CN103108533B - Fpc用电磁波屏蔽材料 - Google Patents

Fpc用电磁波屏蔽材料 Download PDF

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Publication number
CN103108533B
CN103108533B CN201210455392.1A CN201210455392A CN103108533B CN 103108533 B CN103108533 B CN 103108533B CN 201210455392 A CN201210455392 A CN 201210455392A CN 103108533 B CN103108533 B CN 103108533B
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CN
China
Prior art keywords
electromagnetic shielding
film
fpc
shielding material
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201210455392.1A
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English (en)
Chinese (zh)
Other versions
CN103108533A (zh
Inventor
野村直宏
藤井早苗
樱木乔规
稻叶佑子
后藤信弘
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujimori Kogyo Co Ltd
Original Assignee
Fujimori Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
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Publication of CN103108533A publication Critical patent/CN103108533A/zh
Application granted granted Critical
Publication of CN103108533B publication Critical patent/CN103108533B/zh
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/285—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyethers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02A—TECHNOLOGIES FOR ADAPTATION TO CLIMATE CHANGE
    • Y02A30/00—Adapting or protecting infrastructure or their operation
CN201210455392.1A 2011-11-14 2012-11-13 Fpc用电磁波屏蔽材料 Active CN103108533B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011248736A JP5726048B2 (ja) 2011-11-14 2011-11-14 Ｆｐｃ用電磁波シールド材
JP2011-248736 2011-11-14

Publications (2)

Publication Number Publication Date
CN103108533A CN103108533A (zh) 2013-05-15
CN103108533B true CN103108533B (zh) 2015-09-16

Family

ID=48315997

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201210455392.1A Active CN103108533B (zh) 2011-11-14 2012-11-13 Fpc用电磁波屏蔽材料

Country Status (3)

Country Link
JP (1) JP5726048B2 (ja)
KR (1) KR101359474B1 (ja)
CN (1) CN103108533B (ja)

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CN102711428B (zh) * 2012-06-21 2015-11-18 广州方邦电子有限公司 一种高屏蔽效能的极薄屏蔽膜及其制作方法
JP2014046622A (ja) * 2012-08-31 2014-03-17 Dexerials Corp 透明導電体、入力装置および電子機器
KR102301080B1 (ko) 2013-05-29 2021-09-09 타츠타 전선 주식회사 전자파 실드 필름의 제조 방법
JP2015012098A (ja) * 2013-06-27 2015-01-19 住友電工プリントサーキット株式会社 シールドフィルム及びプリント配線板
JP6650660B2 (ja) * 2014-01-20 2020-02-19 東洋インキＳｃホールディングス株式会社 フレキシブルプリント配線板用電磁波シールドシート、および電磁波シールドシート付きフレキシブルプリント配線板
CN104134907B (zh) * 2014-06-27 2017-08-15 小米科技有限责任公司 耳机插座组件和电子设备
US9553382B2 (en) 2014-06-27 2017-01-24 Xiaomi Inc. Headphone socket assembly and electronic equipment including same
JP6520133B2 (ja) * 2015-01-16 2019-05-29 大日本印刷株式会社 積層体ならびにそれを用いた導電性基材の製造方法および電子デバイスの製造方法
JP6520143B2 (ja) * 2015-01-23 2019-05-29 大日本印刷株式会社 積層体、それを用いた導電性基材の製造方法、電子デバイスの製造方法、および転写具
KR102527794B1 (ko) 2016-02-04 2023-05-03 삼성전자주식회사 코일을 포함하는 전자 장치
KR20170136063A (ko) * 2016-05-30 2017-12-11 주식회사 아모그린텍 초박형 전자파 차폐시트 및 그를 구비한 전자기기
CN107567175A (zh) * 2016-06-30 2018-01-09 蔡见明 一种电磁波屏蔽膜
JP2018010888A (ja) * 2016-07-11 2018-01-18 藤森工業株式会社 電磁波シールド材
WO2018116967A1 (ja) * 2016-12-22 2018-06-28 東亞合成株式会社 接着剤組成物並びにこれを用いたカバーレイフィルム、ボンディングシート、銅張積層板及び電磁波シールド材
CN208570149U (zh) * 2018-09-13 2019-03-01 重庆惠科金渝光电科技有限公司 绝缘皮膜、软排线及显示装置
CN109627704A (zh) * 2018-11-21 2019-04-16 惠州市串联电子科技有限公司 用于fpc基板的耐高温材料
JP6699784B2 (ja) * 2019-04-26 2020-05-27 大日本印刷株式会社 積層体、それを用いた導電性基材の製造方法、電子デバイスの製造方法、および転写具
JP6699783B2 (ja) * 2019-04-26 2020-05-27 大日本印刷株式会社 積層体ならびにそれを用いた導電性基材の製造方法および電子デバイスの製造方法
JP6849131B2 (ja) * 2020-04-30 2021-03-24 大日本印刷株式会社 積層体、それを用いた導電性基材の製造方法、電子デバイスの製造方法、および転写具
JP6849130B2 (ja) * 2020-04-30 2021-03-24 大日本印刷株式会社 積層体ならびにそれを用いた導電性基材の製造方法および電子デバイスの製造方法
CN111968857B (zh) * 2020-08-28 2022-02-08 电子科技大学 化学法提高薄膜附着力实现介电薄膜双层复合的方法

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CN101176388A (zh) * 2005-05-13 2008-05-07 大自达系统电子株式会社 屏蔽膜、屏蔽印刷电路板、屏蔽柔性印刷电路板、屏蔽膜制造方法及屏蔽印刷电路板制造方法
CN100584180C (zh) * 2005-02-18 2010-01-20 东洋油墨制造株式会社 电磁波屏蔽性粘合薄膜、其制备方法以及被粘合物的电磁波屏蔽方法
CN102026530A (zh) * 2009-09-18 2011-04-20 东洋油墨制造株式会社 电磁波屏蔽性薄膜及电路板

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JPH07122883A (ja) * 1993-10-21 1995-05-12 Nitto Denko Corp 電磁波シ−ルド材
JP4156233B2 (ja) * 2001-12-19 2008-09-24 大日本印刷株式会社 電磁波シールド材、及び電磁波シールド付きフラットケーブル
JP4737656B2 (ja) * 2002-06-24 2011-08-03 大日本印刷株式会社 導電性化粧シート
JP4174248B2 (ja) * 2002-07-01 2008-10-29 群栄化学工業株式会社 ポリイミド樹脂、これを含有する樹脂組成物、電子部品用被覆材料及び電子部品用接着剤
JP4201548B2 (ja) * 2002-07-08 2008-12-24 タツタ電線株式会社 シールドフィルム、シールドフレキシブルプリント配線板及びそれらの製造方法
JP2004364267A (ja) * 2003-05-09 2004-12-24 Matsushita Electric Ind Co Ltd 撮像装置
JP2005056906A (ja) * 2003-08-05 2005-03-03 Reiko Co Ltd 電磁波遮蔽性転写フイルム
JP4363340B2 (ja) * 2004-03-12 2009-11-11 住友電気工業株式会社 導電性銀ペースト及びそれを用いた電磁波シールド部材
KR100840599B1 (ko) * 2008-02-13 2008-06-23 (주)에이치제이 전자파 차폐 테이프 및 그 제조방법
JP2009246121A (ja) * 2008-03-31 2009-10-22 Nippon Steel Chem Co Ltd 電磁波シールド材及びその製造方法
KR101239816B1 (ko) * 2008-06-26 2013-03-06 디아이씨 가부시끼가이샤 은 함유 분체의 제조 방법, 은 함유 분체, 도전성 페이스트 및 플라스틱 기판
JP5446222B2 (ja) * 2008-11-14 2014-03-19 住友電気工業株式会社 導電性ペースト及びそれを用いた電磁波シールドフィルム、電磁波シールドフレキシブルプリント配線板
JP2010238870A (ja) * 2009-03-31 2010-10-21 Toyo Ink Mfg Co Ltd 電磁波シールド性カバーレイフィルム、フレキシブルプリント配線板の製造方法、及びフレキシブルプリント配線板。

Patent Citations (3)

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Publication number Priority date Publication date Assignee Title
CN100584180C (zh) * 2005-02-18 2010-01-20 东洋油墨制造株式会社 电磁波屏蔽性粘合薄膜、其制备方法以及被粘合物的电磁波屏蔽方法
CN101176388A (zh) * 2005-05-13 2008-05-07 大自达系统电子株式会社 屏蔽膜、屏蔽印刷电路板、屏蔽柔性印刷电路板、屏蔽膜制造方法及屏蔽印刷电路板制造方法
CN102026530A (zh) * 2009-09-18 2011-04-20 东洋油墨制造株式会社 电磁波屏蔽性薄膜及电路板

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Publication number Publication date
JP5726048B2 (ja) 2015-05-27
CN103108533A (zh) 2013-05-15
JP2013105888A (ja) 2013-05-30
KR20130054144A (ko) 2013-05-24
KR101359474B1 (ko) 2014-02-06

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