CN103050408A - 超级结制作方法 - Google Patents
超级结制作方法 Download PDFInfo
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- CN103050408A CN103050408A CN2012101747997A CN201210174799A CN103050408A CN 103050408 A CN103050408 A CN 103050408A CN 2012101747997 A CN2012101747997 A CN 2012101747997A CN 201210174799 A CN201210174799 A CN 201210174799A CN 103050408 A CN103050408 A CN 103050408A
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CN2012101747997A CN103050408A (zh) | 2012-05-31 | 2012-05-31 | 超级结制作方法 |
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CN2012101747997A CN103050408A (zh) | 2012-05-31 | 2012-05-31 | 超级结制作方法 |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104701382A (zh) * | 2015-03-27 | 2015-06-10 | 上海新储集成电路有限公司 | 一种dmos器件及其制备方法 |
CN109979823A (zh) * | 2017-12-28 | 2019-07-05 | 深圳尚阳通科技有限公司 | 一种屏蔽栅功率器件及制造方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6630698B1 (en) * | 1998-09-02 | 2003-10-07 | Infineon Ag | High-voltage semiconductor component |
US20070181927A1 (en) * | 2006-02-03 | 2007-08-09 | Yedinak Joseph A | Charge balance insulated gate bipolar transistor |
US20100032791A1 (en) * | 2008-08-08 | 2010-02-11 | Sony Corporation | Semiconductor device and method of manufacturing the same |
CN102054701A (zh) * | 2009-10-28 | 2011-05-11 | 上海华虹Nec电子有限公司 | 超接面mos纵向p型区的制作方法 |
CN102208447A (zh) * | 2011-05-20 | 2011-10-05 | 无锡新洁能功率半导体有限公司 | 一种具有超结结构的半导体器件及其制造方法 |
CN102456575A (zh) * | 2010-10-28 | 2012-05-16 | 上海华虹Nec电子有限公司 | 超级结结构的半导体器件的制作方法及器件结构 |
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- 2012-05-31 CN CN2012101747997A patent/CN103050408A/zh active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6630698B1 (en) * | 1998-09-02 | 2003-10-07 | Infineon Ag | High-voltage semiconductor component |
US20070181927A1 (en) * | 2006-02-03 | 2007-08-09 | Yedinak Joseph A | Charge balance insulated gate bipolar transistor |
US20100032791A1 (en) * | 2008-08-08 | 2010-02-11 | Sony Corporation | Semiconductor device and method of manufacturing the same |
CN102054701A (zh) * | 2009-10-28 | 2011-05-11 | 上海华虹Nec电子有限公司 | 超接面mos纵向p型区的制作方法 |
CN102456575A (zh) * | 2010-10-28 | 2012-05-16 | 上海华虹Nec电子有限公司 | 超级结结构的半导体器件的制作方法及器件结构 |
CN102208447A (zh) * | 2011-05-20 | 2011-10-05 | 无锡新洁能功率半导体有限公司 | 一种具有超结结构的半导体器件及其制造方法 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104701382A (zh) * | 2015-03-27 | 2015-06-10 | 上海新储集成电路有限公司 | 一种dmos器件及其制备方法 |
CN104701382B (zh) * | 2015-03-27 | 2017-12-05 | 上海新储集成电路有限公司 | 一种dmos器件及其制备方法 |
CN109979823A (zh) * | 2017-12-28 | 2019-07-05 | 深圳尚阳通科技有限公司 | 一种屏蔽栅功率器件及制造方法 |
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Owner name: SHANGHAI HUAHONG GRACE SEMICONDUCTOR MANUFACTURING Free format text: FORMER OWNER: HUAHONG NEC ELECTRONICS CO LTD, SHANGHAI Effective date: 20140120 |
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Effective date of registration: 20140120 Address after: 201203 Shanghai city Zuchongzhi road Pudong New Area Zhangjiang hi tech Park No. 1399 Applicant after: Shanghai Huahong Grace Semiconductor Manufacturing Corporation Address before: 201206, Shanghai, Pudong New Area, Sichuan Road, No. 1188 Bridge Applicant before: Shanghai Huahong NEC Electronics Co., Ltd. |
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Application publication date: 20130417 |