CN103096649A - 壳体及其制备方法 - Google Patents
壳体及其制备方法 Download PDFInfo
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- 238000000034 method Methods 0.000 title claims abstract description 17
- 239000000919 ceramic Substances 0.000 claims abstract description 73
- 239000000463 material Substances 0.000 claims abstract description 41
- 239000000758 substrate Substances 0.000 claims description 45
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 27
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 claims description 19
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 18
- 239000002994 raw material Substances 0.000 claims description 15
- 239000000203 mixture Substances 0.000 claims description 11
- 238000002360 preparation method Methods 0.000 claims description 11
- 238000005245 sintering Methods 0.000 claims description 11
- 239000000049 pigment Substances 0.000 claims description 10
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 claims description 9
- 239000000292 calcium oxide Substances 0.000 claims description 9
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 claims description 9
- 238000001816 cooling Methods 0.000 claims description 9
- 239000000395 magnesium oxide Substances 0.000 claims description 9
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 9
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims description 9
- JKQOBWVOAYFWKG-UHFFFAOYSA-N molybdenum trioxide Chemical compound O=[Mo](=O)=O JKQOBWVOAYFWKG-UHFFFAOYSA-N 0.000 claims description 9
- CHWRSCGUEQEHOH-UHFFFAOYSA-N potassium oxide Chemical compound [O-2].[K+].[K+] CHWRSCGUEQEHOH-UHFFFAOYSA-N 0.000 claims description 9
- 229910001950 potassium oxide Inorganic materials 0.000 claims description 9
- 239000000377 silicon dioxide Substances 0.000 claims description 9
- KKCBUQHMOMHUOY-UHFFFAOYSA-N sodium oxide Chemical compound [O-2].[Na+].[Na+] KKCBUQHMOMHUOY-UHFFFAOYSA-N 0.000 claims description 9
- 229910001948 sodium oxide Inorganic materials 0.000 claims description 9
- 238000007590 electrostatic spraying Methods 0.000 claims description 8
- 230000015572 biosynthetic process Effects 0.000 claims description 7
- 238000005507 spraying Methods 0.000 claims description 7
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 6
- 239000011224 oxide ceramic Substances 0.000 claims description 6
- 229910052574 oxide ceramic Inorganic materials 0.000 claims description 6
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims description 6
- NDLPOXTZKUMGOV-UHFFFAOYSA-N oxo(oxoferriooxy)iron hydrate Chemical compound O.O=[Fe]O[Fe]=O NDLPOXTZKUMGOV-UHFFFAOYSA-N 0.000 claims description 5
- 229910001069 Ti alloy Inorganic materials 0.000 claims description 4
- 229910000428 cobalt oxide Inorganic materials 0.000 claims description 4
- IVMYJDGYRUAWML-UHFFFAOYSA-N cobalt(ii) oxide Chemical compound [Co]=O IVMYJDGYRUAWML-UHFFFAOYSA-N 0.000 claims description 4
- 239000010935 stainless steel Substances 0.000 claims description 4
- 229910001256 stainless steel alloy Inorganic materials 0.000 claims description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 3
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 239000004579 marble Substances 0.000 claims description 3
- 238000007788 roughening Methods 0.000 claims 1
- 230000003746 surface roughness Effects 0.000 claims 1
- 239000011222 crystalline ceramic Substances 0.000 abstract 3
- 229910002106 crystalline ceramic Inorganic materials 0.000 abstract 3
- 238000010438 heat treatment Methods 0.000 description 16
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 238000009434 installation Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
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- 238000005422 blasting Methods 0.000 description 1
- 210000005252 bulbus oculi Anatomy 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- 238000010147 laser engraving Methods 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
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- 238000007254 oxidation reaction Methods 0.000 description 1
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- 230000000007 visual effect Effects 0.000 description 1
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- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
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Abstract
一种壳体，其包括基材，其特征在于：该壳体还包括形成于基材表面的基底陶瓷层、形成于基底陶瓷层表面的透明陶瓷层；基底陶瓷层与透明陶瓷层之间还设置有图案层，且该图案层嵌入于基底陶瓷层中，该图案层由陶瓷组成。所述壳体表面呈现具有陶瓷质感的图案，提高了壳体的外观竞争力。此外，本发明还提供一种所述壳体的制备方法。
Description
技术领域
本发明涉及一种壳体及其制备方法。
背景技术
为了使电子装置的金属外壳具有吸引力的外观，目前主要通过镭射雕刻、化学蚀刻等方法在金属壳体上形成图案。然而，该种方法制作的图案，视觉效果不强，且不能呈现出独特的质感，难以吸引消费者的眼球。
发明内容
有鉴于此，有必要提供一种有效解决上述问题的壳体。
另外，还有必要提供一种上述壳体的制备方法。
一种壳体，其包括基材，该壳体还包括形成于基材表面的基底陶瓷层、形成于基底陶瓷层表面的透明陶瓷层；基底陶瓷层与透明陶瓷层之间还设置有图案层，且该图案层嵌入于基底陶瓷层中，该图案层由陶瓷组成。
一种壳体的制备方法，其包括如下步骤：
提供基材；
采用静电喷涂及高温烧结工艺在基材的表面形成基底陶瓷层；
在基底陶瓷层表面形成图案层，将陶瓷花纸的花膜均匀贴在基底陶瓷层的表面并进行高温烧结处理；
采用静电喷涂及高温烧结工艺在基材的表面形成透明陶瓷层。
本发明所述壳体通过在金属材质的基材上依次形成基底陶瓷层、图案层及透明陶瓷层，能使所述壳体表面呈现具有陶瓷质感的图案，提高了壳体的外观竞争力；且形成于基材表面的各膜层具有良好的化学稳定性，耐磨性，可有效提高壳体的使用寿命。
附图说明
图1为本发明一较佳实施例的壳体的剖视图。
主要元件符号说明
| 壳体 | 10 |
| 基材 | 11 |
| 基底陶瓷层 | 13 |
| 透明陶瓷层 | 15 |
| 图案层 | 17 |
如下具体实施方式将结合上述附图进一步说明本发明。
具体实施方式
请参阅图1，本发明一较佳实施方式的壳体10包括基材11及依次形成于基材11表面的基底陶瓷层13和透明陶瓷层15。该基底陶瓷层13和透明陶瓷层15之间还设置有图案层17，该图案层17嵌入该基底陶瓷层13中。该壳体10可为手机等电子装置的壳体。
该基材11的材质为不锈钢或钛合金。
该基底陶瓷层13由氧化物陶瓷组成，其包括质量百分含量分别为60-70%的氧化硅、15-20%的氧化铝、5-10%的色素原料、5-6%的氧化钾、4-6%的氧化钠、0.4-0.6%的氧化镁、0.2-0.4%的氧化铁、0.2-0.4%的氧化钙。其中，色素原料为金属化合物，具体可为氧化钛、三氧化铁、四氧化三铁或氧化钴，它们能分别使基底陶瓷层13呈现白色、黑色、红色或蓝色效果。本实施例中，基底陶瓷层13的色素原料为氧化钛，使基底陶瓷层13呈现白色效果。该基底陶瓷层13的厚度为0.15-0.18mm。
该透明陶瓷层15由氧化物陶瓷组成，其包括质量百分含量分别为75-85%的氧化硅、5-12%的氧化铝、5-8%的氧化钾、4-6%的氧化钠、0.4-0.6%的氧化镁、0.2-0.4%的三氧化铁、0.2-0.4%的氧化钙。该透明陶瓷层15的厚度为0.08-0.1mm。
该图案层17由氧化物陶瓷组成，其组成成份与基底陶瓷层13的组成相同，但图案层17的色素原料区别于基底陶瓷层13的色素原料，从而使基底陶瓷层13与图案层17呈现不同的颜色效果。本实施例中，图案层17的色素原料为氧化钴，能使图案层17呈现蓝色效果。
本发明一较佳实施方式的壳体10的制备方法包括如下步骤：
(1)提供一基材11并对基材11进行预处理。该基材11的材质为不锈钢或钛合金。该预处理包括对使用草酸溶液或者氢氧化钠溶液对基材11进行除油。
(2)对基材11进行喷砂使基材11表面粗化，以提高后续膜层与基材11的附着力。基材11的粗糙度Ra达到1.3-2.0μm。
(3)采用静电喷涂及高温烧结工艺在基材11的表面形成基底陶瓷层13。使用静电喷涂机(图未示)，采用的喷涂原料中含有质量百分含量分别为60-70%的氧化硅、15-20%的氧化铝、5-10%的氧化钛、5-6%的氧化钾、4-6%的氧化钠、0.4-0.6%的氧化镁、0.2-0.4%的氧化铁、0.2-0.4%的氧化钙。喷涂后将基材11进行高温热处理使形成于基材11表面的喷涂原料熔融，之后冷却固化形成基底陶瓷层13。该高温热处理的过程为：将基材放入热处理炉(图未示)中，在800-805℃的温度下保温3-5min；热处理炉停止加热，自然降温，将产品取出。降温过程中可充液氮控制降温，亦可直接缓慢常规降温。该基底陶瓷层13的厚度为0.15-0.18mm。
(4)在基底陶瓷层13表面形成图案层17。先将基底陶瓷层13表面擦洗干净，并将陶瓷花纸的花膜均匀贴在基底陶瓷层13表面；然后将产品进行高温热处理使花膜能熔融并嵌入到软化的基底陶瓷层13内形成图案层17。该高温热处理的过程为：将基材11放入热处理炉中，在780-785℃的温度下保温3-5min。热处理炉停止加热，自然降温后将产品取出。
(5)采用静电喷涂及高温烧结工艺在基材11的表面形成透明陶瓷层15。使用静电喷涂机(图未示)，采用的喷涂原料中含有质量百分含量分别为75-85%的氧化硅、5-12%的氧化铝、5-8%的氧化钾、4-6%的氧化钠、0.4-0.6%的氧化镁、0.2-0.4%的氧化铁、0.2-0.4%的氧化钙。该透明陶瓷层15的厚度为0.08-0.1mm。喷涂后将基材11进行高温热处理。该高温热处理的过程为：将基材11放入热处理炉中，在730-750℃的温度下保温5-8min。热处理炉停止加热，自然降温，将产品取出。降温过程中可充液氮控制降温，亦可直接缓慢常规降温。
(6)对产品进行后处理。使用喷砂工艺去除壳体10未形成基底陶瓷层13的表面的氧化层。氧化层为基材11在热处理过程中发生氧化形成的。
本发明所述壳体10通过在金属材质的基材11上依次形成基底陶瓷层13、图案层17及透明陶瓷层15，能使所述壳体10表面呈现具有陶瓷质感的图案，提高了壳体10的外观竞争力；且形成于基材11表面的各膜层具有良好的化学稳定性，耐磨性，可有效提高壳体10的使用寿命。
Claims (13)
1.一种壳体，其包括基材，其特征在于：该壳体还包括形成于基材表面的基底陶瓷层、形成于基底陶瓷层表面的透明陶瓷层；基底陶瓷层与透明陶瓷层之间还设置有图案层，且该图案层嵌入于基底陶瓷层中，该图案层由陶瓷组成。
2.如权利要求1所述的壳体，其特征在于：该基材的材质为不锈钢或钛合金。
3.如权利要求1所述的壳体，其特征在于：该基底陶瓷层由氧化物陶瓷组成，该基底陶瓷层包括质量百分含量分别为60-70%的氧化硅、15-20%的氧化铝、5-10%的色素原料、5-6%的氧化钾、4-6%的氧化钠、0.4-0.6%的氧化镁、0.2-0.4%的氧化铁、0.2-0.4%的氧化钙；其中，该色素原料为氧化钛、三氧化铁、四氧化三铁或氧化钴中的一种。
4.如权利要求1所述的壳体，其特征在于：该图案层由氧化物陶瓷组成，该图案层包括质量百分含量分别为60-70%的氧化硅、15-20%的氧化铝、5-10%的色素原料、5-6%的氧化钾、4-6%的氧化钠、0.4-0.6%的氧化镁、0.2-0.4%的氧化铁、0.2-0.4%的氧化钙；其中，该色素原料为氧化钛、三氧化铁、四氧化三铁或氧化钴中的一种。
5.如权利要求1所述的壳体，其特征在于：该透明陶瓷层由氧化物陶瓷组成，该透明陶瓷层包括质量百分含量分别为75-85%的氧化硅、5-12%的氧化铝、5-8%的氧化钾、4-6%的氧化钠、0.4-0.6%的氧化镁、0.2-0.4%的三氧化铁、0.2-0.4%的氧化钙。
6.如权利要求1所述的壳体，其特征在于：该基底陶瓷层的厚度为0.15-0.18mm。
7.如权利要求1所述的壳体，其特征在于：该透明陶瓷层的厚度为0.08-0.1mm。
8.一种壳体的制备方法，其包括如下步骤：
提供基材；
采用静电喷涂及高温烧结工艺在基材的表面形成基底陶瓷层；
将陶瓷花纸的花膜贴在基底陶瓷层的表面并进行高温烧结处理，使基底陶瓷层表面形成图案层；
采用静电喷涂及高温烧结工艺在所述基底陶瓷层及图案层的表面形成透明陶瓷层。
9.如权利要求8所述的壳体的制备方法，其特征在于：所述形成基底陶瓷层的步骤中静电喷涂采用的喷涂原料中含有质量百分含量分别为60-70%的氧化硅、15-20%的氧化铝、5-10%的氧化钛、5-6%的氧化钾、4-6%的氧化钠、0.4-0.6%的氧化镁、0.2-0.4%的氧化铁、0.2-0.4%的氧化钙；高温烧结为在800-805℃的温度下保温3-5min。
10.如权利要求8所述的壳体的制备方法，其特征在于：所述形成图案层的步骤中烧结工艺的具体参数为：在780-785℃的温度下保温3-5min；然后自然降温冷却。
11.如权利要求8所述的壳体的制备方法，其特征在于：所述形成透明陶瓷层的步骤中静电喷涂采用的喷涂原料中含有质量百分含量分别为75-85%的氧化硅、5-12%的氧化铝、5-8%的氧化钾、4-6%的氧化钠、0.4-0.6%的氧化镁、0.2-0.4%的氧化铁、0.2-0.4%的氧化钙；高温烧结为在730-750℃的温度下保温5-8min。
12.如权利要求8所述的壳体的制备方法，其特征在于：该基材的材质为不锈钢或钛合金。
13.如权利要求8所述的壳体的制备方法，其特征在于：所述方法还包括在形成基底陶瓷层前对基材进行粗化处理，使基材的表面粗糙度达到1.3-2.0μm。
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| US13/414,867 US20130108812A1 (en) | 2011-10-27 | 2012-03-08 | Housing and method for making the same |
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| US9461357B2 (en) | 2014-02-12 | 2016-10-04 | Apple Inc. | Antenna on sapphire structure |
| US9632537B2 (en) | 2013-09-23 | 2017-04-25 | Apple Inc. | Electronic component embedded in ceramic material |
| US9678540B2 (en) | 2013-09-23 | 2017-06-13 | Apple Inc. | Electronic component embedded in ceramic material |
| CN107903057A (zh) * | 2017-11-24 | 2018-04-13 | 东北大学 | 氧传感器用电解质层和致密扩散层双层结构的制备方法 |
| CN109016332A (zh) * | 2018-07-12 | 2018-12-18 | 歌尔股份有限公司 | 无机非金属与塑料的结合体及其制备方法 |
| CN111114161A (zh) * | 2019-12-31 | 2020-05-08 | Oppo广东移动通信有限公司 | 壳体、电子设备及壳体的制造方法 |
| WO2023051214A1 (zh) * | 2021-09-29 | 2023-04-06 | Oppo广东移动通信有限公司 | 陶瓷壳体及其制备方法和电子设备 |
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| CN103898500A (zh) * | 2012-12-27 | 2014-07-02 | 深圳富泰宏精密工业有限公司 | 被覆件及其制造方法 |
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| CN109016332A (zh) * | 2018-07-12 | 2018-12-18 | 歌尔股份有限公司 | 无机非金属与塑料的结合体及其制备方法 |
| CN111114161A (zh) * | 2019-12-31 | 2020-05-08 | Oppo广东移动通信有限公司 | 壳体、电子设备及壳体的制造方法 |
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| JP2013098546A (ja) | 2013-05-20 |
| TWI438172B (zh) | 2014-05-21 |
| US20130108812A1 (en) | 2013-05-02 |
| JP5521017B2 (ja) | 2014-06-11 |
| TW201317201A (zh) | 2013-05-01 |
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