CN103079392B - 部件安装装置 - Google Patents

部件安装装置 Download PDF

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Publication number
CN103079392B
CN103079392B CN201210369549.9A CN201210369549A CN103079392B CN 103079392 B CN103079392 B CN 103079392B CN 201210369549 A CN201210369549 A CN 201210369549A CN 103079392 B CN103079392 B CN 103079392B
Authority
CN
China
Prior art keywords
light
led element
fluorophor
substrate
ultraviolet light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201210369549.9A
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English (en)
Chinese (zh)
Other versions
CN103079392A (zh
Inventor
池田善纪
川合章佑
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yamaha Motor Co Ltd
Original Assignee
Yamaha Motor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yamaha Motor Co Ltd filed Critical Yamaha Motor Co Ltd
Publication of CN103079392A publication Critical patent/CN103079392A/zh
Application granted granted Critical
Publication of CN103079392B publication Critical patent/CN103079392B/zh
Active legal-status Critical Current
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
CN201210369549.9A 2011-09-29 2012-09-27 部件安装装置 Active CN103079392B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011-215557 2011-09-29
JP2011215557A JP5566359B2 (ja) 2011-09-29 2011-09-29 部品装着装置

Publications (2)

Publication Number Publication Date
CN103079392A CN103079392A (zh) 2013-05-01
CN103079392B true CN103079392B (zh) 2016-05-11

Family

ID=48155757

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201210369549.9A Active CN103079392B (zh) 2011-09-29 2012-09-27 部件安装装置

Country Status (3)

Country Link
JP (1) JP5566359B2 (ja)
KR (1) KR101562692B1 (ja)
CN (1) CN103079392B (ja)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6259274B2 (ja) * 2012-12-11 2018-01-10 ヤマハ発動機株式会社 部品装着装置
AT513747B1 (de) * 2013-02-28 2014-07-15 Mikroelektronik Ges Mit Beschränkter Haftung Ab Bestückungsverfahren für Schaltungsträger und Schaltungsträger
JP6190172B2 (ja) * 2013-06-12 2017-08-30 ヤマハ発動機株式会社 部品装着装置
KR101497919B1 (ko) * 2013-07-16 2015-03-11 미래산업 주식회사 마운터용 실장좌표 획득장치, 마운터, 및 이를 이용한 렌즈 실장방법
JP5903563B2 (ja) * 2013-08-19 2016-04-13 パナソニックＩｐマネジメント株式会社 部品実装装置
JP6450923B2 (ja) * 2013-12-20 2019-01-16 パナソニックＩｐマネジメント株式会社 電子部品実装システムおよび電子部品実装方法ならびに電子部品実装装置
JP6263028B2 (ja) * 2013-12-27 2018-01-17 ヤマハ発動機株式会社 部品装着装置
DE102014101901B4 (de) * 2014-02-14 2015-10-15 Asm Assembly Systems Gmbh & Co. Kg Optisches Vermessen eines Bauelementes mit an gegenüberliegenden Seiten vorhandenen strukturellen Merkmalen
DE102014210654B4 (de) 2014-06-04 2023-08-31 Automotive Lighting Reutlingen Gmbh Kraftfahrzeugscheinwerfer umfassend ein SMD-Halbleiterlichtquellenbauteil auf einer Leiterplatte
KR102022473B1 (ko) * 2014-07-04 2019-09-18 한화정밀기계 주식회사 테이프 실장 장치
EP3179523B1 (en) 2014-08-04 2020-09-23 FUJI Corporation Mounting device
AT516638A1 (de) * 2014-12-17 2016-07-15 A B Mikroelektronik Ges Mit Beschränkter Haftung Verfahren zur Herstellung eines Schaltungsträgers und Schaltungsträger
AT517259B1 (de) * 2015-06-09 2020-01-15 Zkw Group Gmbh Verfahren zur positionsgenauen Bestückung eines Schaltungsträgers
JP6860440B2 (ja) * 2017-07-20 2021-04-14 日本メクトロン株式会社 基板位置認識装置、位置認識加工装置および基板製造方法
JP7075498B2 (ja) * 2018-10-02 2022-05-25 株式会社Fuji 作業機

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5608642A (en) * 1993-12-29 1997-03-04 Yamaha Hatsudoki Kabushiki Kaisha Component recognition method and device
CN1332843A (zh) * 1998-12-29 2002-01-23 美国拜尔公司 监测在表面上粘合剂用量和分布的在线方法及其可用的装置
CN201903509U (zh) * 2010-12-08 2011-07-20 昆山琉明光电有限公司 Led检查装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3412224B2 (ja) * 1994-01-07 2003-06-03 住友電気工業株式会社 レンズ実装方法と装置
KR101101132B1 (ko) * 2007-11-23 2012-01-12 삼성엘이디 주식회사 발광소자 검사장치 및 이를 이용한 발광소자 검사방법
JP2010225791A (ja) * 2009-03-23 2010-10-07 Stanley Electric Co Ltd 半導体発光装置
JP4797081B2 (ja) * 2009-04-10 2011-10-19 シークス株式会社 レンズ部品の実装方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5608642A (en) * 1993-12-29 1997-03-04 Yamaha Hatsudoki Kabushiki Kaisha Component recognition method and device
CN1332843A (zh) * 1998-12-29 2002-01-23 美国拜尔公司 监测在表面上粘合剂用量和分布的在线方法及其可用的装置
CN201903509U (zh) * 2010-12-08 2011-07-20 昆山琉明光电有限公司 Led检查装置

Also Published As

Publication number Publication date
JP5566359B2 (ja) 2014-08-06
KR20130035235A (ko) 2013-04-08
CN103079392A (zh) 2013-05-01
JP2013077648A (ja) 2013-04-25
KR101562692B1 (ko) 2015-10-22

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Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
ASS Succession or assignment of patent right

Owner name: YAMAHA MOTOR CO. LTD.

Free format text: FORMER OWNER: HITACHI HIGH TECH INSTR CO., LTD.

Effective date: 20150402

TA01 Transfer of patent application right

Effective date of registration: 20150402

Address after: Shizuoka

Applicant after: Yamaha Motor Co., Ltd.

Address before: Saitama Prefecture, Japan

Applicant before: Hitachi High Tech Instr Co., Ltd.

C14 Grant of patent or utility model
GR01 Patent grant