CN103176367B - 泵系统、二氧化碳供给系统、抽取系统、光刻设备和器件制造方法 - Google Patents
泵系统、二氧化碳供给系统、抽取系统、光刻设备和器件制造方法 Download PDFInfo
- Publication number
- CN103176367B CN103176367B CN201210548141.8A CN201210548141A CN103176367B CN 103176367 B CN103176367 B CN 103176367B CN 201210548141 A CN201210548141 A CN 201210548141A CN 103176367 B CN103176367 B CN 103176367B
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- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 title claims abstract description 274
- 229910002092 carbon dioxide Inorganic materials 0.000 title claims abstract description 137
- 239000001569 carbon dioxide Substances 0.000 title claims abstract description 137
- 238000000605 extraction Methods 0.000 title claims abstract description 39
- 238000000034 method Methods 0.000 title abstract description 19
- 238000005086 pumping Methods 0.000 title abstract description 14
- 238000011144 upstream manufacturing Methods 0.000 claims abstract description 34
- 239000007788 liquid Substances 0.000 claims description 119
- 239000012530 fluid Substances 0.000 claims description 98
- 230000003287 optical effect Effects 0.000 claims description 41
- 230000005499 meniscus Effects 0.000 claims description 19
- 230000007306 turnover Effects 0.000 claims description 13
- 230000033001 locomotion Effects 0.000 claims description 12
- 230000008092 positive effect Effects 0.000 claims description 12
- 239000007789 gas Substances 0.000 description 120
- 239000000758 substrate Substances 0.000 description 101
- 238000007654 immersion Methods 0.000 description 36
- 230000005855 radiation Effects 0.000 description 35
- 238000000059 patterning Methods 0.000 description 24
- 238000010276 construction Methods 0.000 description 13
- 230000008569 process Effects 0.000 description 10
- 238000004590 computer program Methods 0.000 description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 230000003068 static effect Effects 0.000 description 6
- 238000013461 design Methods 0.000 description 5
- 230000004888 barrier function Effects 0.000 description 4
- 239000010410 layer Substances 0.000 description 4
- 238000005461 lubrication Methods 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 238000013500 data storage Methods 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 239000000284 extract Substances 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 238000003384 imaging method Methods 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 230000010363 phase shift Effects 0.000 description 3
- 239000000725 suspension Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- -1 aromatic hydrocarbon Chemical class 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 230000001276 controlling effect Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 2
- 238000012940 design transfer Methods 0.000 description 2
- 238000004090 dissolution Methods 0.000 description 2
- 210000003128 head Anatomy 0.000 description 2
- 229930195733 hydrocarbon Natural products 0.000 description 2
- 150000002430 hydrocarbons Chemical class 0.000 description 2
- 239000004615 ingredient Substances 0.000 description 2
- 238000001459 lithography Methods 0.000 description 2
- 230000005381 magnetic domain Effects 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 230000009183 running Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- 241000628997 Flos Species 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000007864 aqueous solution Chemical class 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000001934 delay Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000003631 expected effect Effects 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000002346 layers by function Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 239000002105 nanoparticle Substances 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 210000001747 pupil Anatomy 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 230000000153 supplemental effect Effects 0.000 description 1
- 210000001138 tear Anatomy 0.000 description 1
- 230000005514 two-phase flow Effects 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2041—Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/0318—Processes
- Y10T137/0396—Involving pressure control
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/8158—With indicator, register, recorder, alarm or inspection means
- Y10T137/8326—Fluid pressure responsive indicator, recorder or alarm
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/8593—Systems
- Y10T137/85978—With pump
- Y10T137/85986—Pumped fluid control
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201161578114P | 2011-12-20 | 2011-12-20 | |
| US61/578,114 | 2011-12-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103176367A CN103176367A (zh) | 2013-06-26 |
| CN103176367B true CN103176367B (zh) | 2016-02-03 |
Family
ID=48609815
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210548141.8A Active CN103176367B (zh) | 2011-12-20 | 2012-12-17 | 泵系统、二氧化碳供给系统、抽取系统、光刻设备和器件制造方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US9575406B2 (enExample) |
| JP (2) | JP6010445B2 (enExample) |
| KR (1) | KR101410847B1 (enExample) |
| CN (1) | CN103176367B (enExample) |
| NL (1) | NL2009899A (enExample) |
| TW (1) | TWI461860B (enExample) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL2005655A (en) | 2009-12-09 | 2011-06-14 | Asml Netherlands Bv | A lithographic apparatus and a device manufacturing method. |
| NL2007453A (en) | 2010-10-18 | 2012-04-19 | Asml Netherlands Bv | A fluid handling structure, a lithographic apparatus and a device manufacturing method. |
| NL2009378A (en) * | 2011-10-07 | 2013-04-09 | Asml Netherlands Bv | Lithographic apparatus and method of cooling a component in a lithographic apparatus. |
| US10122591B1 (en) * | 2013-03-13 | 2018-11-06 | Google Llc | Managing access to no-cost content |
| CN104238277B (zh) * | 2013-06-19 | 2016-12-28 | 上海微电子装备有限公司 | 一种浸没式光刻机的流场维持方法 |
| KR101408834B1 (ko) * | 2014-01-06 | 2014-06-20 | 한국지역난방공사 | 배기가스 정량 공급이 가능한 산업설비용 추기장치 |
| JP2017538159A (ja) * | 2014-12-19 | 2017-12-21 | エーエスエムエル ネザーランズ ビー．ブイ． | 流体取扱構造、リソグラフィ装置及びデバイス製造方法 |
| WO2017036830A1 (en) * | 2015-08-31 | 2017-03-09 | Asml Netherlands B.V. | A gas leak detector and a method of detecting a leak of gas |
| US10883866B2 (en) * | 2015-09-24 | 2021-01-05 | Fujikin Incorporated | Pressure-based flow rate control device and malfunction detection method therefor |
| CN107991384B (zh) * | 2017-12-21 | 2023-10-13 | 浙江启尔机电技术有限公司 | 一种微管内气液两相流流型的检测装置及方法 |
| CN109976098B (zh) * | 2019-03-22 | 2024-04-12 | 福建华佳彩有限公司 | 一种光阻刀头 |
| DE102020204545A1 (de) * | 2020-04-08 | 2021-10-14 | Carl Zeiss Smt Gmbh | Verfahren und vorrichtung zum trocknen eines bauteilinnenraums |
| TW202439039A (zh) * | 2023-03-21 | 2024-10-01 | 聯華電子股份有限公司 | 微影機台系統及其液體儲存槽的漏液檢測方法 |
| CN121002450A (zh) * | 2023-04-04 | 2025-11-21 | Asml荷兰有限公司 | 流体处理系统和方法以及制造器件的方法 |
Citations (2)
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|---|---|---|---|---|
| CN101794081A (zh) * | 2004-06-16 | 2010-08-04 | Asml荷兰有限公司 | 浸没光刻用真空系统 |
| CN102096330A (zh) * | 2009-12-09 | 2011-06-15 | Asml荷兰有限公司 | 光刻设备和器件制造方法 |
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| JP2516194B2 (ja) * | 1984-06-11 | 1996-07-10 | 株式会社日立製作所 | 投影露光方法 |
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-
2012
- 2012-11-28 NL NL2009899A patent/NL2009899A/en not_active Application Discontinuation
- 2012-12-10 TW TW101146437A patent/TWI461860B/zh active
- 2012-12-12 JP JP2012271675A patent/JP6010445B2/ja active Active
- 2012-12-13 US US13/714,205 patent/US9575406B2/en active Active
- 2012-12-17 CN CN201210548141.8A patent/CN103176367B/zh active Active
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| CN101794081A (zh) * | 2004-06-16 | 2010-08-04 | Asml荷兰有限公司 | 浸没光刻用真空系统 |
| CN102096330A (zh) * | 2009-12-09 | 2011-06-15 | Asml荷兰有限公司 | 光刻设备和器件制造方法 |
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| Publication number | Publication date |
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| TWI461860B (zh) | 2014-11-21 |
| JP2015146047A (ja) | 2015-08-13 |
| US20130155380A1 (en) | 2013-06-20 |
| JP6010445B2 (ja) | 2016-10-19 |
| TW201335723A (zh) | 2013-09-01 |
| CN103176367A (zh) | 2013-06-26 |
| KR101410847B1 (ko) | 2014-06-23 |
| NL2009899A (en) | 2013-06-24 |
| US9575406B2 (en) | 2017-02-21 |
| KR20130071407A (ko) | 2013-06-28 |
| JP2013131746A (ja) | 2013-07-04 |
| JP6145131B2 (ja) | 2017-06-07 |
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