CN103022713A - Amplitude impedance calibrated three-dimensional package surface antenna - Google Patents
Amplitude impedance calibrated three-dimensional package surface antenna Download PDFInfo
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Abstract
The invention relates to a horn antenna, in particular to an amplitude impedance calibrated three-dimensional package surface antenna which comprises a metalized vertical via feeder (1), a horn antenna (2) and metalized via holes (3), wherein the metalized vertical via feeder (1), the horn antenna (2) and the metalized via holes (3) are integrated on a dielectric substrate (4) which is arranged on the topside of a three-dimensional package (5). One end of the metalized vertical via feeder (1) is connected with an internal circuit (8), the horn antenna (2) comprises a bottom metal plane (6), a top metal plane (9) and metalized via side walls (11), a via array consisting of the metalized via holes (3) comprises a middle metalized via array (17), a left metalized via array (18) and a right metalized via array (19), four dielectric filling waveguides are formed in the horn antenna (2), and port wave impedance of the four dielectric filling waveguides on an antenna caliber surface (12) is equal to free space wave impedance. Antenna caliber efficiency can be improved while return loss is reduced.
Description
Technical field
The present invention relates to a kind of horn antenna, especially a kind of three-dimension packaging skin antenna of amplitude impedance calibration.
Background technology
Adopt little packaging technology, can be integrated in a radio system in the encapsulation, also need antenna is integrated in the surface of encapsulation for this reason.Be a kind of very natural mode at the integrated paster antenna of package surface, but the radiation master of paster antenna is to the normal direction that is the surface, and the radiation master that we need sometimes is to being direction surfacewise.If just can realize radiation along surface direction at the integrated horn antenna of package surface.But usually horn antenna is nonplanar, with incompatible, the larger physical dimension that has of planar circuit technique, thereby has limited its application on encapsulating structure.In recent years, substrate integration wave-guide horn antenna based on the substrate integrated waveguide technology development has the advantages that size is little, lightweight, be easy to Planar integration, but the gain of traditional substrate integration wave-guide horn antenna is relatively low, one of them reason is that the power on wave impedance of magnetic wave of antenna opening diametric plane is different from the wave impedance of free space, can cause reflection of electromagnetic wave, the return loss that has affected antenna and radiance on medium and air interface; The amplitude of electromagnetic field is also very inhomogeneous on the bore face in addition, narrowing toward each end broad in the middle, and this also affects the radiance of antenna.The methods such as at present existing employing medium loading, medium prism, correct the asynchronous of horn mouth diametric plane phase place, but these methods all can not be improved the inconsistent of horn antenna and free space wave impedance on the bore face, can not improve the uniformity that electromagnetic field magnitude distributes on the bore face, and these phase alignment structures have increased the overall structure size of antenna, are not suitable for being integrated into package surface.
Summary of the invention
Technical problem: the three-dimension packaging skin antenna that the objective of the invention is to propose a kind of amplitude impedance calibration, this antenna inside be embedded with the metallization arrays of vias in order to improve the antenna opening diametric plane power on magnetic wave amplitude uniformity and can avoid antenna and free space wave impedance inconsistent, improve aperture efficiency and the gain of antenna, reduce the reflection of antenna.
Technical scheme: the three-dimension packaging skin antenna of amplitude impedance calibration of the present invention comprises metallization vertical vias feeder line, substrate integration wave-guide horn antenna and the embedded metal via hole that is arranged on the medium substrate, and medium substrate is in the top of three-dimension packaging; Described metallization vertical vias feeder line links to each other with the internal circuit of three-dimension packaging; The substrate integration wave-guide horn antenna is comprised of with the metallization via hole loudspeaker sidewall that is connected medium substrate and connects bottom surface metal flat end face metal flat the bottom surface metal flat that is positioned at medium substrate one side, the end face metal flat that is positioned at the medium substrate another side; Metallization via hole embedded in the substrate integration wave-guide horn antenna connects bottom surface metal flat and end face metal flat, and consists of intermediate metallization arrays of vias, left side metallization arrays of vias and the right metallization arrays of vias; In horn antenna, there is first medium to fill waveguide, second medium filling waveguide, the 3rd dielectric-filled waveguide and the 4th dielectric-filled waveguide.
The circular hole that one end of metallization vertical vias feeder line passes on the metal flat of medium substrate bottom surface links to each other with the internal circuit of three-dimension packaging, there is individual circular pad on its other end top, metallization vertical vias feeder line top circular pad 10 is at the center of circular hole of the end face metal flat of medium substrate, and the end face metal flat of therefore metallize vertical vias feeder line top circular pad and medium substrate does not directly electrically contact.
The substrate integration wave-guide horn antenna is made of narrow Cross-section Waveguide Using, tubaeform waveguide and wide Cross-section Waveguide Using serial connection; One end of narrow Cross-section Waveguide Using is short circuit face, the other end of narrow Cross-section Waveguide Using links to each other with tubaeform waveguide, one end of tubaeform waveguide links to each other with narrow Cross-section Waveguide Using, and the other end of tubaeform waveguide links to each other with wide Cross-section Waveguide Using, and the other end of wide Cross-section Waveguide Using is the antenna opening diametric plane.
Intermediate metallization arrays of vias shape is one section straight line, the intermediate metallization arrays of vias is positioned at the middle position of two sidewalls of substrate integration wave-guide horn antenna, and the substrate integration wave-guide horn antenna is divided into symmetrical two parts, in the both sides of the metallization arrays of vias of centre, symmetrical have left side dielectric-filled waveguide and a right dielectric-filled waveguide.
Metallization arrays of vias in the left side is divided into first medium to left side dielectric-filled waveguide and fills waveguide and second medium filling waveguide, and the right metallization arrays of vias is divided into the 3rd dielectric-filled waveguide and the 4th dielectric-filled waveguide to the dielectric-filled waveguide on the right.
Metallization arrays of vias in the left side all is to be linked to each other with three sections of tail end straightways by head end straightway, polygon to consist of with the right metallization arrays of vias shape; The shape of the straightway in intermediate metallization arrays of vias, left side metallization arrays of vias and the right metallization arrays of vias can be straight line, broken line or exponential line etc., and its length can be zero or finite length; Polygon in left side metallization arrays of vias and the right metallization arrays of vias can be triangle, quadrangle, pentagon or other polygon, and the shape on a polygonal limit or many limits can be straight line, camber line or other curve; All towards the short circuit face direction of the narrow Cross-section Waveguide Using of horn antenna, the tail end of intermediate metallization arrays of vias, left side metallization arrays of vias and the right metallization arrays of vias is on the antenna opening diametric plane for the head end of intermediate metallization arrays of vias, left side metallization arrays of vias and the right metallization arrays of vias.。
Left side dielectric-filled waveguide, the right dielectric-filled waveguide, first medium fill waveguide, second medium fill the width of waveguide, the 3rd dielectric-filled waveguide and the 4th dielectric-filled waveguide all to guarantee its main mould can left side dielectric-filled waveguide, the right dielectric-filled waveguide, first medium fill waveguide, second medium is filled transmission in waveguide, the 3rd dielectric-filled waveguide and the 4th dielectric-filled waveguide and is not cut off.
First medium is filled waveguide, second medium is filled waveguide, one end of the 3rd dielectric-filled waveguide and the 4th dielectric-filled waveguide is all towards the short circuit face direction of the narrow Cross-section Waveguide Using of horn antenna, its other end is all on the antenna opening diametric plane, and first medium is filled waveguide, second medium is filled waveguide, the 3rd dielectric-filled waveguide is the same at the width of antenna opening diametric plane upper port with the 4th dielectric-filled waveguide, and first medium is filled waveguide, second medium is filled waveguide, the 3rd dielectric-filled waveguide and the 4th dielectric-filled waveguide all equal the wave impedance of free space in the wave impedance of antenna opening diametric plane upper port.。
Position in the selection left side metallization arrays of vias in head end straightway or the polygon on the left side dielectric-filled waveguide arrives on the bore face of antenna so that fill the two-way electromagnetic wave constant amplitude of transmitting in waveguide and the second medium filling waveguide by first medium.
Select the on the right position in the dielectric-filled waveguide of head end straightway in the right metallization arrays of vias or polygon, so that arrive on the bore face of antenna by the two-way electromagnetic wave constant amplitude of transmitting in the 3rd dielectric-filled waveguide and the 4th dielectric-filled waveguide.
In the metallization via hole loudspeaker sidewall, the spacing of two adjacent metallization via holes is less than or equals 1/10th of operation wavelength, so that the metallization via hole loudspeaker sidewall that consists of can equivalence be electric wall; The spacing of two adjacent metallization via holes will be equal to or less than 1/10th of operation wavelength, so that the intermediate metallization arrays of vias that consists of, left side metallization arrays of vias and the right metallization arrays of vias can equivalence be electric wall.
In dielectric-filled waveguide, the wave impedance of electromagnetic wave master mould (TE10 mould) is relevant with the width of dielectric-filled waveguide, and the width of dielectric-filled waveguide is wider, and the wave impedance of main mould is just lower; Otherwise the width of dielectric-filled waveguide is narrower, and the wave impedance of main mould is just higher.Enter into the substrate integration wave-guide horn antenna from the electromagnetic wave signal of encapsulation internal circuit from an end of the metallization vertical vias feeder line input/output port by antenna, after propagating a segment distance to the bore face direction of antenna, metallization arrays of vias in the middle of running into, two dielectric-filled waveguides transmission about the two-way that just minute success rate is equal enters respectively.About two dielectric-filled waveguide full symmetrics, take the dielectric-filled waveguide on the left side as the example explanation.Enter when electromagnetic wave after the dielectric-filled waveguide transmission on the left side behind the segment distance, will run into the arrays of vias that metallizes, be divided into again two-way and transmit to the bore face by dielectric-filled waveguide; The dielectric-filled waveguide of adjusting the left side is somebody's turn to do the position of polygon vertex in the position of metallization arrays of vias head end and the arrays of vias that metallizes, can change the relative power of this two-way electromagnetic transmission, and then adjust the relative amplitude of electromagnetic wave on the antenna opening diametric plane by two dielectric-filled waveguide transmission; If the port width of these two dielectric-filled waveguides on the antenna opening diametric plane equates, be adjusted at the head end of metallization arrays of vias in the left side in the dielectric-filled waveguide of the left side and the position of polygon vertex, can be so that pass through the electromagnetic bore face that arrives antenna with power of two dielectric-filled waveguides transmission; Transmission also is same situation in the electromagnetic wave dielectric-filled waveguide on the right.Just can be controlled in the above described manner the power on amplitude distribution of magnetic wave of antenna opening diametric plane, if remaining on the port width of four dielectric-filled waveguides on the antenna opening diametric plane equates, and the position of the head end of adjustment metallization arrays of vias and polygon vertex is so that electromagnetic with power arrival antenna opening diametric plane by these four dielectric-filled waveguides transmission, just can so that the field intensity amplitude distribution on the antenna opening diametric plane is even, so just can improve the aperture efficiency of antenna and the purpose of gain.And since on the antenna opening diametric plane wave impedance in these four dielectric-filled waveguides all equal the wave impedance of free space, namely the port width a of dielectric-filled waveguide satisfies condition
Namely port width a equals free space wavelength λ except subtracting 1 subduplicate twice in medium relative dielectric constant ε, so the reflection of antenna opening diametric plane is just little.
Beneficial effect: the beneficial effect of the three-dimension packaging skin antenna of amplitude impedance calibration of the present invention is, improved the antenna opening diametric plane power on magnetic wave amplitude consistency, simultaneously again so that on the bore face the electromagnetic wave impedance of antenna equal the wave impedance of free space, thereby improved the gain of antenna and reduced the return loss of antenna.
Description of drawings
Fig. 1 is the three-dimension packaging overall structure schematic diagram of the three-dimension packaging skin antenna of amplitude impedance calibration.
Fig. 2 is the three-dimension packaging skin antenna Facad structure schematic diagram of amplitude impedance calibration.
Fig. 3 is the three-dimension packaging skin antenna reverse side structural representation of amplitude impedance calibration.
Have among the figure: metallization vertical vias feeder line 1, substrate integration wave-guide horn antenna 2, embedded metal via hole 3, medium substrate 4, three-dimension packaging 5, bottom surface metal flat 6, bottom surface metal flat circular hole 7, internal circuit 8, end face metal flat 9, metallization vertical vias feeder line top circular pad 10, metallization via hole loudspeaker sidewall 11, the bore face 12 of antenna, the narrow Cross-section Waveguide Using 13 of antenna, the tubaeform waveguide 14 of antenna, the wide Cross-section Waveguide Using 15 of antenna, the short circuit face of narrow Cross-section Waveguide Using 16, intermediate metallization arrays of vias 17, left side metallization arrays of vias 18, the right metallization arrays of vias 19, left side dielectric-filled waveguide 20, the right dielectric-filled waveguide 21, first medium is filled waveguide 22, second medium is filled waveguide 23, the 3rd dielectric-filled waveguide 24 and the 4th dielectric-filled waveguide 25.
Embodiment
The invention will be further described below in conjunction with drawings and Examples.
Embodiment of the present invention is: the three-dimension packaging skin antenna of amplitude impedance calibration is comprised of metallization vertical vias feeder line 1, substrate integration wave-guide horn antenna 2 and embedded metal via hole 3 three parts, this three part all is integrated on the same medium substrate 4, and medium substrate 4 is in the top of three-dimension packaging 5; The metallization vertical vias feeder line 1 vertical medium substrate 4 that connects, the circular hole 7 that one end of metallization vertical vias feeder line 1 passes on the medium substrate 4 bottom surface metal flats 6 links to each other with the internal circuit 8 of three-dimension packaging 5, it is the input/output port of antenna, there is individual circular pad 10 on the top of the other end of metallization vertical vias feeder line 1, circular pad 10 is at the center of circular hole of the end face metal flat 9 of medium substrate 4, and the vertical vias feeder line top circular pad 10 that therefore metallizes does not directly electrically contact with the end face metal flat 9 of medium substrate; Substrate integration wave-guide horn antenna 2 is comprised of bottom surface metal flat 7, end face metal flat 9 and metallization via hole loudspeaker sidewall 11, bottom surface metal flat 7 and end face metal flat 9 lay respectively at the two sides of medium substrate 4, and metallization via sidewall 11 connects bottom surface metal flat 7 and end face metal flat 9; The bore face 12 of horn antenna 2 from the input/output port of antenna to antenna is divided into narrow Cross-section Waveguide Using 13, tubaeform waveguide 14 and wide Cross-section Waveguide Using 15 3 parts; One end of narrow Cross-section Waveguide Using 13 is metallized the short circuit face 16 that via sidewall 11 short circuits consist of narrow Cross-section Waveguide Using, and the other end and tubaeform waveguide 14 are joined, and metallization vertical vias feeder line 1 is on the center line of narrow Cross-section Waveguide Using 13 broadsides; Metallization via hole 3 embedded in substrate integration wave-guide horn antenna 2 connects bottom surface metal flat 7 and end face metal flat 9, and these embedded metallization via holes 3 consist of intermediate metallization arrays of vias 17, left side metallization arrays of vias 18 and the right metallization arrays of vias 19; Middle metallization arrays of vias 17 is positioned at the position in the middle of the horn antenna two side 11, and in the both sides of the metallization arrays of vias 17 of centre, symmetrical have left side dielectric-filled waveguide 20 and a right dielectric-filled waveguide 21; Intermediate metallization arrays of vias 17 shapes are one section straightways, and the head end of intermediate metallization arrays of vias 17 is towards the direction of the short circuit face 16 of the narrow Cross-section Waveguide Using of horn antenna, and the tail end of intermediate metallization arrays of vias 17 reaches the bore face 12 of horn antenna; Metallization arrays of vias 18 in the left side is arranged in the dielectric-filled waveguide 20 on horn antenna 2 left sides, left side dielectric-filled waveguide 20 is divided into first medium fills waveguide 22 and second medium filling waveguide 23; In the dielectric-filled waveguide 21 of horn antenna the right, a metallization arrays of vias 19 is arranged, the right dielectric-filled waveguide 21 is divided into the 3rd dielectric-filled waveguide 24 and the 4th dielectric-filled waveguide 25; Left side metallization arrays of vias 18 and the right metallization arrays of vias 19 shapes all are that a paragraph header end straightway connects polygon and connects one section tail end straightway again, the head end of left side metallization arrays of vias 18 and the right metallization arrays of vias 19 all towards the tail end of direction, left side metallization arrays of vias 18 and the right metallization arrays of vias 19 of the short circuit face 16 of the narrow Cross-section Waveguide Using of horn antenna 2 on the bore face 12 of horn antenna 2; Intermediate metallization arrays of vias 17, left side metallization arrays of vias 18 and the right metallization arrays of vias 19 are at the dielectric-filled waveguide of four of the middle formation of antenna 2, be that first medium is filled waveguide 22, second medium is filled waveguide 23, the 3rd dielectric-filled waveguide 24 and the 4th dielectric-filled waveguide 25, and first medium is filled waveguide 22 on the antenna opening diametric plane, second medium is filled waveguide 23, the port width of the 3rd dielectric-filled waveguide 24 and the 4th dielectric-filled waveguide 25 is so that these dielectric-filled waveguides all equal the wave impedance of free space in the wave impedance of antenna opening diametric plane 12.
In dielectric-filled waveguide, the wave impedance of the propagation of electromagnetic wave master mould (TE10 mould) is relevant with the width of dielectric-filled waveguide, and the width of dielectric-filled waveguide is wider, and the wave impedance of main mould is just lower; Otherwise the dielectric-filled waveguide width is narrower, and the wave impedance of main mould is just higher.Enter into substrate integration wave-guide horn antenna 2 from the electromagnetic wave signal of internal circuit 8 from an end of metallization vertical vias feeder line 1 input/output port by antenna, after propagating a segment distance, run into intermediate metallization arrays of vias 17, because symmetry, the electromagnetic wave two-way that just minute success rate is equal enters respectively left side dielectric-filled waveguide 20 and 21 transmission of the right dielectric-filled waveguide.Left side dielectric-filled waveguide 20 and the right dielectric-filled waveguide 21 full symmetrics, take the dielectric-filled waveguide 20 on the left side as the example explanation, when electromagnetic wave enters after left side dielectric-filled waveguide 20 transmission behind the segment distance, to run into left side metallization arrays of vias 18, be divided into again two-way and fill waveguide 23 to the direction transmission of antenna opening diametric plane 12 by first medium filling waveguide 22 and second medium respectively, adjust the position of polygon vertex in the position of the head end of metallization arrays of vias 18 in the left side dielectric-filled waveguide 20 and the arrays of vias 18 that metallizes, can adjust the electromagnetic relative power of filling transmission in waveguide 22 and the second medium filling waveguide 23 by first medium, and then adjust by first medium filling waveguide 22 and second medium and fill the relative amplitude of electromagnetic wave on bore face 12 that waveguide 23 is transmitted; If the port width of first medium filling waveguide 22 and second medium filling waveguide 23 equates on antenna opening diametric plane 12, be adjusted at the head end of metallization arrays of vias 18 in the left side in the left side dielectric-filled waveguide 20 and the position of polygon vertex, can be so that electromagnetic wave fills waveguide 22 by first medium and second medium is filled the bore face 12 that is transferred to antenna that waveguide 23 power equate, the field intensity amplitude distribution of filling on waveguide 23 ports at the filling of the first medium on the antenna opening diametric plane 12 waveguide 22 and second medium like this is the same; Electromagnetic wave on the right in the dielectric-filled waveguide 21 transmission also be same situation.Just can be controlled in the above described manner the electromagnetic amplitude distribution on the antenna opening diametric plane 12, if remain on first medium filling waveguide 22 on the antenna opening diametric plane 12, second medium is filled waveguide 23, the port width of the 3rd dielectric-filled waveguide 24 and the 4th dielectric-filled waveguide 25 all equates, and the position of the head end of left side metallization arrays of vias 18 and the right metallization arrays of vias 19 and polygon vertex is so that fill waveguide 22 by first medium, second medium is filled waveguide 23, the 3rd dielectric-filled waveguide 24 and 25 transmission of the 4th dielectric-filled waveguide are electromagnetic with power arrival antenna opening diametric plane 12, just can be so that first medium be filled waveguide 22 on antenna opening diametric plane 12, second medium is filled waveguide 23, field intensity amplitude distribution on four ports of the 3rd dielectric-filled waveguide 24 and the 4th dielectric-filled waveguide 25 is even, so just reaches the purpose that improves antenna aperture efficient and gain.In like manner also can realize specific field intensity amplitude distribution at the bore face 12 of antenna as required.And because the wave impedance of first medium filling waveguide 22 on antenna opening diametric plane 12, second medium filling waveguide 23, the 3rd dielectric-filled waveguide 24 and the 4th dielectric-filled waveguide 25 middle ports all equals the wave impedance of free space, i.e. the port width a that first medium filling waveguide 22, second medium are filled waveguide 23, the 3rd dielectric-filled waveguide 24 and the 4th dielectric-filled waveguide 25 satisfies condition
Namely port width a equals free space wavelength λ except subtracting 1 subduplicate twice in medium relative dielectric constant ε, so the reflection of antenna opening diametric plane is just little.
On technique, the three-dimension packaging skin antenna of amplitude impedance calibration both can adopt the three-dimensional resinous packaging technology, also can adopt LTCC (LTCC) technique to realize.Via hole 3 and the metallization via sidewall 11 of wherein metallizing can be that the hollow metal through hole also can be the solid metal hole, also can be continuous metallization wall, and the shape of metal throuth hole can be circular, also can be square or other shapes.
Structurally, equate condition owing to will satisfy wave impedance, the port width of dielectric-filled waveguide is certain, thereby the width of antenna opening diametric plane 12 just can not Set arbitrarily, because keep dielectric-filled waveguide to equal the wave impedance of free space in the wave impedance of port, the dielectric constant of medium substrate 4 is certain, and then the port width of dielectric-filled waveguide is also certain, therefore the dielectric-filled waveguide quantity at antenna opening diametric plane place doubles, and bore face 12 width of antenna also will double.According to same thinking, can add four strip metal arrays of vias fills first medium filling waveguide 22, second medium waveguide 23, the 3rd dielectric-filled waveguide 24 and the 4th dielectric-filled waveguide 25 and is divided into eight dielectric-filled waveguides again, and so that arrive the wave impedance that the same and port wave impedance of electromagnetic wave power on antenna opening diametric planes 12 all equals free space by these eight dielectric-filled waveguides, so not only the reflection of antenna is little, and the amplitude distribution on the while bore face 12 is more even, but the overall width of antenna opening diametric plane 12 will double.Polygon in antenna left side metallization arrays of vias 18 and the right metallization arrays of vias 19 can be triangle, quadrangle, pentagon or other polygon, and the shape on these polygonal limits or many limits can be straight line, camber line or other curve; Head end straightway in the metallization arrays of vias 18 and 19 and the shape of tail end straightway can be straight line, broken line, exponential line etc.
According to the above, just can realize the present invention.
Claims (10)
1. the three-dimension packaging skin antenna of an amplitude impedance calibration, it is characterized in that this antenna comprises metallization vertical vias feeder line (1), substrate integration wave-guide horn antenna (2) and the embedded metal via hole (3) that is arranged on the medium substrate (4), medium substrate (4) is in the top of three-dimension packaging (5); Described metallization vertical vias feeder line (1) links to each other with the internal circuit (8) of three-dimension packaging (5); Substrate integration wave-guide horn antenna (2) is comprised of the bottom surface metal flat (6) that is positioned at medium substrate (4) one side, the metallization via hole loudspeaker sidewalls (11) that are positioned at the end face metal flat (9) of medium substrate (4) another side and are connected medium substrate (4) connection bottom surface metal flat (6) end face metal flat (9); Metallization via hole (3) embedded in the substrate integration wave-guide horn antenna (2) connects bottom surface metal flat (6) and end face metal flat (9), and consists of intermediate metallization arrays of vias (17), left side metallization arrays of vias (18) and the right metallization arrays of vias (19); In horn antenna (2), there is first medium to fill waveguide (22), second medium filling waveguide (23), the 3rd dielectric-filled waveguide (24) and the 4th dielectric-filled waveguide (25).
2. the three-dimension packaging skin antenna of a kind of amplitude impedance calibration according to claim 1, it is characterized in that the circular hole (7) that an end of described metallization vertical vias feeder line (1) passes on medium substrate (4) the bottom surface metal flat (6) links to each other with the internal circuit (8) of three-dimension packaging (5), there is individual circular pad (10) on its other end top, metallization vertical vias feeder line top circular pad 10 is at the center of circular hole of the end face metal flat (9) of medium substrate (4), and the vertical vias feeder line top circular pad (10) that therefore metallizes does not directly electrically contact with the end face metal flat (9) of medium substrate (4).
3. the three-dimension packaging skin antenna of a kind of amplitude impedance calibration according to claim 1 is characterized in that described substrate integration wave-guide horn antenna (2) is made of narrow Cross-section Waveguide Using (13), tubaeform waveguide (14) and wide Cross-section Waveguide Using (15) serial connection; One end of narrow Cross-section Waveguide Using (13) is short circuit face (16), the other end of narrow Cross-section Waveguide Using (13) links to each other with tubaeform waveguide (14), one end of tubaeform waveguide (14) links to each other with narrow Cross-section Waveguide Using (13), the other end of tubaeform waveguide (14) links to each other with wide Cross-section Waveguide Using (15), and the other end of wide Cross-section Waveguide Using (15) is antenna opening diametric plane (12).
4. the three-dimension packaging skin antenna of a kind of amplitude impedance calibration according to claim 1, it is characterized in that described intermediate metallization arrays of vias (17) shape is one section straight line, intermediate metallization arrays of vias (17) is positioned at the middle position of two sidewalls (11) of substrate integration wave-guide horn antenna (2), and substrate integration wave-guide horn antenna (2) is divided into symmetrical two parts, in the both sides of the metallization arrays of vias (17) of centre, symmetrical have left side dielectric-filled waveguide (20) and a right dielectric-filled waveguide (21).
5. the three-dimension packaging skin antenna of a kind of amplitude impedance calibration according to claim 4, it is characterized in that described left side metallization arrays of vias (18) is divided into first medium to left side dielectric-filled waveguide (20) and fills waveguide (22) and second medium filling waveguide (23), the right metallization arrays of vias (19) is divided into the 3rd dielectric-filled waveguide (24) and the 4th dielectric-filled waveguide (25) to the dielectric-filled waveguide on the right (21).
6. according to claim 1 or the three-dimension packaging skin antenna of 4 or 5 described a kind of amplitude impedance calibrations, it is characterized in that described left side metallization arrays of vias (18) and the right arrays of vias (19) shape that metallizes all is to be linked to each other with three sections of tail end straightways by head end straightway, polygon to consist of; The shape of the straightway in intermediate metallization arrays of vias (17), left side metallization arrays of vias (18) and the right metallization arrays of vias (19) can be straight line, broken line or exponential line etc., and its length can be zero or finite length; Polygon in left side metallization arrays of vias (18) and the right metallization arrays of vias (19) can be triangle, quadrangle, pentagon or other polygon, and the shape on a polygonal limit or many limits can be straight line, camber line or other curve; All towards short circuit face (16) direction of the narrow Cross-section Waveguide Using of horn antenna, the tail end of intermediate metallization arrays of vias (17), left side metallization arrays of vias (18) and the right metallization arrays of vias (19) is on antenna opening diametric plane (12) for the head end of intermediate metallization arrays of vias (17), left side metallization arrays of vias (18) and the right metallization arrays of vias (19).
7. according to claim 1 or the three-dimension packaging skin antenna of 4 described a kind of amplitude impedance calibrations, it is characterized in that described left side dielectric-filled waveguide (20), the right dielectric-filled waveguide (21), first medium is filled waveguide (22), second medium is filled waveguide (23), the width of the 3rd dielectric-filled waveguide (24) and the 4th dielectric-filled waveguide (25) will guarantee that all its main mould can left side dielectric-filled waveguide (20), the right dielectric-filled waveguide (21), first medium is filled waveguide (22), second medium is filled waveguide (23), transmission and not being cut off in the 3rd dielectric-filled waveguide (24) and the 4th dielectric-filled waveguide (25).
8. the three-dimension packaging skin antenna of a kind of amplitude impedance calibration according to claim 7, it is characterized in that described first medium filling waveguide (22), second medium is filled waveguide (23), one end of the 3rd dielectric-filled waveguide (24) and the 4th dielectric-filled waveguide (25) is all towards short circuit face (16) direction of the narrow Cross-section Waveguide Using of horn antenna, its other end is all on antenna opening diametric plane (12), and first medium is filled waveguide (22), second medium is filled waveguide (23), the 3rd dielectric-filled waveguide (24) is the same at the width of antenna opening diametric plane (12) upper port with the 4th dielectric-filled waveguide (25), and first medium is filled waveguide (22), second medium is filled waveguide (23), the 3rd dielectric-filled waveguide (24) and the 4th dielectric-filled waveguide (25) all equal the wave impedance of free space in the wave impedance of antenna opening diametric plane (12) upper port.
9. the three-dimension packaging skin antenna of a kind of amplitude impedance calibration according to claim 6, it is characterized in that selecting the position in head end straightway in the left side metallization arrays of vias (18) or the polygon on the left side dielectric-filled waveguide (20), fill on the bore face (12) of two-way electromagnetic wave constant amplitude arrival antenna of transmission in the waveguide (23) so that fill waveguide (22) and second medium by first medium.
10. the three-dimension packaging skin antenna of a kind of amplitude impedance calibration according to claim 6, it is characterized in that selecting the on the right position in the dielectric-filled waveguide (21) of head end straightway in the right metallization arrays of vias (19) or polygon, so that on the bore face (12) of the two-way electromagnetic wave constant amplitude arrival antenna by transmission in the 3rd dielectric-filled waveguide (24) and the 4th dielectric-filled waveguide (25).
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| CN201210564034.4A CN103022713B (en) | 2012-12-21 | 2012-12-21 | Amplitude impedance calibrated three-dimensional package surface antenna |
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| CN201210564034.4A CN103022713B (en) | 2012-12-21 | 2012-12-21 | Amplitude impedance calibrated three-dimensional package surface antenna |
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