CN103190209B - 用于板级emi屏蔽的复合膜 - Google Patents

用于板级emi屏蔽的复合膜 Download PDF

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Publication number
CN103190209B
CN103190209B CN201180051609.6A CN201180051609A CN103190209B CN 103190209 B CN103190209 B CN 103190209B CN 201180051609 A CN201180051609 A CN 201180051609A CN 103190209 B CN103190209 B CN 103190209B
Authority
CN
China
Prior art keywords
resin
top layer
composite membrane
conductive
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201180051609.6A
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English (en)
Chinese (zh)
Other versions
CN103190209A (zh
Inventor
C-M·郑
B·夏
G·托马斯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Henkel AG and Co KGaA
Original Assignee
Henkel IP and Holding GmbH
Henkel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Henkel IP and Holding GmbH, Henkel Corp filed Critical Henkel IP and Holding GmbH
Publication of CN103190209A publication Critical patent/CN103190209A/zh
Application granted granted Critical
Publication of CN103190209B publication Critical patent/CN103190209B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • G—PHYSICS
    • G21—NUCLEAR PHYSICS; NUCLEAR ENGINEERING
    • G21F—PROTECTION AGAINST X-RADIATION, GAMMA RADIATION, CORPUSCULAR RADIATION OR PARTICLE BOMBARDMENT; TREATING RADIOACTIVELY CONTAMINATED MATERIAL; DECONTAMINATION ARRANGEMENTS THEREFOR
    • G21F1/00—Shielding characterised by the composition of the materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Electromagnetism (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Laminated Bodies (AREA)
  • Non-Insulated Conductors (AREA)
CN201180051609.6A 2010-10-26 2011-10-24 用于板级emi屏蔽的复合膜 Expired - Fee Related CN103190209B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US40670510P 2010-10-26 2010-10-26
US61/406,705 2010-10-26
PCT/US2011/057418 WO2012058131A2 (en) 2010-10-26 2011-10-24 Composite film for board level emi shielding

Publications (2)

Publication Number Publication Date
CN103190209A CN103190209A (zh) 2013-07-03
CN103190209B true CN103190209B (zh) 2016-05-18

Family

ID=45994675

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201180051609.6A Expired - Fee Related CN103190209B (zh) 2010-10-26 2011-10-24 用于板级emi屏蔽的复合膜

Country Status (8)

Country Link
US (1) US8847184B2 (https=)
EP (1) EP2633746B1 (https=)
JP (2) JP6082696B2 (https=)
KR (1) KR101584872B1 (https=)
CN (1) CN103190209B (https=)
FI (1) FI2633746T3 (https=)
TW (1) TWI507120B (https=)
WO (1) WO2012058131A2 (https=)

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KR102314774B1 (ko) 2014-11-26 2021-10-21 삼성전자주식회사 반도체 패키지
US9635789B2 (en) 2015-01-30 2017-04-25 Laird Technologies, Inc. Board level electromagnetic interference (EMI) shields with increased under-shield space
KR101862121B1 (ko) * 2015-02-02 2018-05-29 토요잉크Sc홀딩스주식회사 전자파 차폐 시트, 프린트 배선판 및 전자 기기
EP3075798A1 (en) * 2015-04-01 2016-10-05 Ronald R. Savin Coating compositions
EP3307815B1 (en) 2015-06-12 2026-02-18 NeoGraf Solutions, LLC Graphite composites and thermal management systems
US9968004B2 (en) 2015-09-25 2018-05-08 Laird Technologies, Inc. Thermal interface materials including electrically-conductive material
US11189420B2 (en) 2016-03-31 2021-11-30 Neograf Solutions, Llc Noise suppressing assemblies
JP6528733B2 (ja) 2016-06-21 2019-06-12 株式会社デンソー エジェクタ式冷凍サイクル
US10080317B2 (en) 2016-06-29 2018-09-18 Microsoft Technology Licensing, Llc Polymeric electromagnetic shield for electronic components
TWI619561B (zh) * 2016-07-28 2018-04-01 Rotating target
US10477738B2 (en) 2017-03-06 2019-11-12 Laird Technologies, Inc. Board level shields and systems and methods of applying board level shielding
KR20190076250A (ko) 2017-12-22 2019-07-02 삼성전자주식회사 반도체 패키지 및 반도체 모듈
WO2019174748A1 (en) 2018-03-16 2019-09-19 Huawei Technologies Co., Ltd. Assembly for electro-magnetic interference shielding and method
KR102075669B1 (ko) * 2018-10-26 2020-02-10 오재숙 신호 전송 커넥터 및 그 제조방법
KR102869375B1 (ko) * 2020-07-28 2025-10-14 삼성전자주식회사 Fpcb 조립체 및 이를 포함하는 전자 기기
CA3199923A1 (en) * 2020-11-25 2022-06-02 Maher F. El-Kady Metallic based electromagnetic interference shielding materials, devices, and methods of manufacture thereof
KR102521564B1 (ko) * 2021-01-14 2023-04-12 성균관대학교산학협력단 방열 및 전자파 차폐 복합재료, 이를 구비하는 전자 소자 패키지 및 이의 제조방법

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WO2006132695A2 (en) * 2005-04-11 2006-12-14 Advanced Energy Technology Inc. Sandwiched thermal article
JP2007294918A (ja) * 2006-03-29 2007-11-08 Tatsuta System Electronics Kk シールドフィルム及びシールドプリント配線板
CN101323173A (zh) * 2006-06-13 2008-12-17 日东电工株式会社 复合材料片材及其制造方法
JP2009191099A (ja) * 2008-02-12 2009-08-27 Tatsuta System Electronics Kk 導電性接着シート及びそれを備えた配線板、導電性接着シートの製造方法

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JP5139156B2 (ja) 2008-05-30 2013-02-06 タツタ電線株式会社 電磁波シールド材及びプリント配線板
CN102803406B (zh) * 2009-06-12 2015-10-14 洛德公司 防止基底被雷击的方法
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Publication number Priority date Publication date Assignee Title
WO2006132695A2 (en) * 2005-04-11 2006-12-14 Advanced Energy Technology Inc. Sandwiched thermal article
US20060247352A1 (en) * 2005-04-29 2006-11-02 Ariel - University Research And Development Ltd. EMI shielding material
JP2007294918A (ja) * 2006-03-29 2007-11-08 Tatsuta System Electronics Kk シールドフィルム及びシールドプリント配線板
CN101323173A (zh) * 2006-06-13 2008-12-17 日东电工株式会社 复合材料片材及其制造方法
JP2009191099A (ja) * 2008-02-12 2009-08-27 Tatsuta System Electronics Kk 導電性接着シート及びそれを備えた配線板、導電性接着シートの製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110246829B (zh) * 2018-03-09 2024-04-26 三星电子株式会社 半导体封装件和半导体模块

Also Published As

Publication number Publication date
JP2014502221A (ja) 2014-01-30
TW201228589A (en) 2012-07-01
WO2012058131A2 (en) 2012-05-03
TWI507120B (zh) 2015-11-01
JP6082696B2 (ja) 2017-02-15
KR101584872B1 (ko) 2016-01-13
EP2633746A2 (en) 2013-09-04
JP2016122859A (ja) 2016-07-07
KR20130132450A (ko) 2013-12-04
CN103190209A (zh) 2013-07-03
FI2633746T3 (fi) 2023-07-24
EP2633746A4 (en) 2017-11-29
US20130207005A1 (en) 2013-08-15
WO2012058131A3 (en) 2012-06-28
US8847184B2 (en) 2014-09-30
EP2633746B1 (en) 2023-07-19

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ASS Succession or assignment of patent right

Owner name: HENKEL CORP.

Free format text: FORMER OWNER: HENKEL US IP LLC

Effective date: 20141119

Owner name: HENKEL US IP LLC

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Effective date: 20141119

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Address after: Dusseldorf

Applicant after: HENKEL IP & HOLDING GmbH

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Applicant before: Henkel American Intellectual Property LLC

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Applicant after: Henkel American Intellectual Property LLC

Address before: American Connecticut

Applicant before: Henkel Corp.

C14 Grant of patent or utility model
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Effective date of registration: 20220808

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Patentee after: HENKEL AG & Co.KGaA

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Patentee before: HENKEL IP & HOLDING GmbH

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CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20160518