CN103022668B - Packaged sandwich antenna with phase and impedance calibration functions - Google Patents
Packaged sandwich antenna with phase and impedance calibration functions Download PDFInfo
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- CN103022668B CN103022668B CN201210562981.XA CN201210562981A CN103022668B CN 103022668 B CN103022668 B CN 103022668B CN 201210562981 A CN201210562981 A CN 201210562981A CN 103022668 B CN103022668 B CN 103022668B
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Abstract
The invention discloses a packaged sandwich antenna with phase and impedance calibration functions, and relates to a horn antenna. The packaged sandwich antenna comprises a micro-strip feeder (1), a horn antenna (2) and metallized via holes (3) which are integrated on a dielectric substrate (4). The dielectric substrate (4) is positioned on an inner layer of a three-dimensional package (5), one end of the micro-strip feeder (1) is connected with internal circuits (8) by a coplanar waveguide (7) on a side surface of the package, the horn antenna (2) comprises a bottom metal plane (9), a top metal plane (10) and metallized via hole side walls (11), a plurality of metallized via hole arrays (17) consisting of the metallized via holes (3) form a plurality of dielectric-filled waveguides (18) in the horn antenna (2), electromagnetic waves reach an antenna aperture plane (12) in a same-phase manner via the dielectric-filled waveguides (18), and the wave impedance of each dielectric-filled waveguide (18) at a port of the antenna aperture plane (12) is equal to the wave impedance of free space. The packaged sandwich antenna has the advantages that the gain of the antenna can be increased, and return loss of the antenna can be reduced.
Description
Technical field
The present invention relates to a kind of horn antenna, especially a kind of encapsulation interlayer antenna of phase impedance calibration.
Background technology
Adopt monolithic three-dimensional multi-chip (3D-MCM) technology, a radio system can be integrated in a 3-D stacks encapsulation, also need antenna to be integrated in encapsulation for this reason.Normally antenna integrated on the surface of encapsulation, such as paster antenna is integrated in the top of encapsulation.But need sometimes integrated for antenna in a package between an interlayer to meet the needs of system.If integrated horn antenna just can realize above-mentioned requirements in the inner interlayer of encapsulation.But usual horn antenna is nonplanar, with incompatible, the larger physical dimension that has of planar circuit technique, thus limit its application on encapsulating structure.In recent years, it is little that substrate integration wave-guide horn antenna based on substrate integrated waveguide technology development has size, lightweight, be easy to the feature of Planar integration, but the gain of traditional substrate integration wave-guide horn antenna is relatively low, its reason is because horn mouth constantly opens, Electromagnetic Wave Propagation is caused to occur that phase place is asynchronous to during horn mouth diametric plane, the PHASE DISTRIBUTION of bore electric field strength is uneven, radiation directivity and gain reduction, and electromagnetic wave impedance is different from the wave impedance of free space on bore face, medium and air interface can cause reflection of electromagnetic wave, have impact on return loss and the radiance of antenna.Existing method such as employing coated by dielectric, medium prism etc. at present, correct the asynchronous of horn mouth diametric plane phase place, but these methods all can not improve the inconsistent of horn antenna and free space wave impedance on bore face, the uniformity of electromagnetic field magnitude distribution on bore face can not be improved, and these phase alignment structures add the overall structure size of antenna, be not suitable for being integrated into the inner interlayer of encapsulation.
Summary of the invention
Technical problem: the object of the invention is the encapsulation interlayer antenna proposing the calibration of a kind of phase impedance, this inner antenna be embedded with metallization arrays of vias can improve antenna opening diametric plane power on magnetic wave phase uniformity and avoid the reflection of antenna on medium and free space interface, the aperture efficiency of raising three-dimension packaging interlayer antenna and gain.
Technical scheme: the encapsulation interlayer antenna package of a kind of phase impedance calibration of the present invention draws together the microstrip feed line be arranged on medium substrate, substrate integration wave-guide horn antenna and embedded metal via hole, and medium substrate is at the internal layer of three-dimension packaging; Described microstrip feed line is connected with the internal circuit of three-dimension packaging by co-planar waveguide; Substrate integration wave-guide horn antenna to be connected bottom-side metal planar top surface metal flat by the bottom-side metal plane being positioned at medium substrate one side, the topside metal plane that is positioned at medium substrate another side metallization via hole trumpet side walls with through medium substrate forms; Metallization via hole embedded in substrate integration wave-guide horn antenna connects bottom-side metal plane and topside metal plane, and forms multiple metallization arrays of vias; Metallization arrays of vias forms multiple dielectric-filled waveguide in horn antenna, and dielectric-filled waveguide equals free space wave impedance in the wave impedance of antenna opening diametric plane upper port.
One end of described microstrip feed line is connected with horn antenna, and the other end of microstrip feed line, near package side surface, is the input/output port of antenna; Microstrip feed line is connected by antenna input/output port one end with the co-planar waveguide of package side surface, and the other end of co-planar waveguide is connected with encapsulation internal circuit.
Described substrate integration wave-guide horn antenna is connected in series by narrow Cross-section Waveguide Using, tubaeform waveguide and wide Cross-section Waveguide Using and forms; One end of narrow Cross-section Waveguide Using is microstrip feed line, the other end of narrow Cross-section Waveguide Using is connected with tubaeform waveguide, one end of tubaeform waveguide is connected with narrow Cross-section Waveguide Using, and the other end of tubaeform waveguide is connected with wide Cross-section Waveguide Using, and the other end of wide Cross-section Waveguide Using is antenna opening diametric plane.
Described metallization arrays of vias shape is all to be connected with end section three sections by head portion, polygon to form, and the head end of metallization arrays of vias is all towards microstrip feed line direction, and the tail end of metallization arrays of vias is on antenna opening diametric plane.
Head portion in described metallization arrays of vias or the shape of end section can be straight line, broken line or other curve, and its length can be zero or finite length.
Polygon in described metallization arrays of vias can be triangle, quadrangle, pentagon or other polygon, and the shape on a polygonal limit or many limits can be straight line, camber line or other curve.
The width of described dielectric-filled waveguide all will ensure that its main mould can transmit and not be cut off in dielectric-filled waveguide.
One end of described dielectric-filled waveguide is all towards microstrip feed line direction, and its other end is all on antenna opening diametric plane, and dielectric-filled waveguide is all the same at the width of antenna opening diametric plane upper port.
Select the position in head portion or polygon on the left side dielectric-filled waveguide in metallization arrays of vias, the Multi-path electricity magnetic wave homophase transmitted by dielectric-filled waveguide is arrived on the bore face of antenna.
In metallization via hole trumpet side walls, the spacing of two adjacent metallization via holes is less than or equals 1/10th of operation wavelength, makes the metallization via hole trumpet side walls formed can be equivalent to electric wall; The spacing of two adjacent metallization via holes will be equal to or less than 1/10th of operation wavelength, makes intermediate metallization arrays of vias, left side metallization arrays of vias and the right metallization arrays of vias formed can be equivalent to electric wall.
In dielectric-filled waveguide, the propagation phase velocity of the main mould of electromagnetic wave (TE10 mould) is all relevant with the width of dielectric-filled waveguide with wave impedance, and the width of dielectric-filled waveguide is wider, the propagation phase velocity of main mould and wave impedance lower; Otherwise the width of dielectric-filled waveguide is narrower, the propagation phase velocity of main mould and wave impedance higher.The co-planar waveguide of electromagnetic wave signal through three-dimension packaging side from encapsulation internal circuit enters antenna input/output port, substrate integration wave-guide horn antenna is entered into again by microstrip feed line, after propagating a segment distance to the direction, bore face of antenna, run into metallization arrays of vias, just be divided into multichannel and enter the transmission of each dielectric-filled waveguide respectively, then arrive the bore face of antenna through these dielectric-filled waveguides.Adjustment metallization arrays of vias head end, from the distance of microstrip feed line, can change the length of dielectric-filled waveguide; In adjustment metallization arrays of vias, the position of polygon vertex can change the relative phase velocity of electromagnetic transmission in adjacent two dielectric-filled waveguides separated by this metallization arrays of vias; Such adjustment metallization arrays of vias head end and the position of polygon vertex, the electromagnetic wave in antenna can be made can to arrive the bore face of antenna by homophase by each dielectric-filled waveguide, and the aperture efficiency of such antenna and the gain of antenna are just high; And to equal the wave impedance of free space in the wave impedance of antenna opening diametric plane upper port due to dielectric-filled waveguide, namely the port width a of dielectric-filled waveguide satisfies condition
namely port width a equals square root that free space wavelength λ is multiplied by medium relative dielectric constant ε again except the subduplicate twice subtracting 1 in medium relative dielectric constant ε, and therefore the reflection of antenna opening diametric plane is just little like this.
Beneficial effect: the beneficial effect of the encapsulation interlayer antenna of phase impedance calibration of the present invention is, improve antenna opening diametric plane power on magnetic wave phase equalization, simultaneously make again the electromagnetic wave impedance of antenna on bore face equal the wave impedance of free space, thus improve the gain of three-dimension packaging interlayer antenna and reduce the return loss of antenna.
Accompanying drawing explanation
Fig. 1 is the three-dimension packaging overall structure schematic diagram of the encapsulation interlayer antenna of phase impedance calibration.
Fig. 2 is the encapsulation interlayer antenna face structural representation of phase impedance calibration.
Fig. 3 is the encapsulation interlayer antenna inverse layer structure schematic diagram of phase impedance calibration.
Have in figure: microstrip feed line 1, substrate integration wave-guide horn antenna 2, embedded metal via hole 3, medium substrate 4, three-dimension packaging 5, the tubaeform waveguide 14 of the bore face 12 of antenna input/output port 6, co-planar waveguide 7, internal circuit 8, bottom-side metal plane 9, topside metal plane 10, metallization via hole trumpet side walls 11, antenna, the narrow Cross-section Waveguide Using 13 of antenna, antenna, the wide Cross-section Waveguide Using 15 of antenna, ground plane 16, metallization arrays of vias 17 and dielectric-filled waveguide 18.
Embodiment
Below in conjunction with drawings and Examples, the invention will be further described.
Embodiment of the present invention is: the encapsulation interlayer antenna of phase impedance calibration is made up of microstrip feed line 1, substrate integration wave-guide horn antenna 2 and embedded metal via hole 3 three part, this three part is all integrated on same medium substrate 4, and this medium substrate is positioned at the internal layer of 4 3-dimensional multi-layered encapsulation 5; One termination substrate integration wave-guide horn antenna 2 of microstrip feed line 1, microstrip feed line 1 other end is near package side surface, it is the input/output port 6 of antenna, the input/output port 6 of antenna is spent to cross by micro-band and co-planar waveguide 90 and is connected with the co-planar waveguide 7 of package side surface, and the other end of co-planar waveguide 7 is connected with encapsulation internal circuit 8; Substrate integration wave-guide horn antenna 2 is made up of bottom-side metal plane 9, topside metal plane 10 and metallization via hole trumpet side walls 11, bottom-side metal plane 9 and topside metal plane 10 lay respectively at the two sides of medium substrate 4, and metallization via sidewall 11 connects bottom-side metal plane 9 and topside metal plane 10; The inside of horn antenna 2 is by narrow Cross-section Waveguide Using 13, and tubaeform waveguide 14 and wide Cross-section Waveguide Using 15 3 part serial connection form; One termination microstrip feed line 1 of horn antenna 2, bottom-side metal plane 9 is connected with the ground plane 16 of microstrip feed line 1, the other end of horn antenna 2 is bore faces 12 of antenna, metallization via hole 3 embedded in substrate integration wave-guide horn antenna 2 connects bottom-side metal plane 9 and topside metal plane 10, and these embedded metallization via holes 3 form multiple metallization arrays of vias 17; Metallization arrays of vias 17 shape is all that a paragraph header end tap polygon connects one section of end section again, and the head end of metallization arrays of vias 17 is all towards the direction of microstrip feed line 1, and the tail end of metallization arrays of vias 17 is on the bore face 12 of horn antenna 2; Metallization arrays of vias 17 forms multiple dielectric-filled waveguide 18 in horn antenna 2; And setting dielectric-filled waveguide 18 makes these dielectric-filled waveguides 18 all equal the wave impedance of free space in the wave impedance of antenna opening diametric plane 12 at the width of sky live width Cross-section Waveguide Using 15.
In dielectric-filled waveguide 18, the phase velocity of the propagation of the main mould of electromagnetic wave (TE10 mould) is all relevant with the width of dielectric-filled waveguide with wave impedance, and the width of dielectric-filled waveguide 18 is wider, the transmission phase velocity of main mould and wave impedance lower; Otherwise dielectric-filled waveguide 18 width is narrower, the transmission phase velocity of main mould and wave impedance higher.The co-planar waveguide 7 of electromagnetic wave signal through three-dimension packaging 5 side from encapsulation internal circuit 8 enters antenna input/output port 6, substrate integration wave-guide horn antenna 2 is entered into again by microstrip feed line 1, after propagating a segment distance, run into metallization arrays of vias 17, electromagnetic wave is just divided into multichannel and enters respectively in each dielectric-filled waveguide 18 and transmit towards the direction of antenna opening diametric plane 12, the position of polygon vertex in adjustment metallization arrays of vias 17, the position of head end, can ensure that the electromagnetic wave transmitted by dielectric-filled waveguide 18 in phase arrives the bore face 12 of antenna, like this at the port that each dielectric-filled waveguide width of bore face 12 of antenna is equal, electromagnetic phase place is with all consistent, thus reach and improve the aperture efficiency of antenna and the object of gain, and all equal the wave impedance of free space due to the wave impedance of each port of dielectric-filled waveguide 18 on antenna opening diametric plane, namely left side dielectric-filled waveguide 19, intermediate medium fill waveguide 20, the port width a of the right dielectric-filled waveguide 21 satisfies condition
namely port width a equals square root that free space wavelength λ is multiplied by medium relative dielectric constant ε again except the subduplicate twice subtracting 1 in medium relative dielectric constant ε, and therefore the reflection of antenna opening diametric plane is just little.
In technique, the encapsulation interlayer antenna of phase impedance calibration both can adopt three-dimensional resinous packaging technology, and LTCC (LTCC) technique also can be adopted to realize.The via hole 3 that wherein metallizes can be hollow metal through hole with metallization via sidewall 11 also can be solid metal hole, and also can be continuous print metallization wall, the shape of metal throuth hole can be circular, also can be square or other shapes.
Structurally, due to the equal condition of wave impedance will be met, dielectric-filled waveguide 18 is certain at the port width of antenna opening diametric plane, thus the width of antenna opening diametric plane 12 just can not set arbitrarily, because keep dielectric-filled waveguide 18 to equal the wave impedance of free space in the wave impedance of antenna opening diametric plane upper port, the dielectric constant of medium substrate 4 is certain, then the port width of dielectric-filled waveguide 18 is also certain, if therefore dielectric-filled waveguide 18 quantity at antenna opening diametric plane 12 place doubles, bore face 12 width of antenna also will double.Due to the metallization via sidewall 11 the closer to antenna, the distance that electromagnetic wave arrives antenna opening diametric plane 12 is far away, therefore relative to from the dielectric-filled waveguide away from metallization via sidewall 11, from the width relative narrower of dielectric-filled waveguide close to metallization via sidewall 11 to obtain higher electromagnetic transmission phase velocity.Polygon in antenna metallization arrays of vias 17 can be triangle, quadrangle, pentagon or other polygon, and the shape on these polygonal limits or many limits can be straight line, camber line or other curve; Head portion in metallization arrays of vias 17 and the shape of end section can be straight line, broken line, exponential line or other curve.
According to the above, just the present invention can be realized.
Claims (7)
1. the encapsulation interlayer antenna of a phase impedance calibration, it is characterized in that this antenna comprises the microstrip feed line (1) be arranged on medium substrate (4), substrate integration wave-guide horn antenna (2) and embedded metal via hole (3), medium substrate (4) internal layer in three-dimension packaging (5); Described microstrip feed line (1) is connected with the internal circuit (8) of three-dimension packaging (5) by co-planar waveguide (7); Substrate integration wave-guide horn antenna (2) to be connected bottom-side metal plane (9) topside metal plane (10) by the bottom-side metal plane (9) being positioned at medium substrate (4) one side, the topside metal plane (10) that is positioned at medium substrate (4) another side metallization via hole trumpet side walls (11) with through medium substrate (4) forms; Metallization via hole (3) embedded in substrate integration wave-guide horn antenna (2) connects bottom-side metal plane (9) and topside metal plane (10), and forms multiple metallization arrays of vias (17); Metallization arrays of vias (17) shape is all to be connected with tail end straightway three sections by head end straightway, polygon to form, the head end of metallization arrays of vias (17) is all towards microstrip feed line (1) direction, and the tail end of metallization arrays of vias (17) is on antenna opening diametric plane (12); Metallization arrays of vias (17) forms multiple dielectric-filled waveguide (18) in horn antenna (2), and dielectric-filled waveguide (18) equals free space wave impedance in the wave impedance of antenna opening diametric plane (12) upper port; Select head end straightway or the position of polygon in dielectric-filled waveguide (18) in metallization arrays of vias (17), the Multi-path electricity magnetic wave homophase transmitted by dielectric-filled waveguide (18) is arrived on the bore face (12) of antenna.
2. the encapsulation interlayer antenna of a kind of phase impedance calibration according to claim 1, it is characterized in that one end of described microstrip feed line (1) is connected with horn antenna (2), the other end of microstrip feed line (1), near package side surface, is the input/output port (6) of antenna; Microstrip feed line (1) is connected by antenna input/output port (6) one end with the co-planar waveguide (7) of package side surface, and the other end of co-planar waveguide (7) is connected with encapsulation internal circuit (8).
3. the encapsulation interlayer antenna of a kind of phase impedance calibration according to claim 1, is characterized in that described substrate integration wave-guide horn antenna (2) is connected in series by narrow Cross-section Waveguide Using (13), tubaeform waveguide (14) and wide Cross-section Waveguide Using (15) and forms; One end of narrow Cross-section Waveguide Using (13) is microstrip feed line (1), the other end of narrow Cross-section Waveguide Using (13) is connected with tubaeform waveguide (14), one end of tubaeform waveguide (14) is connected with narrow Cross-section Waveguide Using (13), the other end of tubaeform waveguide (14) is connected with wide Cross-section Waveguide Using (15), and the other end of wide Cross-section Waveguide Using (15) is antenna opening diametric plane (12).
4. the encapsulation interlayer antenna of a kind of phase impedance calibration according to claim 1, is characterized in that the shape of head portion in described metallization arrays of vias (17) or end section is straight line or broken line or other curve.
5. the encapsulation interlayer antenna of a kind of phase impedance calibration according to claim 1, the polygon that it is characterized in that in described metallization arrays of vias (17) is the polygon that triangle or quadrangle or pentagon or other limit number are greater than five.
6. the encapsulation interlayer antenna of a kind of phase impedance calibration according to claim 1, is characterized in that the width of described dielectric-filled waveguide (18) all will ensure that its main mould can transmit and not be cut off in dielectric-filled waveguide (18).
7. the encapsulation interlayer antenna of a kind of phase impedance calibration according to claim 1, it is characterized in that one end of described dielectric-filled waveguide (18) is all towards microstrip feed line (1) direction, its other end is all on antenna opening diametric plane (12), and dielectric-filled waveguide (18) is all the same at the width of antenna opening diametric plane (12) upper port.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210562981.XA CN103022668B (en) | 2012-12-21 | 2012-12-21 | Packaged sandwich antenna with phase and impedance calibration functions |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210562981.XA CN103022668B (en) | 2012-12-21 | 2012-12-21 | Packaged sandwich antenna with phase and impedance calibration functions |
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| Publication Number | Publication Date |
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| CN103022668A CN103022668A (en) | 2013-04-03 |
| CN103022668B true CN103022668B (en) | 2015-03-04 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201210562981.XA Expired - Fee Related CN103022668B (en) | 2012-12-21 | 2012-12-21 | Packaged sandwich antenna with phase and impedance calibration functions |
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Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103022667B (en) * | 2012-12-21 | 2014-12-17 | 东南大学 | Packaged sandwich antenna with impedance calibration function |
| CN103022669B (en) * | 2012-12-21 | 2014-10-29 | 东南大学 | Planar horn antenna with phase and impedance calibration functions |
| CN104733847A (en) * | 2015-03-30 | 2015-06-24 | 东南大学 | Three-dimensional packaging surface antenna for gap embedded phase position calibration |
| WO2016178609A1 (en) * | 2015-05-07 | 2016-11-10 | Telefonaktiebolaget Lm Ericsson (Publ) | Improved antenna |
| CN113594714B (en) * | 2021-07-20 | 2022-05-17 | 河海大学 | Millimeter wave antenna array for air substrate integrated waveguide horn feed |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US3573838A (en) * | 1968-10-28 | 1971-04-06 | Hughes Aircraft Co | Broadband multimode horn antenna |
| CN101179155B (en) * | 2007-11-12 | 2011-08-24 | 杭州电子科技大学 | H face sectoral horn antenna including filter function |
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| CN103022668A (en) | 2013-04-03 |
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