CN103155698A - 感应加热装置及感应加热方法 - Google Patents
感应加热装置及感应加热方法 Download PDFInfo
- Publication number
- CN103155698A CN103155698A CN2011800464299A CN201180046429A CN103155698A CN 103155698 A CN103155698 A CN 103155698A CN 2011800464299 A CN2011800464299 A CN 2011800464299A CN 201180046429 A CN201180046429 A CN 201180046429A CN 103155698 A CN103155698 A CN 103155698A
- Authority
- CN
- China
- Prior art keywords
- heater
- sensed
- sensed heater
- induction heating
- disposed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010438 heat treatment Methods 0.000 title claims abstract description 134
- 230000006698 induction Effects 0.000 title claims abstract description 80
- 238000000034 method Methods 0.000 title claims description 12
- 230000004907 flux Effects 0.000 claims abstract description 16
- 230000035699 permeability Effects 0.000 claims abstract description 7
- 230000020169 heat generation Effects 0.000 claims description 12
- 235000012431 wafers Nutrition 0.000 abstract 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 43
- 230000000694 effects Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 239000012467 final product Substances 0.000 description 4
- 238000005755 formation reaction Methods 0.000 description 4
- 229910002804 graphite Inorganic materials 0.000 description 4
- 239000010439 graphite Substances 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 2
- 230000005674 electromagnetic induction Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 206010037660 Pyrexia Diseases 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 210000002615 epidermis Anatomy 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B6/00—Heating by electric, magnetic or electromagnetic fields
- H05B6/02—Induction heating
- H05B6/06—Control, e.g. of temperature, of power
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B6/00—Heating by electric, magnetic or electromagnetic fields
- H05B6/02—Induction heating
- H05B6/10—Induction heating apparatus, other than furnaces, for specific applications
- H05B6/105—Induction heating apparatus, other than furnaces, for specific applications using a susceptor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B6/00—Heating by electric, magnetic or electromagnetic fields
- H05B6/02—Induction heating
- H05B6/36—Coil arrangements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B6/00—Heating by electric, magnetic or electromagnetic fields
- H05B6/02—Induction heating
- H05B6/36—Coil arrangements
- H05B6/42—Cooling of coils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B6/00—Heating by electric, magnetic or electromagnetic fields
- H05B6/02—Induction heating
- H05B6/36—Coil arrangements
- H05B6/44—Coil arrangements having more than one coil or coil segment
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Induction Heating (AREA)
Abstract
Description
Claims (24)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010-288396 | 2010-12-24 | ||
JP2010288396A JP4980461B1 (ja) | 2010-12-24 | 2010-12-24 | 誘導加熱装置 |
PCT/JP2011/069798 WO2012086268A1 (ja) | 2010-12-24 | 2011-08-31 | 誘導加熱装置および誘導加熱方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103155698A true CN103155698A (zh) | 2013-06-12 |
CN103155698B CN103155698B (zh) | 2015-08-05 |
Family
ID=46313553
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201180046429.9A Active CN103155698B (zh) | 2010-12-24 | 2011-08-31 | 感应加热装置及感应加热方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US9287146B2 (zh) |
JP (1) | JP4980461B1 (zh) |
KR (1) | KR101297493B1 (zh) |
CN (1) | CN103155698B (zh) |
TW (1) | TWI448207B (zh) |
WO (1) | WO2012086268A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110315619A (zh) * | 2019-08-07 | 2019-10-11 | 中国林业科学研究院木材工业研究所 | 一种木制品弯曲构件成型方法及其装置 |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8963058B2 (en) * | 2011-11-28 | 2015-02-24 | The Boeing Company | System and method of adjusting the equilibrium temperature of an inductively-heated susceptor |
JP6013113B2 (ja) * | 2012-09-27 | 2016-10-25 | 東京エレクトロン株式会社 | 発熱体の製造方法 |
GB201511358D0 (en) | 2015-06-29 | 2015-08-12 | Nicoventures Holdings Ltd | Electronic aerosol provision systems |
GB201511359D0 (en) | 2015-06-29 | 2015-08-12 | Nicoventures Holdings Ltd | Electronic vapour provision system |
GB201511349D0 (en) * | 2015-06-29 | 2015-08-12 | Nicoventures Holdings Ltd | Electronic aerosol provision systems |
US10407769B2 (en) * | 2016-03-18 | 2019-09-10 | Goodrich Corporation | Method and apparatus for decreasing the radial temperature gradient in CVI/CVD furnaces |
DE102016119328A1 (de) | 2016-10-11 | 2018-04-12 | Osram Opto Semiconductors Gmbh | Heizvorrichtung, Verfahren und System zur Herstellung von Halbleiterchips im Waferverbund |
US20220298615A1 (en) * | 2019-07-12 | 2022-09-22 | Carnegie Mellon University | Methods of Modifying a Domain Structure of a Magnetic Ribbon, Manufacturing an Apparatus, and Magnetic Ribbon Having a Domain Structure |
ES2820098A1 (es) * | 2019-10-17 | 2021-04-19 | Gh Electrotermia S A | Sistema para calentamiento por induccion de piezas metalicas |
Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5690742A (en) * | 1994-09-06 | 1997-11-25 | Komatsu Electronic Metals Co., Ltd. | Susceptor for an epitaxial growth apparatus |
US6245152B1 (en) * | 1996-07-05 | 2001-06-12 | Super Silicon Crystal Research Institute Corp. | Method and apparatus for producing epitaxial wafer |
US20030010775A1 (en) * | 2001-06-21 | 2003-01-16 | Hyoung June Kim | Methods and apparatuses for heat treatment of semiconductor films upon thermally susceptible non-conducting substrates |
US20030085223A1 (en) * | 2001-09-28 | 2003-05-08 | Neilson Zeng | Patterned microwave susceptor element and microwave container incorporating same |
US6705394B1 (en) * | 1999-10-29 | 2004-03-16 | Cvc Products, Inc. | Rapid cycle chuck for low-pressure processing |
CN1647244A (zh) * | 2002-04-08 | 2005-07-27 | 克里公司 | 气体驱动的行星旋转设备及用于形成碳化硅层的方法 |
US20050211700A1 (en) * | 2004-03-05 | 2005-09-29 | Canon Kabushiki Kaisha | Heating apparatus |
CN101111934A (zh) * | 2004-12-02 | 2008-01-23 | 蓝姆研究公司 | 控制空间温度分布的方法和装置 |
US20080118641A1 (en) * | 2006-11-20 | 2008-05-22 | Applied Materials, Inc. | Compensation techniques for substrate heating processes |
CN101494163A (zh) * | 2008-01-22 | 2009-07-29 | 东京毅力科创株式会社 | 处理装置和处理方法 |
WO2010026815A1 (ja) * | 2008-09-04 | 2010-03-11 | 東京エレクトロン株式会社 | 熱処理装置 |
WO2010047155A1 (ja) * | 2008-10-23 | 2010-04-29 | 東京エレクトロン株式会社 | 熱処理装置 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5132731B2 (zh) * | 1972-05-19 | 1976-09-14 | ||
JPS6312127A (ja) * | 1986-07-03 | 1988-01-19 | Fujitsu Ltd | 高周波誘導加熱サセプタ |
DE19622402C1 (de) * | 1996-06-04 | 1997-10-16 | Siemens Ag | Vorrichtung zum Behandeln wenigstens eines Substrats sowie Verwendung der Vorrichtung |
JP3652462B2 (ja) * | 1997-01-14 | 2005-05-25 | 本田技研工業株式会社 | 車両用リヤディファレンシャルのケーシング構造 |
US20050186723A1 (en) * | 2001-06-21 | 2005-08-25 | Kim Hyoung J. | Methods and apparatuses for heat treatment of semiconductor films upon thermally susceptible non-conducting substrates |
JP2004039708A (ja) * | 2002-07-01 | 2004-02-05 | Nikon Corp | 荷電粒子線露光装置 |
JP4336283B2 (ja) * | 2004-09-29 | 2009-09-30 | 三井造船株式会社 | 誘導加熱装置 |
TWI281833B (en) * | 2004-10-28 | 2007-05-21 | Kyocera Corp | Heater, wafer heating apparatus and method for manufacturing heater |
JP4313775B2 (ja) | 2005-03-29 | 2009-08-12 | 三井造船株式会社 | 誘導加熱方法および装置 |
US20070125762A1 (en) * | 2005-12-01 | 2007-06-07 | Applied Materials, Inc. | Multi-zone resistive heater |
JP4844330B2 (ja) * | 2006-10-03 | 2011-12-28 | 富士電機株式会社 | 炭化珪素半導体装置の製造方法および炭化珪素半導体装置 |
JP5169097B2 (ja) * | 2007-09-14 | 2013-03-27 | 住友電気工業株式会社 | 半導体装置の製造装置および製造方法 |
JP5004842B2 (ja) * | 2008-03-25 | 2012-08-22 | 三井造船株式会社 | 誘導加熱装置 |
-
2010
- 2010-12-24 JP JP2010288396A patent/JP4980461B1/ja active Active
-
2011
- 2011-08-31 KR KR1020137007417A patent/KR101297493B1/ko active IP Right Grant
- 2011-08-31 WO PCT/JP2011/069798 patent/WO2012086268A1/ja active Application Filing
- 2011-08-31 CN CN201180046429.9A patent/CN103155698B/zh active Active
- 2011-08-31 US US13/994,547 patent/US9287146B2/en active Active
- 2011-10-31 TW TW100139580A patent/TWI448207B/zh active
Patent Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5690742A (en) * | 1994-09-06 | 1997-11-25 | Komatsu Electronic Metals Co., Ltd. | Susceptor for an epitaxial growth apparatus |
US6245152B1 (en) * | 1996-07-05 | 2001-06-12 | Super Silicon Crystal Research Institute Corp. | Method and apparatus for producing epitaxial wafer |
US6705394B1 (en) * | 1999-10-29 | 2004-03-16 | Cvc Products, Inc. | Rapid cycle chuck for low-pressure processing |
US20030010775A1 (en) * | 2001-06-21 | 2003-01-16 | Hyoung June Kim | Methods and apparatuses for heat treatment of semiconductor films upon thermally susceptible non-conducting substrates |
US20030085223A1 (en) * | 2001-09-28 | 2003-05-08 | Neilson Zeng | Patterned microwave susceptor element and microwave container incorporating same |
CN1647244A (zh) * | 2002-04-08 | 2005-07-27 | 克里公司 | 气体驱动的行星旋转设备及用于形成碳化硅层的方法 |
US20050211700A1 (en) * | 2004-03-05 | 2005-09-29 | Canon Kabushiki Kaisha | Heating apparatus |
CN101111934A (zh) * | 2004-12-02 | 2008-01-23 | 蓝姆研究公司 | 控制空间温度分布的方法和装置 |
US20080118641A1 (en) * | 2006-11-20 | 2008-05-22 | Applied Materials, Inc. | Compensation techniques for substrate heating processes |
CN101494163A (zh) * | 2008-01-22 | 2009-07-29 | 东京毅力科创株式会社 | 处理装置和处理方法 |
WO2010026815A1 (ja) * | 2008-09-04 | 2010-03-11 | 東京エレクトロン株式会社 | 熱処理装置 |
WO2010047155A1 (ja) * | 2008-10-23 | 2010-04-29 | 東京エレクトロン株式会社 | 熱処理装置 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110315619A (zh) * | 2019-08-07 | 2019-10-11 | 中国林业科学研究院木材工业研究所 | 一种木制品弯曲构件成型方法及其装置 |
Also Published As
Publication number | Publication date |
---|---|
TWI448207B (zh) | 2014-08-01 |
TW201230880A (en) | 2012-07-16 |
KR20130038957A (ko) | 2013-04-18 |
WO2012086268A1 (ja) | 2012-06-28 |
US20130264335A1 (en) | 2013-10-10 |
CN103155698B (zh) | 2015-08-05 |
JP4980461B1 (ja) | 2012-07-18 |
JP2012138204A (ja) | 2012-07-19 |
US9287146B2 (en) | 2016-03-15 |
KR101297493B1 (ko) | 2013-08-20 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN103155698A (zh) | 感应加热装置及感应加热方法 | |
CN103069921B (zh) | 感应加热装置及感应加热方法 | |
EP2405715B1 (en) | Induction-heating cooking system | |
Fujita et al. | A new zone-control induction heating system using multiple inverter units applicable under mutual magnetic coupling conditions | |
US8912473B2 (en) | Variable-size induction heating plate | |
CN103444260B (zh) | 感应加热装置、感应加热装置的控制方法以及控制程序 | |
US10136476B2 (en) | Inductive heating device, method for controlling inductive heating device, and program | |
CN108987230A (zh) | 载置台和等离子体处理装置 | |
JP5025698B2 (ja) | 誘導加熱装置 | |
JP4313775B2 (ja) | 誘導加熱方法および装置 | |
KR101192501B1 (ko) | 반도체기판 열처리장치 | |
US11166347B2 (en) | Induction heating device | |
CN106341918B (zh) | 感应加热线圈以及使用了该感应加热线圈的感应加热装置 | |
Kilic et al. | Strongly coupled outer squircle–inner circular coil architecture for enhanced induction over large areas | |
CN106102199A (zh) | 一种多相位多线圈的感应加热设备及方法 | |
Ha et al. | Analysis and control of the heat distribution in a zone-control induction heating system | |
KR101931421B1 (ko) | 유도 가열 및 무선 전력 전송 장치 | |
WO2017093168A1 (en) | An inductive coil unit | |
JP5734390B2 (ja) | 誘導加熱調理器 | |
CN216565645U (zh) | 一种线圈与磁条组装配结构及电加热设备 | |
JP2011070873A (ja) | 誘導加熱装置ならびにそれを用いた誘導加熱調理器 | |
CN215529359U (zh) | 一种磁条、磁条装配结构和电加热设备 | |
CN103155120B (zh) | 感应加热装置 | |
JP4668343B1 (ja) | 半導体基板熱処理装置 | |
KR20220120160A (ko) | 유도 가열 방식의 쿡탑 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: Tokyo, Japan Patentee after: Mitsui AIS Corp. Address before: Tokyo, Japan Patentee before: MITSUI ENGINEERING & SHIPBUILDING Co.,Ltd. |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20181029 Address after: Tokyo, Japan Patentee after: MITSUI ENGINEERING & SHIPBUILDING Co.,Ltd. Address before: Tokyo, Japan Patentee before: Mitsui AIS Corp. |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20240311 Address after: Tokyo, Japan Patentee after: Mitsui Yiaisi Co.,Ltd. Country or region after: Japan Address before: Tokyo, Japan Patentee before: MITSUI ENGINEERING & SHIPBUILDING Co.,Ltd. Country or region before: Japan |