CN103261479B - 纳米层压黄铜合金的材料及其电化学沉积方法 - Google Patents

纳米层压黄铜合金的材料及其电化学沉积方法 Download PDF

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Publication number
CN103261479B
CN103261479B CN201180043760.5A CN201180043760A CN103261479B CN 103261479 B CN103261479 B CN 103261479B CN 201180043760 A CN201180043760 A CN 201180043760A CN 103261479 B CN103261479 B CN 103261479B
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Prior art keywords
coating
plastic
article
brass
nanolaminated
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Chinese (zh)
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CN103261479A (zh
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理查德·考德威尔
杰西·安格
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Modumetal Inc
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Modumetal Inc
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C25D5/611—Smooth layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/615—Microstructure of the layers, e.g. mixed structure
    • C25D5/617—Crystalline layers
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12556—Organic component
    • Y10T428/12569—Synthetic resin
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12639—Adjacent, identical composition, components

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Electroplating Methods And Accessories (AREA)
CN201180043760.5A 2010-07-22 2011-07-22 纳米层压黄铜合金的材料及其电化学沉积方法 Active CN103261479B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201510707858.6A CN105386103B (zh) 2010-07-22 2011-07-22 纳米层压黄铜合金的材料及其电化学沉积方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US36692410P 2010-07-22 2010-07-22
US61/366,924 2010-07-22
PCT/US2011/045128 WO2012012789A1 (en) 2010-07-22 2011-07-22 Material and process for electrochemical deposition of nanolaminated brass alloys

Related Child Applications (1)

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CN201510707858.6A Division CN105386103B (zh) 2010-07-22 2011-07-22 纳米层压黄铜合金的材料及其电化学沉积方法

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CN103261479A CN103261479A (zh) 2013-08-21
CN103261479B true CN103261479B (zh) 2015-12-02

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CN201510707858.6A Active CN105386103B (zh) 2010-07-22 2011-07-22 纳米层压黄铜合金的材料及其电化学沉积方法

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US (2) US9732433B2 (enExample)
EP (1) EP2596150B1 (enExample)
JP (3) JP2013544952A (enExample)
CN (2) CN103261479B (enExample)
CA (1) CA2806328C (enExample)
WO (1) WO2012012789A1 (enExample)

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ES2422455T3 (es) 2005-08-12 2013-09-11 Modumetal Llc Materiales compuestos modulados de manera composicional y métodos para fabricar los mismos
EP2310557A2 (en) 2008-07-07 2011-04-20 Modumetal, LLC Property modulated materials and methods of making the same
BR122013014461B1 (pt) 2009-06-08 2020-10-20 Modumetal, Inc revestimento de multicamadas resistente à corrosão em um substrato e método de eletrodeposição para produção de um revestimento de multicamada
WO2012012789A1 (en) 2010-07-22 2012-01-26 Modumetal Llc Material and process for electrochemical deposition of nanolaminated brass alloys
US10472727B2 (en) * 2013-03-15 2019-11-12 Modumetal, Inc. Method and apparatus for continuously applying nanolaminate metal coatings
CN105189826B (zh) 2013-03-15 2019-07-16 莫杜美拓有限公司 通过添加制造工艺制备的制品的电沉积的组合物和纳米层压合金
HK1220743A1 (zh) 2013-03-15 2017-05-12 Modumetal, Inc. 具有高硬度的镍铬纳米层压涂层
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EP2971266A4 (en) * 2013-03-15 2017-03-01 Modumetal, Inc. A method and apparatus for continuously applying nanolaminate metal coatings
US20160208372A1 (en) * 2013-08-27 2016-07-21 University Of Virginia Patent Foundation Lattice materials and structures and related methods thereof
EP3194163A4 (en) 2014-09-18 2018-06-27 Modumetal, Inc. Methods of preparing articles by electrodeposition and additive manufacturing processes
CA2961508C (en) 2014-09-18 2024-04-09 Modumetal, Inc. A method and apparatus for continuously applying nanolaminate metal coatings
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CA3036191A1 (en) 2016-09-08 2018-03-15 Modumetal, Inc. Processes for providing laminated coatings on workpieces, and articles made therefrom
US12227869B2 (en) 2016-09-09 2025-02-18 Modumetal, Inc. Application of laminate and nanolaminate materials to tooling and molding processes
KR102412452B1 (ko) 2016-09-14 2022-06-23 모두메탈, 인크. 신뢰가능한 고처리량 복합 전기장 발생을 위한 시스템, 및 그로부터 코팅을 제조하는 방법
US12076965B2 (en) 2016-11-02 2024-09-03 Modumetal, Inc. Topology optimized high interface packing structures
CA3057836A1 (en) 2017-03-24 2018-09-27 Modumetal, Inc. Lift plungers with electrodeposited coatings, and systems and methods for producing the same
CN110770372B (zh) 2017-04-21 2022-10-11 莫杜美拓有限公司 具有电沉积涂层的管状制品及其生产系统和方法
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KR102256644B1 (ko) 2019-07-26 2021-05-27 서울시립대학교 산학협력단 Bim 객체 모델을 이용한 인공지능 교통신호 호스트 서버 및 이를 포함하는 제어 시스템 및 제어 방법
JP7322678B2 (ja) * 2019-11-27 2023-08-08 住友金属鉱山株式会社 銅張積層板の製造方法
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US20130130057A1 (en) 2013-05-23
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