CN103077920A - 改善硅通孔横向开口的干法刻蚀方法 - Google Patents
改善硅通孔横向开口的干法刻蚀方法 Download PDFInfo
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- CN103077920A CN103077920A CN2011103280710A CN201110328071A CN103077920A CN 103077920 A CN103077920 A CN 103077920A CN 2011103280710 A CN2011103280710 A CN 2011103280710A CN 201110328071 A CN201110328071 A CN 201110328071A CN 103077920 A CN103077920 A CN 103077920A
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103456620A (zh) * | 2013-09-11 | 2013-12-18 | 中微半导体设备(上海)有限公司 | 半导体结构的形成方法 |
CN105845773A (zh) * | 2016-03-30 | 2016-08-10 | 江苏欧达丰新能源科技发展有限公司 | 太阳能电池片三维pn结加工工艺 |
WO2022100725A1 (zh) * | 2020-11-16 | 2022-05-19 | 北京北方华创微电子装备有限公司 | 硅片的刻蚀方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7141504B1 (en) * | 1998-07-23 | 2006-11-28 | Surface Technology Systems Plc | Method and apparatus for anisotropic etching |
CN101988196A (zh) * | 2009-08-07 | 2011-03-23 | 中微半导体设备(上海)有限公司 | 深反应离子刻蚀方法及其气体流量控制装置 |
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- 2011-10-25 CN CN2011103280710A patent/CN103077920A/zh active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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US7141504B1 (en) * | 1998-07-23 | 2006-11-28 | Surface Technology Systems Plc | Method and apparatus for anisotropic etching |
CN101988196A (zh) * | 2009-08-07 | 2011-03-23 | 中微半导体设备(上海)有限公司 | 深反应离子刻蚀方法及其气体流量控制装置 |
Non-Patent Citations (1)
Title |
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REZA ABDOLVAND等: ""An advanced reactive ion etching process for very high aspect-ratio sub-micron wide trenches in silicon"", 《SENSORS AND ACTUATORS A》, vol. 144, no. 1, 5 January 2008 (2008-01-05) * |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103456620A (zh) * | 2013-09-11 | 2013-12-18 | 中微半导体设备(上海)有限公司 | 半导体结构的形成方法 |
CN103456620B (zh) * | 2013-09-11 | 2016-03-02 | 中微半导体设备(上海)有限公司 | 半导体结构的形成方法 |
CN105845773A (zh) * | 2016-03-30 | 2016-08-10 | 江苏欧达丰新能源科技发展有限公司 | 太阳能电池片三维pn结加工工艺 |
WO2022100725A1 (zh) * | 2020-11-16 | 2022-05-19 | 北京北方华创微电子装备有限公司 | 硅片的刻蚀方法 |
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Owner name: SHANGHAI HUAHONG GRACE SEMICONDUCTOR MANUFACTURING Free format text: FORMER OWNER: HUAHONG NEC ELECTRONICS CO LTD, SHANGHAI Effective date: 20140107 |
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Free format text: CORRECT: ADDRESS; FROM: 201206 PUDONG NEW AREA, SHANGHAI TO: 201203 PUDONG NEW AREA, SHANGHAI |
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Effective date of registration: 20140107 Address after: 201203 Shanghai city Zuchongzhi road Pudong New Area Zhangjiang hi tech Park No. 1399 Applicant after: Shanghai Huahong Grace Semiconductor Manufacturing Corporation Address before: 201206, Shanghai, Pudong New Area, Sichuan Road, No. 1188 Bridge Applicant before: Shanghai Huahong NEC Electronics Co., Ltd. |
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Application publication date: 20130501 |