CN103022667A - Packaged sandwich antenna with impedance calibration function - Google Patents
Packaged sandwich antenna with impedance calibration function Download PDFInfo
- Publication number
- CN103022667A CN103022667A CN2012105629735A CN201210562973A CN103022667A CN 103022667 A CN103022667 A CN 103022667A CN 2012105629735 A CN2012105629735 A CN 2012105629735A CN 201210562973 A CN201210562973 A CN 201210562973A CN 103022667 A CN103022667 A CN 103022667A
- Authority
- CN
- China
- Prior art keywords
- antenna
- waveguide
- dielectric
- impedance
- metallization
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Landscapes
- Waveguide Aerials (AREA)
Abstract
The invention discloses a packaged sandwich antenna with an impedance calibration function, and relates to a horn antenna. The packaged sandwich antenna comprises a micro-strip feeder (1), a horn antenna (2) and metallized via holes (3) which are integrated on a dielectric substrate (4), wherein the dielectric substrate (4) is arranged on an inner layer of a three-dimensional package (5), one end of the micro-strip feeder (1) is connected with internal circuits (8) by coplanar waveguides (7) on a side surface of the package, the horn antenna (2) comprises a bottom metal plane (9), a top metal plane (10) and metallized via hole side walls (11), via hole arrays (17) consisting of the metallized via holes (3) form a plurality of dielectric-filled waveguides (18) in the horn antenna (2), and the wave impedance of each dielectric-filled waveguide on an antenna aperture plane (12) is equal to the wave impedance of free space. The packaged sandwich antenna has the advantages that return loss of the antenna can be reduced, and gain of the antenna can be increased.
Description
Technical field
The present invention relates to a kind of horn antenna, especially a kind of encapsulation interlayer antenna of impedance calibration.
Background technology
Adopt lamination 3-D multi-chip (3D-MCM) technology, can be integrated in a radio system in the 3-D stacks encapsulation.Normally surperficial antenna integrated in encapsulation for example is integrated in paster antenna the top of encapsulation.But need sometimes antenna is integrated in a middle interlayer of encapsulation to satisfy the needs of system.If integrated horn antenna just can be realized above-mentioned requirements in the inner interlayer of encapsulation.But usually horn antenna is nonplanar, with incompatible, the larger physical dimension that has of planar circuit technique, thereby has limited its application on encapsulating structure.In recent years, substrate integration wave-guide horn antenna based on the substrate integrated waveguide technology development has the advantages that size is little, lightweight, be easy to Planar integration, but the gain of traditional substrate integration wave-guide horn antenna is relatively low, its reason is because horn mouth constantly opens, electromagnetic wave impedance is different from the wave impedance of free space on the bore face, can cause reflection of electromagnetic wave, the return loss that has affected antenna and radiance on medium and air interface.The methods such as at present existing employing medium loading, medium prism, correct the asynchronous of horn mouth diametric plane phase place, but these methods all can not be improved the inconsistent of horn antenna and free space wave impedance on the bore face, and these phase alignment structures have increased the overall structure size of antenna, are not suitable for being integrated into the inner interlayer of encapsulation.
Summary of the invention
Technical problem: the encapsulation interlayer antenna that the objective of the invention is to propose a kind of impedance calibration, this antenna inside is embedded with inconsistent with RECTIFYING ANTENNA and free space wave impedance of metallization arrays of vias, reduce the reflection of three-dimension packaging interlayer antenna, improve the gain of antenna.
Technical scheme: the encapsulation interlayer antenna package of a kind of impedance calibration of the present invention is drawn together microstrip feed line, substrate integration wave-guide horn antenna and the embedded metal via hole that is arranged on the medium substrate, and medium substrate is at the internal layer of three-dimension packaging; Described microstrip feed line links to each other with the internal circuit of three-dimension packaging by co-planar waveguide; The substrate integration wave-guide horn antenna is comprised of with the metallization via hole loudspeaker sidewall that is connected medium substrate and connects bottom surface metal flat end face metal flat the bottom surface metal flat that is positioned at medium substrate one side, the end face metal flat that is positioned at the medium substrate another side; Metallization via hole embedded in the substrate integration wave-guide horn antenna connects bottom surface metal flat and end face metal flat, and consists of a plurality of metallization arrays of vias; The metallization arrays of vias forms a plurality of dielectric-filled waveguides at horn antenna, and the wave impedance of dielectric-filled waveguide port is the same with the wave impedance of free space on the antenna opening diametric plane.
One end of described microstrip feed line links to each other with horn antenna, and the other end of microstrip feed line is the input/output port of antenna near package side surface; Microstrip feed line links to each other with an end of the co-planar waveguide of package side surface by the antenna input/output port, and the other end of co-planar waveguide links to each other with the encapsulation internal circuit.
Described substrate integration wave-guide horn antenna is made of narrow Cross-section Waveguide Using, tubaeform waveguide and wide Cross-section Waveguide Using serial connection; One end of narrow Cross-section Waveguide Using is short circuit face, the other end of narrow Cross-section Waveguide Using links to each other with tubaeform waveguide, one end of tubaeform waveguide links to each other with narrow Cross-section Waveguide Using, and the other end of tubaeform waveguide links to each other with wide Cross-section Waveguide Using, and the other end of wide Cross-section Waveguide Using is the antenna opening diametric plane.
The shape of described metallization arrays of vias can be one section straight line, also can be straight line, broken line or exponential line or other curve and combination thereof.
Described metallization arrays of vias all be head end all towards the microstrip feed line direction, tail end is on the antenna opening diametric plane.
The width of described dielectric-filled waveguide will guarantee that all its main mould can transmit and is not cut off in dielectric-filled waveguide.
A port of described dielectric-filled waveguide is all towards the microstrip feed line direction, and its another port is all on the antenna opening diametric plane, and dielectric-filled waveguide is all the same at the width of antenna opening diametric plane upper port.
In the described metallization via hole loudspeaker sidewall, the spacing of two adjacent metallization via holes is less than or equals 1/10th of operation wavelength, so that the metallization via hole loudspeaker sidewall that consists of can equivalence be electric wall.
In the described metallization via hole, the spacing of two adjacent metallization via holes will be equal to or less than 1/10th of operation wavelength, so that the metallization arrays of vias that consists of can equivalence be electric wall.
In dielectric-filled waveguide, the propagating wave impedance of electromagnetic wave master mould (TE10 mould) is all relevant with the width of dielectric-filled waveguide, and the width of dielectric-filled waveguide is wider, and the propagating wave impedance of main mould is just lower; Otherwise the width of dielectric-filled waveguide is narrower, and the propagating wave impedance of main mould is just higher.Co-planar waveguide from the electromagnetic wave signal process three-dimension packaging side that encapsulates internal circuit enters the antenna input/output port, enter into the substrate integration wave-guide horn antenna by microstrip feed line again, after propagating a segment distance to the bore face direction of antenna, run into the metallization arrays of vias, just be divided into multichannel and enter respectively the transmission of a plurality of dielectric-filled waveguides, be transferred to radiation on the bore face of antenna by these dielectric-filled waveguides again.The port width of dielectric-filled waveguide equates on the bore face of antenna like this, because the wave impedance of electromagnetic wave in dielectric-filled waveguide equals the wave impedance of free space on the bore face of antenna, namely the port width a of dielectric-filled waveguide satisfies condition
Namely port width a equals free space wavelength λ except subtracting 1 subduplicate twice in medium relative dielectric constant ε, so the reflection of antenna opening diametric plane is just little.
Beneficial effect: the beneficial effect of the encapsulation interlayer antenna of impedance calibration of the present invention is that the wave impedance of magnetic wave equals the wave impedance of free space so that the antenna opening diametric plane powers on, thereby has reduced the return loss of three-dimension packaging interlayer antenna and the gain that has improved antenna.
Description of drawings
Fig. 1 is the three-dimension packaging overall structure schematic diagram of the encapsulation interlayer antenna of impedance calibration.
Fig. 2 is the encapsulation interlayer antenna face structural representation of impedance calibration.
Fig. 3 is the encapsulation interlayer antenna reverse side structural representation of impedance calibration.
Have among the figure: microstrip feed line 1, substrate integration wave-guide horn antenna 2, embedded metal via hole 3, medium substrate 4, three-dimension packaging 5, the bore face 12 of antenna input/output port 6, co-planar waveguide 7, internal circuit 8, bottom surface metal flat 9, end face metal flat 10, metallization via hole loudspeaker sidewall 11, antenna, the narrow Cross-section Waveguide Using 13 of antenna, the tubaeform waveguide 14 of antenna, wide Cross-section Waveguide Using 15, ground plane 16, metallization arrays of vias 17 and the dielectric-filled waveguide 18 of antenna.
Embodiment
The invention will be further described below in conjunction with drawings and Examples.
Embodiment of the present invention is: the encapsulation interlayer antenna of impedance calibration is comprised of microstrip feed line 1, substrate integration wave-guide horn antenna 2 and embedded metal via hole 3 three parts, this three part all is integrated on the same medium substrate 4, and this medium substrate is positioned at the internal layer of 4 3-dimensional multi-layered encapsulation 5; One termination substrate integration wave-guide horn antenna 2 of microstrip feed line 1, microstrip feed line 1 other end is near package side surface, it is the input/output port 6 of antenna, the input/output port 6 of antenna is spent to cross with the co-planar waveguide 7 of package side surface by little band and co-planar waveguide 90 and is linked to each other, and the other end of co-planar waveguide 7 links to each other with encapsulation internal circuit 8; Substrate integration wave-guide horn antenna 2 is comprised of bottom surface metal flat 9, end face metal flat 10 and metallization via hole loudspeaker sidewall 11, bottom surface metal flat 9 and end face metal flat 10 lay respectively at the two sides of medium substrate 4, and metallization via sidewall 11 connects bottom surface metal flat 9 and end face metal flat 10; The inside of horn antenna 2 is by narrow Cross-section Waveguide Using 13, and tubaeform waveguide 14 and wide Cross-section Waveguide Using 15 3 parts serial connection form; One termination microstrip feed line 1 of horn antenna 2, bottom surface metal flat 9 is connected with the ground plane 16 of microstrip feed line 1, the other end of horn antenna 2 is bore faces 12 of antenna, metallization via hole 3 embedded in substrate integration wave-guide horn antenna 2 connects bottom surface metal flat 9 and end face metal flat 10, and these embedded metallization via holes 3 consist of metallization arrays of vias 17; All towards the direction of microstrip feed line 1, the tail end of metallization arrays of vias 17 is on the bore face 12 of horn antenna 2 for shape straight line or the broken line of metallization arrays of vias 17, the head end of metallization arrays of vias 17; Metallization arrays of vias 17 forms a plurality of dielectric-filled waveguides 18 in antenna 2, and sets the width of dielectric-filled waveguide 18 so that the wave impedance of these dielectric-filled waveguides on antenna opening diametric plane 12 all equals the wave impedance of free space.
In dielectric-filled waveguide, the wave impedance of the propagation of electromagnetic wave master mould (TE10 mould) is relevant with the width of dielectric-filled waveguide 18, and the width of dielectric-filled waveguide 18 is wider, and the wave impedance of main mould is just lower; Otherwise dielectric-filled waveguide 18 width are narrower, and the wave impedance of main mould is just higher.Co-planar waveguide 7 from electromagnetic wave signal process three-dimension packaging 5 sides that encapsulate internal circuit 8 enters antenna input/output port 6, enter into substrate integration wave-guide horn antenna 2 by microstrip feed line 1 again, after propagating a segment distance, run into metallization arrays of vias 17, electromagnetic wave just is divided into multichannel and enters respectively in direction transmission from each dielectric-filled waveguide 18 to antenna opening diametric plane 12; Because the wave impedance of each dielectric-filled waveguide 18 port equals the wave impedance of free space on the antenna opening diametric plane, namely the port width a of dielectric-filled waveguide 18 satisfies condition
Namely port width a equals free space wavelength λ except subtracting 1 subduplicate twice in medium relative dielectric constant ε, so the reflection of antenna opening diametric plane is just little, thereby reaches the aperture efficiency that improves antenna and the purpose of gain.
On technique, the encapsulation interlayer antenna of impedance calibration both can adopt the three-dimensional resinous packaging technology, also can adopt LTCC (LTCC) technique to realize.Via hole 3 and the metallization via sidewall 11 of wherein metallizing can be that the hollow metal through hole also can be the solid metal hole, also can be continuous metallization wall, and the shape of metal throuth hole can be circular, also can be square or other shapes.
Structurally, equate condition owing to will satisfy wave impedance, the port width of dielectric-filled waveguide 18 is certain, thereby the width of antenna opening diametric plane 12 just can not Set arbitrarily, because keep dielectric-filled waveguide 18 to equal the wave impedance of free space in the wave impedance of port, the dielectric constant of medium substrate 4 is certain, and then the port width of dielectric-filled waveguide 18 is also certain, therefore the dielectric-filled waveguide quantity at antenna opening diametric plane 12 places doubles, and bore face 12 width of antenna also will double.According to same thinking, can increase dielectric-filled waveguide 18 quantity, and so that on antenna opening diametric plane 12 these dielectric-filled waveguide 18 port wave impedance all equal the wave impedance of free space, the reflection of antenna is little like this, but the width of antenna opening diametric plane 12 is also wanted corresponding increase.Because the metallization via sidewall 11 the closer to antenna, the distance that electromagnetic wave arrives antenna opening diametric plane 12 is far away, therefore with respect to from the dielectric-filled waveguide of metallization via sidewall 11 away from, from the width relative narrower of the dielectric-filled waveguide of metallization via sidewall 11 close to obtain higher electromagnetic transmission phase velocity.The shape of metallization arrays of vias 17 can be straight line, broken line, exponential line, polygon or other curve.
According to the above, just can realize the present invention.
Claims (9)
1. the encapsulation interlayer antenna of an impedance calibration, it is characterized in that this antenna comprises microstrip feed line (1), substrate integration wave-guide horn antenna (2) and the embedded metal via hole (3) that is arranged on the medium substrate (4), medium substrate (4) is at the internal layer of three-dimension packaging (5); Described microstrip feed line (1) links to each other with the internal circuit (8) of three-dimension packaging (5) by co-planar waveguide (7); Substrate integration wave-guide horn antenna (2) is comprised of the bottom surface metal flat (9) that is positioned at medium substrate (4) one side, the metallization via hole loudspeaker sidewalls (11) that are positioned at the end face metal flat (10) of medium substrate (4) another side and are connected medium substrate (4) connection bottom surface metal flat (9) end face metal flat (10); Metallization via hole (3) embedded in the substrate integration wave-guide horn antenna (2) connects bottom surface metal flat (9) and end face metal flat (10), and consists of a plurality of metallization arrays of vias (17); Metallization arrays of vias (17) forms a plurality of dielectric-filled waveguides (18) at horn antenna (2), and is the same with the wave impedance of free space in the wave impedance of upper dielectric-filled waveguide (18) port of antenna opening diametric plane (12).
2. the encapsulation interlayer antenna of a kind of impedance calibration according to claim 1, an end that it is characterized in that described microstrip feed line (1) links to each other with horn antenna (2), the other end of microstrip feed line (1) is the input/output port (6) of antenna near package side surface; Microstrip feed line (1) links to each other with an end of the co-planar waveguide (7) of package side surface by antenna input/output port (6), and the other end of co-planar waveguide (7) links to each other with encapsulation internal circuit (8).
3. the encapsulation interlayer antenna of a kind of impedance calibration according to claim 1 is characterized in that described substrate integration wave-guide horn antenna (2) is made of narrow Cross-section Waveguide Using (13), tubaeform waveguide (14) and wide Cross-section Waveguide Using (15) serial connection; One end of narrow Cross-section Waveguide Using (13) is short circuit face (16), the other end of narrow Cross-section Waveguide Using (13) links to each other with tubaeform waveguide (14), one end of tubaeform waveguide (14) links to each other with narrow Cross-section Waveguide Using (13), the other end of tubaeform waveguide (14) links to each other with wide Cross-section Waveguide Using (15), and the other end of wide Cross-section Waveguide Using (15) is antenna opening diametric plane (12).
4. the encapsulation interlayer antenna of a kind of impedance calibration according to claim 1, the shape that it is characterized in that described metallization arrays of vias (17) can be one section straight line, also can be straight line, broken line or exponential line or other curve and combination thereof.
5. according to claim 1 or the encapsulation interlayer antenna of 4 described a kind of impedance calibrations, it is characterized in that described metallization arrays of vias (17) all be head end all towards microstrip feed line (1) direction, tail end is on antenna opening diametric plane (12).
6. the encapsulation interlayer antenna of a kind of impedance calibration according to claim 1, the width that it is characterized in that described dielectric-filled waveguide (18) will guarantee that all its main mould can transmit and is not cut off in dielectric-filled waveguide (18).
7. according to claim 1 or the encapsulation interlayer antenna of 6 described a kind of impedance calibrations, it is characterized in that a port of described dielectric-filled waveguide (18) is all towards microstrip feed line (1) direction, its another port is all on antenna opening diametric plane (12), and dielectric-filled waveguide (18) is all the same at the width of antenna opening diametric plane (12) upper port.
8. the encapsulation interlayer antenna of a kind of impedance calibration according to claim 1, it is characterized in that in the described metallization via hole loudspeaker sidewalls (11), the spacing of two adjacent metallization via holes is less than or equals 1/10th of operation wavelength, so that the metallization via hole loudspeaker sidewalls (11) that consist of can equivalence be electric wall.
9. the encapsulation interlayer antenna of a kind of impedance calibration according to claim 1, it is characterized in that in the described metallization via hole (3), the spacing of adjacent two metallization via holes (3) will be equal to or less than 1/10th of operation wavelength, so that the metallization arrays of vias (17) that consists of can equivalence be electric wall.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210562973.5A CN103022667B (en) | 2012-12-21 | 2012-12-21 | Packaged sandwich antenna with impedance calibration function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210562973.5A CN103022667B (en) | 2012-12-21 | 2012-12-21 | Packaged sandwich antenna with impedance calibration function |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103022667A true CN103022667A (en) | 2013-04-03 |
| CN103022667B CN103022667B (en) | 2014-12-17 |
Family
ID=47970959
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210562973.5A Expired - Fee Related CN103022667B (en) | 2012-12-21 | 2012-12-21 | Packaged sandwich antenna with impedance calibration function |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103022667B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103904396A (en) * | 2014-03-14 | 2014-07-02 | 中国电子科技集团公司第十三研究所 | Millimeter wave chip gas tightness packaging structure based on SIW |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101179155A (en) * | 2007-11-12 | 2008-05-14 | 杭州电子科技大学 | H face sectoral horn antenna including filter function |
| US20090066597A1 (en) * | 2007-09-07 | 2009-03-12 | Songnan Yang | Substrate Integrated Waveguide Antenna Array |
| CN102324627A (en) * | 2011-09-06 | 2012-01-18 | 电子科技大学 | Miniaturization substrate integrated multi-beam antenna |
| CN103022668A (en) * | 2012-12-21 | 2013-04-03 | 东南大学 | Packaged sandwich antenna with phase and impedance calibration functions |
-
2012
- 2012-12-21 CN CN201210562973.5A patent/CN103022667B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090066597A1 (en) * | 2007-09-07 | 2009-03-12 | Songnan Yang | Substrate Integrated Waveguide Antenna Array |
| CN101179155A (en) * | 2007-11-12 | 2008-05-14 | 杭州电子科技大学 | H face sectoral horn antenna including filter function |
| CN102324627A (en) * | 2011-09-06 | 2012-01-18 | 电子科技大学 | Miniaturization substrate integrated multi-beam antenna |
| CN103022668A (en) * | 2012-12-21 | 2013-04-03 | 东南大学 | Packaged sandwich antenna with phase and impedance calibration functions |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103904396A (en) * | 2014-03-14 | 2014-07-02 | 中国电子科技集团公司第十三研究所 | Millimeter wave chip gas tightness packaging structure based on SIW |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103022667B (en) | 2014-12-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103022708A (en) | Phase-calibrated SIW (substrate integrated waveguide) antenna with embedded plated through holes | |
| CN103022707B (en) | Planar horn antenna with impedance calibration function | |
| CN103022668B (en) | Packaged sandwich antenna with phase and impedance calibration functions | |
| CN103022709B (en) | Phase-calibrated packaged sandwich antenna with embedded plated through holes | |
| CN103022675B (en) | Three-dimensional surface antenna for phase calibration | |
| CN103022674A (en) | Phase- and amplitude-calibrated 3D-package surface antenna with embedded plated through holes | |
| CN103022679B (en) | Amplitude impedance calibrated package interlayer antenna | |
| CN103022667B (en) | Packaged sandwich antenna with impedance calibration function | |
| CN103022672B (en) | Package sandwich antenna for phase amplitude calibration | |
| CN103022712B (en) | Phase- and amplitude-calibrated packaged sandwich antenna with embedded plated through holes | |
| CN103022671B (en) | Amplitude-calibrated packaging interlayer antenna | |
| CN103022714A (en) | Amplitude impedance calibrated planar horn antenna | |
| CN103022676A (en) | Amplitude impedance calibrated three-dimensional package surface antenna | |
| CN103022681A (en) | Amplitude-calibrated SIW (substrate integrated waveguide) antenna with embedded pated through holes | |
| CN103022669B (en) | Planar horn antenna with phase and impedance calibration functions | |
| CN103022673B (en) | Package sandwich antenna for phase amplitude impedance calibration | |
| CN103022711B (en) | Package sandwich antenna for phase calibration | |
| CN103022710B (en) | Amplitude-calibrated packaged sandwich antenna with embedded plated though holes | |
| CN103022665B (en) | Three-dimensional integration surface antenna of impedance calibration | |
| CN103022718A (en) | Three-dimensional package surface antenna for phase amplitude calibration | |
| CN103022670B (en) | Amplitude-calibrated 3D-package surface antenna with embedded plated through holes | |
| CN103022666A (en) | Planar horn antenna for phase amplitude impedance calibration | |
| CN103022706A (en) | Substrate integrated waveguide antenna with embedded metalized via holes for phase and range calibration | |
| CN103022680B (en) | Phase-calibrated 3D-package surface antenna with embedded plated through holes | |
| CN103022678B (en) | Antenna with phase and impedance calibration functions on three-dimensional packaging surface |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141217 Termination date: 20171221 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |