CN103208438A - Etching device - Google Patents
Etching device Download PDFInfo
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- CN103208438A CN103208438A CN2012100087294A CN201210008729A CN103208438A CN 103208438 A CN103208438 A CN 103208438A CN 2012100087294 A CN2012100087294 A CN 2012100087294A CN 201210008729 A CN201210008729 A CN 201210008729A CN 103208438 A CN103208438 A CN 103208438A
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- etch chamber
- assembly
- upper cover
- cavity
- cover plate
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Abstract
An etching device is provided with an etching assembly, a conveying assembly and a carrier assembly. The etching assembly is provided with an etching cavity, an upper cover plate and a lifting device. The upper cover plate is arranged on the top surface of the etching cavity in a reversible mode and the is provided with an electrode guide-in device, two air hole plates and a shading plate. The conveying assembly is arranged in the etching assembly and the inside of the etching cavity is provided with a plurality of rotating shafts in the etching cavity at intervals. The carrier assembly is arranged on the conveying assembly and is provided with a plurality of carrier discs, all the carrier discs are attached to rollers of the conveying assembly, the top surface of the carrier discs is provided with a pole plate, and two bearing holes arranged at intervals and respectively corresponding to two punched holes of the shading plate are formed on the pole plate in a penetrating mode. The etching device saves the cost, shortens the time of the production process and improves the yield.
Description
Technical field
The present invention relates to a kind of Etaching device, refer to a kind of Etaching device especially.
Background technology
Be etched to a kind of technology that removes for material by the mode of chemical reaction or physical shock, existing etching technique is broadly divided into wet etching (wet etching) and dry ecthing (dryetching) two classes, wherein wet etching is to carry out chemical reaction by chemical solution to reach etched effect, dry ecthing then is by a kind of plasma etching (plasma etching), plasma etching may be the physical action of plasma intermediate ion bump wafer surface or may be living radical and the interatomic chemical reaction of wafer surface in the plasma, also may be both composite actions, along with development of science and technology, etching technique has been widely used in aviation, machinery, on chemistry and the semiconductor fabrication;
The configuration of the employed etching machine 80 of industry at present as shown in Figure 8, it mainly arranges a robotic arm 81 in the center, annular space is provided with several transfer chambers 82, an orientation room 83, several reative cells 84 and a clean room 85 in regular turn around this robotic arm 81, by this robotic arm 81 with wafer 90 between each chamber, move, location and etching and processing;
Yet, though existing etching machine 80 can move by robotic arm 81, location and etching and processing, but robotic arm 81 moves the time that needs cost many between each chamber, and robotic arm 81 is after using for a long time, influence the accuracy of its operation because wearing away or wearing and tearing easily, the situation that wafer 90 may be dropped in mobile process and damage has in addition improvements.
Summary of the invention
For improve above-mentioned existing etching machine by robotic arm move, disappearance and the deficiency of location and etching and processing, main purpose of the present invention is to provide a kind of Etaching device, it can make wafer move and process under the situation that robotic arm need not be set, thereby provides one to save the Etaching device of cost, shortening manufacture process time and raising production capacity.
Based on above-mentioned purpose, Etaching device of the present invention includes an etch component, a conveying assembly and a carrier assembly, wherein:
This etch component is provided with an etch chamber, one upper cover plate and a lowering or hoisting gear, this upper cover plate is located at this etch chamber end face turningly and is provided with an electrode gatherer, two spiracular plates and a shield, this electrode gatherer is fixedly arranged on this upper cover plate end face and is provided with an electrode inwardly, this upper cover plate bottom surface is located in two spiracular plate compartment of terrains, this shield compartment of terrain is located at this upper cover plate bottom surface and is run through and is provided with the perforation corresponding with this two spiracular plate, run through one and stretch into the perforate of this shield for this electrode between two perforation, this lowering or hoisting gear is fixedly arranged on this etch chamber bottom surface and is provided with an elevating lever that stretches into this etch chamber up;
This conveying assembly is located in this etch component and is arranged at intervals with a plurality of rotation axiss with roller in this etch chamber; And
This carrier assembly is on this conveying assembly and be located in this etch chamber movably and be provided with several load plates, the roller of each load plate and this conveying assembly reclines mutually and is provided with a pole plate in end face, and this pole plate runs through and is provided with two and arranges at interval and the bearing holes corresponding with these shield two perforation respectively.
Further, this Etaching device is provided with a feeding assembly in addition, one discharging assembly and a valve member, before wherein this feeding assembly is provided with one, rear end charging cavity opening-like and that combine with this etch chamber front end, this discharging assembly is provided with one and differs from the discharging cavity that this charging cavity one end combines with this etch chamber, and this valve member is located at this feeding assembly, between this etch component and this discharging assembly and be provided with several valvings, this is located between each cavity each valving respectively, this conveying assembly is arranged at intervals with a plurality of rotation axiss with roller in each cavity of this feeding assembly and this discharging assembly, this carrier assembly is located on this conveying assembly and is located at movably between each cavity.
Preferably, this charging cavity respectively is provided with one first guide rail in inner both sides, this etch chamber respectively is provided with second guide rail relative with this charging cavity first guide rail straight line in inner both sides, the elevating lever of this lowering or hoisting gear is stretched in this etch chamber and between between two second guide rails, and this discharging cavity respectively is provided with three guide rail relative with this charging cavity first guide rail and this etch chamber second guide rail straight line in inner both sides, and each axis of rolling of this conveying assembly is located at two guide rail inboards of each cavity.
Preferably, this upper cover plate is provided with a plurality of backstays in the bottom surface around this shield, each backstay is provided with a sheathed lid in the bottom that differs from this upper cover plate, and each load plate of this carrier assembly is provided with the protruding grain in several location in the end face around this pole plate, in the time of in this load plate moves to this etch chamber, it is relative with the sheathed lid straight line of this each backstay of etch component that each locatees protruding grain.
Preferably, this upper cover plate is respectively equipped with one and sets firmly the upset pressure cylinder shaft of combination mutually with this etch chamber end face in the limit, two opposite sides, make this etch chamber upset relatively of this upper cover body, and this upper cover plate is installed with a power output unit that is connected with this electrode gatherer in end face.
Preferably, this two spiracular plate is provided with one in order to carry the feed tube of gas respectively at this upper cover plate end face, makes the gas can be via feed tube and spiracular plate and enter in this etch chamber.
Preferably, this shield is provided with several and sets firmly the fixed lever of combination mutually with this upper cover plate, makes this shield compartment of terrain be located at the bottom surface of this upper cover plate.
Preferably, this etch component is provided with a high vacuum pumping that combines with this etch chamber in addition, makes this etch chamber inner sustain in the state of a high vacuum.
Preferably, each valving is provided with a valve and a valve pneumatic cylinder, by the start of valve pneumatic cylinder, makes between two adjacent cavitys to present the state that communicates or seal, and an end of this each rotation axis of conveying assembly is arranged with a drive, and this drive can be a sprocket wheel or a belt pulley.
Preferably, this Etaching device is provided with a cleaning cavity in discharging cavity one side that differs from this etch chamber, thereby carries out surface clean for the wafer after the etching.
By above-mentioned technological means, Etaching device of the present invention arranges a load plate respectively in each cavity when operation, allow each cavity in the same period, carry out different procedure of processings for each wafer, the wafer work flow that can on Etaching device of the present invention, carry out, allow each wafer in each cavity, process in regular turn and continuously, and do not need again clamping and movement by robotic arm, can form one continuous line production line, not only can improve production capacity and shorten the manufacture process time, and wafer is carried between each cavity by each load plate, the phenomenon that can effectively avoid wafer in mobile process, to drop and damage, and then reach cost-effective effect, save cost thereby constitute one, shorten the Etaching device of manufacture process time and raising production capacity.
Description of drawings
Fig. 1 is the stereoscopic schematic diagram of Etaching device first embodiment of the present invention.
Fig. 2 is another stereoscopic schematic diagram of Etaching device first embodiment of the present invention.
Fig. 3 is the diagrammatic cross-sectional side elevation of Etaching device first embodiment of the present invention.
Fig. 4 is the local amplification profile schematic side view of Etaching device first embodiment of the present invention.
Fig. 5 is the three-dimensional appearance schematic diagram of Etaching device etch component of the present invention.
Fig. 6 is the Operation Profile schematic side view of Etaching device first embodiment of the present invention.
Fig. 7 is the stereoscopic schematic diagram of Etaching device second embodiment of the present invention.
Fig. 8 is the schematic top plan view of existing etching machine.
[main element symbol description]
10 feeding assemblies, 11 charging cavitys
111 first guide rails, 20 etch component
21 etch chambers, 211 second guide rails
22 upper cover plates, 221 upset pressure cylinder shafts
23 lowering or hoisting gears, 231 elevating levers
24 electrode gatherers, 241 electrodes
25 spiracular plates, 251 feed tubes
26 shields, 261 fixed levers
262 perforation, 263 perforates
27 backstays, 271 sheathed lids
272 location holes, 28 power output unit
29 high vacuum pumpings, 30 discharging assemblies
31 discharging cavitys 311 the 3rd guide rail
32 cleaning cavitys, 40 valve members
41 valvings, 42 valves
43 valve pneumatic cylinders, 50 conveying assemblies
51 rotation axiss, 52 rollers
53 drives, 60 carrier assemblies
61 load plates, 62 pole plates
The protruding grain in 621 bearing holes, 63 location
70 wafers, 80 etching machines
81 robotic arms, 82 transfer chambers
83 orientation room, 84 reative cells
85 clean rooms, 90 wafers.
Embodiment
Being can detail knowledge technical characterictic of the present invention and practical effect, and can implement according to the content of specification, existing further with as shown in the figure preferred embodiment, describes in detail as the back:
The present invention mainly provides a kind of Etaching device, please cooperate referring to as shown in Figures 1 to 3, by finding out Etaching device of the present invention among the figure, it is provided with a feeding assembly 10, an etch component 20, a discharging assembly 30, a valve member 40, a conveying assembly 50 and a carrier assembly 60, wherein:
This feeding assembly 10 is provided with a charging cavity 11, this charging cavity 11 is a hollow cavity that slightly is rectangle, the front and back ends of this charging cavity 11 respectively is an opening shape, this charging cavity 11 respectively is provided with one first guide rail 111 in inner both sides, further, this feeding assembly 10 is connected with a vacuum pump (not shown), thereby makes this charging cavity 11 keep a vacuum state;
Please further cooperate referring to shown in Fig. 4 and 5, this etch component 20 combines with this feeding assembly 10 and is provided with an etch chamber 21, one upper cover plate 22 and a lowering or hoisting gear 23, wherein this etch chamber 21 is a hollow cavity that is consistent with these charging cavity 11 structures, this etch chamber 21 and the rear end of this charging cavity 11 set firmly in conjunction with and respectively are provided with in inner both sides second guide rail 211 relative with these charging cavity 11 first guide rails 111 straight lines mutually, this upper cover plate 22 is located at the end face of this etch chamber 21 turningly and is provided with an electrode gatherer 24, two spiracular plates 25, one shield 26 and a plurality of backstay 27, preferably, this upper cover plate 22 is respectively equipped with one and sets firmly the upset pressure cylinder shaft 221 of combination mutually with these etch chamber 21 end faces in the limit, two opposite sides, this electrode gatherer 24 is fixedly arranged on the end face of this upper cover plate 22 and stretches inwardly and is provided with an electrode 241, further, this upper cover plate 22 is installed with a power output unit 28 that is connected with this electrode gatherer 24 in end face, and this power output unit 28 is provided with a radio-frequency power supply supply, one intermediate frequency power supply supply and one is in order to adjust the adaptation of power output size;
Two spiracular plates, 25 compartment of terrains are located at the bottom surface of this upper cover plate 22 and are provided with a feed tube 251 in order to carry gas respectively at these upper cover plate 22 end faces, make the gas can be via feed tube 251 and spiracular plate 25 and enter in this etch chamber 21, this shield 26 is provided with several and sets firmly the fixed lever 261 of combination mutually with this upper cover plate 22, make these shield 26 compartment of terrains be located at the bottom surface of this upper cover plate 22, this shield 26 runs through and is provided with the perforation 262 corresponding with this two spiracular plate 25, and and two 262 of perforation run through and are provided with one and stretch into the perforate 263 of this shield 26 for this electrode 241, the bottom surface of each backstay 27 and this upper cover plate 22 set firmly mutually in conjunction with and be positioned at this shield 26 around, each backstay 27 is provided with a sheathed lid 271 in the bottom that differs from this upper cover plate 22, preferably, this sheathed lid 271 is concaved with the location hole 272 of a summary semicircular in shape;
Further, this etch component 20 is provided with a high vacuum pumping 29 that combines with this etch chamber 21 in addition, make these etch chamber 21 inner sustain in the state of a high vacuum, and can in this etch chamber 21 at least one position sensor be set, this lowering or hoisting gear 23 is fixedly arranged on the bottom surface of this etch chamber 21 and is provided with one up and is stretched in this etch chamber 21 and between the elevating lever 231 of 211 on two second guide rails;
This discharging assembly 30 is connected with this etch component 20 and is provided with a discharging cavity 31, this discharging cavity 31 combines with the end that this etch chamber 21 differs from this charging cavity 11, and respectively is provided with three guide rail 311 relative with these charging cavity 11 first guide rails 111 and this etch chamber 21 second guide rails 211 straight lines in inner both sides;
This valve member 40 is located between this feeding assembly 10, this etch component 20 and this discharging assembly 30 and is provided with several valvings 41, this is located at each cavity 11 to each valving 41 respectively, 21, between 31 and be provided with a valve 42 and a valve pneumatic cylinder 43, start by valve pneumatic cylinder 43, make two 11,21,31 of adjacent cavitys present the state that communicates or seal;
This conveying assembly 50 is located between this feeding assembly 10, this etch component 20 and this discharging assembly 30 and in each cavity 11,21,31 two guide rails 111,211,311 inboards are arranged at intervals with a plurality of rotation axiss 51 with roller 52 respectively, and an end of each rotation axis 51 is arranged with a drive 53, wherein each drive 53 can be a sprocket wheel one belt pulley, and then can make each rotation axis 51 relative cavity 11,21 by a chain or a belt, 31 rotate; And
This carrier assembly 60 is located on this conveying assembly 50 and is located at each cavity 11 movably, 21, between 31 and be provided with several load plates 61, the roller 52 of each load plate 61 and this conveying assembly 50 reclines mutually and is provided with the protruding grain 63 of a pole plate 62 and several location, wherein this pole plate 62 is located at the end face of this load plate 61 and is run through and is provided with two and arranges at interval and bearing holes 621 corresponding with 26 liang of perforation of this shield 262 respectively, each bearing holes 621 of this pole plate 62 is in order to put a wafer 70, each locate protruding grain 63 be located at the end face of this load plate 61 and be positioned at this pole plate 62 around, and in the time of in this load plate 61 moves to this etch chamber 21, it is relative with sheathed lid 271 straight lines of these etch component 20 each backstays 27 that each locatees protruding grain 63.
Please cooperate referring to as shown in Figure 7, Etaching device of the present invention is provided with a cleaning cavity 32 in discharging cavity 31 1 sides that differ from this etch chamber 21 in addition, thereby carries out surface clean for the wafer 70 after the etching, and the effect of a cleaning is provided.
Etaching device of the present invention is when using, please cooperate referring to shown in Fig. 3 and 5, it is placed in the wafer 70 of desire processing in pole plate 62 bearing holes 621 of load plate 61 earlier, this load plate 61 is put on each roller 52 that is positioned at this charging cavity 11, inflate for this charging cavity 11 via a vacuum pump, thereby make this charging cavity 11 present a vacuum state, after treating that this charging cavity 11 presents a vacuum state, be positioned at the valving 41 of 21 of this charging cavity 11 and this etch chambers by unlatching, and the mode of this conveying assembly 50 rotation axiss rotation, the load plate 61 that will be positioned at this charging cavity 11 by each roller 52 moves to this etch chamber 21 as shown in Figure 4, at this moment, can be by the mode of position sensor induction, make on this load plate 61 respectively to locate protruding grain 63 relative with sheathed lid 271 straight lines of each backstay 27;
Pass through the mode that these lowering or hoisting gear 23 elevating levers 231 rise as shown in Figure 6, the load plate 61 that will be positioned at this etch chamber 21 raises towards these upper cover plate 22 directions, make and respectively locate the location hole 272 that protruding grain 63 places corresponding backstay 27, and make way for two wafers 70 on this pole plate 62 respectively near two perforation, 262 places that are positioned at shield 26 on this upper cover plate 22, at this moment, the gas of the required use of one etching is delivered in this etch chamber 21 through the extremely corresponding spiracular plate 25 of each feed tube 251, and start the mode of this electrode gatherer 24 via this power output unit 28, make the gas that is positioned at this etch chamber 21 be subjected to the effect of highfield, and form the some gas (Partially Ionized Gas) that dissociates, can carry out plasma etching (Plasma Etching) for each wafer 70 that is arranged on the pole plate 62;
After treating that each wafer 70 is finished etching and processing, drop to the mode of initial position via this elevating lever 231, make and respectively locate protruding grain 63 and be separated with corresponding backstay 27, this load plate 61 can be reclined mutually with each roller 52 that is positioned at this etch chamber 21, and be positioned at the valving 41 of 31 of this etch chamber 21 and this discharging cavitys by unlatching, make this carry out discharging through the intact wafer 70 of etching along with load plate 61 moves to these discharging cavity 31 places, in addition can be as shown in Figure 7, to be delivered to by the wafer 70 that this discharging cavity 31 is sent in this cleaning cavity 32 and clean, namely finish the etching and processing of wafer 70.
The etching and processing flow process of wafer 70 on the above-mentioned single load plate 61, when practical operation in each cavity 11,21,31, one load plate 61 is set respectively in 32, allow each cavity 11,21,31,32 can carry out different procedure of processings for each wafer 70 in the same period, wafer 70 work flows that can carry out on Etaching device of the present invention allow each wafer 70 in regular turn and continuously in each cavity 11,21,31, process in 32, and do not need again clamping and movement by robotic arm 81, can form one continuous line production line, not only can improve production capacity and shorten the manufacture process time, and wafer 70 is by each load plate 61 and in each cavity 11,21,31, carry on 32, the phenomenon that can effectively avoid wafer 70 in mobile process, to drop and damage, and then reach cost-effective effect, thus constituting one saves cost, shorten the Etaching device of manufacture process time and raising production capacity.
The above, only be the preferred embodiments of the present invention, be not that the present invention is done any pro forma restriction, any those skilled in the art, if in the scope that does not break away from technical scheme that the present invention puies forward, utilize disclosed technology contents to do the local equivalent embodiment that changes or modify, and do not break away from technical scheme content of the present invention, all still belong in the scope of technical solution of the present invention.
Claims (10)
1. Etaching device, it includes an etch component, a conveying assembly and a carrier assembly, wherein:
This etch component is provided with an etch chamber, one upper cover plate and a lowering or hoisting gear, this upper cover plate is located at this etch chamber end face turningly and is provided with an electrode gatherer, two spiracular plates and a shield, this electrode gatherer is fixedly arranged on this upper cover plate end face and is provided with an electrode inwardly, this upper cover plate bottom surface is located in two spiracular plate compartment of terrains, this shield compartment of terrain is located at this upper cover plate bottom surface and is run through and is provided with the perforation corresponding with this two spiracular plate, run through one and stretch into the perforate of this shield for this electrode between two perforation, this lowering or hoisting gear is fixedly arranged on this etch chamber bottom surface and is provided with an elevating lever that stretches into this etch chamber up;
This conveying assembly is located in this etch component and is arranged at intervals with a plurality of rotation axiss with roller in this etch chamber; And
This carrier assembly is located on this conveying assembly and is located in this etch chamber movably and is provided with several load plates, the roller of each load plate and this conveying assembly reclines mutually and is provided with a pole plate in end face, and this pole plate runs through and is provided with two and arranges at interval and the bearing holes corresponding with these shield two perforation respectively.
2. Etaching device as claimed in claim 1, wherein this Etaching device is provided with a feeding assembly in addition, one discharging assembly and a valve member, before wherein this feeding assembly is provided with one, rear end charging cavity opening-like and that combine with this etch chamber front end, this discharging assembly is provided with one and differs from the discharging cavity that this charging cavity one end combines with this etch chamber, and this valve member is located at this feeding assembly, between this etch component and this discharging assembly and be provided with several valvings, this is located between each cavity each valving respectively, this conveying assembly is arranged at intervals with a plurality of rotation axiss with roller in each cavity of this feeding assembly and this discharging assembly, this carrier assembly is located on this conveying assembly and is located at movably between each cavity.
3. Etaching device as claimed in claim 2, wherein this charging cavity respectively is provided with one first guide rail in inner both sides, this etch chamber respectively is provided with second guide rail relative with this charging cavity first guide rail straight line in inner both sides, the elevating lever of this lowering or hoisting gear is stretched in this etch chamber and between between two second guide rails, and this discharging cavity respectively is provided with three guide rail relative with this charging cavity first guide rail and this etch chamber second guide rail straight line in inner both sides, and each axis of rolling of this conveying assembly is located at two guide rail inboards of each cavity.
4. Etaching device as claimed in claim 3, wherein this upper cover plate is provided with a plurality of backstays in the bottom surface around this shield, each backstay is provided with a sheathed lid in the bottom that differs from this upper cover plate, and each load plate of this carrier assembly is provided with the protruding grain in several location in the end face around this pole plate, in the time of in this load plate moves to this etch chamber, it is relative with the sheathed lid straight line of this each backstay of etch component that each locatees protruding grain.
5. Etaching device as claimed in claim 4, wherein this upper cover plate is respectively equipped with one and sets firmly the upset pressure cylinder shaft of combination mutually with this etch chamber end face in the limit, two opposite sides, make this etch chamber upset relatively of this upper cover body, and this upper cover plate is installed with a power output unit that is connected with this electrode gatherer in end face.
6. Etaching device as claimed in claim 5, wherein this two spiracular plate is provided with one in order to carry the feed tube of gas respectively at this upper cover plate end face, makes the gas can be via feed tube and spiracular plate and enter in this etch chamber.
7. Etaching device as claimed in claim 6, wherein this shield is provided with several and sets firmly the fixed lever of combination mutually with this upper cover plate, makes this shield compartment of terrain be located at the bottom surface of this upper cover plate.
8. Etaching device as claimed in claim 7, wherein this etch component is provided with a high vacuum pumping that combines with this etch chamber in addition, makes this etch chamber inner sustain in the state of a high vacuum.
9. Etaching device as claimed in claim 8, wherein each valving is provided with a valve and a valve pneumatic cylinder, start by the valve pneumatic cylinder, make between two adjacent cavitys and present the state that communicates or seal, and an end of this each rotation axis of conveying assembly is arranged with a drive, and this drive can be a sprocket wheel or a belt pulley.
10. Etaching device as claimed in claim 9, wherein this Etaching device is provided with a cleaning cavity in discharging cavity one side that differs from this etch chamber, thereby carries out surface clean for the wafer after the etching.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210008729.4A CN103208438B (en) | 2012-01-12 | 2012-01-12 | Etaching device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210008729.4A CN103208438B (en) | 2012-01-12 | 2012-01-12 | Etaching device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103208438A true CN103208438A (en) | 2013-07-17 |
| CN103208438B CN103208438B (en) | 2016-04-06 |
Family
ID=48755620
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210008729.4A Active CN103208438B (en) | 2012-01-12 | 2012-01-12 | Etaching device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103208438B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105023868A (en) * | 2015-06-16 | 2015-11-04 | 无锡华瑛微电子技术有限公司 | Fluid transmission device |
| CN108048814A (en) * | 2017-12-22 | 2018-05-18 | 凌嘉科技股份有限公司 | There is the continous way coating system of reactive ion etch |
| CN113038683A (en) * | 2021-03-09 | 2021-06-25 | 珠海恒格微电子装备有限公司 | Microwave plasma generating device and plasma etching equipment |
| CN113772384A (en) * | 2021-09-27 | 2021-12-10 | 无锡万思汇科技有限公司 | Interval plate turnover machine and working method thereof |
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| CN2714582Y (en) * | 2004-04-09 | 2005-08-03 | 友威科技股份有限公司 | Automation embedded type internal reflux apparatus |
| CN2797387Y (en) * | 2005-02-16 | 2006-07-19 | 友威科技股份有限公司 | Continuous vacuum film coating machine with built-in electrostatic dusting mechanism |
| CN101989635A (en) * | 2009-08-07 | 2011-03-23 | 北儒精密股份有限公司 | Equipment for making electrodes of solar cells |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2714582Y (en) * | 2004-04-09 | 2005-08-03 | 友威科技股份有限公司 | Automation embedded type internal reflux apparatus |
| CN2797387Y (en) * | 2005-02-16 | 2006-07-19 | 友威科技股份有限公司 | Continuous vacuum film coating machine with built-in electrostatic dusting mechanism |
| CN101989635A (en) * | 2009-08-07 | 2011-03-23 | 北儒精密股份有限公司 | Equipment for making electrodes of solar cells |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105023868A (en) * | 2015-06-16 | 2015-11-04 | 无锡华瑛微电子技术有限公司 | Fluid transmission device |
| CN105023868B (en) * | 2015-06-16 | 2018-02-27 | 无锡华瑛微电子技术有限公司 | Device for transferring fluid |
| CN108048814A (en) * | 2017-12-22 | 2018-05-18 | 凌嘉科技股份有限公司 | There is the continous way coating system of reactive ion etch |
| CN108048814B (en) * | 2017-12-22 | 2020-01-31 | 凌嘉科技股份有限公司 | Continuous coating system with reactive ion etching function |
| CN113038683A (en) * | 2021-03-09 | 2021-06-25 | 珠海恒格微电子装备有限公司 | Microwave plasma generating device and plasma etching equipment |
| CN113038683B (en) * | 2021-03-09 | 2023-07-25 | 珠海恒格微电子装备有限公司 | Microwave plasma generating device and plasma etching equipment |
| CN113772384A (en) * | 2021-09-27 | 2021-12-10 | 无锡万思汇科技有限公司 | Interval plate turnover machine and working method thereof |
| CN113772384B (en) * | 2021-09-27 | 2023-09-22 | 无锡万思汇科技有限公司 | Spacing panel turnover machine and working method thereof |
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| Publication number | Publication date |
|---|---|
| CN103208438B (en) | 2016-04-06 |
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