CN103107272B - 基板、发光装置、以及基板的制造方法 - Google Patents

基板、发光装置、以及基板的制造方法 Download PDF

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Publication number
CN103107272B
CN103107272B CN201210474091.3A CN201210474091A CN103107272B CN 103107272 B CN103107272 B CN 103107272B CN 201210474091 A CN201210474091 A CN 201210474091A CN 103107272 B CN103107272 B CN 103107272B
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CN
China
Prior art keywords
lead frame
distribution
electrode
wiring
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201210474091.3A
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English (en)
Chinese (zh)
Other versions
CN103107272A (zh
Inventor
木村康之
荒井直
小林刚
冈部敏幸
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Shinko Electric Co Ltd
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Shinko Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Shinko Electric Co Ltd filed Critical Shinko Electric Co Ltd
Publication of CN103107272A publication Critical patent/CN103107272A/zh
Application granted granted Critical
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Expired - Fee Related legal-status Critical Current
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8582—Means for heat extraction or cooling characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8585—Means for heat extraction or cooling being an interconnection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings

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  • Led Device Packages (AREA)
CN201210474091.3A 2011-11-07 2012-11-05 基板、发光装置、以及基板的制造方法 Expired - Fee Related CN103107272B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011-243700 2011-11-07
JP2011243700A JP5813467B2 (ja) 2011-11-07 2011-11-07 基板、発光装置及び基板の製造方法

Publications (2)

Publication Number Publication Date
CN103107272A CN103107272A (zh) 2013-05-15
CN103107272B true CN103107272B (zh) 2017-03-01

Family

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Family Applications (1)

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CN201210474091.3A Expired - Fee Related CN103107272B (zh) 2011-11-07 2012-11-05 基板、发光装置、以及基板的制造方法

Country Status (4)

Country Link
US (1) US8786065B2 (https=)
EP (1) EP2590215B1 (https=)
JP (1) JP5813467B2 (https=)
CN (1) CN103107272B (https=)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN203521475U (zh) * 2013-09-06 2014-04-02 郑榕彬 用于led倒装晶片封装的浮动散热铜片支架及led封装件
JP6314493B2 (ja) * 2014-01-20 2018-04-25 株式会社カネカ 発光素子実装用リードフレーム、発光素子実装用樹脂成型体、表面実装型発光装置、及び表面実装型発光装置の製造方法
JP6381432B2 (ja) 2014-05-22 2018-08-29 新光電気工業株式会社 インダクタ、コイル基板及びコイル基板の製造方法
WO2016080521A1 (ja) * 2014-11-20 2016-05-26 日本精工株式会社 電子部品搭載用放熱基板
JP6606517B2 (ja) * 2015-02-13 2019-11-13 シチズン電子株式会社 発光装置の製造方法
US10395810B2 (en) 2015-05-19 2019-08-27 Shinko Electric Industries Co., Ltd. Inductor
JP6237826B2 (ja) * 2015-09-30 2017-11-29 日亜化学工業株式会社 パッケージ及び発光装置、並びにそれらの製造方法
JP6304282B2 (ja) 2016-02-16 2018-04-04 日亜化学工業株式会社 半導体レーザ装置
DE102016105491A1 (de) * 2016-03-23 2017-09-28 Osram Opto Semiconductors Gmbh Herstellung von halbleiterbauelementen
JP6643213B2 (ja) * 2016-09-16 2020-02-12 新光電気工業株式会社 リードフレーム及びその製造方法と電子部品装置
JP6610497B2 (ja) 2016-10-14 2019-11-27 オムロン株式会社 電子装置およびその製造方法
JP7071631B2 (ja) 2018-06-25 2022-05-19 日亜化学工業株式会社 パッケージ、発光装置及びそれぞれの製造方法
JP7116303B2 (ja) 2018-06-25 2022-08-10 日亜化学工業株式会社 パッケージ及び発光装置
JP7295479B2 (ja) * 2018-06-25 2023-06-21 日亜化学工業株式会社 パッケージ及び発光装置
JP7164804B2 (ja) * 2018-06-25 2022-11-02 日亜化学工業株式会社 パッケージ、発光装置およびそれらの製造方法
JP6879270B2 (ja) 2018-07-20 2021-06-02 日亜化学工業株式会社 発光装置
CN111864050B (zh) * 2020-04-16 2023-04-18 诺思(天津)微系统有限责任公司 半导体器件、半导体组件及电子设备
JP7104348B2 (ja) * 2020-10-28 2022-07-21 日亜化学工業株式会社 発光装置
DE102021117414A1 (de) 2021-07-06 2023-01-12 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches halbleiterbauteil und herstellungsverfarhen
EP4553892A1 (en) * 2023-11-13 2025-05-14 Infineon Technologies Austria AG Leadframe package with increased routing capability

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007507910A (ja) * 2004-09-10 2007-03-29 ルクスピア カンパニー リミテッド 多様な色実現が可能な半導体発光装置及びその製造方法
CN101043061A (zh) * 2006-03-23 2007-09-26 财团法人工业技术研究院 可防止静电破坏的发光器封装结构及其制造方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11284233A (ja) * 1998-03-27 1999-10-15 Stanley Electric Co Ltd 平面実装型ｌｅｄ素子
US6612890B1 (en) * 1998-10-15 2003-09-02 Handy & Harman (Ny Corp.) Method and system for manufacturing electronic packaging units
JP3217322B2 (ja) * 1999-02-18 2001-10-09 日亜化学工業株式会社 チップ部品型発光素子
CN1449583A (zh) * 2000-07-25 2003-10-15 Ssi株式会社 塑料封装基底、气腔型封装及其制造方法
KR100374683B1 (ko) * 2000-10-07 2003-03-04 에쓰에쓰아이 주식회사 에어-캐비티형 패캐지 및 그 제조방법
JP4067802B2 (ja) 2001-09-18 2008-03-26 松下電器産業株式会社 照明装置
JP3910144B2 (ja) * 2003-01-06 2007-04-25 シャープ株式会社 半導体発光装置およびその製造方法
US7554179B2 (en) * 2005-02-08 2009-06-30 Stats Chippac Ltd. Multi-leadframe semiconductor package and method of manufacture
JP2007134376A (ja) * 2005-11-08 2007-05-31 Akita Denshi Systems:Kk 発光ダイオード装置及びその製造方法
JP2007214246A (ja) * 2006-02-08 2007-08-23 Matsushita Electric Ind Co Ltd 放熱配線基板とその製造方法
JP2007214248A (ja) * 2006-02-08 2007-08-23 Matsushita Electric Ind Co Ltd 発光モジュールとその製造方法
JP2008140954A (ja) * 2006-12-01 2008-06-19 Matsushita Electric Ind Co Ltd 放熱配線基板とその製造方法並びにこれを用いた発光モジュール
TWI325644B (en) * 2007-01-03 2010-06-01 Chipmos Technologies Inc Chip package and manufacturing thereof
JP5106862B2 (ja) * 2007-01-15 2012-12-26 昭和電工株式会社 発光ダイオードパッケージ

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007507910A (ja) * 2004-09-10 2007-03-29 ルクスピア カンパニー リミテッド 多様な色実現が可能な半導体発光装置及びその製造方法
CN101043061A (zh) * 2006-03-23 2007-09-26 财团法人工业技术研究院 可防止静电破坏的发光器封装结构及其制造方法

Also Published As

Publication number Publication date
US8786065B2 (en) 2014-07-22
CN103107272A (zh) 2013-05-15
JP5813467B2 (ja) 2015-11-17
EP2590215A3 (en) 2016-03-16
US20130113015A1 (en) 2013-05-09
EP2590215A2 (en) 2013-05-08
JP2013101996A (ja) 2013-05-23
EP2590215B1 (en) 2017-06-14

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Granted publication date: 20170301