CN103035751A - 肖特基二极管 - Google Patents
肖特基二极管 Download PDFInfo
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- CN103035751A CN103035751A CN2012105090467A CN201210509046A CN103035751A CN 103035751 A CN103035751 A CN 103035751A CN 2012105090467 A CN2012105090467 A CN 2012105090467A CN 201210509046 A CN201210509046 A CN 201210509046A CN 103035751 A CN103035751 A CN 103035751A
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- deep trench
- schottky diode
- dioxide layer
- silicon dioxide
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Abstract
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Priority Applications (1)
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CN2012105090467A CN103035751A (zh) | 2012-11-23 | 2012-11-23 | 肖特基二极管 |
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CN2012105090467A CN103035751A (zh) | 2012-11-23 | 2012-11-23 | 肖特基二极管 |
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CN103035751A true CN103035751A (zh) | 2013-04-10 |
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CN2012105090467A Pending CN103035751A (zh) | 2012-11-23 | 2012-11-23 | 肖特基二极管 |
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Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1520615A (zh) * | 2001-06-01 | 2004-08-11 | ͨ�ð뵼�幫˾ | 沟槽肖特基整流器 |
US20050062124A1 (en) * | 2003-09-08 | 2005-03-24 | Davide Chiola | Thick field oxide termination for trench schottky device and process for manufacture |
CN101800252A (zh) * | 2010-03-04 | 2010-08-11 | 无锡新洁能功率半导体有限公司 | 沟槽型肖特基势垒整流器及其制造方法 |
CN101901808A (zh) * | 2010-06-23 | 2010-12-01 | 苏州硅能半导体科技股份有限公司 | 一种沟槽式肖特基势垒二极管整流器件及制造方法 |
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2012
- 2012-11-23 CN CN2012105090467A patent/CN103035751A/zh active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1520615A (zh) * | 2001-06-01 | 2004-08-11 | ͨ�ð뵼�幫˾ | 沟槽肖特基整流器 |
US20050062124A1 (en) * | 2003-09-08 | 2005-03-24 | Davide Chiola | Thick field oxide termination for trench schottky device and process for manufacture |
CN101800252A (zh) * | 2010-03-04 | 2010-08-11 | 无锡新洁能功率半导体有限公司 | 沟槽型肖特基势垒整流器及其制造方法 |
CN101901808A (zh) * | 2010-06-23 | 2010-12-01 | 苏州硅能半导体科技股份有限公司 | 一种沟槽式肖特基势垒二极管整流器件及制造方法 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Owner name: SHANGHAI HUAHONG GRACE SEMICONDUCTOR MANUFACTURING Free format text: FORMER OWNER: HUAHONG NEC ELECTRONICS CO LTD, SHANGHAI Effective date: 20140123 |
|
C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 201206 PUDONG NEW AREA, SHANGHAI TO: 201203 PUDONG NEW AREA, SHANGHAI |
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TA01 | Transfer of patent application right |
Effective date of registration: 20140123 Address after: 201203 Shanghai city Zuchongzhi road Pudong New Area Zhangjiang hi tech Park No. 1399 Applicant after: Shanghai Huahong Grace Semiconductor Manufacturing Corporation Address before: 201206, Shanghai, Pudong New Area, Sichuan Road, No. 1188 Bridge Applicant before: Shanghai Huahong NEC Electronics Co., Ltd. |
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C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130410 |