CN105023868B - Device for transferring fluid - Google Patents
Device for transferring fluid Download PDFInfo
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- CN105023868B CN105023868B CN201510335380.9A CN201510335380A CN105023868B CN 105023868 B CN105023868 B CN 105023868B CN 201510335380 A CN201510335380 A CN 201510335380A CN 105023868 B CN105023868 B CN 105023868B
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- valve portion
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/6773—Conveying cassettes, containers or carriers
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Valve Housings (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a kind of device for transferring fluid, and it includes loading plate, offers several through holes thereon, and the through hole includes the first manhole and the second square through hole, and first manhole and the second square through hole are connected；Electronic control valve, it includes the first valve portion and the second valve portion, and the shape of first valve portion is corresponding with the first manhole of the loading plate, and the shape of second valve portion is corresponding with the second square through hole of the loading plate；Supporting plate, it is fixed in the second valve portion of the electronic control valve, and the first valve portion of the electronic control valve stretches out first manhole, and the second valve portion and supporting plate are caught in second square through hole.Compared with prior art, the present invention sets supporting plate in the lower section of the second valve portion of the electronic control valve, and firmly the electronic control valve can be caught on the loading plate, and is readily disassembled.
Description
【Technical field】
The present invention relates to semiconductor applications, more particularly to a kind of device for transferring fluid.
【Background technology】
Integrated circuit is gradually applied in many fields at present, such as computer, communication, Industry Control and consumer electricity
Son etc..The manufacturing industry of integrated circuit, have become important basic industry as steel.
Wafer is the carrier for producing used in integrated circuits.The wafer for needing to prepare in actual production has smooth, super clear
Clean surface, and the existing method for being used to prepare ultra-clean wafer surface can be divided into two kinds of classifications：Such as submergence and spraying technique
Wet-treating process, and the dry process process such as based on chemical gaseous phase and plasma technology.Wherein wet-treating process
It is that prior art uses relatively broad method, wet-treating process generally includes that crystalline substance is submerged or sprayed using appropriate chemical solution
A succession of step group of circle into.
However, the general existing equipment for preparing ultra-clean wafer surface typically has as a drawback that：1st, structure is very multiple
It is miscellaneous, volume is huger, cost is also higher；2nd, these equipment are fixed a breakdown once breaking down and generally require the life of stopping producing line
Production, influences output；3rd, after installation, it is not easy to carry out adjustment and change in terms of function and position；4th, it is inconvenient to carry.
With the continuous diminution of dimensions of semiconductor devices, manufacture the wafer size used in semiconductor devices and constantly increase, semiconductor production
Technique needs to update, and device therefor also and then needs to adjust or change.
Therefore, it is necessary to a solution is proposed to solve the above problems.
【The content of the invention】
The technical problem to be solved in the present invention is to provide a kind of small volume, simple in construction, component is easily changed, conveniently
The semiconductor processing device of carrying.
In order to solve the above problems, according to an aspect of the present invention, the invention provides a kind of device for transferring fluid, its
Including：
Loading plate, offers several through holes thereon, and the through hole includes the first manhole and the second square through hole, institute
State the first manhole and the second square through hole is connected；
Electronic control valve, it includes the first valve portion and the second valve portion, shape and the loading plate of first valve portion
First manhole is corresponding, and the shape of second valve portion is corresponding with the second square through hole of the loading plate；
Supporting plate, it is fixed in the second valve portion of the electronic control valve,
First valve portion of the electronic control valve stretches out first manhole, and the second valve portion and supporting plate are caught in described the
In two square through holes.
As a preferred embodiment of the invention, its also include bottom plate, the placer on bottom plate, be arranged at it is described
One or more pump and tank plates on bottom plate,
The loading plate is vertically installed in the bottom plate and vertically engaged positioned at the side of the placer, the tank plate
In on the loading plate.
As a preferred embodiment of the invention, first valve portion has more in cylinder in the side of cylinder
Individual opening；
Second valve portion is in prism-shaped, and its end is connected with electrical cable.
As a preferred embodiment of the invention, the one side of the second valve portion prism-shaped offer several the
One screw hole, the position that first screw hole is corresponded on the supporting plate offer the second screw hole, by the first screw hole and
The supporting plate is attached on the electronic control valve by the second screw hole.
As a preferred embodiment of the invention, the length of second valve portion is more than the length of second square through hole
Degree, the thickness summation and the height of second square through hole of second valve portion and supporting plate are adapted.
As a preferred embodiment of the invention, the diameter of first manhole is less than second square through hole
Width, the length of first manhole are less than the length of second square through hole.
As a preferred embodiment of the invention, the length of first manhole is grown for second square through hole
/ to five/6th of degree.
Compared with prior art, the present invention sets supporting plate in the lower section of the second valve portion of the electronic control valve, can jail
Solid the electronic control valve is caught on the loading plate, and be readily disassembled.
On other objects of the present invention, feature and advantage are detailed in a specific embodiment below in conjunction with accompanying drawing
Description.
【Brief description of the drawings】
It will be better understood with reference to refer to the attached drawing and ensuing detailed description, the present invention, wherein same reference
Corresponding same structure member, wherein：
Fig. 1 is the structural representation of modularized semiconductor processing unit of the present invention；
Fig. 2 is the dimensional structure diagram of fluid carrying module in one embodiment in Fig. 1；
Fig. 3 A are the planar structure schematic diagram of equipment support meanss in one embodiment in the present invention；
Fig. 3 B are the plane left view of the equipment support meanss in Fig. 3 A；
Fig. 4 is a kind of cross section structure schematic diagram for section bar that the equipment support meanss in the present invention use；
Fig. 5 A are the cross section structure schematic diagram for another section bar that the equipment support meanss in the present invention use；
Fig. 5 B are the cross section structure schematic diagram of the section bar shown in Fig. 5 A；
Fig. 6 is that the assembling stereochemical structure of equipment support meanss 100 in one further embodiment in the present invention is shown
It is intended to；
Fig. 7 A are the planar structure schematic diagram for the plate that the equipment support meanss in the present invention use；
Fig. 7 B are the left view structural representation of the plate shown in Fig. 7 A；
Fig. 8 is the structural representation of fluid delivery module of the present invention；
Fig. 9 is the part-structure schematic diagram of fluid delivery module of the present invention；
Figure 10 is the main structure diagram of loading plate described in Fig. 8；
Figure 11 is the backsight structural representation of loading plate described in Figure 10；
Figure 12 is the structural representation of tank plate described in Fig. 8；
Figure 13 is structural representation of the tank board together in the loading plate；
Figure 14 is the structural representation of electronic control valve described in Fig. 8；
Figure 15 is the structural representation of supporting plate of the present invention；
Figure 16 is the structural representation that Figure 15 supporting plate is fixed on electronic control valve；
Figure 17 is the structural representation that the electronic control valve of the present invention is sticked on the loading plate.
【Embodiment】
In order to facilitate the understanding of the purposes, features and advantages of the present invention, it is below in conjunction with the accompanying drawings and specific real
Applying mode, the present invention is further detailed explanation.
" one embodiment " or " embodiment " referred to herein refer to the special characteristic related to the embodiment, structure or
Characteristic at least may be included at least one implementation of the present invention.In this manual different places occur " in a reality
Apply in example " not necessarily all refer to same embodiment, also it is necessarily that the independent or selection mutually exclusive with other embodiment is real
Apply example." multiple ", " some " in the present invention represent two or more."and/or" in the present invention represent " and " or
"or".
Referring to Fig. 1, it is the structural representation of modularized semiconductor processing unit of the present invention.As shown in figure 1, described half
Conductor processing equipment 1 includes semiconductor processing module 10, fluid delivery module 20, fluid carrying module 30 and control module 40.
The semiconductor processing module 10 includes a micro chamber for being used to accommodating and handling semiconductor crystal wafer, the micro chamber
It is described micro- for treatment fluid discharge including one or more entrances for supplying treatment fluid to enter the micro chamber and one or more
The outlet of chamber.The micro chamber includes forming the portion of upper chamber of working surface and forms the lower chambers portion of lower working surface,
The portion of upper chamber and the lower chambers portion can load and/or remove the semiconductor crystal wafer under the driving of a drive device
Relatively moved between open position and a closed position for accommodating the semiconductor crystal wafer.When portion of upper chamber or the cavity of resorption
When room portion is in the closed position, semiconductor crystal wafer is installed between the upper working surface and lower working surface.Due to using micro-
The structure of chamber, the volume of the semiconductor processing module 10 become very little.
It is chemicals that the fluid carrying module 30 is used to carrying required for the various processing semiconductor crystal wafers, super clear
Clean water or other fluids (may be collectively referred to as that fluid is not used) and/or carrying treat using for the semiconductor crystal wafer and flowed
Body, the fluid can be liquid or gas.Referring to Fig. 2, its be Fig. 1 in fluid carrying module in a reality
Apply the dimensional structure diagram in example.As shown in Fig. 2 it illustrates one embodiment of the fluid carrying module 30, it is described
Fluid carrying module 30, which includes carriage 31 and the multiple containers 32 being positioned in the carriage 31, the container, to be accommodated
For handle the various unused fluids required for the semiconductor crystal wafer and/or treat the semiconductor crystal wafer it is various
Use fluid.For example ultra-clean water is contained in a container, filled in another container by the change for handling the crystal column surface
Treatment fluid is learned, then separately has to contain in a container and utilizes the waste liquid for reclaiming to obtain after the water-treated semiconductor crystal wafer of ultra-clean.
Certain waste liquid can also be discharged directly by predetermined fluid discharge line, the container without being positioned over the fluid carrying module 30
In 32.In one embodiment, fluid can not can now be had to special set and be flowed by predetermined fluid service real-time feed
Body carrier module 30 carries various fluids.
The fluid delivery module 20 is connected by pipeline with the entrance and exit of the micro chamber, passes through pipeline and institute
The fluid communication in fluid carrying module 30 is stated, it is used to supply in fluid carrying module 30 or by predetermined fluid service
Various unused fluids driven by the entrance of pipeline and the micro chamber to the micro chamber.The fluid is described micro-
The semiconductor crystal wafer is handled in chamber, for example surface clean is carried out to the semiconductor crystal wafer using ultra-clean water,
Afterwards because the outlet and pipe for having used contaminated-fluid via the micro chamber is driven in the delivery of pressure, gravity or gas
Road is sent into corresponding container or predetermined fluid discharge line in the fluid carrying module 30.
In one embodiment, the semiconductor processing module 10, fluid delivery module 20, fluid carrying module 30 and control
Molding block 40 is all arranged in a kind of assembly type equipment support meanss.
Fig. 3 A show the planar structure schematic diagram of equipment support meanss in one embodiment in the present invention, and Fig. 3 B are
The plane left view of equipment support meanss in Fig. 3 A.
Incorporated by reference to reference to shown in figure 3A to Fig. 3 B, the equipment support meanss 100 include four montants, 110, two tops
Second cross bar, 130, two the first cross bars of bottom 140 and two the second cross bars of bottom 150 at the top of first cross bar 120, two.
Four montants 110 vertical spacing placement is simultaneously parallel to each other.Described two the first cross bars of top 120 erect with described
Bar 110 is vertical and parallel to each other, the both ends of the first cross bar 120 of each top respectively the top end face with two montants 110 against simultaneously
Connection.Described two the second cross bars of top 130 are vertical with the montant 110 and the first cross bar of the top 120 and mutually equal
OK, the both ends of the second cross bar 130 of each top respectively with the side of one end of two the first cross bars 120 of top against and be connected.
Described two the first cross bars of bottom 140 are vertical with the montant 110 and parallel with top the first cross bar 120, each bottom first
The both ends of cross bar 140 respectively with the bottom faces of two montants 110 against and be connected.Described two the second cross bars of bottom 150 and institute
State montant 110 and the top the second cross bar 130 be parallel, the both ends of each the second cross bar of bottom 150 respectively with two bottoms
The side of one end of the first cross bar 140 against and connect.
So, the equipment support meanss 100 are formed a cuboid framework (or being cuboid framework), four
Montant 110 forms the vertical edge of the cuboid framework, and four the first cross bars 120 and 140 form the of the cuboid framework
One horizontal edge, four the second cross bars 130 and 150 form the second horizontal edge of the cuboid framework.Positioned at the cuboid framework
One top 120, two montant 110 of the first cross bar of the same side and first cross bar of bottom 140 form the cuboid frame
One side of frame, top 130, two montants 110 and one of the second cross bar positioned at the same side of the cuboid framework
Individual the second cross bar of bottom 150 forms a side of the cuboid framework, two the first cross bars 120 of top and two tops the
Two cross bars 130 form the top surface of the cuboid framework, two the first cross bars of bottom 130 and two shapes of the second cross bar of bottom 150
Into the bottom surface of the cuboid framework.
For the cuboid framework, the in the vertical direction of montant 110 can be to the He of the first cross bar of top 120
The second cross bar of top 130 provides strong support so that heavier wafer can be placed on the top surface of the cuboid framework
Section components in surface processing equipment.The portions in crystal column surface processing equipment can also be placed in the cuboid framework
Part.
The equipment support meanss 100 also include two first support bars 160 and two second support bars 170, and described two
Individual first support bar 160 is parallel, and described two first support bars 160 are located at first cross bar of top 120 and bottom respectively
The outside of first cross bar 140 is simultaneously connected with first cross bar of top 120 and the first cross bar of bottom 140 respectively, and described two
Individual second support bar 170 is parallel, and described two second support bars 170 are located at second cross bar of bottom 150 and one first
It is connected between support bar 160 and with the lateral surface of first cross bar of bottom 140, the second support bar 170 and bottom
The upper side of first cross bar 140 is collectively forming the inside bottom surface of the cuboid framework.Institute can be placed in the inside bottom surface
State semiconductor processing module 10.Meanwhile first support bar 160 can also play certain add to whole equipment support meanss 100
Gu effect.
In one embodiment, second framework (not shown) is also associated with the outside of the cuboid framework, this
Two frameworks include the 3rd support bar (not shown), the 3rd support bar connection parallel with the first support bar, pass through first
The cuboid framework and the second framework are attached by the connection of support bar and the 3rd support bar.Can be with second framework
Place the control module 40.
Please emphasis refering to shown in Fig. 3 A and Fig. 3 B, each cross bar stretches out and formed beyond the montant being connected with the cross bar
Lateral surface epitaxy part, the epitaxy part is to stretch out from the one side of the cross bar along the width of the side shape
Into groove, the epitaxy part of two cross bars of forward surface pair is oppositely arranged.
Specifically, the first cross bar 120 of each top stretches out and is formed to exceed and is connected with first cross bar of top 120
Montant 110 lateral surface 111 epitaxy part 121, the epitaxy part 121 is the one side from first cross bar of top 120
Stretch out the groove to be formed along the width of the side.The first cross bar of each bottom 140, which stretches out and formed, to be exceeded
The epitaxy part 141 of the lateral surface 111 for the montant 110 being connected with first cross bar of bottom 140, the epitaxy part 141 are described in
The one side of the second cross bar of bottom 150 stretches out the groove to be formed along the width of the side.Each top second is horizontal
Bar 130 stretches out and forms the epitaxy part beyond the lateral surface 111 of montant 110 being connected with second cross bar of top 130
131, the epitaxy part 131 is to stretch out from the one side of second cross bar of top 130 along the width of the side
The groove of formation.The second cross bar of each bottom 150 stretches out and formed beyond the montant being connected with second cross bar of bottom 150
The epitaxy part 151 of 110 lateral surface 111, the epitaxy part 151 are from the one side of second cross bar of bottom 150 along the side
Stretch out the groove to be formed on the width in face.The bottom of the epitaxy part 121 and forward surface pair of the first cross bar 120 of each top
The epitaxy part 141 of the first cross bar of portion 140 is oppositely arranged, likewise, the epitaxy part 141 of each the first cross bar of bottom 140 with it is opposite
The epitaxy part 121 of the first cross bar of top 120 faced is oppositely arranged.The epitaxy part 131 of the second cross bar 130 of each top with it is opposite
The epitaxy part 151 of the second cross bar of bottom 150 faced is oppositely arranged, likewise, the epitaxy part of the second cross bar of each bottom 150
151 are oppositely arranged with the epitaxy part 131 of the second cross bar of top 130 of forward surface pair.
The montant, first cross bar, the second cross bar, first support bar and the second support bar are made up of section bar.
Referring to Fig. 4, it is a kind of cross section structure schematic diagram for the section bar 200 that can be used using the equipment support meanss in the present invention.
First cross bar and second cross bar are made up of the first section bar.First section bar 200 includes main part 210 and epitaxy part
220, the epitaxy part 220 be from the one side of the main part 210 of the first section bar 200 along the width of the side outwards
Extend the groove 230 formed.The main part 210 substantially cuboid, its length can be set as needed, the main body
The cross section in portion 210 is broadly square, and the height of its cross section of main part 210 is H1, and length L1, wherein L1 are equal to H1.
The depth H 2 for the groove 230 that the 220 of the epitaxy part are formed is the half of the height H1 of main part 210.In one embodiment
In, the length of the epitaxy part 220 is slightly larger than the length of the main part 210, when plate 400 (see Fig. 7 A and Fig. 7 B) inserts ditch
The epitaxy part perpendicular with the plate can be abutted against when in groove so that plate is unlikely to skid off groove.
Set on the main part 210 of first section bar 200 on the other three side adjacent with the one side with groove 230
There is first to pass through groove 240, first on three sides passes through groove 240 and divide first section bar 200 for positioned at the first of center
Connecting portion 250 and positioned at the first end portion 260 in four corners.The first end portion 260 and the first connecting portion 250
All it is hollow structure.In other embodiments, what H1 and L1 size can also design is inconsistent, and can be as needed
Design H1 and L1 value.In this embodiment, it is to be connected to one positioned at two first end portions 260 of the one side of groove 230
Rise.
Refer to the section knot that Fig. 5 A and Fig. 5 B, Fig. 5 A are another section bar that the equipment support meanss in the present invention use
Structure schematic diagram, Fig. 5 B are the cross section structure schematic diagram of the section bar shown in Fig. 5 A.As fig. 5 a and fig. 5b, the montant, first
Support bar and second support bar are made up of the second section bar.The cross section of second section bar 300 is broadly square, its cross section
Height be H3, length L3, wherein L3 are equal to H3.It is designed with running through the side on each side of second section bar 300
Second pass through groove 310, four second on four sides pass through groove 310 and divide second section bar 300 for positioned at center
Second connecting portion 330 and positioned at the second end portion 320 in four corners, the second end portion 320 and second connection
Portion 330 is all hollow structure.
Fig. 6 is that the assembling stereochemical structure of equipment support meanss 100 in one further embodiment in the present invention is shown
It is intended to, Fig. 7 A are the planar structure schematic diagram for the plate that the equipment support meanss in the present invention use, and Fig. 7 B are shown in Fig. 7 A
The left view structural representation of plate.Equipment support meanss 100 in Fig. 6 are compared with the equipment support meanss described in Fig. 3 A, and it is also
Include side plate 400, in this embodiment, the plate there are four.With reference to shown in Fig. 3 A and Fig. 3 B, each side plate
Between the groove of the epitaxy part of 400 dismountable epitaxy parts for being plugged in a corresponding top cross bar and a bottom bar,
In the groove for the epitaxy part that the top edge of each side plate 400 is contained in the top cross bar, under each side plate 400
Edge is contained in the raceway groove of the epitaxy part of the bottom bar.
Please continue to refer to Fig. 7 A and Fig. 7 B, the plate 400 includes pars intermedia 410 and extended from pars intermedia 410 to both sides
End 420.In this embodiment, the thickness of the end 420 of the plate 400 and the epitaxy part of first section bar 200
Groove 230 is corresponding so that the end 420 of the plate 400 can correspond to and insert in the groove 230 of first section bar 200.
Specifically, there is the He of epitaxy part 121 that two side plates 400 are plugged in the first cross bar 120 of corresponding top respectively
Between the epitaxy part 141 of the first cross bar of bottom 140, the top edge of two side plates 400 is contained in the horizontal stroke of top first
In the groove 230 of the epitaxy part 121 of bar 120, its lower edge is contained in the ditch of the epitaxy part 141 of first cross bar of bottom 140
In groove 230.There are epitaxy part 131 and the bottom second that two side plates 400 are plugged in the second cross bar 130 of corresponding top respectively
Between the epitaxy part 151 of cross bar 150, the top edge of two side plates 400 is contained in the outer of second cross bar of top 130
Prolong in the groove 230 in portion 131, its lower edge is contained in the groove 230 of the epitaxy part 151 of second cross bar of bottom 150.
The semiconductor processing module that the side plate 400 can be given in the equipment support meanss 100 provides certain
Semienclosed receiving space.So, the semiconductor processing module in it, the semiconductor being also possible to prevent in it can both have been protected
Processing module breaks down and has influence on external environment condition after (for example unexpected liquid leakage or sprinkling occur).In addition, the side
Face plate also make it that the outward appearance of whole equipment support meanss is more attractive in appearance.
In one embodiment, the montant 110 in the equipment support meanss 100 in the present invention, the and of cross bar 120,130,140
150, and support bar 160 and 170 can use usually used standard sections.
In the present invention, when two adjacent section bars are linked together, can by directly on section bar perforate use spiral shell
Relay part connects into section bar the equipment support meanss of stereo structure, can also use be spirally connected part by outer connector (not shown)
On perforation outer connector and profiled bars are relatively fixed.Material bar can be attached at an arbitrary position as needed.One
In individual embodiment, the part that is spirally connected can also be used by the perforation on interconnecting piece (not shown) by interconnecting piece and profiled bars phase
To fixation.Material bar can be attached at an arbitrary position as needed.Further, in order to reaching special intensity or solid
Determine effect, can be with welding or other methods come connection section bar.
The section bar of the invention that the equipment support meanss 100 of the present invention use, by simply assembling can group
Dress forms, and equally very convenient during dismounting, the section bar after dismounting can also reuse again, saves resource, reduces rubbish, favorably
In environmental protection.
Those of ordinary skill in art is it should be understood that the description as described in equipment support meanss 100 in embodiment
It is merely exemplary, all changes are made on the premise of without departing from true spirit and scope of the present invention should all belong to this
The protection domain of invention.As space is limited, the embodiment of part change is only listed below.
In certain embodiments, the pattern of the section bar not office used by the equipment support meanss 100 shown in Fig. 3 A
This is limited to, as long as the section bar can be built into the structure shown in Fig. 3 A, for example the section bar only has 1 or 2 sides
With groove through the side etc..
In certain embodiments, the first cross bar 120 and 140 can be located at the outside of the second cross bar 130 and 150, that is,
Say, the second cross bar 130 and 150 directly leans and is connected with the terminal surface of montant, and the first cross bar 120 and 140 is respectively with
The side of two cross bars 130 and 150 leans and connected.It is, of course, also possible to the first cross bar 120 and the second cross bar are exchanged as needed
Position relationship between 130, the position relationship that can also be exchanged as needed between the first cross bar 140 and the second cross bar 150.
" push up " herein and " bottom " is relative, if one of those is " top ", then its relative one is exactly
" bottom ".
It should be noted that the cuboid framework of the present invention has multilayer, wherein, semiconductor processing module 10 is located at as schemed
On the layer in 3A.The fluid delivery module 20 is placed on next layer of framework (not shown) of semiconductor processing module 10, stream
Body conveyer is connected with the semiconductor processing module on its upper strata by pipeline, on next layer of framework of the delivery module 20
Fluid carrying module 30 is placed with, the control module 40 is arranged on the fluid delivery module 20 and fluid carrying module 30
On lateral frame.
Referring to Fig. 8, it is the structural representation of fluid delivery module of the present invention.As shown in Figure 8.The fluid transmits mould
Block include bottom plate 510, the placer 520 on bottom plate 510 and, be vertically installed in the bottom plate 510 and be located at the placement
The loading plate 530 of the side of device 520, the tank plate 540 being sticked on the loading plate 530, electronic control valve 550 and it is arranged at institute
State one or more pumps 560 on bottom plate 510.
Referring to Fig. 9, it is the part-structure schematic diagram of fluid delivery module of the present invention.As shown in Figure 8 and Figure 9.It is described
Bottom plate 510, the pump seat 570 of " mountain " font is installed thereon, several first circular holes 511 are offered around the pump seat 570.
The pump seat 570 has the first arm 571, the second arm 572 and the 3rd arm 573, relative on the arm 572 of the first arm 571 and second
The first neck 574 is offered, the second neck 575 is offered relatively on the arm 573 of the second arm 572 and the 3rd.Pass through described
The pump 560 can be slidably mounted on the bottom plate 510 by one neck 574 and the second neck 575.
The placer 520, it is set up in the top of first circular hole 511, second is offered on the placer 520
Circular hole 521, the circular hole 511 of the second circular hole 521 and first are corresponding.The first circular hole 511 and the phase of the second circular hole 521 of the present invention
It is correspondingly arranged and preset distance is separated between the circular hole 521 of first circular hole 511 and second, filter (not shown) then inserts institute
State in the first circular hole 511 and the second circular hole 521, so as to ensure that the stability of filter.
Please continue to refer to Fig. 8.The loading plate 530, it is installed vertically on institute's bottom plate 510 by groove seat 580, described
Groove seat 580 is to upwardly extend what is formed from the surface of the bottom plate 510.Wherein, the first groove 581 of the groove seat 580
Width it is corresponding with the thickness of the loading plate 530, can be firm by the loading plate 530 by first groove 581
It is sticked on the bottom plate 510.By opening up the first groove 581 on groove seat 580, it can not only conveniently engage the present invention
Loading plate 530, and different types of loading plate is readily disassembled or changes, its is applied widely.In this embodiment, it is described recessed
Groove seat 580 is integrally formed with the bottom plate 510.In other embodiments, for the ease of dismantling and repairing, the groove seat
580 can also be fixed on by fastener on the bottom plate 510.
Figure 10 and Figure 11 are referred to, Figure 10 is the main structure diagram of loading plate described in Fig. 8, and Figure 11 is the carrying
The backsight structural representation of plate.As shown in Figure 10 and Figure 11, several through holes 531 are offered on the loading plate 530 and are located at
The positive conduit 532 of loading plate 530.The through hole 531 includes the first manhole 5311 and the second square through hole 5312, described
First manhole 5311 is connected with the second square through hole 5312, and the diameter of first manhole 5311 is less than described the
The width of two square through hole 5312.The length of first manhole 5311 is less than the length of second square through hole 5312,
In one embodiment, the length of first manhole 5311 be about the length of the second square through hole 5312 six/
1/1st to five.In this embodiment, several described through holes 531 are uniformly distributed at equal intervals on loading plate 530.At other
In embodiment, several through holes 531 distribution situation on loading plate 530 is not limited, can be adjusted according to being actually needed
Depending on.
Figure 12 is the structural representation of tank plate described in Fig. 8, and Figure 13 is the tank board together in the loading plate
Structural representation.As shown in Fig. 8 to Figure 13.The tank plate 540 includes tank 541, positioned at tank both sides first along arm 542
With second along arm 543, described first along the width of arm 542 be less than described second along arm 543 width, described second along arm 543
Width it is corresponding with the depth of the tank 541, so enable to the tank plate 540 to be firmly sticked in described
In the conduit 532 of loading plate 530.Wherein, the tank plate 540 is vertically sticked in the conduit 532 of the loading plate 530, from
The liquid flowed out in the through hole 531 enters tank 541.The tank plate 540 of the present invention is mobilizable to be sticked in loading plate
Groove in, it is not necessary to joint outer part, it is easily disassembled, it is easy to maintain.The present invention is set in the lower section of the loading plate 530
One tank plate 540, for collecting the liquid spilt from the opening 553 of the electronic control valve 550, avoid to miscellaneous part
Impact.
Please continue to refer to Figure 14, it is the structural representation of electronic control valve described in Fig. 8.As shown in Fig. 8 and Figure 14.Institute
Electronic control valve 550 is stated, it includes the first valve portion 551 and the second valve portion 552, and the shape of first valve portion 551 is held with described
The shape of first manhole 5311 of support plate 530 is corresponding, the shape of second valve portion 552 and the loading plate 530
The shape of second square through hole 5312 is corresponding.
First valve portion 551 has multiple openings 553 in the side of cylinder, controlled according to outside in cylinder
The electronic control valve 550 selective can connect two opening 553.It is provided with the one end of the pump 560
The suction inlet (not shown) and an outlet (not shown) for discharging liquid of one suction liquid.Second valve portion 552 is in
Prism-shaped, its end are connected with electrical cable (not shown), and the first screw hole 554 is offered in the one side of prism-shaped.At this
In embodiment, the quantity of first screw hole 554 is three.
Please continue to refer to Fig. 8.When in use, pipeline can be utilized by the row of the suction inlet of the pump 560, the pump 560
Outlet, the opening 553 of the electronic control valve 550, the micro chamber entrance (not shown), the micro chamber outlet
(not shown) and/or the fluid communication of the fluid carrying module 30.So, can be by the fluid under the driving of pump 560
The fluid of carrier module 30 is delivered to the micro chamber by pipeline and/or the electronic control valve 550, from the micro chamber
The fluid of outflow is delivered to the fluid carrying module 30 by pipeline and/or the electronic control valve 550 or predetermined fluid is arranged
Go out in pipeline.
Please continue to refer to Fig. 8.The under shed 590 for connecting the fluid space is offered on the bottom plate 510, is opened under this
221 pipeline for connection of mouth passes through.For example, if shown in position relationship Fig. 1 of modules 10,20,30 and 40, that
The pipeline passed through from the under shed 221 will be communicated to the fluid carrying module 30.
Figure 15 is referred to, it is the structural representation of supporting plate of the present invention, and the supporting plate that Figure 16 is Figure 15 is fixed on Electronic Control
Structural representation on valve.As shown in Figure 14 to 16.The electronic control valve also includes supporting plate 610, is corresponded on the supporting plate 610
The position of first screw hole 554 offers the second screw hole 611, passes through the screw hole of the first screw hole 554 and second
611 are fixed on the supporting plate 610 in first valve portion 551 of the electronic control valve 550.Figure 17 is the Electronic Control of the present invention
Valve is sticked in the structural representation on the loading plate.As shown in Figure 10,11 and Figure 17, the electronic control valve 550 is described in
One end of second square through hole 5312 is caught in and stretches out first manhole 5311 so that the electronic control valve 550
First valve portion 551 stretches out first manhole 5311, the second valve portion 552 be caught in and supporting plate 610 described in the second square through hole
In 5312.In the present invention, the length of second valve portion 552 is much larger than the length of second square through hole 5312, described
Second valve portion 552 and the thickness summation of supporting plate 610 and the height of second square through hole 5312 are adapted, by by the support
Plate 610 is attached to the second valve portion 552 of the electronic control valve and then electronic control valve 550 is fixed on into the loading plate 530
On.The supporting plate 610 of the present invention, it is caught in the second square through hole of the loading plate 530 with the electronic control valve 550 together
In 5312, and then a supporting role is played to the electronic control valve 550 so that the electronic control valve 550 can be firm
Be sticked on the loading plate 530, when need the electronic control valve 550 is unloaded from the loading plate 530 when, only need
The second valve portion 552 connection supporting plate 562 of electronic control valve 550 described in manual contact is together from second square through hole 5312
Extraction, not only facilitate but also be hardly damaged each part.
A feature or advantage for electronic control valve in the present invention is：In the second valve of the electronic control valve 550
The lower section in portion 552 sets supporting plate 610, and firmly the electronic control valve 550 can be caught on the loading plate 530, and
It is readily disassembled.
Described above has fully disclosed the embodiment of the present invention.It is pointed out that it is familiar with the field
Scope of the technical staff to any change that the embodiment of the present invention is done all without departing from claims of the present invention.
Correspondingly, the scope of claim of the invention is also not limited only to previous embodiment.
Claims (7)
1. a kind of device for transferring fluid, it is characterised in that it includes：
Loading plate, offers several through holes thereon, and the through hole includes the first manhole and the second square through hole, and described
One manhole and the second square through hole are connected；
Electronic control valve, it includes the first valve portion and the second valve portion, the shape of first valve portion and the first of the loading plate
Manhole is corresponding, and the shape of second valve portion is corresponding with the second square through hole of the loading plate；
Supporting plate, it is fixed in the second valve portion of the electronic control valve,
First valve portion of the electronic control valve stretches out first manhole, and the second valve portion and supporting plate are caught in the second party
In shape through hole.
2. device for transferring fluid according to claim 1, it is characterised in that it also includes bottom plate, putting on bottom plate
Device, one or more pump and the tank plates being arranged on the bottom plate are put,
The loading plate is vertically installed in the bottom plate and is vertically sticked in institute positioned at the side of the placer, the tank plate
State on loading plate.
3. device for transferring fluid according to claim 1, it is characterised in that first valve portion is in cylinder, in cylinder
The side of shape has multiple openings；
Second valve portion is in prism-shaped, and its end is connected with electrical cable.
4. device for transferring fluid according to claim 3, it is characterised in that in the one side of the second valve portion prism-shaped
Several the first screw holes are offered, the position that first screw hole is corresponded on the supporting plate offers the second screw hole, leads to
Cross the first screw hole and the supporting plate is attached on the electronic control valve by the second screw hole.
5. device for transferring fluid according to claim 1, it is characterised in that the length of second valve portion is more than described the
The thickness summation of the length of two square through holes, second valve portion and supporting plate is equal with the height of second square through hole.
6. device for transferring fluid according to claim 1, it is characterised in that the diameter of first manhole is less than institute
The second square entire widths are stated, the length of first manhole is less than the length of second square through hole.
7. device for transferring fluid according to claim 6, it is characterised in that the length of first manhole is described
/ to five/6th of second square through hole length.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510335380.9A CN105023868B (en) | 2015-06-16 | 2015-06-16 | Device for transferring fluid |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510335380.9A CN105023868B (en) | 2015-06-16 | 2015-06-16 | Device for transferring fluid |
Publications (2)
| Publication Number | Publication Date |
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| CN105023868A CN105023868A (en) | 2015-11-04 |
| CN105023868B true CN105023868B (en) | 2018-02-27 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201510335380.9A Active CN105023868B (en) | 2015-06-16 | 2015-06-16 | Device for transferring fluid |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102437077A (en) * | 2011-10-19 | 2012-05-02 | 东莞宏威数码机械有限公司 | Equipment for linearly transmitting organic light-emitting diode (OLED) substrate |
| CN103208438A (en) * | 2012-01-12 | 2013-07-17 | 余端仁 | Etching device |
| CN104051311A (en) * | 2014-07-08 | 2014-09-17 | 深圳市华星光电技术有限公司 | Base plate conveying device and strong acid or strong base etching process suitable for wet process |
| CN204680658U (en) * | 2015-06-16 | 2015-09-30 | 无锡华瑛微电子技术有限公司 | Device for transferring fluid |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110065276A1 (en) * | 2009-09-11 | 2011-03-17 | Applied Materials, Inc. | Apparatus and Methods for Cyclical Oxidation and Etching |
| JP2015009702A (en) * | 2013-06-28 | 2015-01-19 | 株式会社デンソー | Vehicular brake device |
-
2015
- 2015-06-16 CN CN201510335380.9A patent/CN105023868B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102437077A (en) * | 2011-10-19 | 2012-05-02 | 东莞宏威数码机械有限公司 | Equipment for linearly transmitting organic light-emitting diode (OLED) substrate |
| CN103208438A (en) * | 2012-01-12 | 2013-07-17 | 余端仁 | Etching device |
| CN104051311A (en) * | 2014-07-08 | 2014-09-17 | 深圳市华星光电技术有限公司 | Base plate conveying device and strong acid or strong base etching process suitable for wet process |
| CN204680658U (en) * | 2015-06-16 | 2015-09-30 | 无锡华瑛微电子技术有限公司 | Device for transferring fluid |
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| CN105023868A (en) | 2015-11-04 |
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