CN103022333B - 一种led芯粒的固晶方法 - Google Patents

一种led芯粒的固晶方法 Download PDF

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CN103022333B
CN103022333B CN201210542245.8A CN201210542245A CN103022333B CN 103022333 B CN103022333 B CN 103022333B CN 201210542245 A CN201210542245 A CN 201210542245A CN 103022333 B CN103022333 B CN 103022333B
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core particle
led core
die
bonding method
led
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CN103022333A (zh
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林科闯
廖泳
包书林
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Quanzhou Sanan Semiconductor Technology Co Ltd
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Xiamen Sanan Optoelectronics Technology Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1225—Screens or stencils; Holders therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder

Abstract

本发明涉及一种LED芯粒的固晶方法，具体为采用SMT表面贴装技术（Surface？Mounted？Technology的缩写）对LED芯粒进行固晶的方法。

Description

一种LED芯粒的固晶方法
技术领域
本发明涉及一种LED芯粒的固晶方法，具体为采用SMT表面贴装技术（SurfaceMountedTechnology的缩写）对LED芯粒进行固晶的方法。
背景技术
目前白光LED已产业化并推向市场，并向普通照明市场迈进。由于成本的限制，LED芯粒的尺寸不断缩小，但是其输入电流却不断提高，因此对LED的封装技术提出了更高的要求。LED封装既要有高的取光效率，又要热阻尽可能低以延缓LED亮度的衰减，同时还要求效率足够高以降低生产成本。
随着LED功率的增大，目前低热导率的银胶（导热系数一般为1.5~15W/m·K）已难以满足功率LED的散热需求，而锡或者金锡都是金属材料，导热系数高，剪切强度好，固化时间快，缩短整个工艺流程的时间，且大大降低固晶成本，所以采用共晶焊接已成为功率LED封装的发展趋势。共晶焊接方式大大降低了芯片与支架之间的热阻，提高了导热性能。共晶焊接目前有两种方式：一种就是；晶粒底部采用纯锡（Sn）或金锡（Au~Sn）合金作接触面镀层，晶粒可焊接于镀有金或银的基板上，当基板被加热至适合的共晶温度时，令共晶层固化并将LED紧固的焊于热沉或基板上，但这种方式焊接效率低下（低于5K/H）；另一种是直接用锡膏代替导电银胶涂布后进行回流焊接，但这种方式对锡膏的涂布尺寸控制要求很高，LED芯粒极容易漂移造成焊接不良。
发明内容
本发明的目的就是针对现有技术存在的不足，提供一种简便、快速的固晶焊接方法，不仅能适应中小尺寸LED芯粒，而且对LED集成应用会产生积极的影响。
为实现本发明之目的，本发明将通过以下的技术方案来实现：一种LED芯粒的固晶焊接方法，其包括步骤：1）提供一激光雕刻钢网，且钢网孔的尺寸比芯粒小0.03~0.1mm；2）提供一PCB，此处PCB是指设计有布线层的铝基板或玻纤板，在其预定的位置上丝印涂布锡膏；3）提供待固晶的LED芯粒，其包装于载带内；4）采用表面贴片设备将载带内的LED芯粒吸附置放于印有锡膏的PCB上；5）将有LED芯粒的PCB板进行回流焊接。
在步骤2）中，所述锡膏为超细粉锡膏，粉径为10~20μm，能有效满足10~50mil（0.25~1.25mm）尺寸范围内LED晶片的焊接。在本发明的优选实施例中，采用丝印涂布锡膏。
在步骤3）中，LED芯粒为未做封装处理的裸晶，优选为倒装结构的LED芯粒。
本发明的其它特征和优点将在随后的说明书中阐述，并且，部分地从说明书中变得显而易见，或者通过实施本发明而了解。本发明的目的和其他优点可通过在说明书、权利要求书以及附图中所特别指出的结构来实现和获得。
附图说明
图1为依据本发明实施的一种待固晶的LED芯粒的结构简图，其中21为N电极，22为P电极。
图2为依据本发明实施的一种LED芯粒的固晶过程示意图。其中，13为PCB板，11和12为印刷在PCB板上的锡膏，分别对应LED芯粒的N电极和P电极。
具体实施方式
以下将结合附图及实施例来详细说明本发明的实施方式，由实例所形成的技术方案均在本发明的保护范围之内。
满足LED导热散热需求的固晶键合材料中，锡膏的成本远远低于银胶和Au~Sn合金，且电阻小、传热快，具有更好的导热效果，且能大大降低固晶成本。选择合适的合金材料，即可满足ROHS指令要求。
下面实施例公开了一种新的LED芯粒固晶方式，其利用钢网在PCB预定的位置上精确丝印锡膏，采用SMT工艺的高速贴片设备将载带内的LED芯粒吸附置放于印有锡膏的PCB上。具体包括下面步骤：1）提供一PCB与对应的钢网，在PCB预定的位置上涂布锡膏；2）提供待固晶的LED芯粒，其包装于载带内；3）采用表面贴片设备将载带内的LED芯粒吸附置放于印有锡膏的PCB上；4）通过回流焊将LED芯粒焊接于所述PCB板上，完成固晶。
首先，采用超细锡膏代替现有的导电银胶和导热胶等固晶材料，锡膏粉径为10~20μm，能有效满足10~50mil（0.25~1.25mm）尺寸范围内LED晶片的焊接。超细锡粉的粒径均匀，配合高触变性的助焊膏，触变性好，不会引起晶片的漂移，残留物极少，焊接机械强度比银胶高。
接着，按照LED芯粒及PCB的尺寸，利用激光雕刻机雕刻钢网，且钢网孔的尺寸比芯粒小0.03~0.1mm；后采用丝印涂布锡膏，精确控制锡膏的面积与厚度。
然后，将载带包装的LED芯粒，利用高速精准的表面贴片设备，从载带中吸附LED芯粒，准确置放于备有锡膏的PCB上。其中，表面贴片设备的定位精度要求X/Y偏移<0.03mm。
最后，利用热风回流焊或台式回流焊，将回流炉的温度直接设定在合金焊接温度点即可。一般焊接过程可在6min内完成，而银胶一般为90min，减少了能耗。
下面结合附图及实施例对本发明的实施做进一步说明。
选择24×12mil的LED芯粒，芯粒高度6mil，公制尺寸为0.6×0.3×0.15mm，其结构简图如图1所示，其中21为N电极，22为P电极。
选择厚度约0.1mm的钢网，依据上述尺寸，设计钢网孔的尺寸比芯粒小0.03~0.1mm并进行激光雕刻，后将钢网固定于PCB上，采用丝印机印刷锡膏，其结构简图如图2所示，其中13为PCB板，11和12为印刷在PCB板上的锡膏，分别对应LED芯粒的N电极和P电极。
将置放LED芯粒的载带装配在SMT贴片机的夹具上，利用SMT贴片工艺的吸附动作将LED芯粒准确置放于涂覆有锡膏的PCB上。
将装配完毕的PCB送于热风回流焊机，按照锡膏的成分预置回流参数，热风回流成型即可。
采用本实施例的固晶方法对LED芯粒进行固定，至少具有以下积极效果：1）采用高速SMT设备，加快了LED芯粒的固晶速度，可达20K/H；2）利用钢网丝印锡膏，确保锡膏的面积与厚度均匀控制；3）锡膏焊接牢固，性能可靠，具有极低的热阻，导热性能优良；4）在倒装芯片中应用，可直接实现从LED芯片到照明单元，使LED应用有效降低中间成本，促进LED照明发展。
本发明适用于LEDCOB共晶焊固晶工艺，尤其是倒装结构LED固晶制程工艺。

Claims (5)

1.一种LED芯粒的固晶方法，其包括步骤：
1）提供一钢网，且钢网孔的尺寸比芯粒小0.03~0.1mm；
2）提供一PCB，此处PCB是指设计有布线层的铝基板或玻纤板，在其预定的位置上丝印涂布锡膏；
3）提供待固晶的LED芯粒，所述LED芯粒为未做封装处理的裸晶，其尺寸为10~50mil，包装于载带内；
4）采用表面贴片设备将载带内的LED芯粒吸附置放于印有锡膏的PCB上；
5）将包含LED芯粒的PCB板，送入回流焊接设备完成固晶焊接。
2.根据权利要求1所述的一种LED芯粒的固晶方法，其特征在于：所述钢网采用激光雕刻。
3.根据权利要求1所述的一种LED芯粒的固晶方法，其特征在于：步骤2）中，所述锡膏为超细粉锡膏，粉径为10~20μm。
4.根据权利要求1所述的一种LED芯粒的固晶方法，其特征在于：步骤3）中,所述LED芯粒为倒装结构的LED芯粒。
5.根据权利要求1所述的一种LED芯粒的固晶方法，其特征在于：步骤4）中，所述表面贴片设备的定位精度要求X/Y偏移<0.03mm。
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CN103022333B (zh) * 2012-12-14 2016-04-27 厦门市三安光电科技有限公司 一种led芯粒的固晶方法
CN104167380A (zh) * 2014-05-30 2014-11-26 上海芯哲微电子科技有限公司 一种smt贴片封装结构的smt贴片封装方法
CN105304788A (zh) * 2014-07-04 2016-02-03 利亚德光电股份有限公司 发光二极管的封装方法、封装装置及封装线
CN104599990A (zh) * 2015-01-13 2015-05-06 中国科学院半导体研究所 Led共晶焊方法
CN106159070B (zh) * 2016-08-26 2019-01-15 曾广祥 一种高密显示屏单元板及其制作方法

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