CN103022674B - Phase- and amplitude-calibrated 3D-package surface antenna with embedded plated through holes - Google Patents
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Abstract
The invention relates to a horn antenna, in particular to a phase- and amplitude-calibrated 3D-package surface antenna with embedded plated through holes. The antenna comprises a plated vertical through hole feeder (1), a horn antenna (2) and plated through holes (3), wherein the plated vertical through hole feeder (1), the horn antenna (2) and the plated through holes (3) are integrated on a dielectric substrate (4). The dielectric substrate (4) is arranged at the topmost of 3D package (5). One end of the plated vertical through hole feeder (1) is connected with an internal circuit (8). The horn antenna (2) comprises a bottom metal plane (6), a top metal plane (9) and plated through hole sidewalls (11). The plated through holes (3) form a middle plated through hole array (16), a left plated through hole array (17) and a right plated through hole array (18). Four dielectric loaded waveguides are formed in the horn antenna (2). One end of each dielectric loaded waveguide faces to an antenna narrow-section waveguide short surface (15), and the other end of each dielectric loaded waveguide is close to an antenna aperture surface (12). Gain of the phase- and amplitude-calibrated 3D-package surface antenna with embedded plated through holes can be increased.
Description
Technical field
The present invention relates to a kind of horn antenna, especially a kind of 3D-package surface antenna of embedded metal via hole phase amplitude calibration.
Background technology
Adopt Micro-package technique, a radio system can be integrated in an encapsulation, also need surface antenna being integrated in encapsulation for this reason.Be the very natural mode of one at the integrated paster antenna of package surface, but the main normal direction to being surface of the radiation of paster antenna, and the radiation that we need sometimes is main to being direction surfacewise.If the radiation along surface direction just can be realized at the integrated horn antenna of package surface.But usual horn antenna is nonplanar, with incompatible, the larger physical dimension that has of planar circuit technique, thus limit its application on encapsulating structure.In recent years, substrate integration wave-guide horn antenna based on substrate integrated waveguide technology development has the advantages that size is little, lightweight, be easy to Planar integration, but the gain of traditional substrate integration wave-guide horn antenna is relatively low, its reason is because horn mouth constantly opens, Electromagnetic Wave Propagation is caused to occur that phase place is asynchronous to during horn mouth diametric plane, the PHASE DISTRIBUTION of bore electric field strength is uneven, radiation directivity and gain reduction; On bore face, the amplitude of electromagnetic field is also very uneven in addition, narrowing toward each end broad in the middle, and this also affects the radiance of antenna.Existing method such as employing coated by dielectric, medium prism etc. at present, correct the asynchronous of horn mouth diametric plane phase place, but these methods all can not improve the inconsistent of horn antenna and free space wave impedance on bore face, the uniformity of electromagnetic field magnitude distribution on bore face can not be improved, and these phase alignment structures add the overall structure size of antenna, are not suitable for being integrated into package surface.
Summary of the invention
Technical problem: the object of the invention is the 3D-package surface antenna proposing a kind of embedded metal via hole phase amplitude calibration, it is inconsistent and improve the consistency of amplitude distribution on bore face in order to electromagnetic phase place on RECTIFYING ANTENNA bore face that this inner antenna is embedded with metallization arrays of vias, reduce the quantity of null field, bore face simultaneously, improve aperture efficiency and the gain of antenna.
Technical scheme: the 3D-package surface antenna of embedded metal via hole phase amplitude calibration of the present invention comprises the metallization vertical vias feeder line, substrate integration wave-guide horn antenna and the embedded metal via hole that are arranged on medium substrate, and medium substrate is in the top of three-dimension packaging; Described metallization vertical vias feeder line is connected with the internal circuit of three-dimension packaging; Substrate integration wave-guide horn antenna to be connected bottom-side metal planar top surface metal flat by the bottom-side metal plane being positioned at medium substrate one side, the topside metal plane that is positioned at medium substrate another side metallization via hole trumpet side walls with through medium substrate forms; Metallization via hole embedded in substrate integration wave-guide horn antenna connects bottom-side metal plane and topside metal plane, and forms intermediate metallization arrays of vias, left side metallization arrays of vias and the right metallization arrays of vias; In horn antenna, there is first medium to fill waveguide, second medium fills waveguide, the 3rd dielectric-filled waveguide and the 4th dielectric-filled waveguide, first medium fills waveguide, second medium fills waveguide, a port of the 3rd dielectric-filled waveguide and the 4th dielectric-filled waveguide all towards the direction, short circuit face of the narrow Cross-section Waveguide Using of antenna, the antenna opening diametric plane that its another port is all concordant and close.
One end of metallization vertical vias feeder line is connected with the internal circuit of three-dimension packaging through the circular hole in medium substrate bottom-side metal plane, there is individual circular pad on its other end top, metallization vertical vias feeder line top circular pad 10 is at the center of circular hole of the topside metal plane of medium substrate, and the topside metal plane of therefore metallize vertical vias feeder line top circular pad and medium substrate does not have direct electrical contact.
Substrate integration wave-guide horn antenna is connected in series by narrow Cross-section Waveguide Using and tubaeform waveguide and forms; One end of narrow Cross-section Waveguide Using is short circuit face, and the other end of narrow Cross-section Waveguide Using is connected with tubaeform waveguide, and one end of tubaeform waveguide is connected with narrow Cross-section Waveguide Using, and the other end of tubaeform waveguide is antenna opening diametric plane.
Intermediate metallization arrays of vias is positioned at the position in the middle of two sidewalls of substrate integration wave-guide horn antenna, and substrate integration wave-guide horn antenna is divided into symmetrical two parts, in the both sides of the metallization arrays of vias of centre, symmetrical has left side dielectric-filled waveguide and the right dielectric-filled waveguide.
Metallization arrays of vias in the left side is divided into first medium left side dielectric-filled waveguide and fills waveguide and second medium filling waveguide, and the right metallization arrays of vias is divided into the 3rd dielectric-filled waveguide and the 4th dielectric-filled waveguide the dielectric-filled waveguide on the right.
Intermediate metallization arrays of vias, left side metallization arrays of vias and the right metallization arrays of vias shape are all to be connected with tail end straightway three sections by head end straightway, polygon to form, the head end of intermediate metallization arrays of vias, left side metallization arrays of vias and the right metallization arrays of vias is all towards the direction, short circuit face of the narrow Cross-section Waveguide Using of horn antenna, the tail end of intermediate metallization arrays of vias, left side metallization arrays of vias and the right metallization arrays of vias stretches to antenna opening diametric plane, but less than on antenna opening diametric plane.
Head end straightway in intermediate metallization arrays of vias, left side metallization arrays of vias and the right metallization arrays of vias or the shape of tail end straightway can be straight line, broken line or exponential line etc., and its length can be zero or finite length; Polygon in intermediate metallization arrays of vias, left side metallization arrays of vias and the right metallization arrays of vias can be triangle, quadrangle, pentagon or other polygon, and the shape on a polygonal limit or many limits can be straight line, camber line or other curve.
Left side dielectric-filled waveguide, the right dielectric-filled waveguide, first medium fill waveguide, second medium fills waveguide, the width of the 3rd dielectric-filled waveguide and the 4th dielectric-filled waveguide all will ensure that its main mould can on the left side dielectric-filled waveguide, the right dielectric-filled waveguide, first medium fill waveguide, second medium fills transmission in waveguide, the 3rd dielectric-filled waveguide and the 4th dielectric-filled waveguide and be not cut off.
Select the position of polygon vertex in intermediate metallization arrays of vias and the position in head end straightway in selection left side metallization arrays of vias or polygon on the left side dielectric-filled waveguide, can make to fill the port of the two-way electromagnetic wave constant amplitude homophase arrival dielectric-filled waveguide transmitted in waveguide again to radiation on the bore face of antenna by first medium filling waveguide and second medium.
Selecting the position of polygon vertex in intermediate metallization arrays of vias and select the position on the right in dielectric-filled waveguide of head end straightway or polygon in the right metallization arrays of vias, the two-way electromagnetic wave constant amplitude homophase by transmitting in the 3rd dielectric-filled waveguide and the 4th dielectric-filled waveguide can being made to arrive the port of dielectric-filled waveguide again to radiation on the bore face of antenna.
In metallization via hole trumpet side walls, the spacing of two adjacent metallization via holes is less than or equals 1/10th of operation wavelength, makes the metallization via hole trumpet side walls formed can be equivalent to electric wall; The spacing of two adjacent metallization via holes will be equal to or less than 1/10th of operation wavelength, makes intermediate metallization arrays of vias, left side metallization arrays of vias and the right metallization arrays of vias formed can be equivalent to electric wall.
In dielectric-filled waveguide, the propagation phase velocity of the main mould of electromagnetic wave (TE10 mould) is relevant with the width of dielectric-filled waveguide, and the width of dielectric-filled waveguide is wider, and the propagation phase velocity of main mould is lower; Otherwise the width of dielectric-filled waveguide is narrower, the propagation phase velocity of main mould is higher.Electromagnetic wave signal from encapsulation internal circuit enters into substrate integration wave-guide horn antenna from one end of metallization vertical vias feeder line by the input/output port of antenna, after propagating a segment distance to the direction, bore face of antenna, run into middle metallization arrays of vias, the two-way that just point success rate is equal enters the dielectric-filled waveguide transmission of two, left and right respectively.Two the dielectric-filled waveguide full symmetrics in left and right, illustrate for the dielectric-filled waveguide on the left side.After electromagnetic wave enters the dielectric-filled waveguide transmission on the left side after a segment distance, the arrays of vias that metallizes will be run into, then be divided into two-way and transmitted to bore face by dielectric-filled waveguide; Adjust the position of polygon vertex in intermediate metallization arrays of vias, adjust the position of polygon vertex in the position of this metallization arrays of vias head end of dielectric-filled waveguide on the left side and metallization arrays of vias, can change relative phase velocity and the relative power of this two-way electromagnetic transmission, and then adjustment is by relative phase on antenna opening diametric plane of the electromagnetic wave of two dielectric-filled waveguides transmission and relative amplitude; If the port width of these two dielectric-filled waveguides near antenna opening diametric plane is equal, adjust the left side metallization head end of arrays of vias and the position of polygon vertex in the position of polygon vertex in intermediate metallization arrays of vias, adjustment on the left side dielectric-filled waveguide, can make by the electromagnetic power of two dielectric-filled waveguide transmission equal, also make this two-way electromagnetic wave homophase arrive the port of dielectric-filled waveguide and then arrive the bore face of antenna more simultaneously; Transmitting in electromagnetic wave dielectric-filled waveguide on the right is also same situation.Just can control electromagnetic amplitude and PHASE DISTRIBUTION near antenna opening diametric plane in the above described manner, if the port width remaining on four dielectric-filled waveguides near antenna opening diametric plane is equal, and the adjustment metallization head end of arrays of vias and the position of polygon vertex make arrived the port of dielectric-filled waveguide by these four electromagnetic same power homophases of dielectric-filled waveguide transmission and then arrived antenna opening diametric plane again, the field intensity phase place near antenna opening diametric plane just can be made all consistent with amplitude distribution, so just can improve the aperture efficiency of antenna and the object of gain.In addition due on bore face except trumpet side walls is null field, other region in bore face does not have null field, the field strength distribution in such bore face also relatively evenly.In like manner also can realize specific field intensity amplitude and PHASE DISTRIBUTION as required near the bore face of antenna.
Beneficial effect: the beneficial effect of the 3D-package surface antenna of embedded metal via hole phase amplitude calibration of the present invention is, the surface modification antenna opening diametric plane of three-dimension packaging power on magnetic wave phase place consistency, simultaneously make again antenna opening diametric plane power on magnetic wave amplitude distribution evenly, also avoid occurring more null field on antenna opening diametric plane, thus improve aperture efficiency and the gain of antenna.
Accompanying drawing explanation
Fig. 1 is the 3D-package surface antenna overall structure schematic diagram of embedded metal via hole phase amplitude calibration.
Fig. 2 is the 3D-package surface antenna Facad structure schematic diagram of embedded metal via hole phase amplitude calibration.
Fig. 3 is the 3D-package surface antenna inverse layer structure schematic diagram of embedded metal via hole phase amplitude calibration.
Have in figure: metallization vertical vias feeder line 1, substrate integration wave-guide horn antenna 2, embedded metal via hole 3, medium substrate 4, three-dimension packaging 5, bottom-side metal plane 6, bottom-side metal plane circular hole 7, internal circuit 8, topside metal plane 9, metallization vertical vias feeder line top circular pad 10, metallization via hole trumpet side walls 11, the bore face 12 of antenna, the narrow Cross-section Waveguide Using 13 of antenna, the tubaeform waveguide 14 of antenna, the short circuit face 15 of narrow Cross-section Waveguide Using, intermediate metallization arrays of vias 16, left side metallization arrays of vias 17, the right metallization arrays of vias 18, left side dielectric-filled waveguide 19, the right dielectric-filled waveguide 20, first medium fills waveguide 21, second medium fills waveguide 22, 3rd dielectric-filled waveguide 23, the port 25 of the 4th dielectric-filled waveguide 24 and dielectric-filled waveguide.
Embodiment
Below in conjunction with drawings and Examples, the invention will be further described.
Embodiment of the present invention is: the 3D-package surface antenna of embedded metal via hole phase amplitude calibration is made up of the vertical vias feeder line 1 that metallizes, substrate integration wave-guide horn antenna 2 and embedded metal via hole 3 three part, this three part is all integrated on same medium substrate 4, and medium substrate 4 is in the top of three-dimension packaging 5; The vertical through medium substrate 4 of metallization vertical vias feeder line 1, one end of metallization vertical vias feeder line 1 is connected with the internal circuit 8 of three-dimension packaging 5 through the circular hole 7 in medium substrate 4 bottom-side metal plane 6, it is the input/output port of antenna, there is individual circular pad 10 on the top of the other end of metallization vertical vias feeder line 6, circular pad 10 is at the center of circular hole of the topside metal plane 9 of medium substrate 4, and the vertical vias feeder line top circular pad 10 that therefore metallizes does not have direct electrical contact with the topside metal plane 9 of medium substrate; Substrate integration wave-guide horn antenna 2 is made up of bottom-side metal plane 6, topside metal plane 9 and metallization via hole trumpet side walls 11, bottom-side metal plane 6 and topside metal plane 9 lay respectively at the two sides of medium substrate 4, and metallization via sidewall 11 connects bottom-side metal plane 6 and topside metal plane 9; The bore face 12 of horn antenna 2 from the input/output port of antenna to antenna is divided into narrow Cross-section Waveguide Using 13 and tubaeform waveguide 14 two parts; One end of narrow Cross-section Waveguide Using 13 is metallized the short circuit face 15 that via sidewall 11 short circuit forms narrow Cross-section Waveguide Using, and the other end of narrow Cross-section Waveguide Using 13 connects with tubaeform waveguide 14, and metallization vertical vias feeder line 1 is on the center line of narrow Cross-section Waveguide Using 13 broadside; Metallization via hole 3 embedded in substrate integration wave-guide horn antenna 2 connects bottom-side metal plane 6 and topside metal plane 9, and these embedded metallization via holes 3 form intermediate metallization arrays of vias 16, left side metallization arrays of vias 17 and the right metallization arrays of vias 18; Middle metallization arrays of vias 16 is positioned at the position in the middle of horn antenna two side 12, and in the both sides of the metallization arrays of vias 16 of centre, symmetrical has left side dielectric-filled waveguide 19 and the right dielectric-filled waveguide 20; Intermediate metallization arrays of vias 16 shape is that a paragraph header end straightway connects polygon and connects one section of tail end straightway again, the head end of intermediate metallization arrays of vias 16 is towards the direction in the short circuit face 15 of the narrow Cross-section Waveguide Using of horn antenna, the tail end of intermediate metallization arrays of vias 16 stretches to the bore face 12 of horn antenna, but less than bore face 12; In the dielectric-filled waveguide 19 on horn antenna 2 left side, there is left side metallization arrays of vias 17, left side dielectric-filled waveguide 19 is divided into first medium and fills waveguide 21 and second medium filling waveguide 22; On the right of horn antenna in dielectric-filled waveguide 20, there is the right metallization arrays of vias 18, the right dielectric-filled waveguide 20 is divided into the 3rd dielectric-filled waveguide 23 and the 4th dielectric-filled waveguide 24; Left side metallization arrays of vias 17 and the right metallization arrays of vias 18 shape are all that a paragraph header end straightway connects polygon and connects one section of tail end straightway again, the head end of left side metallization arrays of vias 17 and the right metallization arrays of vias 18 all towards the direction in the short circuit face 15 of the narrow Cross-section Waveguide Using of horn antenna 2, the tail end of left side metallization arrays of vias 17 and the right metallization arrays of vias 18 stretches to the bore face 12 of horn antenna 2, but less than on bore face 12, null field bore face 12 occurring electric field can be avoided like this; Intermediate metallization arrays of vias 16, left side metallization arrays of vias 17 and the right metallization arrays of vias 18 form in substrate integration wave-guide horn antenna 2 that first medium fills waveguide 21, second medium fills waveguide 22, the 3rd dielectric-filled waveguide 23 and the 4th dielectric-filled waveguide 24, and first medium fills waveguide 21, second medium does not fill waveguide 22, the 3rd dielectric-filled waveguide 23 and the 4th dielectric-filled waveguide 24 near port 25 width equal of antenna opening diametric plane 12 or not etc.
In dielectric-filled waveguide, the phase velocity of the propagation of the main mould of electromagnetic wave (TE10 mould) is relevant with the width of dielectric-filled waveguide, and the width of dielectric-filled waveguide is wider, and the transmission phase velocity of main mould is lower; Otherwise dielectric-filled waveguide width is narrower, the transmission phase velocity of main mould is higher.Electromagnetic wave signal from internal circuit 8 enters into substrate integration wave-guide horn antenna 2 from one end of metallization vertical vias feeder line 1 by the input/output port of antenna, after propagating a segment distance, run into intermediate metallization arrays of vias 16, due to symmetry, the electromagnetic wave two-way that just point success rate is equal enters left side dielectric-filled waveguide 19 respectively and the right dielectric-filled waveguide 20 transmits.Left side dielectric-filled waveguide 19 and the right dielectric-filled waveguide 20 full symmetric, for dielectric-filled waveguide 19 explanation on the left side, when electromagnetic wave enter left side dielectric-filled waveguide 19 transmit after after a segment distance, left side metallization arrays of vias 17 will be run into, be divided into two-way again to transmit to the direction of antenna opening diametric plane 12 respectively by first medium filling waveguide 21 and second medium filling waveguide 22, the position of polygon vertex in adjustment intermediate metallization arrays of vias 16, the position of polygon vertex in the position of the head end of left side metallization arrays of vias 17 and left side metallization arrays of vias 17 in adjustment left side dielectric-filled waveguide 19, electromagnetic relative phase velocity and the relative power of being filled transmission in waveguide 22 by first medium filling waveguide 21 and second medium can be adjusted, and then adjustment is filled waveguide 21 and second medium by first medium and is filled relative phase on bore face 12 of electromagnetic wave that waveguide 22 transmits and relative amplitude, if the width that first medium fills waveguide 21 and the port 25 of second medium filling waveguide 22 near antenna opening diametric plane 12 is equal, the left side metallization head end of arrays of vias 17 and the position of polygon vertex in adjustment on the left side dielectric-filled waveguide 19, the electromagnetic power of being filled waveguide 21 and second medium filling waveguide 22 transmission by first medium can be made equal, and make this two-way electromagnetic wave homophase arrive the port 25 of dielectric-filled waveguide and then arrive the bore face 12 of antenna again, it is all the same with phase place with the field intensity amplitude distribution of second medium filling waveguide 22 port 25 that first medium like this near antenna opening diametric plane 12 fills waveguide 21, it is also same situation that electromagnetic wave transmits in dielectric-filled waveguide 20 on the right.Just can control the electromagnetic amplitude near antenna opening diametric plane 12 and PHASE DISTRIBUTION in the above described manner, if the first medium remained near antenna opening diametric plane 12 fills waveguide 21, second medium fills waveguide 22, the width of the port 25 of the 3rd dielectric-filled waveguide 23 and the 4th dielectric-filled waveguide 24 is all equal, and adjust intermediate metallization arrays of vias 16, the left side metallization arrays of vias 17 and the right metallization the head end of arrays of vias 18 and the position of polygon vertex make by first medium fill waveguide 21, second medium fills waveguide 22, 3rd dielectric-filled waveguide 23 and the 4th dielectric-filled waveguide 24 transmit the port 25 that electromagnetic same power homophase arrives these dielectric-filled waveguides and arrive antenna opening diametric plane 12 again, first medium near antenna opening diametric plane 12 just can be made to fill waveguide 21, second medium fills waveguide 22, 3rd dielectric-filled waveguide 23 is all consistent with amplitude distribution with the field intensity phase place of four ports 25 of the 4th dielectric-filled waveguide 24, so just reach the object improving antenna aperture efficiency and gain.In addition due on antenna opening diametric plane 12 except trumpet side walls 11 is except null field, other region on antenna opening diametric plane 12 does not have null field, the field strength distribution in such bore face 12 also relatively evenly.In like manner also can realize specific field intensity amplitude and PHASE DISTRIBUTION as required on the bore face 12 of antenna.
In technique, the 3D-package surface antenna of embedded metal via hole phase amplitude calibration both can adopt three-dimensional resinous packaging technology, and LTCC (LTCC) technique also can be adopted to realize.The via hole 3 that wherein metallizes can be hollow metal through hole with metallization via sidewall 11 also can be solid metal hole, and also can be continuous print metallization wall, the shape of metal throuth hole can be circular, also can be square or other shapes.
Structurally, according to same principle, four strip metal arrays of vias can be added again four dielectric-filled waveguides are divided into eight dielectric-filled waveguides, and make the port arriving dielectric-filled waveguide with same magnitude by these eight dielectric-filled waveguide electromagnetic waves arrive antenna opening diametric plane 12 again, the amplitude distribution while of such on antenna opening diametric plane 12 is more even, and the quantity of the dielectric-filled waveguide increased on antenna opening diametric plane 12 might not require the width increasing antenna opening diametric plane 12 simultaneously, as long as it is just passable to ensure that dielectric-filled waveguide can transmit main mould.Due to the metallization via sidewall 11 the closer to antenna, the distance that electromagnetic wave arrives antenna opening diametric plane 12 is far away, therefore relative to from the dielectric-filled waveguide away from metallization via sidewall 11, from the width relative narrower of dielectric-filled waveguide close to metallization via sidewall 11 to obtain higher electromagnetic transmission phase velocity.Polygon in antenna intermediate metallization arrays of vias 16, left side metallization arrays of vias 17 and the right metallization arrays of vias 18 can be triangle, quadrangle, pentagon or other polygon, and the shape on these polygonal limits or many limits can be straight line, camber line or other curve; Head end straightway in intermediate metallization arrays of vias 16, left side metallization arrays of vias 17 and the right metallization arrays of vias 18 and the shape of tail end straightway can be straight line, broken line, exponential line or other curve.
According to the above, just the present invention can be realized.
Claims (6)
1. the 3D-package surface antenna of an embedded metal via hole phase amplitude calibration, it is characterized in that this antenna comprises the metallization vertical vias feeder line (1) be arranged on medium substrate (4), substrate integration wave-guide horn antenna (2) and embedded metal via hole (3), medium substrate (4) is in the top of three-dimension packaging (5); Described metallization vertical vias feeder line (1) is connected with the internal circuit (8) of three-dimension packaging (5); Substrate integration wave-guide horn antenna (2) to be connected bottom-side metal plane (6) topside metal plane (9) by the bottom-side metal plane (6) being positioned at medium substrate (4) one side, the topside metal plane (9) that is positioned at medium substrate (4) another side metallization via hole trumpet side walls (11) with through medium substrate (4) forms; In substrate integration wave-guide horn antenna (2), embedded metal via hole (3) connects bottom-side metal plane (6) and topside metal plane (9), and forms intermediate metallization arrays of vias (16), left side metallization arrays of vias (17) and the right metallization arrays of vias (18); Intermediate metallization arrays of vias (16) is positioned at the position in the middle of two sidewalls (11) of substrate integration wave-guide horn antenna (2), and substrate integration wave-guide horn antenna (2) is divided into symmetrical left side dielectric-filled waveguide (19) and the right dielectric-filled waveguide (20); Left side metallization arrays of vias (17) is divided into first medium left side dielectric-filled waveguide (19) and fills waveguide (21) and second medium filling waveguide (22), and the right metallization arrays of vias (18) is divided into the 3rd dielectric-filled waveguide (23) and the 4th dielectric-filled waveguide (24) the dielectric-filled waveguide on the right (20); First medium fills waveguide (21), second medium fills waveguide (22), a port of the 3rd dielectric-filled waveguide (23) and the 4th dielectric-filled waveguide (24) all towards short circuit face (15) direction of the narrow Cross-section Waveguide Using of antenna (13), the antenna opening diametric plane (12) that its another port (25) are all concordant and close;
Described intermediate metallization arrays of vias (16), left side metallization arrays of vias (17) and the right metallization arrays of vias (18) shape are all by head end straightway, polygon and tail end straightway three sections are connected formation successively, intermediate metallization arrays of vias (16), the head end on left side metallization arrays of vias (17) and the right metallization arrays of vias (18) is all towards short circuit face (15) direction of the narrow Cross-section Waveguide Using of horn antenna, intermediate metallization arrays of vias (16), the tail end on left side metallization arrays of vias (17) and the right metallization arrays of vias (18) stretches to antenna opening diametric plane (12), but less than on antenna opening diametric plane (12),
Select the position of polygon vertex in intermediate metallization arrays of vias (16) and select the position in head end straightway in left side metallization arrays of vias (17) or polygon on the left side dielectric-filled waveguide (19), can make to fill by first medium bore face (12) the above radiation that port (25) that two-way electromagnetic wave constant amplitude homophase that waveguide (21) and second medium fill transmission in waveguide (22) arrives dielectric-filled waveguide arrives antenna again;
Select the position of polygon vertex in intermediate metallization arrays of vias (16) and select the position on the right in dielectric-filled waveguide (20) of head end straightway or polygon in the right metallization arrays of vias (18), the port (25) arriving dielectric-filled waveguide by the two-way electromagnetic wave constant amplitude homophase of transmission in the 3rd dielectric-filled waveguide (23) and the 4th dielectric-filled waveguide (24) can be made to arrive bore face (12) the above radiation of antenna again.
2. the 3D-package surface antenna of a kind of embedded metal via hole phase amplitude calibration according to claim 1, it is characterized in that one end of described metallization vertical vias feeder line (1) is connected with the internal circuit (8) of three-dimension packaging (5) through the circular hole (7) in medium substrate (4) bottom-side metal plane (6), there is individual circular pad (10) on its other end top, metallization vertical vias feeder line top circular pad (10) is at the center of circular hole of the topside metal plane (9) of medium substrate (4), therefore metallization vertical vias feeder line top circular pad (10) does not have direct electrical contact with the topside metal plane (9) of medium substrate (4).
3. the 3D-package surface antenna of a kind of embedded metal via hole phase amplitude calibration according to claim 1, is characterized in that described substrate integration wave-guide horn antenna (2) is connected in series by narrow Cross-section Waveguide Using (13) and tubaeform waveguide (14) and forms; One end of narrow Cross-section Waveguide Using (13) is short circuit face (15), the other end of narrow Cross-section Waveguide Using (13) is connected with tubaeform waveguide (14), one end of tubaeform waveguide (14) is connected with narrow Cross-section Waveguide Using (13), and the other end of tubaeform waveguide (14) is antenna opening diametric plane (12).
4. the 3D-package surface antenna of a kind of embedded metal via hole phase amplitude calibration according to claim 1, it is characterized in that the metallize shape of head end straightway in arrays of vias (18) or tail end straightway of described intermediate metallization arrays of vias (16), left side metallization arrays of vias (17) and the right is straight line or broken line or exponential line, its length is zero or finite length; Intermediate metallization arrays of vias (16), left side metallization arrays of vias (17) and the right polygon metallized in arrays of vias (18) are triangle or quadrangle or pentagon or other polygon, and the shape on a polygonal limit or many limits is straight line or camber line or other curve.
5. the 3D-package surface antenna of a kind of embedded metal via hole phase amplitude calibration according to claim 1, it is characterized in that described left side dielectric-filled waveguide (19), the right dielectric-filled waveguide (20), first medium fills waveguide (21), second medium fills waveguide (22), the width of the 3rd dielectric-filled waveguide (23) and the 4th dielectric-filled waveguide (24) all will ensure that its main mould can on the left side dielectric-filled waveguide (19), the right dielectric-filled waveguide (20), first medium fills waveguide (21), second medium fills waveguide (22), transmission in 3rd dielectric-filled waveguide (23) and the 4th dielectric-filled waveguide (24) and not being cut off.
6. the 3D-package surface antenna of embedded metal via hole phase amplitude calibration according to claim 1, it is characterized in that in metallization via hole trumpet side walls (11), the spacing of two adjacent metallization via holes is less than or equals 1/10th of operation wavelength, makes the metallization via hole trumpet side walls (11) formed can be equivalent to electric wall; The spacing of two adjacent embedded metal via holes (3) will be equal to or less than 1/10th of operation wavelength, makes the intermediate metallization arrays of vias (16) of formation, left side metallization arrays of vias (17) and the right metallization arrays of vias (18) can be equivalent to electric wall.
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| CN201210563484.1A CN103022674B (en) | 2012-12-21 | 2012-12-21 | Phase- and amplitude-calibrated 3D-package surface antenna with embedded plated through holes |
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| CN104733867A (en) * | 2015-03-30 | 2015-06-24 | 东南大学 | Three-dimensional package surface antenna with calibrated gap phase amplitude |
| CN104733847A (en) * | 2015-03-30 | 2015-06-24 | 东南大学 | Three-dimensional packaging surface antenna for gap embedded phase position calibration |
| CN104779445A (en) * | 2015-04-02 | 2015-07-15 | 南京邮电大学 | Three-dimensional packaging surface antenna with function of gap embedded phase amplitude calibration |
| CN106450782B (en) * | 2016-10-20 | 2019-07-12 | 加特兰微电子科技(上海)有限公司 | Radar component |
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| JP2002359516A (en) * | 2001-05-30 | 2002-12-13 | Kyocera Corp | Primary radiator and phase shifter, and beam scanning antenna |
| CN101179155A (en) * | 2007-11-12 | 2008-05-14 | 杭州电子科技大学 | H face sectoral horn antenna including filter function |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7808439B2 (en) * | 2007-09-07 | 2010-10-05 | University Of Tennessee Reserch Foundation | Substrate integrated waveguide antenna array |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002359516A (en) * | 2001-05-30 | 2002-12-13 | Kyocera Corp | Primary radiator and phase shifter, and beam scanning antenna |
| CN101179155A (en) * | 2007-11-12 | 2008-05-14 | 杭州电子科技大学 | H face sectoral horn antenna including filter function |
Non-Patent Citations (1)
| Title |
|---|
| Dielectric Loaded Substrate Integrated Waveguide(SIW) H-Plane Horn Antennas;Hao Wang, Da-Gang Fang, Bing Zhang, Wen-Quan Che;《IEEE Transactions on Antennas and Propagation》;20100331;第58卷(第3期);640-647 * |
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| CN103022674A (en) | 2013-04-03 |
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