CN103065764B - Magnetic cell and manufacture method thereof - Google Patents
Magnetic cell and manufacture method thereof Download PDFInfo
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- CN103065764B CN103065764B CN201210394713.1A CN201210394713A CN103065764B CN 103065764 B CN103065764 B CN 103065764B CN 201210394713 A CN201210394713 A CN 201210394713A CN 103065764 B CN103065764 B CN 103065764B
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Abstract
Especially object is to provide a kind of magnetic cell and manufacture method thereof that can reduce contact resistance compared with the past.Have: insulating substrate (11); First coil (12); Second coil (13); Via the conductting layer (14) that winding top is connected to each other by through hole; Be electrically connected with the winding terminal of the first coil first takes out electrode layer (15); Be electrically connected with the winding terminal of the second coil second takes out electrode layer (16).First coil, described second coil, conductting layer, first take out electrode layer and the second taking-up electrode layer is integrally formed.Each taking-up electrode layer (15,16) has: be formed in the side surface part (15a, 16a) on the side of insulating substrate (11); Upper surface part (15b, 16b); Lower surface portion (15c, 16c).
Description
Technical field
The present invention relates to magnetic cell and the manufacture method thereof of the taking-up electrode layer possessing coil on the surface of insulating substrate and draw from coil.
Background technology
A kind of invention relating to the film magnetic cell used as film inductor etc. is disclosed in following patent documentation.
At patent documentation 1 or Patent Document 2 discloses the stepped construction that a kind of upper and lower surface at insulating substrate is formed with coil.But, in patent documentation 1 or patent documentation 2 and the structure of the unexposed taking-up electrode layer be electrically connected with coil.
On the other hand, although at patent documentation 3, patent documentation 4 and Patent Document 5 discloses a kind of structure of taking out electrode layer, formed owing to separating with coil, there is the problem that contact resistance increases.And being vertically disposed with in the structure of coil at insulating substrate, contact resistance also and produces between the conductting layer of each coil conducting at each coil with via the through hole being formed at insulating substrate.
In addition, in the past, the formation process of coil was separated with the formation process of taking out electrode layer, and the lower degradation manufacturing efficiency becomes problem.
[at first technical literature]
[patent documentation]
[patent documentation 1] Japanese Unexamined Patent Publication 4-363006 publication
[patent documentation 2] Japanese Unexamined Patent Publication 2000-243637 publication
[patent documentation 3] Japanese Unexamined Patent Publication 8-115840 publication
[patent documentation 4] Japanese Unexamined Patent Publication 9-270342 publication
[patent documentation 5] Japanese Unexamined Patent Publication 2000-68125 publication
Summary of the invention
Therefore, the present invention seeks to solve above-mentioned existing problem, a kind of magnetic cell and manufacture method thereof that can reduce contact resistance compared with the past is particularly provided.
In addition, the object of the invention is to provide a kind of manufacture method that can improve the magnetic cell of the manufacture efficiency of coil and taking-up electrode layer.
The feature of magnetic cell of the present invention is,
Have: insulating substrate; At the first coil that the upper surface of described insulating substrate is formed; At the second coil that the lower surface of described insulating substrate is formed; Via be formed at described insulating substrate through hole and by the winding top of the inner side at described first coil and the conductting layer that is electrically connected between the winding top of the inner side of described second coil; Be electrically connected with the winding terminal in the outside being positioned at described first coil first takes out electrode layer; Be electrically connected with the winding terminal in the outside being positioned at described second coil second takes out electrode layer,
Described first coil, described second coil, described conductting layer, described first take out electrode layer and described second taking-up electrode layer is integrally formed,
Described first takes out electrode layer has: the first side surface part formed in the first side of described insulating substrate; Extend from described first side surface part to the upper surface of described insulating substrate and the first upper surface part linked with the described winding terminal one of described first coil; From described first side surface part to the first lower surface portion that the lower surface of described insulating substrate extends,
Described second takes out electrode layer has: the second side surface part formed in second side different from described first side of described insulating substrate; Extend from described second side surface part to the lower surface of described insulating substrate and the second lower surface portion linked with the winding terminal one of described second coil.Thus, compared with the past, can reduce that the first coil and first takes out between electrode layer, the second coil and second takes out contact resistance between electrode layer and between each coil and conductting layer.And high inductance can be obtained by the coil of use up and down at insulating substrate.
In addition, each taking-up electrode layer not only possesses upper surface part and lower surface portion but also possesses side surface part, integration is carried out to upper surface part and lower surface portion and from two-side supporting insulating substrate, thus each taking-up electrode layer can be made to play function as suppressing the two-side supporting body of the distortion of magnetic cell etc.
In the present invention, preferably, form described first and take out described first upper surface part of electrode layer and described first lower surface portion, form described second take out described second lower surface portion of electrode layer formed than described first coil and described second coil thick, in the upper surface side of described first coil, the first magnetic layer is set with overlapping, in the lower face side of described second coil, the second magnetic layer is set with overlapping, each surface of described first magnetic layer and described first upper surface part is formed by roughly the same face, or the surface of the first magnetic layer is outstanding to the direction leaving described insulating substrate described in the surface ratio of described first upper surface part, described second magnetic layer, each surface of described first lower surface portion and described second lower surface portion is formed by roughly the same face, or the surface of the second magnetic layer is outstanding to the direction leaving described insulating substrate described in each surface ratio of described first lower surface portion and described second lower surface portion.In the present invention, each surface of lower surface portion and upper surface part is formed as and each surface of magnetic layer roughly the same face or outstanding mode, thus when utilizing solder etc. to be installed on circuit substrate, first taking-up electrode layer and second can be taken out electrode layer to be suitably connected with circuit substrate, the generation of unfavorable condition can be prevented.Further, by using magnetic layer, the raising of Q value can be realized, and magnetic layer can be used as magnetic shield.
In addition, in the present invention, preferably, form and described first take out described first upper surface part of electrode layer and described first lower surface portion, form the described second described second lower surface portion of taking out electrode layer and have and the internal layer of described first coil and the roughly the same thickness of described second coil and the skin formed that overlaps with described internal layer, described internal layer is integrated with described skin and formed.Thereby, it is possible to formed from coil to taking-up electrode layer by simple structural integrity, effectively contact resistance can be reduced.
In addition, in the present invention, preferably, the paper tinsel body that described internal layer and each coil are formed by the surface at described insulating substrate and close with described paper tinsel body weight the first plating layer formed and form, described skin is formed by the second plating layer formed that overlaps with described first plating layer, and the second side surface part of the described first first side surface part and described second taking-up electrode layer of taking out electrode layer is formed by the stepped construction of described first plating layer and described second plating layer respectively.Thereby, it is possible to increase the thickness of the first coil and the second coil, coil resistance can be reduced.
In addition, in the present invention, preferably, described first plating layer is electroless plating coating, and described second plating layer is electrolysis plating layer.Thus, suitably can form the first plating layer based on electroless plating in the first side of insulating substrate and the second side, the stepped construction of the first plating layer and the second plating layer can be utilized to form the second side surface part that the described first first side surface part and described second of taking out electrode layer takes out electrode layer.And, by being formed by the stepped construction of the first plating layer based on electroless plating with the second plating layer based on electrolysis plating, can the thickness of plating layer be formed thicker.
In addition, in the present invention, preferably, described first coil and the described first described first upper surface part of taking out electrode layer have the first paper tinsel body formed at the upper surface of described insulating substrate,
Described second lower surface portion of described first lower surface portion and described second taking-up electrode layer that described second coil, described first takes out electrode layer has the second paper tinsel body formed at the lower surface of described insulating substrate,
Overlap on the surface of the surface of described first paper tinsel body and described second paper tinsel body formation plating layer respectively,
Take out in electrode layer described first, to have from the surface of described first paper tinsel body by described first side of described insulating substrate until the surface of described second paper tinsel body and the plating layer formed, thus form described first upper surface part, described first side surface part and described first lower surface portion
Take out in electrode layer described second, there is described first side from described insulating substrate until the surface of described second paper tinsel body and the plating layer that formed, thus form described second side surface part and described second lower surface portion.Thus, the thickness of the first coil and the second coil can be increased, can coil resistance be reduced, and simply and suitably can form the surface that has from the surface of the first paper tinsel body and the second paper tinsel body until the first side of insulating substrate and the second side and first of plating layer taking out electrode layer and second and take out electrode layer of being formed.
In addition, in the present invention, preferably, described first takes out electrode layer is formed as length roughly same as described first side, and described second takes out electrode layer is formed as length roughly same as described second side.The first taking-up electrode layer and described second can be formed with large area and take out electrode layer, the contact resistance between the splicing ear of installation base plate can be reduced, and can reliably simply each taking-up electrode layer be electrically connected with between splicing ear.
In addition, in the present invention, preferably, the most surface of taking out electrode layer and described second taking-up electrode layer described first is formed with pad.Thereby, it is possible to by magnetic cell suitably soldering on installation base plate.
In addition, in the present invention, preferably, described second taking-up electrode layer has: described second side surface part; Extend and the second upper surface part formed by the structure identical with described first upper surface part from described second side surface part to the upper surface of described insulating substrate; Described second lower surface portion.Thus, take out on electrode layer and described second taking-up electrode layer first and upper surface part and lower surface portion are set respectively, therefore, it is possible to by the upper and lower surface of magnetic cell either party towards installation base plate reliably and be connected with installation base plate conducting simply, thus can assembleability be improved.
In addition, in the present invention, preferably, described first coil from the initial bearing of trend at described winding top be first direction, described second coil be the second direction in direction opposite to the first direction from the initial bearing of trend at described winding top, described second side of described insulating substrate is positioned at and the opposition side faced by described first side, and described first direction and described second direction are the orthogonal directions orthogonal with described first side of described insulating substrate and the length direction of described second side.The first coil can be made identical with the number of turn of the second coil, and can the number of turn be increased to greatest extent, the increase of inductance can be realized.
In addition, the feature of the manufacture method of magnetic cell of the present invention is to have:
First operation, wherein, prepare to be formed with the first paper tinsel body at the upper surface of insulating substrate and be formed with the second paper tinsel body at lower surface, the insulated substrate that can cut into multiple magnetic cell,
The interregional position becoming each magnetic cell of described insulated substrate forms through hole, in the region becoming each magnetic cell, forms through hole;
Second operation, wherein, the first plating layer is formed with closing with described first paper tinsel body and described second paper tinsel body weight, now, the conductting layer based on described first plating layer is formed in described through hole, and from the surface of described first paper tinsel body until the surface of side wall surface in described through hole and described second paper tinsel body and form described first plating layer;
3rd operation, wherein, use photoetching technique, first coil with described first paper tinsel body and described first plating layer is formed in the upper surface side of described insulating substrate, and, second coil with described second paper tinsel body and described first plating layer is formed in the lower face side of described insulating substrate
Now, by integrated with described conductting layer for each winding top of the inner side of the inner side and described second coil that are positioned at described first coil and formed,
In addition, form first take out electrode layer and form the second taking-up electrode layer, described first takes out electrode layer has the first side surface part formed on the first side wall face of the described through hole suitable with the first side of described insulating substrate, from described first side surface part to the upper surface of described insulating substrate extend and with first upper surface part of winding terminal integral in outside being positioned at described first coil, from described first side surface part to the first lower surface portion that the lower surface of described insulating substrate extends, described second takes out electrode layer has the second side surface part formed on the second side wall surface of the suitable described through hole in the second side being different from described first side with described insulating substrate, from described second side surface part to the lower surface of described insulating substrate extend and with second lower surface portion of winding terminal integral in outside being positioned at described second coil,
4th operation, wherein, cuts off described insulated substrate, obtains multiple described magnetic cell.
In the present invention, can each coil, conductting layer be formed by same processes and respectively take out electrode layer, integration can form each coil, conductting layer and respectively take out electrode layer.Thus, in the present invention, compared with the past, the thin inductance device that can reduce coil and take out the contact resistance between electrode layer and between coil and conductting layer can be produced with manufacture efficiency system excellent than ever.
In the present invention, preferably, there is between described 3rd operation with described 4th operation the 5th operation of taking out formation second plating layer that surface that electrode layer and described second takes out described first plating layer of electrode layer overlaps described first,
After described 5th operation, having overlaps to arrange the first magnetic layer and overlap in the lower face side of described second coil in the upper surface side of described first coil arranges the 6th operation of the second magnetic layer, make described first magnetic layer, and each surface of described first upper surface part is roughly the same face, or make the surface of the first magnetic layer described in the surface ratio of described first upper surface part outstanding to the direction leaving described insulating substrate, make described second magnetic layer, each surface of described first lower surface portion and described second lower surface portion is roughly the same face, or make the surface of the second magnetic layer described in each surface ratio of described first lower surface portion and described second lower surface portion outstanding to the direction leaving described insulating substrate.Accordingly, can take out on the first plating layer that electrode layer and described second takes out electrode layer described first and to overlap formation second plating layer, the first upper surface part of electrode layer and the first lower surface portion can be taken out first, the second second lower surface portion of taking out electrode layer forms thicker than each coil.Therefore, when the face side coincidence of coil is provided with magnetic layer, or each surface of each magnetic layer of each surface ratio of lower surface portion and upper surface part can be given prominence to each surface that roughly the same face forms each magnetic layer, the first taking-up electrode layer and second takes out electrode layer.
In addition, in the present invention, preferably, described first take out electrode layer and described second take out electrode layer most surface on form pad.
In addition, in the present invention, preferably, take out on electrode layer described second, form the second upper surface part together with described second side surface part and described second lower surface portion, this second upper surface part extends from described second side surface part to the upper surface of described insulating substrate and is same structure with described first upper surface part.
[invention effect]
According to magnetic cell of the present invention, compared with the past, can reduce that the first coil and first takes out between electrode layer, the second coil and second takes out contact resistance between electrode layer and between each coil and conductting layer.
In addition, according to the manufacture method of magnetic cell of the present invention, can each coil, conductting layer be formed by same processes and respectively take out electrode layer, integration can form each coil, conductting layer and respectively take out electrode layer.Manufacture efficiency can be improved thus.
Accompanying drawing explanation
In Fig. 1, Fig. 1 (a) is the vertical view of the thin inductance device of present embodiment, especially be arranged on the first coil on insulating substrate and take out the vertical view of upper surface part of electrode layer, the figure that the second coil be arranged under insulating substrate is illustrated by the broken lines, Fig. 1 (b) is the longitudinal sectional view of the thin inductance device of the present embodiment cut off from the A-A line shown in Fig. 1 (a) and observe from the direction of arrow, and Fig. 1 (c) is the vertical view of the second coil be arranged under insulating substrate and the lower surface portion of taking out electrode layer.
Fig. 2 is the partial enlargement longitudinal sectional view of the thin inductance device shown in Fig. 1 (b).
In Fig. 3, Fig. 3 (a), Fig. 3 (b) are the vertical views of the first coil and the second coil.
Fig. 4 is the longitudinal sectional view of the thin inductance device of another execution mode.
In Fig. 5, Fig. 5 (a) ~ Fig. 5 (f) is the process chart (longitudinal sectional view) of the manufacture method of thin inductance device for illustration of present embodiment.
[symbol description]
10 thin inductance devices
11 insulating substrates
11c, 53 through holes
12,40,45 first coils
12a, 13a, 40a, 41a, 45a, 46a reel top
12b, 13b, 40b, 41b, 45b, 46b reel terminal
13,41,46 second coils
14 conductting layers
15,42,47 first electrode layer is taken out
15a first side surface part
15b first upper surface part
15c first lower surface portion
16,43,48 second electrode layer is taken out
16a second side surface part
16b second upper surface part
16c second lower surface portion
17,30 magnetic pieces
18 first paper tinsel bodies
19 first plating layers
23 second plating layers
25 installation base plates
31,32 insulating barriers
34 pads
35 solder layers
51 insulated substrates
52 through holes
Embodiment
Fig. 1 (a) is the vertical view of the thin inductance device of present embodiment, especially be arranged on the first coil on insulating substrate and take out the vertical view of upper surface part of electrode layer, the figure that the second coil be arranged under insulating substrate is illustrated by the broken lines, Fig. 1 (b) is the longitudinal sectional view of the thin inductance device from the cut-out of A-A line from the present embodiment of direction of arrow observation shown in Fig. 1 (a), Fig. 1 (c) is the vertical view of the second coil be arranged under insulating substrate and the lower surface portion of taking out electrode layer, Fig. 2 is the partial enlargement longitudinal sectional view of the thin inductance device shown in Fig. 1 (b).
As shown in Fig. 1 (b), thin inductance device (magnetic cell) 10 has insulating substrate 11, first coil 12, second coil 13, conductting layer 14, first takes out electrode layer 15, second and takes out electrode layer 16, magnetic piece (magnetic layer) 17,30.
The material of insulating substrate 11 is also not particularly limited, but preferably corresponds to the Copper Foil (paper tinsel body) of each coil 12,13 described later and be glass epoxy substrate.
In Fig. 1 (a), the plane of insulating substrate 11 is square or rectangular shape, but shape does not limit.
As shown in Fig. 1 (a) (b), the first coil 12 is formed in the upper surface 11a of insulating substrate 11.And as shown in Fig. 1 (b), the second coil 13 is formed in the lower surface 11b of insulating substrate 11.
As shown in Fig. 1 (a), the first coil 12 is that the winding terminal 12b from the winding top 12a of inner side to outside is bent into right angle and the planar coil simultaneously reeled.As shown in Fig. 1 (a), the first coil 12 from winding top 12a initial bearing of trend α 1 be X1 direction.
In addition, as shown in Fig. 1 (c), the second coil 13 is that the winding terminal 13b from the winding top 13a of inner side to outside is bent into right angle and the planar coil simultaneously reeled.As shown in Fig. 1 (c), the second coil 13 from winding top 13a initial bearing of trend α 2 be X2 direction.
As shown in Fig. 1 (b), be formed with the through hole 11c penetrating into lower surface 11b from upper surface 11a in the substantial middle of insulating substrate 11.As shown in Fig. 1 (b), in through hole 11c, be provided with conductting layer 14.Further, conductting layer 14 is electrically connected with the winding top 12a of the first coil 12, and conductting layer 14 is electrically connected with the winding top 13a of the second coil 13.
As shown in Fig. 1 (b), be formed with the first taking-up electrode layer 15 in the first side (X1 side) the 11d side of insulating substrate 11.And as shown in Fig. 1 (b), be formed with the second taking-up electrode layer 16 in the second side (side, X2 side) the 11e side of insulating substrate 11.
As shown in Fig. 1 (b), first takes out electrode layer 15 has: be formed in the first side surface part 15a on the first side 11d of insulating substrate 11; Extend from the first side surface part 15a to the upper surface 11a of insulating substrate 11, and the first upper surface part 15b be connected with the winding terminal 12b of the first coil 12; From the first side surface part 15a to the first lower surface portion 15c that the lower surface 11b of insulating substrate 11 extends.
As shown in Fig. 1 (a), the first the first upper surface part 15b taking out electrode layer 15 exposes at the upper surface 11a of insulating substrate 11.And as shown in Fig. 1 (c), the first the first lower surface portion 15c taking out electrode layer 15 exposes at the lower surface 11b of insulating substrate 11.
As shown in Fig. 1 (b), second takes out electrode layer 16 has: be formed in the second side surface part 16a on the second side 11e of insulating substrate 11; From the second side surface part 16a to the second upper surface part 16b that the upper surface 11a of insulating substrate 11 extends; Extend from the second side surface part 16a to the lower surface 11b of insulating substrate 11, and the second lower surface portion 16c be connected with the winding terminal 13b of the second coil 13.It should be noted that, in Fig. 1 (a), as described later, first coil 12 is consistent with the number of turn of the second coil 13, therefore the second side 11e is made to be positioned at and the opposition side faced by the first side 11d, but when thin inductance device 10 is installed on installation base plate 25, corresponding to the position of the Wiring pattern of the splicing ear 25a of installation base plate 25, the position adjacent with the first side 11d also can be formed as.
As shown in Fig. 1 (a), the second the second upper surface part 16b taking out electrode layer 16 exposes at the upper surface 11a of insulating substrate 11.And as shown in Fig. 1 (c), the second the second lower surface portion 16c taking out electrode layer 16 exposes at the lower surface 11b of insulating substrate 11.
As shown in Fig. 1 (b), Fig. 2, the first coil 12 by be formed in the first paper tinsel body (such as Copper Foil) 18 on the upper surface 11a of insulating substrate 11 with overlap be formed in the first paper tinsel body 18 surperficial 18a on the first plating layer 19 stepped construction and formed.
In addition, as shown in Fig. 1 (b), Fig. 2, the second coil 13 by be formed in the second paper tinsel body (such as Copper Foil) 20 on the lower surface 11b of insulating substrate 11 with overlap be formed in the second Copper Foil 20 surperficial 20a on the first plating layer 19 stepped construction and formed.
As shown in Fig. 1 (b), Fig. 2, the first the first upper surface part 15b taking out electrode layer 15 has the stepped construction of the first paper tinsel body 18 and the first plating layer 19 in the same manner as the first coil 12.At the first upper surface part 15b, the stepped construction of the first paper tinsel body 18 and the first plating layer 19 is formed as internal layer 21.In addition, as shown in Fig. 1 (b), Fig. 2, the first the first lower surface portion 15c taking out electrode layer 15 has the stepped construction of the second paper tinsel body 20 and the first plating layer 19 in the same manner as the second coil 13.At the first lower surface portion 15c, the stepped construction of the second paper tinsel body 20 and the first plating layer 19 is formed as internal layer 22.
As shown in Figure 2, the first internal layer 21 taking out the first upper surface part 15b of electrode layer 15 is roughly the same thickness with the first coil 12, and the first internal layer 22 taking out the first lower surface portion 15c of electrode layer 15 is roughly the same thickness with the second coil 13.
As shown in Fig. 1 (b), Fig. 2, the surface of taking out the internal layer 21 of the first upper surface part 15b of electrode layer 15 in formation first is formed as outer field second plating layer 23.And the surface of taking out the internal layer 22 of the first lower surface portion 15c of electrode layer 15 in formation first is formed as outer field second plating layer 23.
In addition, as shown in Fig. 1 (b), Fig. 2, the first the first side surface part 15a taking out electrode layer 15 is formed by the stepped construction of the first plating layer 19 and the second plating layer 23.
Take out in the first side surface part 15a of electrode layer 15 first, the first plating layer 19 is directly formed at the first side 11d of insulating substrate 11, and overlapping on the surface of described first plating layer 19 is formed with the second plating layer 23.
The above-mentioned stepped construction for the first taking-up electrode layer 15 is illustrated, but takes out electrode layer 16 too about second.Namely as shown in Fig. 1 (b), second the second side surface part 16a taking out electrode layer 16 is the stepped construction of the first plating layer 19 and the second plating layer 23, second upper surface part 16b is the stepped construction of the first paper tinsel body 18, first plating layer 19 and the second plating layer 23, and the second lower surface portion 16c is the stepped construction of the second paper tinsel body 20, first plating layer 19 and the second plating layer 23.
As shown in Fig. 1 (b), conductting layer 14 is formed by the first plating layer 19.
Such as, the first paper tinsel body 18,20 is Copper Foils, and the first plating layer 19 and the second plating layer 23 are copper facing.Thus, to internal layer 21,22 with carry out integrated as outer field second plating layer 23.
As shown in Fig. 1 (a) (b), Fig. 2, first coil 12 and first takes out electrode layer 15 and possesses the common stepped construction be made up of the first paper tinsel body 18 and the first plating layer 19 and integrated, and the second coil 13 and second takes out electrode layer 16 and possesses the common stepped construction be made up of the second paper tinsel body 20 and the first plating layer 19 and integrated.And conductting layer 14 is formed by the first plating layer 19, and carry out integrated with the first coil 12 and the second coil 13 that possess the first plating layer 19 and formed.
So, in the present embodiment, the first coil 12, second coil 13, first taking-up electrode layer 15, second taking-up electrode layer 16 and conductting layer 14 are integrally formed.
Thus, with in the past such by each coil 12,13 with respectively take out the structure that electrode layer 15,16 formed respectively and compare, can contact resistance be reduced.Structure according to the present embodiment, can make each coil and each contact resistance taken out between electrode layer be zero.And, in the present embodiment, the contact resistance between coil 12,13 and conductting layer 14 can be reduced, specifically, the contact resistance between each coil and conductting layer can be made to be zero.
In the present embodiment, the first coil 12 and the second coil 13 is formed up and down at insulating substrate 11.Thereby, it is possible to obtain high inductance.And by coil 12,13 is formed in the upper and lower of insulating substrate 11, taking-up electrode layer 15,16 can be drawn by simple structure from each coil 12,13.
In addition, in the present embodiment, upper surface part 15b, 16b and lower surface portion 15c, 16c is equipped with at the first taking-up electrode layer 15 and second taking-up both electrode layers 16.Therefore, no matter which surface of the upper and lower surface of thin inductance device 10 is towards installation base plate 25, can both be connected with the conducting of described installation base plate 25.Namely as shown in Figure 2, first takes out the second the second lower surface portion 16c taking out electrode layer 16 not shown in the first lower surface portion 15c of electrode layer 15 and Fig. 2 is electrically connected with the splicing ear 25a on installation base plate 25 surface, and the thin inductance device shown in Fig. 2 also can put upside down 180 degree and be electrically connected with the splicing ear 25a of installation base plate 25.Thereby, it is possible to thin inductance device 10 to be arranged on simply and reliably the surface of installation base plate 25, good assembleability can be obtained.It should be noted that, if without the need to this function, then the second coil 13 is connected the second taking-up electrode 16 and the second lower surface portion 16c, when therefore considering that solder layer 35 described later is arranged on the situation between first, second side surface part 15a, 16a and first, second lower surface portion 15c, can there is no the second upper surface part 16b yet.
In addition, as shown in Fig. 1 (b), Fig. 2, each taking-up electrode layer 15,16 not only possesses upper surface part 15b, 16b and lower surface portion 15c, 16c but also possesses side surface part 15a, 16a and integrated with upper surface part 15b, 16b and lower surface portion 15c, 16c, and becomes the structure of the two-side supporting insulating substrate 11 from X1-X2 direction.Thereby, it is possible to make each taking-up electrode layer 15,16 play function as suppressing the two-side supporting body of the distortion of thin inductance device etc.
As shown in Fig. 1 (b), Fig. 2, form first take out the first upper surface part 15b of electrode layer 15 and the first lower surface portion 15c and form second take out the second upper surface part 16b of electrode layer 16 and the second lower surface portion 16c formed than the first coil 12 and the second coil 13 thick.
Therefore, take out electrode layer 15 and second first to take out between each upper surface part 15b, the 16b of electrode layer 16 and each lower surface portion 15c, 16c and the first coil 12 and the second coil 13 and can form difference of height.Further, as shown in Fig. 1 (b), Fig. 2, the first magnetic piece 17 is configured at the upper surface of the first coil 12 via insulating barrier (adhesive linkage) 31.And, as shown in Fig. 1 (b), Fig. 2, configure the second magnetic piece 30 at the lower surface of the second coil 13 via insulating barrier (adhesive linkage) 32.Now, in the present embodiment, as shown in Fig. 1 (b), Fig. 2, the mode that can become roughly the same face with each surface of the first magnetic piece 17, first upper surface part 15b and the second upper surface part 16b configures the first magnetic piece 17.And the mode that can become roughly the same face with each surface of the second magnetic piece 30, first lower surface portion 15c and the second lower surface portion 16c configures the second magnetic piece 30.
Or in the present embodiment, each surface of the first upper surface part 15b and the second upper surface part 16b can be formed as the mode more outstanding to the direction (top) leaving insulating substrate 11 than the surface of the first magnetic layer 17.And, each surface of the first lower surface portion 15c and the second lower surface portion 16c can be formed as the mode more outstanding to the direction (below) leaving insulating substrate 11 than the surface of the second magnetic layer 30.
As previously discussed, each upper surface part, each lower surface portion and each magnetic layer are formed or make each outwardly side of each magnetic layer of each surface ratio of each upper surface part, each lower surface portion outstanding by roughly the same face, thus, when utilizing solder etc. that thin inductance device 10 is installed on installation base plate 25, not easily occur to install bad etc.
In the present embodiment, by using magnetic piece 17,30, the raising of Q value can be realized, and magnetic piece 17,30 can be used as magnetic shield.The structure of magnetic piece 17,30 is also not particularly limited.PEN can be set forth in, PETG, polyamide-based etc. insulating trip are formed with the magnetospheric structure of FeAlN or FeN on the surface, on the surface of insulating trip by the magnetosphere of FeAlN or FeN and SiO
2deng the structure of the alternately laminated defined amount of insulating barrier or the ferrite sheet deposited, ferrite-plate, magnetic alloy strip etc.
The insulating barrier (adhesive linkage) 31,32 engaged between each coil 12,13 with each magnetic piece 17,30 can be used such as epoxy low temperature curing agent, propylene system low temperature curing agent.
Between each coil 12,13 and each magnetic piece 17,30, be folded with insulating barrier 31,32, the magnetosphere of magnetic piece 17,30 therefore can be made to engage towards coil 12,13 side, the magnetosphere of magnetic piece 17,30 also can be made to engage toward the outer side.And, also can be following structure: pass through SiO at the magnetic layer surface of each magnetic piece 17,30
2, Al
2o
3, SiAlON, AlN etc. are pre-formed dielectric film (not shown), use bonding agent at insulating barrier 31,32, under the state being filled with described bonding agent, make the magnetosphere of magnetic piece 17,30 carry out crimping, engaging towards coil 12,13 side.By this structure, bonding agent is crushed because of crimping, the interval of coil 12,13 and magnetic piece 17,30 roughly becomes the thickness of the only dielectric film of magnetic layer surface, under the state of insulation maintaining magnetic piece 17,30 and coil 12,13, the thickness of thin inductance device can be made thinning further, also can improve inductance value and Q value.
In addition, in the structure shown in Fig. 2, each surface of the first magnetic piece 17, first upper surface part 15b and the second upper surface part 16b is formed as roughly the same face, in addition, each surface of the second magnetic piece 30, first lower surface portion 15c and the second lower surface portion 16c is formed as roughly the same face, therefore, it is possible to form each upper surface part 15b, 16b or each lower surface portion 15c, 16c as the installed surface to installation base plate 25, the good electrical connectivity with the splicing ear 25a of installation base plate 25 can be obtained.
As shown in Fig. 1 (b), Fig. 2, in the present embodiment, first take out the first upper surface part 15b of electrode layer 15 and the first lower surface portion 15c and formed by the stepped construction of internal layer 21,22 and skin (the second plating layer 23).Further, described internal layer 21 is formed with roughly the same thickness with each coil 12,13.It should be noted that, the second taking-up electrode layer 16 also takes out electrode layer 15 with first be same structure, below, uses first to take out electrode layer 15 and be described.
As shown in Figure 2, the internal layer 21 of the first upper surface part 15b and the first coil 12 are the first same paper tinsel body 18 and the stepped construction of the first plating layer 19, thereby, it is possible to the internal layer 21 of the first upper surface part 15b and the first coil 12 are formed with identical thickness.
In addition as shown in Figure 2, the internal layer 22 of the first lower surface portion 15c and the second coil 13 are the second same paper tinsel body 20 and the stepped construction of the first plating layer 19, thereby, it is possible to the internal layer 21 of the first lower surface portion 15c and the second coil 13 are formed with identical thickness.First plating layer 19 is such as electroless plating coating, thus can from the surface of the first paper tinsel body 18 and the second paper tinsel body 20 until the first side 11d of insulating substrate 11 and directly form the first plating layer 19.
And, at surface coincidence formation second plating layer 23 of first plating layer 19 of formation first upper surface part 15b and the first lower surface portion 15c, thereby, it is possible to the thickness of the first upper surface part 15b and the first lower surface portion 15c is formed than the first coil 12 and the second coil 13 thick.
In addition, the second plating layer 23 overlaps with the first plating layer 19 be formed on the first side 11d and is formed, and the first side surface part 15a is formed by the stepped construction of the first plating layer 19 and the second plating layer 23.
Second plating layer 23 is preferably electrolysis plating layer.Also can be formed as without electrolysis, but the second plating layer 23 can be formed when being formed as electrolysis plating layer at short notice thicklyer.
In addition, the first plating layer 19 is formed by material that is identical or homogeneity with the second plating layer 23, preferably carries out integration.
When representing an example of thickness of each layer, the thickness of each paper tinsel body 18,20 is about 35 μm, and the thickness of the first plating layer 19 is about 35 μm, and the thickness of the second plating layer 23 is about 65 ~ 75 μm.
As shown in Fig. 1 (a), Fig. 1 (c), in the present embodiment, first electrode layer 15 is taken out to be formed with the first side 11d equal length of insulating substrate 11.And second takes out electrode layer 16 to be formed with the same length of the second side 11e of insulating substrate 11.As shown in Fig. 1 (a), first takes out electrode layer 15, first side 11d, the second length dimension on Y1-Y2 direction taking out electrode layer 16 and the second side 11e is L1.
In addition, as shown in Fig. 1 (a), the second upper surface part 16b that the first the first upper surface part 15b and second taking out electrode layer 15 takes out electrode layer 16 keeps the length dimension of L1 and is formed with the width dimensions of T1 along X1-X2 direction simultaneously.And as shown in Fig. 1 (c), the second lower surface portion 16c that the first the first lower surface portion 15c and second taking out electrode layer 15 takes out electrode layer 16 keeps the length dimension of L1 and is formed with the width dimensions of T1 along X1-X2 direction simultaneously.
Length dimension L1 is about 2 ~ 5mm, and width dimensions T1 is about 0.35mm.
Thus, large area can form the first taking-up electrode layer 15 and the second taking-up electrode layer 16, the contact resistance between the splicing ear 25a of installation base plate 25 can be reduced, and can by each taking-up electrode layer 15,16 with between splicing ear 25a reliably and be electrically connected simply.
In addition, as shown in Figure 2, in the present embodiment, the most surface of taking out electrode layer 15 first is formed with pad 34.It should be noted that, be also formed with pad in the second most surface of taking out electrode layer 16.Pad 34 is such as Ni/Au layer (Ni is base side), Ni/Sn layer, Ni/ solder layer, Ni/Ag layer.The thickness of pad 34 is formed be as thin as about 5 μm.
As shown in Figure 2, engaged by solder layer 35 between the first taking-up electrode layer 15 and the splicing ear 25a of installation base plate 25.Pad 34 is provided with by the most surface of taking out electrode layer 15 first, and the first solder wettability taking out the most surface of electrode layer 15 improves, as shown in Figure 2, the solder layer 35 of radiussed can be formed, the electrical connectivity between the first taking-up electrode layer 15 and the splicing ear 25a of installation base plate 25 can be improved.It should be noted that, take out between electrode layer 16 and the splicing ear 25a of installation base plate 25 for second and also can be engaged by the solder layer of radiussed.
As shown in Fig. 1 (a), first coil 12 from winding top 12a initial bearing of trend α 1 be X1 direction (first direction), on the other hand, as shown in Fig. 1 (c), second coil 13 from winding top 13a initial bearing of trend α 2 are X2 direction (second directions), in the first coil 12 and the second coil 13, bearing of trend is contrary.
And described bearing of trend α 1, α 2 are orthogonal with the first side 11d of insulating substrate 11 and the length direction (Y1-Y2) of the second side 11e.Thereby, it is possible to make the first coil 12 identical with the number of turn of the second coil 13, and can the number of turn be increased to greatest extent, the increase of inductance can be realized.
Fig. 3 (a) is another execution mode different from Fig. 1 (a), Fig. 1 (c), and the right figure of Fig. 3 (a) represents the vertical view of First Line circle 40, and the left figure of Fig. 3 (a) represents the vertical view of the second coil 41.
As shown in Fig. 3 (a), the first coil 40 from the initial bearing of trend α 3 of winding top 40a be Y1 direction, the second coil 41 from the initial bearing of trend α 4 of top 41a of reeling be Y2 direction.
As shown in the right figure of Fig. 3 (a), the winding terminal 40b and integrated first of the first coil 40 takes out electrode layer 42 and connects, and the first taking-up electrode layer 42 is formed along the length direction (X1-X2) of first side (not shown) of insulating substrate.
In addition, as shown in the left figure of Fig. 3 (a), the winding terminal 41b and integrated second of the second coil 41 takes out electrode layer 43 and connects, and the second taking-up electrode layer 43 is formed along the length direction (X1-X2) of second side (not shown) of insulating substrate.
Namely, first coil 40 and the second coil 41 be rightabout each other from initial bearing of trend α 3, the α 4 (Y1-Y2) of each winding top 40a, 41a, and described bearing of trend α 3, α 4 are orthogonal with the first side of insulating substrate and the length direction (X1-X2) of the second side.
Consequently, as shown in Fig. 3 (a), the first coil 40 is identical with the number of turn of the second coil 41, when making the first coil 40 overlap with the second coil 41, the position consistency of the position of each circle of the first coil 40 and each circle of the second coil 41, and the number of turn can be increased to greatest extent.
On the other hand, Fig. 3 (b) represents the coil of comparative example, and the right figure of Fig. 3 (b) represents the vertical view of First Line circle 45, and the left figure of Fig. 3 (b) represents the vertical view of the second coil 46.
As shown in Fig. 3 (b), the first coil 45 from the initial bearing of trend α 5 of winding top 45a be Y1 direction, the second coil 46 from the initial bearing of trend α 6 of top 46a of reeling be Y2 direction.
As shown in the right figure of Fig. 3 (b), the winding terminal 45b and integrated first of the first coil 45 takes out electrode layer 47 and connects, and the first taking-up electrode layer 47 is formed along the length direction (Y1-Y2) of the side (not shown) of insulating substrate.
In addition, as shown in the left figure of Fig. 3 (b), the winding terminal 46b and integrated second of the second coil 46 takes out electrode layer 48 and connects, and the second taking-up electrode layer 48 is formed along the length direction (Y1-Y2) of the side (not shown) of insulating substrate.
In the comparative example of Fig. 3 (b), first coil 45 and the second coil 46 be rightabout each other from initial bearing of trend α 5, the α 6 (Y1-Y2) of each winding top 45a, 46a, but described bearing of trend α 5, α 6 are parallel with the length direction (Y1-Y2) of side of the insulating substrate being formed with each taking-up electrode layer 47,48.
Consequently, as shown in Fig. 3 (b), the first coil 45 is different from the number of turn of the second coil 46.As shown in Fig. 3 (b), when observing from the winding top 45a of the first coil 45, the coil turn of Y2 side region is 3, but when observing from the winding top 46a of the second coil 46, the coil turn of Y2 side region is 4.
So, in the comparative example of Fig. 3 (b), the number of turn of the first coil 45 and the second coil 46 is inconsistent in local, cannot increase to greatest extent by the number of turn, and compared with the execution mode of Fig. 3 (a), inductance declines.
Thus, as Fig. 3 (a), first coil 40 and the second coil 41 from initial bearing of trend α 3, the α 4 (Y1-Y2) of each winding top 40a, 41a be rightabout each other, and described bearing of trend α 3, α 4 are orthogonal with the first side of insulating substrate and the length direction (X1-X2) of the second side, can realize the increase of inductance thus.And, in order to obtain the identical number of turn, also can comprise and take out electrode layer and be formed as the thin inductance device of minimum dimension.
It should be noted that, the part of the common feature of present embodiment is by coil, conductting layer and the point taking out electrode layer integration.Thus, about coiling direction and the relation of the bearing of trend of taking-up electrode layer of coil, the structure of Fig. 3 (b) is not foreclosed.But Fig. 3 (a) more preferably.
Fig. 4 is the longitudinal sectional view of the thin inductance device of another execution mode.In the diagram, for the layer identical with Fig. 1 (b), mark same-sign.
In the diagram, with Fig. 1 (b) differently, take out electrode layer 15 and second first and take out electrode layer 16 and do not form the second plating layer 23.Thus, in the diagram, first takes out electrode layer 15 and second takes out each upper surface part 15b, the 16b of electrode layer 16, each lower surface portion 15c, 16c in the same manner as the first coil 12 and the second coil 13, is the stepped construction of paper tinsel body 18,20 and first plating layer 19, is formed as roughly the same thickness.Therefore, as shown in Figure 4, between the surface of magnetic piece 17,30 and the surface of respectively taking out each upper surface part 15b, the 16b of electrode layer 15,16 and each lower surface portion 15c, 16c, difference of height is produced.Thus, as shown in Figure 3, between each lower surface portion 15c, the 16c and the splicing ear 25a of installation base plate 25 of each taking-up electrode layer 15,16, easily gap beta is formed.Described gap beta is by solder layer 35 landfill, and each electrode layer 15,16 that takes out is electrically connected via solder layer 35 with between splicing ear 25a.
But, when the structure of Fig. 3, each taking-up electrode layer 15, each lower surface portion 15c of 16, 16c does not become becomes the state of floating to the installed surface of installation base plate 25, therefore the contact resistance between splicing ear 25a can be reduced, and in order to obtain being connected with the reliable of splicing ear 25a, and as Fig. 1 (b), shown in Fig. 2, second plating layer 23 is implemented to the first taking-up electrode layer 15 and the second taking-up electrode layer 16, each taking-up electrode layer 15, each upper surface part 15b of 16, 16b and each lower surface portion 15c, the thickness of 16c is formed than each coil 12, the thickness of 13 is thick, preferably by each magnetic piece 17, the surface of 30 and each taking-up electrode layer 15, each upper surface part 15b of 16, 16b and each lower surface portion 15c, the surface of 16c is formed as roughly same plane.Or preferably make each upper surface part 15b, 16b and each lower surface portion 15c, 16c the surface of each magnetic piece of surface ratio 17,30 outstanding to the direction leaving insulating substrate 11.
Next, the manufacture method of the thin inductance device (magnetic cell) of present embodiment is described.Each figure of Fig. 5 is the partial lengthwise sectional view of the thin inductance device of fabrication stage.It should be noted that, for the layer identical with Fig. 1 etc., mark same-sign.
In Fig. 5 (a), prepare to form the first paper tinsel body 18 at the upper surface 11a of insulating substrate 11 and the insulated substrate 51 being formed with the second paper tinsel body 20 at lower surface 50b.As Suo Shi Fig. 5 (b) ~ Fig. 5 (f), this insulated substrate 51 is processed, cut off by Fig. 5 (f) operation, the thin inductance device shown in multiple Fig. 1 can be obtained from insulated substrate 51 thus.Such as, insulated substrate 51 is preferably the glass epoxy substrate possessing Copper Foil in upper and lower surface.At this, the thickness of the first paper tinsel body 18 and the second paper tinsel body 20 is such as about 35 μm.
In the operation of Fig. 5 (b), each interregional position when insulated substrate 51 being divided into the region of multiple thin inductance device is formed with through hole 52.Insulated substrate 51 from upper surface 51a until lower surface 51b formed through hole 52.The length dimension to Y1-Y2 direction of through hole 52 is the L1 shown in Fig. 1.And the width dimensions T3 to X1-X2 direction of through hole 52 is more than the width dimensions T5 of through hole 53, preferably reduce in the mode that can obtain multiple thin inductance device from insulated substrate 51 as far as possible.Especially, width dimensions T3 formed be greater than the upper formation of side 11d, 11e of each thin inductance device the first plating layer 19 be added 2 times of obtained thickness T4 (with reference to Fig. 1 (a) (b)) with the thickness of the second plating layer 23.Specifically, width dimensions T3 is more than 200 μm.
In addition, as shown in Fig. 5 (b), be formed with the through hole 53 through from the upper surface 51a of insulated substrate 51 to lower surface 51b in the substantial middle position in the region becoming each thin inductance device.Through hole 53 is such as cylindric or prism-shaped.As shown in Fig. 1 (b), the width dimensions T3 of through hole 52 is formed be greater than the width dimensions T5 of through hole 53.
The formation of through hole 52 and through hole 53 can use photoetching technique.Or be not only photoetching technique, the machining of drill bit etc. also can be used to form hole at an easy rate.
Next, in the operation of Fig. 5 (c), form the first plating layer 19 by electroless plating method with overlapping with the first paper tinsel body 18 and the second paper tinsel body 20.Now, formed based on the conductting layer 14 of the first plating layer 19 in through hole 53, and from the surface of the first paper tinsel body 18 until the surface of side wall surface 52a, 52b in through hole 52 and the second paper tinsel body 20 and form described first plating layer 19.Such as by forming the first plating layer 19 based on the electroless plating of Cu.The thickness of the first plating layer 19 is such as about 35 μm.
Next, in the operation of Fig. 5 (d), use photoetching technique, the first coil 12 be made up of the first paper tinsel body 18 and the first plating layer 19 is formed in the upper surface side in each region becoming thin inductance device, and, form in the lower face side in each region becoming thin inductance device the second coil 13 be made up of the second paper tinsel body 20 and the first plating layer 19.
Such as, the first coil 12 and the second coil 13 is formed by the flat shape shown in Fig. 1 (a), Fig. 1 (c).
As shown in Fig. 5 (d), the winding top 12a and conductting layer 14 integration that are positioned at the inner side of the first coil 12 are formed, and, the winding top 13a and conductting layer 14 integration that are positioned at the inner side of the second coil 13 are formed.
In addition, in the operation of Fig. 5 (d), formed be connected with the winding terminal 12b in the outside being positioned at the first coil 12 first take out electrode layer 15 and be connected with the winding terminal 13b in the outside being positioned at the second coil 13 second take out electrode layer 16 (with reference to Fig. 1 (a) (c)).
The first side wall face 52a of through hole 52 is equivalent to the first side 11d of the insulating substrate 11 forming thin inductance device 10.And the second side wall surface 52b of through hole 52 is equivalent to the second side 11e of the insulating substrate 11 forming thin inductance device 10.Further, the first taking-up electrode layer 15 has: the first side surface part 15a with the first plating layer 19 based on electroless plating being directly formed at the first side wall face 52a; From the first side surface part 15a to the first upper surface part 15b that the upper surface of insulating substrate 11 extends; From the first side surface part 15a to the first lower surface portion 15c that the lower surface of insulating substrate 11 extends.And second takes out electrode layer 16 has: the second side surface part 16a with the first plating layer 19 based on electroless plating being directly formed at the second side wall surface 52b; From the second side surface part 16a to the second upper surface part 16b that the upper surface of insulating substrate 11 extends; From the second side surface part 16a to the second lower surface portion 16c that the lower surface of insulating substrate 11 extends.
As shown in Fig. 1 (a) (c), the first taking-up electrode layer 15 and the second taking-up electrode layer 16 are formed along Y1-Y2 direction by length dimension L1.This length dimension L1 is consistent with the first side 11d of the insulating substrate 11 of each thin inductance device 10 of formation and the length dimension to Y1-Y2 direction of the second side 11e.
As shown in Fig. 5 (d) and Fig. 1 (a), first coil 12 and first takes out electrode layer 15 and is similarly formed by the stepped construction of the first paper tinsel body 18 and the first plating layer 19, and from the winding terminal 12b of the first coil 12 until first takes out the first upper surface part 15b of electrode layer 15 and integrated formation.And as shown in Fig. 5 (d) and Fig. 1 (c), second coil 13 and second takes out electrode layer 16 and is similarly formed by the stepped construction of the second paper tinsel body 20 and the first plating layer 19, and from the winding terminal 13b of the second coil 13 until second takes out the second lower surface portion 16c of electrode layer 16 and integrated formation.
Next, in the operation of Fig. 5 (e), form the second plating layer 23 on the first surface of taking out the first plating layer 19 of electrode layer 15 and the second taking-up electrode layer 16 by electrolysis plating.Second plating layer 23 is preferably formed by material that is identical with the first plating layer 19 or homogeneity.Such as form the second plating layer 23 by Cu.And the thickness of the second plating layer 23 is such as about 65 ~ 75 μm.
Take out electrode layer 16 form the second plating layer 23 to only take out electrode layer 15 and second first, as long as take out electrode layer 15 and the second region of taking out beyond electrode layer 16 first to arrange resist layer and not plating second plating layer 23.
Thereby, it is possible to take out first that electrode layer 15 and second takes out each upper surface part 15b, the 16b of electrode layer 16 and each lower surface portion 15c, the thickness of 16c formed than the first coil 12 and the second coil 13 thick.
Now, the first each side surface part 15a, 16a taking out electrode layer 15 and the second taking-up electrode layer 16 is formed by the stepped construction of the first plating layer 19 and the second plating layer 23.Now, as shown in Fig. 5 (e), the first taking-up electrode layer 15 and second adjacent in through hole 52 takes out electrode layer 16 and does not abut, and separates space.
In addition, the first plating layer 19 is formed by material that is identical or homogeneity with the second plating layer 23, and the first plating layer 19 carries out integrated with the second plating layer 23.
And, be formed with in the first most surface of taking out electrode layer 15 and the second taking-up electrode layer 16 pad 34 (with reference to Fig. 2) be made up of Ni/Au layer (Ni is base side), Ni/Sn layer, Ni/ solder layer, Ni/Ag layer etc.
Next, in the operation of Fig. 5 (f), form insulating barrier 31,32 on the surface of the first coil 12 and the second coil 13.Insulating barrier 31,32 can use epoxy low temperature curing agent, propylene system low temperature curing agent.Further, to be magnetic sheet 17,30 at the surface mount of insulating barrier 31,32.Now, the surface and first of magnetic piece 17,30 takes out that electrode layer 15 and second takes out each upper surface part 15b, the 16b of electrode layer 16, each lower surface portion 15c, the surface of 16c can be formed by roughly same plane.And, can make the first taking-up electrode layer 15 and second take out each upper surface part 15b, the 16b of electrode layer 16, each lower surface portion 15c, 16c the surface of surface ratio magnetic piece 17,30 outstanding to the direction leaving insulating substrate 11.So, as long as at least make the structure that magnetic piece 17,30 is not given prominence to from the surface of each upper surface part 15b, 16b, each lower surface portion 15c, 16c with no obstacle when utilizing solder to be installed on circuit substrate.
Further, when cutting off insulated substrate 51 from the position of the single dotted broken line of Fig. 5 (f), multiple thin inductance device 10 can be obtained.
The manufacture method of the thin inductance device 10 of the present embodiment according to Fig. 5, as shown in Fig. 5 (b) ~ Fig. 5 (d), each coil 12,13, conductting layer 14 and each electrode layer 15,16 that takes out can be formed by identical operation, each coil 12,13, conductting layer 14 and each electrode layer 15,16 that takes out can integrated formation.Thus, in the present embodiment, compared with the past, the thin inductance device that can reduce coil 12,13 and take out the contact resistance between electrode layer 15,16 and between coil 12,13 and conductting layer 14 can be produced with manufacture efficiency system more excellent than ever.
In addition, in the operation of Fig. 5 (e), take out first formation second plating layer 23 that the first plating layer 19 that electrode layer 15 and second takes out electrode layer 16 can overlap, the first upper surface part 15b of electrode layer 15 and the first lower surface portion 15c, second can be taken out first and take out the second upper surface part 16b of electrode layer 16 and the second lower surface portion 16c and be formed than each coil 12,13 thick.Therefore, in the operation of Fig. 5 (f), can arrange suitably and simply on the surface of coil 12,13 and take out the magnetic piece 17,30 that electrode layer 15 and the second surface of taking out electrode layer 16 become roughly the same face with first.Or the first taking-up electrode layer 15 and the second surface of taking out the surface ratio magnetic piece 17,30 of electrode layer 16 can be made to give prominence to.
In addition, in order to the thin inductance device of the structure shown in shop drawings 4, as long as the operation of removing Fig. 5 (e).
In addition, in the present embodiment, form the second the second upper surface part 16b taking out electrode layer 16 also can not be formed.By arranging resist etc. in the position of the second upper surface part 16b and not forming plating layer, the thin inductance device of the structure not having the second upper surface part 16b can be formed.
Claims (6)
1. a manufacture method for magnetic cell, it has:
First operation, wherein, prepare to be formed with the first paper tinsel body at the upper surface of insulating substrate and be formed with the second paper tinsel body at lower surface, the insulated substrate that can cut into multiple magnetic cell,
The interregional position becoming each magnetic cell of described insulated substrate forms through hole, in the region becoming each magnetic cell, forms through hole;
Second operation, wherein, the first plating layer is formed with closing with described first paper tinsel body and described second paper tinsel body weight, now, the conductting layer based on described first plating layer is formed in described through hole, and from the surface of described first paper tinsel body until the surface of side wall surface in described through hole and described second paper tinsel body and form described first plating layer;
3rd operation, wherein, use photoetching technique, first coil with described first paper tinsel body and described first plating layer is formed in the upper surface side of described insulating substrate, and, second coil with described second paper tinsel body and described first plating layer is formed in the lower face side of described insulating substrate
Now, by integrated with described conductting layer for each winding top of the inner side of the inner side and described second coil that are positioned at described first coil and formed,
In addition, form first take out electrode layer and form the second taking-up electrode layer, described first takes out electrode layer has the first side surface part formed on the first side wall face of the described through hole suitable with the first side of described insulating substrate, from described first side surface part to the upper surface of described insulating substrate extend and with first upper surface part of winding terminal integral in outside being positioned at described first coil, from described first side surface part to the first lower surface portion that the lower surface of described insulating substrate extends, described second takes out electrode layer has the second side surface part formed on the second side wall surface of the suitable described through hole in the second side being different from described first side with described insulating substrate, from described second side surface part to the lower surface of described insulating substrate extend and with second lower surface portion of winding terminal integral in outside being positioned at described second coil,
4th operation, wherein, cuts off described insulated substrate, obtains multiple described magnetic cell,
The feature of the manufacture method of described magnetic cell is,
Have to take out surface that electrode layer and described second takes out described first plating layer of electrode layer overlaps described first between described 3rd operation with described 4th operation and form the 5th operation of the second plating layer formed by the material identical with described first plating layer
After described 5th operation, having overlaps to arrange the first magnetic layer and overlap in the lower face side of described second coil in the upper surface side of described first coil arranges the 6th operation of the second magnetic layer, make described first magnetic layer, and each surface of described first upper surface part is roughly the same face, or make the surface of the first magnetic layer described in the surface ratio of described first upper surface part outstanding to the direction leaving described insulating substrate, make described second magnetic layer, each surface of described first lower surface portion and described second lower surface portion is roughly the same face, or make the surface of the second magnetic layer described in each surface ratio of described first lower surface portion and described second lower surface portion outstanding to the direction leaving described insulating substrate.
2. the manufacture method of magnetic cell according to claim 1, wherein,
Take out on electrode layer described second, form the second upper surface part together with described second side surface part and described second lower surface portion, this second upper surface part extends from described second side surface part to the upper surface of described insulating substrate and is same structure with described first upper surface part.
3. the manufacture method of magnetic cell according to claim 2, wherein,
Pad is formed in second upper surface part of described first taking out the first upper surface part of electrode layer, the first lower surface portion, the first side surface part and described second take out electrode layer, the second lower surface portion, the second side surface part.
4. the manufacture method of the magnetic cell according to any one of claims 1 to 3, wherein,
Described first paper tinsel body, described second paper tinsel body, described first plating layer and described second plating layer are formed by Cu.
5. the manufacture method of the magnetic cell according to any one of claims 1 to 3, wherein,
Described first plating layer is formed by electroless plating method, and described second plating layer is formed by electrolysis plating.
6. the manufacture method of magnetic cell according to claim 4, wherein,
Described first plating layer is formed by electroless plating method, and described second plating layer is formed by electrolysis plating.
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| KR101792365B1 (en) * | 2015-12-18 | 2017-11-01 | 삼성전기주식회사 | Coil component and manufacturing method for the same |
| JP6642030B2 (en) * | 2016-01-20 | 2020-02-05 | 株式会社村田製作所 | Coil parts |
| KR101994754B1 (en) * | 2017-08-23 | 2019-07-01 | 삼성전기주식회사 | Inductor |
| KR102064079B1 (en) * | 2018-06-04 | 2020-01-08 | 삼성전기주식회사 | Inductor |
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- 2011-10-20 JP JP2011231047A patent/JP5765685B2/en active Active
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2012
- 2012-08-29 TW TW101131320A patent/TWI490894B/en active
- 2012-10-17 CN CN201210394713.1A patent/CN103065764B/en active Active
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101950658A (en) * | 2009-07-08 | 2011-01-19 | 株式会社村田制作所 | Electronic component and method for manufacturing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201330027A (en) | 2013-07-16 |
| JP5765685B2 (en) | 2015-08-19 |
| JP2013089876A (en) | 2013-05-13 |
| CN103065764A (en) | 2013-04-24 |
| TWI490894B (en) | 2015-07-01 |
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