CN103022668A - Packaged sandwich antenna with phase and impedance calibration functions - Google Patents
Packaged sandwich antenna with phase and impedance calibration functions Download PDFInfo
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- CN103022668A CN103022668A CN201210562981XA CN201210562981A CN103022668A CN 103022668 A CN103022668 A CN 103022668A CN 201210562981X A CN201210562981X A CN 201210562981XA CN 201210562981 A CN201210562981 A CN 201210562981A CN 103022668 A CN103022668 A CN 103022668A
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Abstract
The invention discloses a packaged sandwich antenna with phase and impedance calibration functions, and relates to a horn antenna. The packaged sandwich antenna comprises a micro-strip feeder (1), a horn antenna (2) and metallized via holes (3) which are integrated on a dielectric substrate (4). The dielectric substrate (4) is positioned on an inner layer of a three-dimensional package (5), one end of the micro-strip feeder (1) is connected with internal circuits (8) by a coplanar waveguide (7) on a side surface of the package, the horn antenna (2) comprises a bottom metal plane (9), a top metal plane (10) and metallized via hole side walls (11), a plurality of metallized via hole arrays (17) consisting of the metallized via holes (3) form a plurality of dielectric-filled waveguides (18) in the horn antenna (2), electromagnetic waves reach an antenna aperture plane (12) in a same-phase manner via the dielectric-filled waveguides (18), and the wave impedance of each dielectric-filled waveguide (18) at a port of the antenna aperture plane (12) is equal to the wave impedance of free space. The packaged sandwich antenna has the advantages that the gain of the antenna can be increased, and return loss of the antenna can be reduced.
Description
Technical field
The present invention relates to a kind of horn antenna, especially a kind of encapsulation interlayer antenna of phase place impedance calibration.
Background technology
Adopt lamination 3-D multi-chip (3D-MCM) technology, can be integrated in a radio system in the 3-D stacks encapsulation, also need antenna is integrated in the encapsulation for this reason.Normally surperficial antenna integrated in encapsulation for example is integrated in paster antenna the top of encapsulation.But need sometimes antenna is integrated in a middle interlayer of encapsulation to satisfy the needs of system.If integrated horn antenna just can be realized above-mentioned requirements in the inner interlayer of encapsulation.But usually horn antenna is nonplanar, with incompatible, the larger physical dimension that has of planar circuit technique, thereby has limited its application on encapsulating structure.In recent years, it is little to have size based on the substrate integration wave-guide horn antenna of substrate integrated waveguide technology development, lightweight, be easy to the characteristics of Planar integration, but the gain of traditional substrate integration wave-guide horn antenna is relatively low, its reason is because horn mouth constantly opens, it is asynchronous phase place to occur when causing Electromagnetic Wave Propagation to the horn mouth diametric plane, the PHASE DISTRIBUTION of bore electric field strength is inhomogeneous, radiation directivity and gain reduce, and electromagnetic wave impedance is different from the wave impedance of free space on the bore face, can cause reflection of electromagnetic wave on medium and air interface, return loss and the radiance of antenna have been affected.The methods such as at present existing employing medium loading, medium prism, correct the asynchronous of horn mouth diametric plane phase place, but these methods all can not be improved the inconsistent of horn antenna and free space wave impedance on the bore face, can not improve the uniformity that electromagnetic field magnitude distributes on the bore face, and these phase alignment structures have increased the overall structure size of antenna, are not suitable for being integrated into the inner interlayer of encapsulation.
Summary of the invention
Technical problem: the encapsulation interlayer antenna that the objective of the invention is to propose a kind of phase place impedance calibration, this antenna inside be embedded with the metallization arrays of vias can improve the antenna opening diametric plane power on magnetic wave phase uniformity and avoid the reflection of antenna on medium and free space interface, aperture efficiency and the gain of raising three-dimension packaging interlayer antenna.
Technical scheme: the encapsulation interlayer antenna package of a kind of phase place impedance calibration of the present invention is drawn together microstrip feed line, substrate integration wave-guide horn antenna and the embedded metal via hole that is arranged on the medium substrate, and medium substrate is at the internal layer of three-dimension packaging; Described microstrip feed line links to each other with the internal circuit of three-dimension packaging by co-planar waveguide; The substrate integration wave-guide horn antenna is comprised of with the metallization via hole loudspeaker sidewall that is connected medium substrate and connects bottom surface metal flat end face metal flat the bottom surface metal flat that is positioned at medium substrate one side, the end face metal flat that is positioned at the medium substrate another side; Metallization via hole embedded in the substrate integration wave-guide horn antenna connects bottom surface metal flat and end face metal flat, and consists of a plurality of metallization arrays of vias; The metallization arrays of vias forms a plurality of dielectric-filled waveguides in horn antenna, dielectric-filled waveguide equals the free space wave impedance in the wave impedance of antenna opening diametric plane upper port.
One end of described microstrip feed line links to each other with horn antenna, and the other end of microstrip feed line is the input/output port of antenna near package side surface; Microstrip feed line links to each other with an end of the co-planar waveguide of package side surface by the antenna input/output port, and the other end of co-planar waveguide links to each other with the encapsulation internal circuit.
Described substrate integration wave-guide horn antenna is made of narrow Cross-section Waveguide Using, tubaeform waveguide and wide Cross-section Waveguide Using serial connection; One end of narrow Cross-section Waveguide Using is microstrip feed line, the other end of narrow Cross-section Waveguide Using links to each other with tubaeform waveguide, one end of tubaeform waveguide links to each other with narrow Cross-section Waveguide Using, and the other end of tubaeform waveguide links to each other with wide Cross-section Waveguide Using, and the other end of wide Cross-section Waveguide Using is the antenna opening diametric plane.
Described metallization arrays of vias shape all is to be linked to each other with three sections of tail end straightways by head end straightway, polygon to consist of, and the head end of metallization arrays of vias is all towards the microstrip feed line direction, and the tail end of metallization arrays of vias is on the antenna opening diametric plane.
Head end straightway in the described metallization arrays of vias or the shape of tail end straightway can be straight line, broken line or other curve, and its length can be zero or finite length.
Polygon in the described metallization arrays of vias can be triangle, quadrangle, pentagon or other polygon, and the shape on a polygonal limit or many limits can be straight line, camber line or other curve.
The width of described dielectric-filled waveguide will guarantee that all its main mould can transmit and is not cut off in dielectric-filled waveguide.
One end of described dielectric-filled waveguide is all towards the microstrip feed line direction, and its other end is all on the antenna opening diametric plane, and dielectric-filled waveguide is all the same at the width of antenna opening diametric plane upper port.
Position in the selection metallization arrays of vias in head end straightway or the polygon on the left side dielectric-filled waveguide is so that arrive on the bore face of antenna by the Multi-path electricity magnetic wave homophase of dielectric-filled waveguide transmission.
In the metallization via hole loudspeaker sidewall, the spacing of two adjacent metallization via holes is less than or equals 1/10th of operation wavelength, so that the metallization via hole loudspeaker sidewall that consists of can equivalence be electric wall; The spacing of two adjacent metallization via holes will be equal to or less than 1/10th of operation wavelength, so that the intermediate metallization arrays of vias that consists of, left side metallization arrays of vias and the right metallization arrays of vias can equivalence be electric wall.
In dielectric-filled waveguide, the propagation phase velocity of electromagnetic wave master mould (TE10 mould) is all relevant with the width of dielectric-filled waveguide with wave impedance, and the width of dielectric-filled waveguide is wider, and the propagation phase velocity of main mould and wave impedance are just lower; Otherwise the width of dielectric-filled waveguide is narrower, and the propagation phase velocity of main mould and wave impedance are just higher.Co-planar waveguide from the electromagnetic wave signal process three-dimension packaging side that encapsulates internal circuit enters the antenna input/output port, enter into the substrate integration wave-guide horn antenna by microstrip feed line again, after propagating a segment distance to the bore face direction of antenna, run into the metallization arrays of vias, just be divided into multichannel and enter respectively each dielectric-filled waveguide transmission, arrive again the bore face of antenna through these dielectric-filled waveguides.Adjust metallization arrays of vias head end from the distance of microstrip feed line, can change the length of dielectric-filled waveguide; The position of adjusting polygon vertex in the metallization arrays of vias can change the relative phase velocity of electromagnetic transmission in adjacent two dielectric-filled waveguides that separated by this metallization arrays of vias; Adjust like this position of metallization arrays of vias head end and polygon vertex, can be so that the electromagnetic wave in the antenna can homophase arrive the bore face of antenna by each dielectric-filled waveguide, the gain of the aperture efficiency of antenna and antenna is with regard to height like this; And because dielectric-filled waveguide equals the wave impedance of free space in the wave impedance of antenna opening diametric plane upper port, namely the port width a of dielectric-filled waveguide satisfies condition
Namely port width a equals free space wavelength λ except subtracting 1 subduplicate twice in medium relative dielectric constant ε, and therefore the reflection of antenna opening diametric plane is just little like this.
Beneficial effect: the beneficial effect of the encapsulation interlayer antenna of phase place impedance calibration of the present invention is, improved the antenna opening diametric plane power on the phase equalization of magnetic wave, simultaneously again so that on the bore face the electromagnetic wave impedance of antenna equal the wave impedance of free space, thereby improved the gain of three-dimension packaging interlayer antenna and reduced the return loss of antenna.
Description of drawings
Fig. 1 is the three-dimension packaging overall structure schematic diagram of the encapsulation interlayer antenna of phase place impedance calibration.
Fig. 2 is the encapsulation interlayer antenna face structural representation of phase place impedance calibration.
Fig. 3 is the encapsulation interlayer antenna reverse side structural representation of phase place impedance calibration.
Have among the figure: microstrip feed line 1, substrate integration wave-guide horn antenna 2, embedded metal via hole 3, medium substrate 4, three-dimension packaging 5, the bore face 12 of antenna input/output port 6, co-planar waveguide 7, internal circuit 8, bottom surface metal flat 9, end face metal flat 10, metallization via hole loudspeaker sidewall 11, antenna, the narrow Cross-section Waveguide Using 13 of antenna, the tubaeform waveguide 14 of antenna, wide Cross-section Waveguide Using 15, ground plane 16, metallization arrays of vias 17 and the dielectric-filled waveguide 18 of antenna.
Embodiment
The invention will be further described below in conjunction with drawings and Examples.
Embodiment of the present invention is: the encapsulation interlayer antenna of phase place impedance calibration is comprised of microstrip feed line 1, substrate integration wave-guide horn antenna 2 and embedded metal via hole 3 three parts, this three part all is integrated on the same medium substrate 4, and this medium substrate is positioned at the internal layer of 4 3-dimensional multi-layered encapsulation 5; One termination substrate integration wave-guide horn antenna 2 of microstrip feed line 1, microstrip feed line 1 other end is near package side surface, it is the input/output port 6 of antenna, the input/output port 6 of antenna is spent to cross with the co-planar waveguide 7 of package side surface by little band and co-planar waveguide 90 and is linked to each other, and the other end of co-planar waveguide 7 links to each other with encapsulation internal circuit 8; Substrate integration wave-guide horn antenna 2 is comprised of bottom surface metal flat 9, end face metal flat 10 and metallization via hole loudspeaker sidewall 11, bottom surface metal flat 9 and end face metal flat 10 lay respectively at the two sides of medium substrate 4, and metallization via sidewall 11 connects bottom surface metal flat 9 and end face metal flat 10; The inside of horn antenna 2 is by narrow Cross-section Waveguide Using 13, and tubaeform waveguide 14 and wide Cross-section Waveguide Using 15 3 parts serial connection form; One termination microstrip feed line 1 of horn antenna 2, bottom surface metal flat 9 is connected with the ground plane 16 of microstrip feed line 1, the other end of horn antenna 2 is bore faces 12 of antenna, metallization via hole 3 embedded in substrate integration wave-guide horn antenna 2 connects bottom surface metal flat 9 and end face metal flat 10, and these embedded metallization via holes 3 consist of a plurality of metallization arrays of vias 17; Metallization arrays of vias 17 shapes all are that a paragraph header end straightway connects polygon and connects one section tail end straightway again, and all towards the direction of microstrip feed line 1, the tail end of metallization arrays of vias 17 is on the bore face 12 of horn antenna 2 for the head end of metallization arrays of vias 17; Metallization arrays of vias 17 forms a plurality of dielectric-filled waveguides 18 in horn antenna 2; And set dielectric-filled waveguide 18 at the width of sky live width Cross-section Waveguide Using 15 so that these dielectric-filled waveguides 18 all equal the wave impedance of free space in the wave impedance of antenna opening diametric plane 12.
In dielectric-filled waveguide 18, the phase velocity of the propagation of electromagnetic wave master mould (TE10 mould) is all relevant with the width of dielectric-filled waveguide with wave impedance, and the width of dielectric-filled waveguide 18 is wider, and the transmission phase velocity of main mould and wave impedance are just lower; Otherwise dielectric-filled waveguide 18 width are narrower, and the transmission phase velocity of main mould and wave impedance are just higher.Co-planar waveguide 7 from electromagnetic wave signal process three-dimension packaging 5 sides that encapsulate internal circuit 8 enters antenna input/output port 6, enter into substrate integration wave-guide horn antenna 2 by microstrip feed line 1 again, after propagating a segment distance, run into metallization arrays of vias 17, electromagnetic wave just is divided into multichannel and enters respectively in each dielectric-filled waveguide 18 direction transmission towards antenna opening diametric plane 12, adjust the position of polygon vertex in the metallization arrays of vias 17, the position of head end, can guarantee that the electromagnetic wave by dielectric-filled waveguide 18 transmission in phase arrives the bore face 12 of antenna; Like this at the equal port of bore face 12 each dielectric-filled waveguide width of antenna, electromagnetic phase place is with all consistent, thereby reach the aperture efficiency that improves antenna and the purpose of gain, and because the wave impedance of each port of dielectric-filled waveguide 18 on the antenna opening diametric plane all equals the wave impedance of free space, namely the port width a of left side dielectric-filled waveguide 19, intermediate medium filling waveguide 20, the right dielectric-filled waveguide 21 satisfies condition
Namely port width a equals free space wavelength λ except subtracting 1 subduplicate twice in medium relative dielectric constant ε, so the reflection of antenna opening diametric plane is just little.
On technique, the encapsulation interlayer antenna of phase place impedance calibration both can adopt the three-dimensional resinous packaging technology, also can adopt LTCC (LTCC) technique to realize.Via hole 3 and the metallization via sidewall 11 of wherein metallizing can be that the hollow metal through hole also can be the solid metal hole, also can be continuous metallization wall, and the shape of metal throuth hole can be circular, also can be square or other shapes.
Structurally, equate condition owing to will satisfy wave impedance, dielectric-filled waveguide 18 is certain at the port width of antenna opening diametric plane, thereby the width of antenna opening diametric plane 12 just can not Set arbitrarily, because keep dielectric-filled waveguide 18 to equal the wave impedance of free space in the wave impedance of antenna opening diametric plane upper port, the dielectric constant of medium substrate 4 is certain, then the port width of dielectric-filled waveguide 18 is also certain, if therefore dielectric-filled waveguide 18 quantity at antenna opening diametric plane 12 places double, bore face 12 width of antenna also will double.Because the metallization via sidewall 11 the closer to antenna, the distance that electromagnetic wave arrives antenna opening diametric plane 12 is far away, therefore with respect to from the dielectric-filled waveguide of metallization via sidewall 11 away from, from the width relative narrower of the dielectric-filled waveguide of metallization via sidewall 11 close to obtain higher electromagnetic transmission phase velocity.Polygon in the antenna metallization arrays of vias 17 can be triangle, quadrangle, pentagon or other polygon, and the shape on these polygonal limits or many limits can be straight line, camber line or other curve; Head end straightway in the metallization arrays of vias 17 and the shape of tail end straightway can be straight line, broken line, exponential line or other curve.
According to the above, just can realize the present invention.
Claims (9)
1. the encapsulation interlayer antenna of a phase place impedance calibration, it is characterized in that this antenna comprises microstrip feed line (1), substrate integration wave-guide horn antenna (2) and the embedded metal via hole (3) that is arranged on the medium substrate (4), medium substrate (4) is at the internal layer of three-dimension packaging (5); Described microstrip feed line (1) links to each other with the internal circuit (8) of three-dimension packaging (5) by co-planar waveguide (7); Substrate integration wave-guide horn antenna (2) is comprised of the bottom surface metal flat (9) that is positioned at medium substrate (4) one side, the metallization via hole loudspeaker sidewalls (11) that are positioned at the end face metal flat (10) of medium substrate (4) another side and are connected medium substrate (4) connection bottom surface metal flat (9) end face metal flat (10); Metallization via hole (3) embedded in the substrate integration wave-guide horn antenna (2) connects bottom surface metal flat (9) and end face metal flat (10), and consists of a plurality of metallization arrays of vias (17); Metallization arrays of vias (17) forms a plurality of dielectric-filled waveguides (18) in horn antenna (2), dielectric-filled waveguide (18) equals the free space wave impedance in the wave impedance of antenna opening diametric plane (12) upper port.
2. the encapsulation interlayer antenna of a kind of phase place impedance calibration according to claim 1, an end that it is characterized in that described microstrip feed line (1) links to each other with horn antenna (2), the other end of microstrip feed line (1) is the input/output port (6) of antenna near package side surface; Microstrip feed line (1) links to each other with an end of the co-planar waveguide (7) of package side surface by antenna input/output port (6), and the other end of co-planar waveguide (7) links to each other with encapsulation internal circuit (8).
3. the encapsulation interlayer antenna of a kind of phase place impedance calibration according to claim 1 is characterized in that described substrate integration wave-guide horn antenna (2) is made of narrow Cross-section Waveguide Using (13), tubaeform waveguide (14) and wide Cross-section Waveguide Using (15) serial connection; One end of narrow Cross-section Waveguide Using (13) is microstrip feed line (1), the other end of narrow Cross-section Waveguide Using (13) links to each other with tubaeform waveguide (14), one end of tubaeform waveguide (14) links to each other with narrow Cross-section Waveguide Using (13), the other end of tubaeform waveguide (14) links to each other with wide Cross-section Waveguide Using (15), and the other end of wide Cross-section Waveguide Using (15) is antenna opening diametric plane (12).
4. the encapsulation interlayer antenna of a kind of phase place impedance calibration according to claim 1, it is characterized in that described metallization arrays of vias (17) shape all is to be linked to each other with three sections of tail end straightways by head end straightway, polygon to consist of, the head end of metallization arrays of vias (17) is all towards microstrip feed line (1) direction, and the tail end of metallization arrays of vias (17) is on antenna opening diametric plane (12).
5. the encapsulation interlayer antenna of a kind of phase place impedance calibration according to claim 4, it is characterized in that head end straightway in the described metallization arrays of vias (17) or the shape of tail end straightway can be straight line, broken line or other curve, its length can be zero or finite length.
6. the encapsulation interlayer antenna of a kind of phase place impedance calibration according to claim 4, it is characterized in that the polygon in the described metallization arrays of vias (17) can be triangle, quadrangle, pentagon or other polygon, the shape on a polygonal limit or many limits can be straight line, camber line or other curve.
7. the encapsulation interlayer antenna of a kind of phase place impedance calibration according to claim 1, the width that it is characterized in that described dielectric-filled waveguide (18) will guarantee that all its main mould can transmit and is not cut off in dielectric-filled waveguide (18).
8. the encapsulation interlayer antenna of a kind of phase place impedance calibration according to claim 1, it is characterized in that an end of described dielectric-filled waveguide (18) is all towards microstrip feed line (1) direction, its other end is all on antenna opening diametric plane (12), and dielectric-filled waveguide (18) is all the same at the width of antenna opening diametric plane (12) upper port.
9. the encapsulation interlayer antenna of a kind of phase place impedance calibration according to claim 6, it is characterized in that selecting the position in head end straightway in the metallization arrays of vias (17) or the polygon on the left side dielectric-filled waveguide (18), so that arrive on the bore face (12) of antenna by the Multi-path electricity magnetic wave homophase of dielectric-filled waveguide (18) transmission.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201210562981.XA CN103022668B (en) | 2012-12-21 | 2012-12-21 | Packaged sandwich antenna with phase and impedance calibration functions |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210562981.XA CN103022668B (en) | 2012-12-21 | 2012-12-21 | Packaged sandwich antenna with phase and impedance calibration functions |
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| Publication Number | Publication Date |
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| CN103022668A true CN103022668A (en) | 2013-04-03 |
| CN103022668B CN103022668B (en) | 2015-03-04 |
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| CN201210562981.XA Expired - Fee Related CN103022668B (en) | 2012-12-21 | 2012-12-21 | Packaged sandwich antenna with phase and impedance calibration functions |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103022669A (en) * | 2012-12-21 | 2013-04-03 | 东南大学 | Planar horn antenna with phase and impedance calibration functions |
| CN103022667A (en) * | 2012-12-21 | 2013-04-03 | 东南大学 | Packaged sandwich antenna with impedance calibration function |
| CN104733847A (en) * | 2015-03-30 | 2015-06-24 | 东南大学 | Three-dimensional packaging surface antenna for gap embedded phase position calibration |
| WO2016178609A1 (en) * | 2015-05-07 | 2016-11-10 | Telefonaktiebolaget Lm Ericsson (Publ) | Improved antenna |
| CN113594714A (en) * | 2021-07-20 | 2021-11-02 | 河海大学 | Millimeter wave antenna array for air substrate integrated waveguide horn feed |
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| US3573838A (en) * | 1968-10-28 | 1971-04-06 | Hughes Aircraft Co | Broadband multimode horn antenna |
| CN101179155B (en) * | 2007-11-12 | 2011-08-24 | 杭州电子科技大学 | H face sectoral horn antenna including filter function |
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2012
- 2012-12-21 CN CN201210562981.XA patent/CN103022668B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3573838A (en) * | 1968-10-28 | 1971-04-06 | Hughes Aircraft Co | Broadband multimode horn antenna |
| CN101179155B (en) * | 2007-11-12 | 2011-08-24 | 杭州电子科技大学 | H face sectoral horn antenna including filter function |
Non-Patent Citations (1)
| Title |
|---|
| MICHAEL WONG等: "A Broadside Substrate Integrated Horn Antenna", 《IEEE》, 31 December 2008 (2008-12-31) * |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103022669A (en) * | 2012-12-21 | 2013-04-03 | 东南大学 | Planar horn antenna with phase and impedance calibration functions |
| CN103022667A (en) * | 2012-12-21 | 2013-04-03 | 东南大学 | Packaged sandwich antenna with impedance calibration function |
| CN103022669B (en) * | 2012-12-21 | 2014-10-29 | 东南大学 | Planar horn antenna with phase and impedance calibration functions |
| CN103022667B (en) * | 2012-12-21 | 2014-12-17 | 东南大学 | Packaged sandwich antenna with impedance calibration function |
| CN104733847A (en) * | 2015-03-30 | 2015-06-24 | 东南大学 | Three-dimensional packaging surface antenna for gap embedded phase position calibration |
| WO2016178609A1 (en) * | 2015-05-07 | 2016-11-10 | Telefonaktiebolaget Lm Ericsson (Publ) | Improved antenna |
| US10522919B2 (en) | 2015-05-07 | 2019-12-31 | Telefonaktiebolaget Lm Ericsson (Publ) | Surface integrated waveguide antenna and a transceiver including a surface integrated waveguide antenna array |
| CN113594714A (en) * | 2021-07-20 | 2021-11-02 | 河海大学 | Millimeter wave antenna array for air substrate integrated waveguide horn feed |
| CN113594714B (en) * | 2021-07-20 | 2022-05-17 | 河海大学 | Millimeter wave antenna array for air substrate integrated waveguide horn feed |
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