CN103209794B - 自烧结的多晶立方氮化硼(pcbn)切割元件和形成自烧结pcbn切割元件的方法 - Google Patents
自烧结的多晶立方氮化硼(pcbn)切割元件和形成自烧结pcbn切割元件的方法 Download PDFInfo
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Abstract
本公开涉及具有高cBN含量并且可通过放电机加工(EDM)切割的立方氮化硼(cBN)切割元件。根据一个实施方案的切割元件包括自烧结的多晶立方氮化硼(PCBN)复合片,该复合片具有第一立方氮化硼(cBN)颗粒相和含有钛化合物的陶瓷粘结剂相。所述第一相占所述自烧结的PCBN复合片的大于80%体积。所述自烧结的PCBN复合片具有足以通过放电机加工可切割的电导率。
Description
发明领域
本公开涉及具有高cBN含量和可通过放电机加工(EDM)切割的立方氮化硼(cBN)切割元件。
背景技术
由立方氮化硼(cBN)制得的烧结复合片(sinteredcompact)被用在切割工具中并以其优良的耐磨性著称。为了形成这种复合片,将cBN颗粒在高压和高温下烧结(HPHT烧结)以产生多晶立方氮化硼(PCBN)结构。可以在基材材料存在下HPHT烧结cBN颗粒,其提供了从基材渗入cBN层并帮助PCBN的形成和cBN晶粒之间的晶间结合的金属催化剂。
作为替代,可以在不存在基材的情况下HPHT烧结cBN颗粒,在该情况中所得的PCBN复合片可以被描述为“固体的”或者“自烧结的”或者“独立式的(free-standing)”。可以将催化剂/粘结剂物质与cBN颗粒在烧结之前混合以促进在HPHT烧结期间PCBN结构的形成,或者可以将催化剂/粘结剂物质与cBN颗粒相邻设置。在没有基材的情况下烧结可以是有利的,因为基材不会占据高压压机内有价值的工作区,并且工作区可以被cBN混合物完全占据。作为实例,高压压机可以具有约50cm3的工作体积。另外,催化剂/粘结剂物质可以被均匀地混合遍布整个cBN混合物,而不是从基材渗入cBN层,因此自烧结的PCBN复合片可以具有更均匀的组成和材料性质。
然而,用于自烧结的已知催化剂/粘结剂物质产生本质上为陶瓷的(介电)并且不导电的PCBN复合片。因此,这样的自烧结的PCBN复合片不能通过放电机加工(EDM)来切割。烧结后,常常有必要将烧结的PCBN复合片切割成用于特定切割工具的希望的形状。通过EDM切割在多个应用中是有利的,因为EDM切割可以降低工具处理成本和允许生产更精准的几何形状。激光切割工艺可能产生较不均匀的表面光洁度和较不平坦(即平面)或者垂直的切割表面,从而另外导致附加的精加工成本。激光切割工艺还可以导致热损伤。然而,EDM切割要求被切割的材料是导电的或者半导电的。
用于形成自烧结的PCBN复合片的粘结剂材料以前典型地是不导电的,因此所得的PCBN复合片不能通过EDM切割。例如,已经用于形成自烧结PCBN的一种粘结剂前体材料是铝。在HPHT烧结之后所得的自烧结PCBN复合片具有在PCBN晶粒之间的铝陶瓷粘结剂相。这种铝陶瓷粘结剂相是非导电的。过去曾尝试了具有其它类型粘结剂相的PCBN复合片,但是这些复合片典型地局限于低cBN含量,是不可EDM切割的,和/或不具有用于预期应用的足够的硬度和强度性质。
因此仍然存在对具有导电或半导电陶瓷粘结剂相的高cBN含量的自烧结PCBN复合片的需求,这种复合片是可EDM切割的,具有用于预期应用的希望的材料性质。
概述
本公开涉及具有高cBN含量、是自烧结的,并且是可通过放电机加工(EDM)切割的立方氮化硼(cBN)切割元件。在一个实施方案中,切割元件包括自烧结的多晶立方氮化硼(PCBN)复合片,该复合片包含立方氮化硼颗粒的第一相和含有钛化合物的陶瓷粘结剂相。第一相占自烧结的PCBN复合片的体积的大于80%。自烧结的PCBN复合片具有足以通过放电机加工可切割的电导率。
根据一个实施方案的切割元件包括自烧结的多晶立方氮化硼(PCBN)复合片,该复合片具有第一立方氮化硼(cBN)颗粒相和含有钛化合物的陶瓷粘结剂相。第一相占自烧结的PCBN复合片的大于80%体积。自烧结的PCBN复合片具有足以通过放电机加工可切割的电导率。
在另一实施方案中,提供了形成自烧结的多晶立方氮化硼(PCBN)切割元件的方法。该方法包括将多个cBN颗粒与粘结剂前体混合以形成混合物。混合物包含大于80体积%的cBN颗粒。该方法还包括在没有基材支撑的情况下将混合物HPHT烧结,以形成自烧结的PCBN复合片,和通过放电机加工切割该自烧结的PCBN复合片。
附图简述
图1是根据本公开的一个实施方案,用于HPHT烧结的cBN颗粒和粘结剂前体的混合物的代表。
图2是根据本公开的一个实施方案的烧结的多晶结构。
图3是形成根据本公开的一个实施方案的自烧结的可EDM切割的PCBN复合片的方法的流程图。
图4是显示包括根据本公开的一个实施方案的复合片的若干PCBN复合片的实验结果的图。
图5是根据本公开的一个实施方案,顶端装有切割自PCBN复合片的部件的切割工具插入物。
发明详述
本公开涉及具有高cBN含量并且可通过放电机加工(EDM)切割的自烧结PCBN复合片。在一个实施方案中,自烧结PCBN复合片包括高cBN含量和提供用于烧结的PCBN复合片的优良材料性质和还使得复合片能够通过EDM切割的半导电或者导电的粘结剂相。烧结的PCBN复合片具有足够的电导率以使其可以通过EDM切割成切割插入物形状(例如通过EDM切割成具有特定的厚度或者希望的表面几何形状的切割插入物)。
在图1-2中说明了本公开的一个实施方案。图1显示了包括由具有希望的尺寸或者尺寸范围的cBN颗粒组成的cBN混合物12的粉末混合物10。cBN混合物12还包含与cBN颗粒均匀混合的粘结剂前体14。粘结剂前体14包含有助于在HPHT烧结期间形成PCBN的催化剂/粘结剂物质。如图1说明的,cBN和前体混合物10被放入高压压机中,并在高温和高压下被烧结。例如,在一个实施方案中,在3-6.5GPa的压力下于1300-1500℃的升高的温度下压制粉末混合物10。
这种HPHT烧结工艺产生具有晶间结合cBN晶粒16的网络的多晶结构,其中形成粘结剂相18的前体物质保留在结合的PCBN晶粒16之间的空隙或者间隙内,如例如图2所示的。在HPHT烧结之后,烧结的PCBN复合片可以被切成用于特定切割工具例如通过EDM切割的希望的形状。
EDM切割工艺依赖于一定比例的PCBN复合片(其为导电的或者半导电的)。EDM也可以被称作线EDM,电火花切割,电火花烧蚀,或者线烧蚀。EDM切割通过借助放电或者电火花除去物质而工作。在施加的高电压下,在电极和被切割物体之间通过一系列电流放电,从而导致少量物质被除去。这种工艺采用导电的或者至少半导电的物质进行工作。
在一个实施方案中,提供具有高cBN含量和导电的或者半导电的粘结剂相18的自烧结PCBN复合片。通过HPHT烧结cBN粉末12和粘结剂前体14的混合物来形成PCBN复合片。粉末混合物包括高cBN含量,例如约80%体积的cBN,或者高于80%体积的cBN,或者约81%体积,或者高于81%体积,或者约85%体积,或者高于85%体积,或者80-95%体积,或者85-95%体积。在一个实施方案中,粉末混合物包含约85%体积的cBN。在一个实施方案中,cBN颗粒具有约12-22微米的尺寸,这对于形成用作用于在金属切割中的高材料除去速率和搅拌摩擦焊接的坯件的PCBN复合片而言是有用的。在另一实施方案中,cBN颗粒具有约1-2微米的尺寸,这对于形成用在以精细表面精加工来机加工金属中的PCBN复合片而言是有用的。在另一实施方案中,cBN颗粒的尺寸为2-4微米,在另一实施方案中它们的尺寸是亚微米级的(即在0-1微米的范围内)。在另一实施方案中,cBN颗粒的尺寸为3-6微米,在另一实施方案中cBN颗粒的尺寸为6-12微米。根据应用,可以采用其它cBN颗粒尺寸和尺寸范围。本文给出的cBN颗粒的尺寸范围是根据ANSIB7420标准的。例如,2-4微米的范围是指D5(颗粒的5%)具有最小颗粒尺寸2微米和D95(颗粒的95%)具有最大颗粒尺寸4微米。因此,小于5%的颗粒的尺寸小于2微米,和小于5%的颗粒的尺寸大于4微米。
粘结剂前体占据粉末混合物的残留体积百分比,例如小于20%体积,或者小于15%体积,这取决于cBN的量。选择粘结剂前体14以使得所得的粘结剂相18是导电的或者半导电的。在一个实施方案中,粘结剂前体包括钛(Ti)。特别地,在一个实施方案中,粘结剂前体是碳化钛铝(Ti3AlC)。在一个实施方案中,前体化合物被研磨至亚微米尺寸的粉末颗粒(即,具有小于1微米的平均尺寸的颗粒)和然后与cBN颗粒共混。在一个实施方案中,将粘结剂前体中的氧含量保持在低水平,例如小于(粘结剂重量的)5重量%。低氧含量促进在HPHT烧结期间物质之间的更好结合。
在一个实施方案中,cBN和粘结剂前体混合物包含85%体积的2-4微米的cBN颗粒和15%体积的亚微米尺寸的Ti3AlC颗粒。粘结剂前体14的其它选择包括Ti2AlC和Ti2-3AlN。在一个实施方案中,粘结剂前体包含以下的一种或多种:Ti3AlC、或Ti3AlN、或Ti2AlC、或TizAlN(其中z=2或3)。尽管以痕量存在(典型地低于1%体积),Ti3AlN可能是不可检测到的。粘结剂前体可以通过Ti、TiC、TiCN、和TiN与铝的反应而合成。在其它实施方案中,cBN和粘结剂前体混合物也可以包含0-6%体积的钴和/或0-2%体积的WC。可以添加钴以进一步改善烧结期间cBN颗粒重排和致密化,以增大PCBN复合片的电导率。可以添加碳化钨(WC)以增大PCBN复合片的韧性。然而这些物质的添加是任选的。
然后在没有基材支撑的情况下将cBN颗粒和粘结剂前体颗粒的混合物进行HPHT烧结,以形成具有第一PCBN相和位于PCBN晶粒之间的第二粘结剂相的自烧结的PCBN复合片(参见图2)。自烧结的PCBN复合片具有高cBN含量,例如高于80%体积的cBN,或者高于81%体积,或者高于85%体积,或者80-95%体积,或者85-95%体积。在一个实施方案中,自烧结的PCBN复合片以第一PCBN相的形式包含约85%体积的cBN。
在HPHT烧结期间,钛-铝-碳化物前体与粉末混合物内的cBN反应和与氧反应,并形成构成粘结剂相18的各种化合物。在一个实施方案中,前体的组分反应以形成碳化钛(TiC)、碳氮化钛(TiCxNy)、氮化钛(TiN)、二硼化钛(TiB2)、氮化铝(A1N)、和/或氧化铝(A12O3)。在烧结期间形成这些化合物,而不是直接作为粘结剂前体物质提供的。HPHT烧结可以被称作反应烧结,因为粘结剂前体在HPHT烧结期间分解并与cBN颗粒反应以形成粘结剂相化合物。烧结的粘结剂相18(参见图2)中的这些化合物是通过在HPHT烧结期间的反应而形成的,而不是被提供在前体混合物中的。反应烧结可以促进烧结的物质中更好的硬度。例如,用TiCN和Al的粘结剂前体形成的烧结体显示出约3,000kg/mm2的硬度(具有85%体积的cBN)。根据本文中的一个实施方案。用Ti3AlC粘结剂前体形成的烧结体显示出大于3,200kg/mm2的硬度(85%体积的cBN)。
在一个实施方案中,在HPHT烧结期间粘结剂前体完全地与cBN反应,以使得前体化合物在HPHT烧结之后不再存在。前体化合物的组分完全地与cBN颗粒反应以形成其它粘结剂相化合物,例如上文列出的那些。烧结的PCBN复合片可以通过X-射线衍射、扫描电子显微镜(SEM)或者其它已知的方法来分析以识别存在的化合物。在一个实施方案中,预烧结粘结剂前体化合物(例如Ti3AlC)在烧结的PCBN复合片中不再存在,或者仅以痕量存在(典型地小于1%体积)。
所得的粘结剂相18包括呈反应的、烧结的化合物(碳化钛,碳氮化钛、二硼化钛)形式的钛。据信当在粘结剂前体(例如Ti3AlC)中提供铝时,该铝容易与粉末混合物中的氧反应,形成A12O3,并由此导致钛与cBN颗粒反应,形成TiN和TiB2。在一个实施方案中,粘结剂相以氮化钛和碳化钛为主导。钛化合物是半导电的,并且因此粘结剂相是导电的。因此,具有这种粘结剂相18的自烧结的PCBN复合片是可EDM切割的从而形成希望的切割插入物形状。PCBN复合片的电导率可以通过其电阻来衡量。在一个实施方案中,在HPHT烧结cBN颗粒与钛-铝-碳化物粘结剂前体之后形成的PCBN复合片具有约0.5×10-2欧姆-m([Ω]-m)的电导率。在一个实施方案中,自烧结的PCBN复合片包括小于约0.5×10-2欧姆-m([Ω]-m)的电阻率ρ。在一个实施方案中,自烧结的PCBN复合片包括小于约10-2欧姆-m([Ω]-m)的电阻。这种低电阻率使得PCBN复合片能够通过EDM切割。电阻率可以使用四点法由EDM切割的条状物来测量。
在一个实施方案中,烧结的粘结剂相18不存在单质钛,或者仅包含痕量的单质钛。来自粘结剂前体的钛完全地与cBN颗粒反应以形成粘结剂相中的硼化钛、碳化钛、和氮化钛。这些钛化合物是稳定的并且具有用于切割工具的优良硬度。另外,它们是半导电的。这种粘结剂相赋予自烧结的PCBN复合片优良的用于切割工具应用的材料性质,同时还使得PCBN复合片成为可EDM-切割的。在一个实施方案中,自烧结的PCBN复合片具有大于3,200kg/mm2的维氏硬度。在一个实施方案中,自烧结的PCBN复合片具有1080MPa的三点平均弯曲强度(以8.3mm的跨距,1.2mm的宽度,和1.0mm的厚度测试的)。
在一个实施方案中,粘结剂前体14与cBN反应以形成本质上为陶瓷性而不是金属的粘结剂相18,从而提供自烧结的PCBN复合片中更大的热稳定性,同时还提供电导率。在一些应用中,金属粘结剂相比陶瓷粘结剂相的热稳定性差。金属粘结剂相会在高温下膨胀,导致PCBN层内的裂化。金属还更可能与正通过PCBN切割插入物加工的工件材料呈反应性。另外,具有金属粘结剂相的PCBN复合片典型地在HPHT烧结期间依赖于基材以提供金属渗透剂,因此这些复合片不是自烧结的。本文实施方案的钛基粘结剂相18是导电的,但是本质上仍然是陶瓷的,从而提供化学和热稳定性。
钛成分还提供电导率,以使得自烧结的PCBN复合片的粘结剂相处于通过EDM切割所要求的导电范围内,例如具有低于约10-2欧姆-m([Ω]-m)的电阻率。碳化钛铝前体(T13AlC)被认为提供优良的电导率,这是因为钛与铝的摩尔比为3。因此,与释放的Al相比将存在更多游离的Ti,然后Ti与cBN粉末反应以形成TiB2和TiN化合物。Ti化合物是半导电的,而铝化合物是不导电的。因此在本文的实施方案中,粘结剂相18包含比Al化合物更多的Ti化合物,从而制得可通过EDM切割的烧结的PCBN。粘结剂相主导地是氮化钛和碳化钛,其形成穿过PCBN结构的导电网络,从而提供具有足够的用于EDM切割的电导率的PCBN复合片。在一个实施方案中,自烧结的PCBN复合片中Ti与Al的比例为3,在另一实施方案中该比例为2。
在一个实施方案中,提供了形成自烧结的可EDM切割的PCBN复合片的方法,如图3所示的。方法包括将cBN颗粒与粘结剂前体混合以形成均匀的cBN和前体混合物(112)。cBN颗粒占混合物的至少80%体积,例如约85%体积。以粉末形式提供cBN颗粒和粘结剂前体并通过合适的混合过程例如球磨混合或者磨机碾磨将它们混合物在一起。任选地,该方法包括对cBN和前体混合物进行真空处理(114)。在一个实施方案中该步骤包括将粉末混合物放入真空炉内,施加真空,和加热该炉。在一个实施方案中,将炉加热至约1,000℃达约1小时。真空促进粘结剂前体和cBN颗粒之间的初始反应,由此使得粉末混合物对于操作而言更稳定。粘结剂前体化合物可以部分地分解或分解,并且游离的原子可以开始与cBN颗粒反应。该步骤可以被描述为预烧结反应。
在使得混合物经历真空之后,或者如果省去该真空步骤则在将cBN和前体颗粒混合在一起之后,该方法然后包括在没有基材的情况下HPHT烧结自支撑的cBN和前体混合物,以形成自烧结的PCBN复合片(116)。HPHT烧结产生具有由粘结剂前体和cBN之间的反应形成的化合物的粘结剂相的PCBN复合片。该方法然后包括通过EDM切割方法将PCBN复合片切成合适的切割插入物(118)。
作为实例,EDM切割步骤可以包括将自烧结的PCBN复合片切成厚度为约4.8mm、或约3.2mm、或约1mm、或者1mm-50mm、或者其它厚度的一个或多个切片,这取决于应用领域。这些被切的薄片可以被铜焊到碳化物体上以形成切割插入物。切割插入物可以用于其中希望高耐磨性的应用中,例如机加工铸铁(或灰铸铁)和超级合金(例如镍基超级合金)。EDM切割可以被用于在PCBN插入物上产生均匀的且垂直的外围切口。
图4显示了根据本公开的一个实施方案的试验结果的曲线图。通过对它们进行铸铁回转实验来比较若干PCBN切割元件。实验机器是MoriSeikiSL-25CNC车床,工件材料为35级灰铸铁,具有200布氏硬度(BHN)。回转速率为3,500表面英尺/分钟(sfpm),和进料速率为0.020英寸/转。切口的深度为0.015英寸。工件壁厚为1.32英寸。在干燥条件下进行实验。
在下表I中概述了进行试验的PCBN复合片。还提供每一PCBN复合片的弯曲强度用于对比。
表I
PCBN等级E插入物与自烧结的PCBN复合片铜焊在一起,该复合片通过HPHT烧结85%体积的2-4微米的cBN颗粒和15%体积的Ti3AlC颗粒而形成。等级E是可EDM切割的自烧结的高含量PCBN复合片。
在图4中将每一个切割元件上的道次数目相对磨损绘制曲线图。如图4所示,等级E在该实验中的表现优于其它切割元件,在最少量的磨损情况下耐受最大数目的道次次数。
图5显示了根据本公开的一个实施方案,顶端装有切割自PCBN复合片的部件110的切割工具插入物120。切割插入物120包括硬质合金插入物体112,和切割自PCBN复合片的PCBN顶端部件110在所述体112的边角处被铜焊至所述体112。
为了清楚起见在这些图中夸大了相对尺寸,尺寸不一定按照比例。
尽管已经就示例性实施方案描述和说明了本发明,但应当理解本发明并不被如此限制,因为可以作出完全落入如权利要求书要求的本发明的完整预期范围内的改变和变换。
Claims (12)
1.一种切割元件,其包括:
自烧结的多晶立方氮化硼(PCBN)复合片,该复合片包含立方氮化硼(cBN)颗粒的第一相和含有二硼化钛的陶瓷粘结剂相,所述第一相占所述自烧结的PCBN复合片的大于80%体积,
其中导电的陶瓷粘结剂相还包含铝化合物,并且所述自烧结的复合片中钛与铝之摩尔比为约2或3,和
其中所述自烧结的PCBN复合片具有足以通过放电机加工可切割的电导率。
2.根据权利要求1所述的切割元件,其中所述粘结剂相还包含氮化钛和碳化钛。
3.根据权利要求1所述的切割元件,其中所述粘结剂相还包含碳化钛、碳氮化钛、氮化钛、氮化铝、氧化铝中的至少一种。
4.根据权利要求1所述的切割元件,其中所述第一相占所述自烧结的PCBN复合片的大于85%体积。
5.根据权利要求4所述的切割元件,其中所述第一相占所述自烧结的PCBN复合片的大于90%体积。
6.根据权利要求1所述的切割元件,其中所述自烧结的PCBN复合片具有小于10-2欧姆·米的电阻率。
7.一种形成自烧结的多晶立方氮化硼(PCBN)切割元件的方法,其包括:
将多个cBN颗粒与粘结剂前体混合以形成混合物,该混合物包含大于80%体积的cBN颗粒;
在没有基材支撑的情况下将所述混合物HPHT烧结,以形成自烧结的PCBN复合片,该复合片包含cBN颗粒的第一相和含有二硼化钛的陶瓷粘结剂相,该第一相占自烧结的PCBN复合片的大于80%体积,且其中粘结剂前体还包含铝化合物,且在自烧结的复合片中的钛与铝之摩尔比为约2或3;和
通过放电机加工切割所述自烧结的PCBN复合片。
8.根据权利要求7所述的方法,其中所述粘结剂前体包含以下的一种或多种:Ti3AlC、Ti3AlN、Ti2AlC、Ti2AlN。
9.根据权利要求7所述的方法,其进一步包括在HPHT烧结之前于真空下加热所述混合物。
10.根据权利要求7所述的方法,其进一步包括在HPHT烧结之前将所述粘结剂前体部分地与所述cBN颗粒反应。
11.根据权利要求7所述的方法,其中HPHT烧结包括反应烧结以形成所述自烧结的PCBN复合片中的粘结剂相。
12.根据权利要求11所述的方法,其中所述粘结剂相包含碳化钛、碳氮化钛、氮化钛、二硼化钛、氮化铝、氧化铝中的至少一种。
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US38103010P | 2010-09-08 | 2010-09-08 | |
US61/381,030 | 2010-09-08 | ||
PCT/US2011/050853 WO2012033930A2 (en) | 2010-09-08 | 2011-09-08 | Edm cuttable, high cbn content solid pcbn compact |
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US9028575B2 (en) | 2015-05-12 |
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