CN103134778B - 电路板沉铜质量的检测方法及电路板的制造工艺 - Google Patents
电路板沉铜质量的检测方法及电路板的制造工艺 Download PDFInfo
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- CN103134778B CN103134778B CN201110392452.5A CN201110392452A CN103134778B CN 103134778 B CN103134778 B CN 103134778B CN 201110392452 A CN201110392452 A CN 201110392452A CN 103134778 B CN103134778 B CN 103134778B
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CN201110392452.5A CN103134778B (zh) | 2011-12-01 | 2011-12-01 | 电路板沉铜质量的检测方法及电路板的制造工艺 |
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CN103134778B true CN103134778B (zh) | 2015-03-25 |
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Families Citing this family (7)
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CN104144571B (zh) * | 2014-06-18 | 2018-02-27 | 四川深北电路科技有限公司 | 一种高密度互连集成电路板制作方法 |
CN105722300B (zh) * | 2014-12-03 | 2019-04-16 | 北大方正集团有限公司 | 电镀质量检测模块、印制电路板母板和电镀质量检测方法 |
CN105848419B (zh) * | 2016-05-06 | 2018-06-15 | 鹤山市中富兴业电路有限公司 | 一种含pofv树脂塞孔且激光盲孔不填平的电路板制作方法 |
CN108548819A (zh) * | 2018-05-10 | 2018-09-18 | 深圳市富利特科技有限公司 | 一种印刷电路板背光测试的方法 |
CN112326667A (zh) * | 2020-10-27 | 2021-02-05 | 惠州市特创电子科技有限公司 | 导电连接孔的覆铜检测方法及装置 |
CN113570562A (zh) * | 2021-07-19 | 2021-10-29 | 苏州悦谱半导体有限公司 | 一种基于cam的电路板导通分析检测方法 |
CN113686557B (zh) * | 2021-10-27 | 2022-01-18 | 四川英创力电子科技股份有限公司 | 一种沉铜背光切片制备方法及检测方法 |
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CN1991299A (zh) * | 2005-12-26 | 2007-07-04 | 比亚迪股份有限公司 | 线路板中导通孔镀铜厚度的测试方法 |
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JPH09275265A (ja) * | 1996-04-05 | 1997-10-21 | Toppan Printing Co Ltd | 配線回路基板用検査治具及びその製造方法 |
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Patent Citations (1)
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CN1991299A (zh) * | 2005-12-26 | 2007-07-04 | 比亚迪股份有限公司 | 线路板中导通孔镀铜厚度的测试方法 |
Non-Patent Citations (2)
Title |
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The Importance of High Quality Electroless Copper Deposition in the Production of Plated-through-hole PCBs;C.Lea;《Circuit World》;19861231;第12卷(第2期);16-21 * |
化学镀铜的印刷电路内层断裂问题研究;陈雪梅等;《涂料涂装与电镀》;20041031;第2卷(第5期);32-35 * |
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Address after: 518053 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee after: SHENNAN CIRCUITS Co.,Ltd. Address before: 518053 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee before: SHENNAN CIRCUITS Co.,Ltd. |
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