 2016-10-01
EP2656686A1 (en) 2013-10-30
JP6285183B2 (ja) 2018-02-28
US20120153812A1 (en) 2012-06-21
TW201246643A (en) 2012-11-16
JP2013546154A (ja) 2013-12-26
EP2656686B1 (en) 2018-09-19

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Effective date of registration: 20160510

Address after: Beijing economic and Technological Development Zone 100176 Beijing Zelu 9

Applicant after: BOE Technology Group Co., Ltd.

Address before: New York, USA

Applicant before: General Electric Company

C14 Grant of patent or utility model
GR01 Patent grant
C56 Change in the name or address of the patentee
CP02 Change in the address of a patent holder

Address after: 100015 Jiuxianqiao Road, Beijing, No. 10, No.

Patentee after: BOE Technology Group Co., Ltd.

Address before: Beijing economic and Technological Development Zone 100176 Beijing Zelu 9

Patentee before: BOE Technology Group Co., Ltd.