CN103021875A - Flat packaging part manufacturing process based on AAQFN frame product secondary plastic package - Google Patents
Flat packaging part manufacturing process based on AAQFN frame product secondary plastic package Download PDFInfo
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- CN103021875A CN103021875A CN2012105232580A CN201210523258A CN103021875A CN 103021875 A CN103021875 A CN 103021875A CN 2012105232580 A CN2012105232580 A CN 2012105232580A CN 201210523258 A CN201210523258 A CN 201210523258A CN 103021875 A CN103021875 A CN 103021875A
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- plastic packaging
- aaqfn
- framework
- plastic package
- secondary plastic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
- H01L2224/92—Specific sequence of method steps
- H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
- H01L2224/9222—Sequential connecting processes
- H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
- H01L2224/92247—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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Abstract
The invention relates to a flat packaging part manufacturing process based on AAQFN frame product secondary plastic package and belongs to the technical field of integrated circuit package. First grooves are formed on a frame in a corrosive mode, plastic package materials are filled into the grooves for primary plastic package, ball mounting is performed after back etching, the secondary plastic package is performed finally, the thickness of a whole product can be reduced, and the development requirements are met. In particularly, plastic package materials for the secondary plastic package, the package materials for the primary plastic package and the frame can form an effective anti-pulling structure, reliability of a packaging part is remarkably improved, the process is practical, and production efficiency is high.
Description
Technical field
The present invention relates to a kind of flat packaging part manufacture craft based on AAQFN shell frame products secondary plastic packaging, belong to the integrated antenna package technical field.
Background technology
Integrated circuit is the core of information industry and new and high technology, is the basis of economic development.Integrated antenna package is the chief component of IC industry, and its development is accompanied by the increase of its function and device count always and strides forward.From the nineties in 20th century, it has entered the development track of many number of pins, thin space, small-sized slimming.Carrier-free Background Grid array packages (being AAQFN) is for adapting to the fast-developing a kind of new packing forms that is born of electronic product, is that complete electronic set is realized microminaturization, lightweight, networked requisite product.
Carrier-free Background Grid array packages element, the bottom does not have soldered ball, pin directly is connected with pcb board during welding, with the electric and mechanical connection of PCB be by Printing Paste on the PCB pad, the solder joint that cooperates the SMT reflow soldering process to form is realized.This technology encapsulation can realize many pins, high density, small-sized slimming encapsulation under the same size condition, have the characteristics such as thermal diffusivity, electrical property and coplanarity are good.
The AAQFN encapsulating products is applicable on a large scale, the encapsulation of very lagre scale integrated circuit (VLSIC).The device great majority of AAQFN encapsulation are used for the high-grade consumer goods markets such as mobile phone, network and communications equipment, digital camera, microcomputer, notebook computer and various types of flat panel display.Grasp its core technology, possess mass production capabilities, will greatly dwindle the gap of domestic IC industry and international most advanced level, this product has wide market application foreground.
But because restrictions such as technical difficulty, the at present popularization of AAQFN product on market acquires a certain degree of difficulty, and especially aspect reliability, directly affects use and the life-span of product, become the research of technique difficult point of AAQFN packaging part.
Summary of the invention
The problem that exists in order to overcome above-mentioned prior art, the invention provides a kind of flat packaging part manufacture craft based on AAQFN shell frame products secondary plastic packaging, the integrated circuit framework is combined more firm with plastic-sealed body, is not affected by the external environment, directly improve the package reliability of product.And reduce to a certain extent cost.
The technical solution used in the present invention: a kind of flat packaging part manufacture craft based on AAQFN shell frame products secondary plastic packaging, first at the method formation groove of framework with corrosion, plastic packaging is that plastic packaging material is filled into groove for the first time, behind the back etched, plant again ball, carry out at last the secondary plastic packaging, specifically carry out according to following steps;
The first step, attenuate: thickness thinning is 50 μ m～200 μ m;
Second step, scribing: the above wafer of 150 μ m adopts common Q FN scribing process, and thickness uses double-pole scribing machine and technique thereof at the following wafer of 150 μ m;
The 3rd step, framework etched recesses: do the part at the framework back side with liquor ferri trichloridi and window and etch partially, the formation groove, severity control is in half of frame thickness;
The 4th step, upper core: adopt core on the bonding die glue;
The 5th step, pressure welding;
The 6th step, a plastic packaging: carry out plastic packaging with traditional plastic packaging material;
The 7th step, laser cutting, rear curing, plant ball;
The 8th step, secondary plastic packaging: the secondary plastic packaging uses the plastic packaging material of 30 ~ 32um granularity to fill;
The 9th step, rear curing, mill glue, tin, printing, separation of products, check, packing.
The 4th step can adopt glue film (DAF) to replace bonding die glue in the described step; The 5th step, the 7th step, the 9th go on foot all identical with conventional AAQFN technique in the described step.
Beneficial effect of the present invention: at the method formation groove of framework with corrosion, plastic packaging is that plastic packaging material is filled into groove for the first time, behind the back etched first in the present invention, plant again ball, carry out at last the secondary plastic packaging, can effectively reduce the product integral thickness, the adapt to development demand; Especially for the second time the plastic packaging material of plastic packaging can and the first time plastic packaging plastic packaging material and framework between form more anti-traction structure, significantly improve the reliability of packaging part, and this method goes easily, production efficiency is high.
Description of drawings
Fig. 1 lead frame profile;
Profile after the top perforate of Fig. 2 framework;
Profile after the below perforate of Fig. 3 framework;
Product profile behind the core on Fig. 4;
Product profile after Fig. 5 pressure welding;
Plastic packaged products profile of Fig. 6;
Product profile behind Fig. 7 framework back etched;
Product profile after Fig. 8 laser cutting;
Fig. 9 plants product profile behind the ball;
Figure 10 secondary plastic packaged products profile.
Among the figure: 1-lead frame, 2-bonding die glue, 3-chip, 4-bonding line, 5-be plastic-sealed body, 6-framework upper grooves, 7-framework lower grooves, 8-tin ball, the 9-plastic-sealed body second time for the first time.
Embodiment
The present invention will be further described below in conjunction with drawings and Examples, understands to make things convenient for the technical staff.
Shown in Fig. 1-10: adopt method of the present invention to be used for single-chip package, product comprises lead frame 1, bonding die glue 2, chip 3, bonding line 4, plastic-sealed body 5, framework upper grooves 6, framework lower grooves 7, plants ball 8; Its chips 3 links to each other by bonding die glue 2 with lead frame 1; bonding line 4 is directly got on the lead frame 1 from chip 3; bonding die glue 2 on the lead frame 1; it is chip 3 on the bonding die glue 2; bonding wire between the solder joint on the chip 3 and interior pin is bonding line 4; plastic-sealed body 5 has surrounded lead frame 1; bonding die glue 2; chip 3; bonding line 4; framework upper grooves 6; framework lower grooves 7; plant ball 8 and consisted of the integral body of circuit; the bonding line 4 of 5 pairs of chips 3 of plastic-sealed body and plant ball 8 and played support and protective effect, chip 3; bonding line 4; lead frame 1 and plant power supply and the signalling channel that ball 8 has consisted of circuit.
A kind of flat packaging part manufacture craft based on AAQFN shell frame products secondary plastic packaging, at the method formation groove of framework with corrosion, plastic packaging is that plastic packaging material is filled into groove for the first time first, behind the back etched, plant again ball, carry out at last the secondary plastic packaging, specifically carry out according to following steps;
The first step, attenuate: thickness thinning is 50 μ m～200 μ m;
Second step, scribing: adopting thickness is the wafer of 100 μ m, uses double-pole scribing machine and technique thereof;
The 3rd step, framework etched recesses: do the part at the framework back side with liquor ferri trichloridi and window and etch partially, formation framework upper grooves 6 and framework lower grooves 7, severity control is in half of frame thickness;
The 4th step, upper core: adopt core on the bonding die glue 2;
The 5th step, pressure welding: pressure welding is identical with conventional AAQFN technique;
The 6th step, a plastic packaging: carry out plastic packaging with traditional plastic packaging material 9220;
The 7th step, laser cutting, rear curing, plant ball, identical with conventional AAQFN technique;
The 8th step, secondary plastic packaging: the secondary plastic packaging uses the plastic packaging material of 30um granularity to fill;
The 9th step, rear curing, mill glue, tin, printing, separation of products, check, packing are identical with conventional AAQFN technique.
The first step, attenuate: thickness thinning is 50 μ m～200 μ m;
Second step, scribing: adopting thickness is the wafer of 130 μ m, uses double-pole scribing machine and technique thereof;
The 3rd step, framework etched recesses: do the part at the framework back side with liquor ferri trichloridi and window and etch partially, formation framework upper grooves 6 and framework lower grooves 7, severity control is in half of frame thickness;
The 4th step, upper core: adopt core on the bonding die glue 2;
The 5th step, pressure welding: pressure welding is identical with conventional AAQFN technique;
The 6th step, a plastic packaging: carry out plastic packaging with traditional plastic packaging material 9220;
The 7th step, laser cutting, rear curing, plant ball, identical with conventional AAQFN technique;
The 8th step, secondary plastic packaging: the secondary plastic packaging uses the plastic packaging material of 31um granularity to fill;
The 9th step, rear curing, mill glue, tin, printing, separation of products, check, packing are identical with conventional AAQFN technique.
The first step, attenuate: thickness thinning is 50 μ m～200 μ m;
Second step, scribing: adopting thickness is the wafer of 170 μ m, identical with common Q FN scribing process;
The 3rd step, framework etched recesses: do the part at the framework back side with liquor ferri trichloridi and window and etch partially, formation framework upper grooves 6 and framework lower grooves 7, severity control is in half of frame thickness;
The 4th step, upper core: adopt the upper core of glue film (DAF);
The 5th step, pressure welding: pressure welding is identical with conventional AAQFN technique;
The 6th step, a plastic packaging: carry out plastic packaging with traditional plastic packaging material 9220;
The 7th step, laser cutting, rear curing, plant ball, identical with conventional AAQFN technique;
The 8th step, secondary plastic packaging: the secondary plastic packaging uses the plastic packaging material of 32um granularity to fill;
The 9th step, rear curing, mill glue, tin, printing, separation of products, check, packing are identical with conventional AAQFN technique.
The tradition ram frame is after plastic packaging operation plastic packaging material is filled, because framework itself is smooth smooth, the conjugation between plastic packaging material and the framework is low, the situation of layering very easily occurs, and the packaging part reliability can not be guaranteed.The plastic package process different from the past that the present invention adopts, behind the method formation groove of framework with corrosion, the method that adopts the secondary plastic packaging forms between framework and plastic packaging material, secondary plastic packaging material effectively prevents traction structure, greatly reduce the occurrence probability of packaging part layering situation, greatly improve product reliability, be better than the plastic packaging effect of traditional AQQFN product.
The present invention describes by specific implementation process, without departing from the present invention, can also carry out various conversion and be equal to replacement patent of the present invention, therefore, patent of the present invention is not limited to disclosed specific implementation process, and should comprise the whole embodiments that fall in the Patent right requirement scope of the present invention.
Claims (3)
1. flat packaging part manufacture craft based on AAQFN shell frame products secondary plastic packaging, it is characterized in that: first at the method formation groove of framework with corrosion, plastic packaging is that plastic packaging material is filled into groove for the first time, behind the back etched, plant again ball, carry out at last the secondary plastic packaging, specifically carry out according to following steps:
The first step, attenuate: thickness thinning is 50 μ m～200 μ m;
Second step, scribing: the above wafer of 150 μ m adopts common Q FN scribing process, and thickness uses double-pole scribing machine and technique thereof at the following wafer of 150 μ m;
The 3rd step, framework etched recesses: do the part at the framework back side with liquor ferri trichloridi and window and etch partially, the formation groove, severity control is in half of frame thickness;
The 4th step, upper core: adopt core on the bonding die glue;
The 5th step, pressure welding;
The 6th step, a plastic packaging: carry out plastic packaging with traditional plastic packaging material;
The 7th step, laser cutting, rear curing, plant ball;
The 8th step, secondary plastic packaging: the secondary plastic packaging uses the plastic packaging material of 30 ~ 32um granularity to fill;
The 9th step, rear curing, mill glue, tin, printing, separation of products, check, packing.
2. a kind of flat packaging part manufacture craft based on AAQFN shell frame products secondary plastic packaging according to claim 1 is characterized in that: the 4th step can adopt glue film (DAF) to replace bonding die glue in the described step.
3. a kind of flat packaging part manufacture craft based on AAQFN shell frame products secondary plastic packaging according to claim 1 is characterized in that: the 5th step in the described step, the 7th step, the 9th step are all identical with conventional AAQFN technique.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012105232580A CN103021875A (en) | 2012-12-09 | 2012-12-09 | Flat packaging part manufacturing process based on AAQFN frame product secondary plastic package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012105232580A CN103021875A (en) | 2012-12-09 | 2012-12-09 | Flat packaging part manufacturing process based on AAQFN frame product secondary plastic package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103021875A true CN103021875A (en) | 2013-04-03 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012105232580A Pending CN103021875A (en) | 2012-12-09 | 2012-12-09 | Flat packaging part manufacturing process based on AAQFN frame product secondary plastic package |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116373209A (en) * | 2023-06-05 | 2023-07-04 | 宁波中车时代传感技术有限公司 | Manufacturing method of plastic package current detection device and plastic package current detection device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101826501A (en) * | 2009-03-06 | 2010-09-08 | 李同乐 | Leadless integrated circuit package having high density contacts |
| CN102354691A (en) * | 2011-11-04 | 2012-02-15 | 北京工业大学 | Quad flat non-lead (QFN) package with high density and manufacturing method |
| CN102365737A (en) * | 2009-03-30 | 2012-02-29 | 凸版印刷株式会社 | Method of producing substrate for semiconductor element, and semiconductor device |
| CN101958300B (en) * | 2010-09-04 | 2012-05-23 | 江苏长电科技股份有限公司 | Double-sided graphic chip inversion module packaging structure and packaging method thereof |
-
2012
- 2012-12-09 CN CN2012105232580A patent/CN103021875A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101826501A (en) * | 2009-03-06 | 2010-09-08 | 李同乐 | Leadless integrated circuit package having high density contacts |
| CN102365737A (en) * | 2009-03-30 | 2012-02-29 | 凸版印刷株式会社 | Method of producing substrate for semiconductor element, and semiconductor device |
| CN101958300B (en) * | 2010-09-04 | 2012-05-23 | 江苏长电科技股份有限公司 | Double-sided graphic chip inversion module packaging structure and packaging method thereof |
| CN102354691A (en) * | 2011-11-04 | 2012-02-15 | 北京工业大学 | Quad flat non-lead (QFN) package with high density and manufacturing method |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116373209A (en) * | 2023-06-05 | 2023-07-04 | 宁波中车时代传感技术有限公司 | Manufacturing method of plastic package current detection device and plastic package current detection device |
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Application publication date: 20130403 |
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