CN103177974A - Process for manufacturing discrete electronic component of copper sheet electrode - Google Patents
Process for manufacturing discrete electronic component of copper sheet electrode Download PDFInfo
- Publication number
- CN103177974A CN103177974A CN201110451233XA CN201110451233A CN103177974A CN 103177974 A CN103177974 A CN 103177974A CN 201110451233X A CN201110451233X A CN 201110451233XA CN 201110451233 A CN201110451233 A CN 201110451233A CN 103177974 A CN103177974 A CN 103177974A
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- pressing mold
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 27
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 18
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 18
- 239000010949 copper Substances 0.000 title claims abstract description 18
- 238000000034 method Methods 0.000 title abstract description 10
- 230000008569 process Effects 0.000 title abstract description 4
- 238000005520 cutting process Methods 0.000 claims abstract description 57
- 238000004806 packaging method and process Methods 0.000 claims abstract description 24
- 239000000084 colloidal system Substances 0.000 claims abstract description 12
- 238000003825 pressing Methods 0.000 claims description 81
- 239000011469 building brick Substances 0.000 claims description 27
- 238000003860 storage Methods 0.000 claims description 11
- 238000012856 packing Methods 0.000 claims description 10
- 239000000969 carrier Substances 0.000 claims description 3
- 238000003466 welding Methods 0.000 abstract 2
- 238000010586 diagram Methods 0.000 description 7
- 230000008901 benefit Effects 0.000 description 5
- 230000002950 deficient Effects 0.000 description 4
- 241000567030 Ampulloclitocybe clavipes Species 0.000 description 3
- 206010043101 Talipes Diseases 0.000 description 3
- 201000011228 clubfoot Diseases 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009740 moulding (composite fabrication) Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
Abstract
The invention relates to a process for manufacturing a discrete electronic component of a copper sheet electrode. A plurality of chips are respectively arranged on a plurality of chip bearing seats of a wire support and electrically connected with the chip bearing seats via guide connection layers, a plurality of welding lines are respectively electrically connected with a plurality of pins and the chips of the wire support, the wire support is arranged on a mould-sealed mould group, the chips, the welding lines and a plurality of longitudinal connecting ribs between the chip bearing seats and the pins are sealed via packaging colloid, then, the mould-sealed mould group is removed, the wire support is arranged on a press-fit mould group, the longitudinal connecting ribs of the wire support are removed via a high-rotating-speed cutter by the aid of a lower cutting channel and an upper cutting channel of the press-fit mould group, and then a plurality of the discrete electronic components are formed.
Description
Technical field
The present invention relates to a kind of discrete type electronic building brick manufacturing process of copper plate electrode.
Background technology
See also shown in Figure 17ly, existing known a kind of passive component packaging structure 10 is with pin 11 bending formings, and is electrically connected another electronic building bricks by this pin 11.
Because this passive component packaging structure 10 is to be electrically connected another electronic building brick by this pin 11, therefore its volume is larger, and be not suitable for light, thin, short, the little market demand of existing electronic goods, in addition due to this passive component packaging structure 10 in manufacture process, easily produce the bad situation of clubfoot, cause the pin distortion, serious even pin fracture, affecting the quality yield very large, is also the place that present passive component encapsulation affects the yield most critical.
Because the defective that above-mentioned existing passive component packaging structure exists, the inventor is based on being engaged in this type of product design manufacturing abundant practical experience and professional knowledge for many years, positive research and innovation in addition, to founding a kind of discrete type electronic building brick manufacturing process of new copper plate electrode, can improve general existing passive component packaging structure, make it have more practicality.Through constantly research, design, and through after repeatedly studying sample and improvement, finally create the present invention who has practical value.
Summary of the invention
Main purpose of the present invention is, overcome the defective that existing passive component packaging structure exists, and provide a kind of discrete type electronic building brick manufacturing process of new copper plate electrode, technical problem to be solved is to solve existing known electronic building brick to be encapsulated in manufacturing process, easily produce the bad situation of clubfoot, and cause pin distortion or fracture, affect the manufacturing process yield.
The object of the invention to solve the technical problems realizes by the following technical solutions.The discrete type electronic building brick manufacturing process of a kind of copper plate electrode that proposes according to the present invention wherein comprises:
one lead frame is provided, this lead frame is to have a plurality of horizontal connection ribs, a plurality of vertical connection ribs, a plurality of conductive carriers unit and a plurality of respectively interval trough between this conductive carrier unit and this horizontal connection rib that is positioned at, this horizontal connection rib and this vertical connection rib are to be chessboard to arrange, and this conductive carrier unit is between adjacent vertical connection rib, respectively this conductive carrier unit is that a chip bearing is arranged, one pin and one is positioned at the clearance space between this chip bearing and this pin, respectively this chip bearing and this pin of this conductive carrier unit are to be connected to different vertical connection ribs, this chip bearing and this pin are not to be connected with this horizontal connection rib, a plurality of chips are provided, and respectively this chip is to comprise the conductive layer that the second connection pad and that the first connection pad, that a upper surface, a lower surface, be positioned at this upper surface is positioned at this lower surface is positioned at this lower surface, and this conductive layer is to be electrically connected this second connection pad, this chip is arranged at respectively respectively this chip bearing of this conductive carrier unit, and this chip is to be electrically connected respectively this chip bearing with this conductive layer, form a plurality of bonding wires, this first connection pad of this chip reaches respectively this pin to be electrically connected respectively respectively, one mould envelope set of molds is provided, it comprises a bed die and a mold, this lead frame is to be arranged on this bed die, this mold is to have a plurality of transverse moment connected in stars, this mold is to be arranged on this lead frame, and be arranged at this lead frame those chips, those bonding wires, be to be placed between this transverse moment connected in star and this bed die at those the vertical connection ribs between those chip bearings and those pins and those clearance spaces, be filled in this transverse moment connected in star with a packing colloid, to seal those chips, this bonding wire and this vertical connection rib and this clearance space between this chip bearing and this pin, remove this mould envelope set of molds, so that this lead frame is formed with a plurality of horizontal rectangle packaging bodies, one pressing mold group is provided, it comprises pressing mold on pressing mold and, this time pressing mold has a plurality of lower pressing bases and a plurality of lower cutting conduit, this time pressing base and this time cutting conduit are for being spaced, should have a plurality of upper pressing bases and a plurality of upper cutting conduit by upper pressing mold, should upper pressing base with should upper cutting conduit be for being spaced, and this time pressing base is to should go up pressing base, it is to going up the cutting conduit that conduit is cut in this time, this wire erection with a plurality of horizontal rectangle packaging bodies is placed in this time pressing mold and is somebody's turn to do between upper pressing mold, and this time pressing mold be this lead frame of pressing with being somebody's turn to do upper pressing mold, this time pressing base and should upper pressing base be respectively this packing colloid of conflicting respectively wherein, and respectively this vertical connection rib is to cut between conduit with being somebody's turn to do at those lower cutting conduits, and with a cutting tool, prolonging on this cutting conduit and this time and cutting conduit and move, removing this vertical connection rib of this lead frame, with form a plurality of lists from electronic building brick.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
The discrete type electronic building brick manufacturing process of aforesaid copper plate electrode, wherein the rotating speed of this cutting tool is more than 30000rpm.
The discrete type electronic building brick manufacturing process of aforesaid copper plate electrode, wherein those lower cutting conduits have one first width, and respectively upward the cutting groove road has one second width, and this second width is not less than this first width.
The discrete type electronic building brick manufacturing process of aforesaid copper plate electrode wherein should separately have at least one storage tank by upper pressing mold, and on those, cutting conduit is to be communicated with this storage tank, and those lower cutting conduits of this time pressing mold are to be arranged in this storage tank.
The present invention compared with prior art has obvious advantage and beneficial effect.By technique scheme, the discrete type electronic building brick manufacturing process of copper plate electrode of the present invention can reach suitable technological progress and practicality, and has the extensive value on industry, and it has following advantages at least:
avoid existing known electronic building brick in package fabrication process, easily produce the bad situation of clubfoot, and cause the pin distortion or rupture, affect the situation of manufacturing process yield, and can once encapsulate a plurality of electronic building bricks by mould envelope set of molds, and utilize the upper cutting conduit of pressing mold group and vertical connection rib that lower cutting conduit cut and removed lead frame, with form single from electronic building brick, and single from electronic building brick be held between the upper pressing base and lower pressing base of pressing mold group, in order to follow-up access and collection, the discrete type electronic building brick manufacturing process of copper plate electrode of the present invention is compared the advantage that has more simplified manufacturing technique and reduce fraction defective with known techniques in addition.
Above-mentioned explanation is only the general introduction of technical solution of the present invention, for can clearer understanding technological means of the present invention, and can be implemented according to the content of specification, and for above and other objects of the present invention, feature and advantage can be become apparent, below especially exemplified by preferred embodiment, and the cooperation accompanying drawing, be described in detail as follows.
Description of drawings
Fig. 1 is according to a preferred embodiment of the present invention, the vertical view of a lead frame.
Fig. 2 is according to a preferred embodiment of the present invention, the partial enlarged drawing of this lead frame.
Fig. 3 is according to a preferred embodiment of the present invention, the schematic diagram of a chip.
Fig. 4 is according to a preferred embodiment of the present invention, and this chip is arranged at the schematic diagram of this lead frame.
Fig. 5 is according to a preferred embodiment of the present invention, and this wire erection is placed in the schematic diagram of a mould envelope set of molds.
Fig. 6 is according to a preferred embodiment of the present invention, and this mould seals the mold bottom view of set of molds.
Fig. 7 is according to a preferred embodiment of the present invention, and a packing colloid is filled in the schematic diagram of this mould envelope set of molds.
Fig. 8 forms the schematic diagram of horizontal rectangle packaging body according to a preferred embodiment of the present invention in this lead frame.
Fig. 9 forms the vertical view of horizontal rectangle packaging body according to a preferred embodiment of the present invention in this lead frame
Figure 10 is according to a preferred embodiment of the present invention, and this wire erection that is formed with horizontal rectangle packaging body is placed in the schematic diagram of a pressing mold group.
Figure 11 is according to a preferred embodiment of the present invention, the lower pressing mold vertical view of this pressing mold group.
Figure 12 is according to a preferred embodiment of the present invention, the upper pressing mold vertical view of this pressing mold group.
Figure 13 is according to a preferred embodiment of the present invention, and this wire erection that is formed with horizontal rectangle packaging body is placed in the cutaway view of this pressing mold group.
Figure 14 is according to a preferred embodiment of the present invention, and this wire erection that is formed with horizontal rectangle packaging body is placed in the vertical view of this pressing mold group.
Figure 15 is according to a preferred embodiment of the present invention, and this wire erection that is formed with horizontal rectangle packaging body is placed in the cutaway view that the cut cutter of this pressing mold group removes vertical connection rib.
Figure 16 forms the cutaway view of electronic building brick according to a preferred embodiment of the present invention.
A kind of known passive component packaging structure schematic diagram of Figure 17.
10: the passive component packaging structure
11: pin
100: lead frame 110: horizontal connection rib
120: vertical connection rib 130: the conductive carrier unit
131: chip bearing 132: pin
133: clearance space 140: interval trough
200: chip 210: upper surface
211: the first connection pads
220: 221: the second connection pads of lower surface
230: conductive layer
300: bonding wire 400: packing colloid
500: mould envelope set of molds 510: bed die
520: mold 521: the transverse moment connected in star
600: pressing mold group 610: lower pressing mold
611: lower pressing base 612: lower cutting conduit
620: upper pressing mold 621: upper pressing base
622: on cut conduit 623: storage tank
700: cutting tool
A: horizontal rectangle packaging body
H1: the first width H2: the second width
Embodiment
Reach for further setting forth the present invention technological means and the effect that predetermined goal of the invention is taked, below in conjunction with accompanying drawing and preferred embodiment, the discrete type electronic building brick manufacturing process of the copper plate electrode that foundation the present invention is proposed, its embodiment, method, step, feature and effect thereof are described in detail as follows.
see also Figure 1 and Figure 2, at first, one lead frame 100 is provided, this lead frame 100 is to have a plurality of horizontal connection ribs 110, a plurality of vertical connection ribs 120, a plurality of conductive carriers unit 130 and a plurality of interval trough 140 that is positioned at 110 of respectively this conductive carrier unit 130 and this horizontal connection rib, described horizontal connection rib 110 and described vertical connection rib 120 are to be chessboard to arrange, and this conductive carrier unit 130 is between adjacent vertical connection rib 120, respectively this conductive carrier unit 130 is that a chip bearing 131 is arranged, one pin 132 and one is positioned at the clearance space 133 of 132 of this chip bearing 131 and this pins, see also shown in Figure 2, respectively this chip bearing 131 and this pin 132 of this conductive carrier unit 130 are to be connected to different vertical connection ribs 120, this chip bearing 131 and this pin 132 are not to be connected with this horizontal connection rib 110.
See also shown in Figure 3, a plurality of chips 200 are provided, respectively this chip 200 is to comprise the conductive layer 230 that the second connection pad 221 and that the first connection pad 211, that a upper surface 210, a lower surface 220, be positioned at this upper surface 210 is positioned at this lower surface 220 is positioned at this lower surface 220, and this conductive layer 230 is to be electrically connected this second connection pad 221.
See also shown in Figure 4ly, then, those chips 200 are arranged at respectively respectively this chip bearing 131 of this conductive carrier unit 130, and this chip 200 is to be electrically connected respectively this chip bearing 131 with this conductive layer 230.
Please consult Fig. 4 again, then, form a plurality of bonding wires 300, this first connection pad 211 of this chip 200 reaches respectively this pin 132 to be electrically connected respectively respectively.
see also Fig. 2, Fig. 4, Fig. 5, Figure 6 and Figure 7, one mould envelope set of molds 500 is provided, it comprises a bed die 510 and a mold 520, this lead frame 100 is to be arranged on this bed die 510, this mold 520 is to have a plurality of transverse moment connected in stars 521, this mold 520 is to be arranged on this lead frame 100, and be arranged at this chip 200 of this lead frame 100, this bonding wire 300, to be placed between this transverse moment connected in star 521 and this bed die 510 at this vertical connection rib 120 between this chip bearing 131 and this pin 132 and this clearance space 133, those transverse moment connected in stars 521 and this bed die 510 of this mold 520, to form the colloid runner.
Please consult again shown in Figure 7ly, be filled in above-mentioned transverse moment connected in star 521 with a packing colloid 400, with sealing said chip 200, this bonding wire 300 and this vertical connection rib 120 and this clearance space 133 between this chip bearing 131 and this pin 132.
See also Fig. 8 and shown in Figure 9, afterwards, remove this mould envelope set of molds 500, so that this lead frame 100 is formed with a plurality of horizontal rectangle packaging body A.
see also Figure 10, Figure 11 and shown in Figure 12, then, one pressing mold group 600 is provided, it comprises pressing mold 620 on pressing mold 610 and, this time pressing mold 610 has a plurality of lower pressing bases 611 and a plurality of lower cutting conduit 612, this time pressing base 611 is for being spaced with this time cutting conduit 612, should have a plurality of upper pressing bases 621 and a plurality of upper cutting conduit 622 by upper pressing mold 620, should upper pressing base 621 be for being spaced with being somebody's turn to do upper cutting conduit 622, and this time pressing base 611 is to going up pressing base 621, this time cutting conduit 612 is to going up cutting conduit 622, in the present embodiment, should separately have at least one storage tank 623 by upper pressing mold 620, should upper cutting conduit 622 be to be communicated with this storage tank 623, and this time of this time pressing mold 610 cutting conduit 612 is to be arranged in this storage tank 623.
see also shown in Figure 13, then, this lead frame 100 with a plurality of horizontal rectangle packaging body A is arranged at this time pressing mold 610 and is somebody's turn to do between upper pressing mold 620, and this time pressing mold 610 be these lead frames 100 of pressing with being somebody's turn to do upper pressing mold 620, this time pressing base 611 and should upper pressing base 621 be respectively these packing colloids 400 of conflicting respectively wherein, and respectively this vertical connection rib 120 is at this time cutting conduit 612 and is somebody's turn to do between cutting conduit 622, in the present embodiment, this time cutting conduit 612 has one first width H1, respectively should have one second width H2 by upper cutting conduit 622, this second width H2 is not less than this first width H1, support this horizontal rectangle packaging body A in order to this time pressing base 611.
see also Figure 13 and shown in Figure 14, then, with a cutting tool 700, prolonging on this cutting conduit 622 and this time cuts conduit 612 and moves, the rotating speed of this cutting tool is more than 30000rpm, but it is to remove this vertical connection rib 120 of this lead frame 100 moment and be positioned at packing colloid 400 on those vertical connection ribs 120, see also Figure 15 and shown in Figure 16, remove this vertical connection rib 120 of this lead frame 100 with this cutting tool 700, with form a plurality of lists from electronic building brick B, in the present embodiment, be not less than this first width H1 of respectively this time cutting conduit 612 due to this second width H2 of cutting conduit 622 on this, therefore cut conduit 622 and this time when this cutting tool 700 when cutting conduit 612 and moving to remove this vertical connection rib 120 of this lead frame 100 on this, this time pressing base 611 of this time pressing mold 610 has been to provide the shearing resistance fulcrum of this horizontal rectangle packaging body A, it can avoid this packing colloid 400 and this vertical connection rib 120 to burst apart because of cutting scissors stress, in addition, cutting conduit 612 due to this time of this time pressing mold 610 is to be positioned at this storage tank 623, therefore be to be conducive to access and collection after cutting manufacturing technology is completed, the discrete type electronic building brick manufacturing process of copper plate electrode of the present invention and known techniques are compared the advantage that has more simplified manufacturing technique and reduce fraction defective.
the above, it is only preferred embodiment of the present invention, be not that the present invention is done any pro forma restriction, although the present invention discloses as above with preferred embodiment, yet be not to limit the present invention, any those skilled in the art, within not breaking away from the technical solution of the present invention scope, when the technology contents that can utilize above-mentioned announcement is made a little change or is modified to the equivalent embodiment of equivalent variations, in every case be the content that does not break away from technical solution of the present invention, any simple modification that foundation technical spirit of the present invention is done above embodiment, equivalent variations and modification, all still belong in the scope of technical solution of the present invention.
Claims (4)
1. the manufacturing process of the discrete type electronic building brick of a copper plate electrode is characterized in that comprising:
one lead frame, this lead frame is to have a plurality of horizontal connection ribs, a plurality of vertical connection ribs, a plurality of conductive carriers unit and a plurality of respectively interval trough between this conductive carrier unit and this horizontal connection rib that is positioned at, this horizontal connection rib and this vertical connection rib are to be chessboard to arrange, and this conductive carrier unit is between adjacent vertical connection rib, respectively this conductive carrier unit is that a chip bearing is arranged, one pin and one is positioned at the clearance space between this chip bearing and this pin, respectively this chip bearing and this pin of this conductive carrier unit are to be connected to different vertical connection ribs, this chip bearing and this pin are not to be connected with this horizontal connection rib,
A plurality of chips, respectively this chip is to comprise the conductive layer that the second connection pad and that the first connection pad, that a upper surface, a lower surface, be positioned at this upper surface is positioned at this lower surface is positioned at this lower surface, this conductive layer is to be electrically connected this second connection pad;
This chip is arranged at respectively respectively this chip bearing of this conductive carrier unit, and this chip is to be electrically connected respectively this chip bearing with this conductive layer;
Form a plurality of bonding wires, this first connection pad of this chip reaches respectively this pin to be electrically connected respectively respectively;
One mould envelope set of molds, it comprises a bed die and a mold, this lead frame is to be arranged on this bed die, this mold is to have a plurality of transverse moment connected in stars, this mold is to be arranged on this lead frame, and be arranged at this lead frame this chip, this bonding wire, be to be placed between this transverse moment connected in star and this bed die at this vertical connection rib between this chip bearing and this pin and this clearance space;
Be filled in this transverse moment connected in star with a packing colloid, to seal this chip, this bonding wire and this vertical connection rib and this clearance space between this chip bearing and this pin;
Remove this mould envelope set of molds, so that this lead frame is formed with a plurality of horizontal rectangle packaging bodies;
One pressing mold group is provided, it comprises pressing mold on pressing mold and, this time pressing mold has a plurality of lower pressing bases and a plurality of lower cutting conduit, this time pressing base and this time cutting conduit are for being spaced, should have a plurality of upper pressing bases and a plurality of upper cutting conduit by upper pressing mold, should upper pressing base with should upper cutting conduit be for being spaced, and this time pressing base is to should go up pressing base, it is to going up the cutting conduit that conduit is cut in this time;
This wire erection with a plurality of horizontal rectangle packaging bodies is placed in this time pressing mold and is somebody's turn to do between upper pressing mold, and this time pressing mold be this lead frame of pressing with being somebody's turn to do upper pressing mold, this time pressing base and should upper pressing base be respectively this packing colloid of conflicting respectively wherein, and respectively this vertical connection rib is at this time cutting conduit and is somebody's turn to do and cuts between conduit; And
With a cutting tool, prolonging on this cutting conduit and this time and cutting conduit and move, removing this vertical connection rib of this lead frame, with form a plurality of lists from electronic building brick.
2. the discrete type electronic building brick manufacturing process of copper plate electrode as claimed in claim 1, the rotating speed that it is characterized in that this cutting tool is more than 30000rpm.
3. the discrete type electronic building brick manufacturing process of copper plate electrode as claimed in claim 1, is characterized in that respectively this time cutting conduit has one first width, and respectively upward the cutting groove road has one second width, and this second width is not less than this first width.
4. the discrete type electronic building brick manufacturing process of copper plate electrode as claimed in claim 1, it is characterized in that on this, pressing mold separately has at least one storage tank, should upper cutting conduit be to be communicated with this storage tank, and this time of this time pressing mold cutting conduit be to be arranged in this storage tank.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110451233.XA CN103177974B (en) | 2011-12-23 | 2011-12-23 | Process for manufacturing discrete electronic component of copper sheet electrode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110451233.XA CN103177974B (en) | 2011-12-23 | 2011-12-23 | Process for manufacturing discrete electronic component of copper sheet electrode |
Publications (2)
| Publication Number | Publication Date |
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| CN103177974A true CN103177974A (en) | 2013-06-26 |
| CN103177974B CN103177974B (en) | 2014-10-29 |
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| CN201110451233.XA Active CN103177974B (en) | 2011-12-23 | 2011-12-23 | Process for manufacturing discrete electronic component of copper sheet electrode |
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| US20010044169A1 (en) * | 2000-03-21 | 2001-11-22 | Shoshi Yasunaga | Lead frame for semiconductor devices, a semiconductor device made using the lead frame, and a method of manufacturing a semiconductor device |
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| CN1549341A (en) * | 2003-05-20 | 2004-11-24 | 矽品精密工业股份有限公司 | Non pin semiconductor package parts and production process constituted with conducting wire frame |
| US20050017335A1 (en) * | 2003-01-09 | 2005-01-27 | Nec Electronics Corporation | Leadless type semiconductor package, and production process for manufacturing such leadless type semiconductor package |
| CN101226890A (en) * | 2007-01-18 | 2008-07-23 | 南茂科技股份有限公司 | Blanking type encapsulation constitution without external pin and manufacturing method thereof |
| CN101540289A (en) * | 2008-03-19 | 2009-09-23 | 飞思卡尔半导体公司 | Semiconductor integrated circuit package and method for packaging semiconductor integrated circuit |
-
2011
- 2011-12-23 CN CN201110451233.XA patent/CN103177974B/en active Active
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|---|---|---|---|---|
| US20010044169A1 (en) * | 2000-03-21 | 2001-11-22 | Shoshi Yasunaga | Lead frame for semiconductor devices, a semiconductor device made using the lead frame, and a method of manufacturing a semiconductor device |
| US20030071365A1 (en) * | 2001-09-11 | 2003-04-17 | Rohm Co., Ltd. | Electronic device fabrication method comprising twofold cutting of conductor member |
| US20050017335A1 (en) * | 2003-01-09 | 2005-01-27 | Nec Electronics Corporation | Leadless type semiconductor package, and production process for manufacturing such leadless type semiconductor package |
| CN1549341A (en) * | 2003-05-20 | 2004-11-24 | 矽品精密工业股份有限公司 | Non pin semiconductor package parts and production process constituted with conducting wire frame |
| CN101226890A (en) * | 2007-01-18 | 2008-07-23 | 南茂科技股份有限公司 | Blanking type encapsulation constitution without external pin and manufacturing method thereof |
| CN101540289A (en) * | 2008-03-19 | 2009-09-23 | 飞思卡尔半导体公司 | Semiconductor integrated circuit package and method for packaging semiconductor integrated circuit |
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| Publication number | Publication date |
|---|---|
| CN103177974B (en) | 2014-10-29 |
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