CN116373209A - Manufacturing method of plastic package current detection device and plastic package current detection device - Google Patents
Manufacturing method of plastic package current detection device and plastic package current detection device Download PDFInfo
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- CN116373209A CN116373209A CN202310653852.XA CN202310653852A CN116373209A CN 116373209 A CN116373209 A CN 116373209A CN 202310653852 A CN202310653852 A CN 202310653852A CN 116373209 A CN116373209 A CN 116373209A
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/1418—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the inserts being deformed or preformed, e.g. by the injection pressure
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R15/00—Details of measuring arrangements of the types provided for in groups G01R17/00 - G01R29/00, G01R33/00 - G01R33/26 or G01R35/00
- G01R15/14—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks
- G01R15/20—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks using galvano-magnetic devices, e.g. Hall-effect devices, i.e. measuring a magnetic field via the interaction between a current and a magnetic field, e.g. magneto resistive or Hall effect devices
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- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R15/00—Details of measuring arrangements of the types provided for in groups G01R17/00 - G01R29/00, G01R33/00 - G01R33/26 or G01R35/00
- G01R15/14—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks
- G01R15/20—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks using galvano-magnetic devices, e.g. Hall-effect devices, i.e. measuring a magnetic field via the interaction between a current and a magnetic field, e.g. magneto resistive or Hall effect devices
- G01R15/202—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks using galvano-magnetic devices, e.g. Hall-effect devices, i.e. measuring a magnetic field via the interaction between a current and a magnetic field, e.g. magneto resistive or Hall effect devices using Hall-effect devices
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R15/00—Details of measuring arrangements of the types provided for in groups G01R17/00 - G01R29/00, G01R33/00 - G01R33/26 or G01R35/00
- G01R15/14—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks
- G01R15/20—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks using galvano-magnetic devices, e.g. Hall-effect devices, i.e. measuring a magnetic field via the interaction between a current and a magnetic field, e.g. magneto resistive or Hall effect devices
- G01R15/205—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks using galvano-magnetic devices, e.g. Hall-effect devices, i.e. measuring a magnetic field via the interaction between a current and a magnetic field, e.g. magneto resistive or Hall effect devices using magneto-resistance devices, e.g. field plates
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R19/00—Arrangements for measuring currents or voltages or for indicating presence or sign thereof
- G01R19/0092—Arrangements for measuring currents or voltages or for indicating presence or sign thereof measuring current only
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/752—Measuring equipment
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Abstract
The invention relates to the field of current detection, in particular to a manufacturing method of a plastic package current detection device and the plastic package current detection device, and an integrated frame is manufactured; the integrated frame comprises a primary side busbar, connecting ribs and a secondary side area; the secondary side area comprises an electric pin and a lead frame; the primary side busbar is electrically connected with the secondary side area only through the connecting ribs; fixing the magnetic sensing unit in the lead frame, and electrically connecting the magnetic sensing unit with the lead frame to obtain a primary plastic package precursor; performing primary plastic packaging on the primary plastic packaging precursor to obtain a primary plastic packaging body; cutting the preset position of the primary plastic package body, and cutting off the connecting ribs; fixing the magnet core on a primary plastic package body for cutting off the connecting ribs to obtain a secondary plastic package front object; and performing secondary plastic packaging on the secondary plastic packaging precursor to obtain the plastic packaging current detection device. The invention improves the measurement accuracy and the working stability of the current detection device.
Description
Technical Field
The invention relates to the field of current detection, in particular to a manufacturing method of a plastic package current detection device and the plastic package current detection device.
Background
The Hall current sensor is used as a non-contact device, does not electrically contact with a circuit to be measured, and can realize measurement of physical quantities such as high voltage and large current. The method is widely applied to the fields of rail transit, photovoltaics, wind power, new energy automobiles and the like.
The prior Hall current sensor mainly realizes a module-level measurement scheme by assembling a magneto-sensitive element, a primary busbar (also called a current busbar) and a lead frame, the primary busbar is connected into a circuit to be measured, current in the circuit to be measured flows through the primary busbar, magnetic field changes are induced at the corresponding magneto-sensitive element, the magneto-sensitive element converts the magnetic field changes into corresponding electric signals, the corresponding electric signals are led out through the lead frame, and non-contact current measurement is further completed.
Therefore, how to ensure the measurement accuracy and the working stability of the current detection device is a problem to be solved by those skilled in the art.
Disclosure of Invention
The invention aims to provide a manufacturing method of a plastic package current detection device and the plastic package current detection device, which are used for solving the problem that current detection is inaccurate due to the fact that a primary busbar and a lead frame are easily misplaced in the prior art.
In order to solve the technical problems, the invention provides a manufacturing method of a plastic package current detection device, comprising the following steps:
preparing an integrated frame; the integrated frame comprises a primary side busbar, connecting ribs and a secondary side area; the secondary side area comprises an electric pin and a lead frame; the primary side busbar is electrically connected with the secondary side area only through the connecting ribs;
fixing the magnetic sensing unit in the lead frame, and electrically connecting the magnetic sensing unit with the lead frame to obtain a primary plastic package precursor;
performing primary plastic packaging on the primary plastic packaging precursor to obtain a primary plastic packaging body;
cutting the preset position of the primary plastic package body, and cutting off the connecting ribs;
fixing the magnet core on a primary plastic package body for cutting off the connecting ribs to obtain a secondary plastic package front object;
and performing secondary plastic packaging on the secondary plastic packaging precursor to obtain the plastic packaging current detection device.
Optionally, in the method for manufacturing the plastic package current detection device, the fixing the poly magnet core on the primary plastic package body for cutting off the connecting ribs to obtain the secondary plastic package precursor includes:
and adhering the magnet core to a preset position of the primary plastic package body for cutting off the connecting ribs to obtain a secondary plastic package precursor.
Optionally, in the method for manufacturing the plastic package current detection device, the fixing the poly magnet core on the primary plastic package body for cutting off the connecting ribs to obtain the secondary plastic package precursor includes:
and fixing the magnet core on a limiter of the primary plastic package body for cutting off the connecting ribs to obtain a secondary plastic package front object.
Optionally, in the method for manufacturing a plastic package current detection device, the performing the second plastic package on the secondary plastic package precursor to obtain the plastic package current detection device includes:
performing secondary plastic packaging on the secondary plastic packaging precursor to obtain a secondary plastic packaging body;
and performing post-curing on the secondary plastic package body to obtain the plastic package current detection device.
Optionally, in the method for manufacturing the plastic package current detection device, the post-curing the secondary plastic package body to obtain the plastic package current detection device includes:
post-curing the secondary plastic package body to obtain a cured plastic package body;
and aging and annealing the solidified plastic package body to obtain the plastic package current detection device.
Optionally, in the method for manufacturing a plastic package current detection device, the preparing integrated frame includes:
preparing a rigid integrated frame; the primary side busbar in the rigid integrated frame and the secondary side area are fixed in relative positions.
Optionally, in the method for manufacturing the plastic package current detection device, the raw material of the first plastic package and/or the second plastic package is epoxy resin.
Optionally, in the method for manufacturing the plastic package current detection device, the thickness of the primary-side busbar ranges from 0.5 mm to 1.0 mm, including the end point value.
Optionally, in the method for manufacturing the plastic package current detection device, the performing the first plastic package on the primary plastic package precursor to obtain a primary plastic package body includes:
performing primary plastic packaging on the plurality of primary plastic packaging precursors by using a first multi-hole die to obtain a plurality of primary plastic packaging bodies;
and/or
The second plastic packaging of the secondary plastic packaging precursor is carried out to obtain a plastic packaging current detection device, which comprises the following steps:
and performing secondary plastic packaging on the plurality of secondary plastic packaging precursors by using a second multi-hole die to obtain a plurality of plastic packaging current detection devices.
The plastic package current detection device is obtained by the manufacturing method of any one of the plastic package current detection devices.
The manufacturing method of the plastic package current detection device provided by the invention comprises the steps of preparing an integrated frame; the integrated frame comprises a primary side busbar, connecting ribs and a secondary side area; the secondary side area comprises an electric pin and a lead frame; the primary side busbar is electrically connected with the secondary side area only through the connecting ribs; fixing the magnetic sensing unit in the lead frame, and electrically connecting the magnetic sensing unit with the lead frame to obtain a primary plastic package precursor; performing primary plastic packaging on the primary plastic packaging precursor to obtain a primary plastic packaging body; cutting the preset position of the primary plastic package body, and cutting off the connecting ribs; fixing the magnet core on a primary plastic package body for cutting off the connecting ribs to obtain a secondary plastic package front object; and performing secondary plastic packaging on the secondary plastic packaging precursor to obtain the plastic packaging current detection device.
According to the invention, the primary busbar and the secondary area are integrated into the integrated frame, the relative positions of the primary busbar and the secondary area are fixed through the connecting ribs, and then the primary plastic packaging is carried out, after the plastic packaging, the primary plastic packaging body is used for replacing the connecting ribs to provide support and fixation for the primary busbar and the secondary area, the relative positions of the primary busbar and the secondary area are kept accurate and are not changed due to external influence, then the secondary plastic packaging is carried out, the relative positions of the magnetic core, the primary busbar and the secondary area are fixed, and are not changed due to external influence, the relative positions of all components are fixed, so that the measurement accuracy and the working stability of the plastic packaging current detection device are greatly improved, in addition, the finally obtained plastic packaging current detection device is wrapped by the plastic packaging body, only pins for connecting an external circuit are reserved outside, the installation form of the plastic packaging current detection device on a tested circuit is greatly expanded, the application scene is widened, the integrated degree of the components is improved, the occupied degree is simplified, and the production flow is simplified. The invention also provides a plastic package current detection device with the beneficial effects.
Drawings
For a clearer description of embodiments of the invention or of the prior art, the drawings that are used in the description of the embodiments or of the prior art will be briefly described, it being apparent that the drawings in the description below are only some embodiments of the invention, and that other drawings can be obtained from them without inventive effort for a person skilled in the art.
Fig. 1 is a schematic flow chart of a specific embodiment of a method for manufacturing a plastic package current detection device according to the present invention;
fig. 2 and fig. 3 are process flow diagrams of a specific embodiment of a method for manufacturing a plastic package current detection device provided by the invention;
fig. 4 is a schematic flow chart of another embodiment of a method for manufacturing a plastic package current detection device according to the present invention;
fig. 5 is a process flow chart of another embodiment of a method for manufacturing a plastic package current detection device according to the present invention.
The drawing comprises the following steps: 10-primary busbar, 11-electrical pins, 21-lead frame, 22-electrical pins, 30-magnetic sensitive unit, 40-magnetic core, 50-primary plastic package and 60-secondary plastic package.
Detailed Description
In order to better understand the aspects of the present invention, the present invention will be described in further detail with reference to the accompanying drawings and detailed description. It will be apparent that the described embodiments are only some, but not all, embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
The core of the present invention is to provide a method for manufacturing a plastic package current detection device, a flow diagram of one embodiment of which is shown in fig. 1, which is referred to as embodiment one, including:
s101: preparing an integrated frame; the integrated frame comprises a primary busbar 10, connecting ribs and a secondary area; the secondary side region comprises an electric pin 22 and a lead frame 21; the primary busbar 10 is electrically connected with the secondary area only through the connecting ribs.
The primary busbar 10 and the lead frame 21 are preferably made of metal materials with high conductivity, high thermal conductivity, good electroplating property, corrosion resistance, high temperature softening resistance, etc., including but not limited to red copper and other copper alloys. The number of the electrical pins 22 in the secondary side area can be flexibly selected according to practical application scenes, and can be 4 pins and 5 pins, or can be 6 pins and 8 pins.
The integrated design and manufacture of the lead frame 21 and the primary busbar 10 enable the distance between the primary busbar 10 and the secondary area to be accurately designed, and improve the isolation voltage between the primary and secondary sides; the accurate alignment of the primary side and the secondary side is realized, the processing error is effectively reduced, the method is suitable for automatic production, and the level of batch manufacturing technology is improved.
The integrated frame is an integrated frame made of metal, for example, a frame obtained by cutting the whole metal to be processed, and the specific implementation manner is that the primary-side busbar 10 and the lead frame 21 of the secondary side area used for carrying out electrical property connection with the chip are simultaneously designed on the same copper alloy lead frame 21, so that the alignment precision of subsequent plastic packaging can be ensured, and the yield is improved.
As a preferred embodiment, the step may include:
preparing a rigid integrated frame; the primary busbar 10 in the rigid integrated frame is fixed in relative position to the secondary zone.
In the preferred embodiment, the integral frame is defined as a rigid integral frame, so that the integral frame itself can maintain the relative position between the primary busbar 10 and the secondary area fixed, and the primary busbar 10 and the secondary area cannot deviate from each other due to stress in the process of performing the subsequent first plastic packaging of the rigid integral frame.
It should be noted that, the rigid structure of the rigid integrated frame may be that the primary busbar 10 and the secondary area are rigidly connected by the connecting rib, or the primary busbar 10 and the secondary area may be rigidly connected by other structures, for example, a fixing connector is added between the primary busbar 10 and the secondary area, so as to ensure that the relative positions of the primary busbar 10 and the secondary area are fixed, but no matter whether other structures are used to ensure the rigid connection of the primary busbar 10 and the secondary area, the electrical connection channel between the primary busbar 10 and the secondary area is only the connecting rib.
S102: the magnetically sensitive unit 30 is fixed in the lead frame 21, and the magnetically sensitive unit 30 is electrically connected with the lead frame 21, so as to obtain a primary plastic package precursor.
The specific obtaining process of the primary plastic package precursor comprises the following steps: fixing the magnetic sensing unit 30 on a specific area of the lead frame 21 through die bonding glue, then electrically connecting a bonding pad on the magnetic sensing unit 30 with the lead frame 21 through a gold wire bonding mode, ball implantation is carried out on a first bonding point, a second bonding point is cut into fish tails, and finally heating and curing are carried out at about 150 ℃ for about 60 minutes under a nitrogen protection environment. Finally, the bonding pads of the magneto-sensitive unit 30 are electrically connected with the corresponding electrical pins 22 of the lead frame 21 by gold wire bonding.
Specifically, the magnetic sensing unit 30 includes a magnetic sensing element and an interface signal conditioning device; the magnetic field generated by the magnetic sensor can be at least one of a silicon-based Hall element, a compound Hall element, a fluxgate element and a magnetic resistance element. The interface signal conditioning device is mainly an integrated circuit prepared by a CMOS (Complementary Metal Oxide Semiconductor ) process and is used for processing an electrical signal output by a magnetic sensor and comprises functions of filtering, chopping, amplifying, temperature compensation and the like.
Preferably, the magneto-sensitive unit 30 may be an integrated device, that is, the magneto-sensitive element and the interface signal conditioning device are integrated on the same chip, and of course, a separate structure may also be adopted to separate the magneto-sensitive element from the interface signal conditioning device.
Also, a chip base is preset on the lead frame 21, and the magnetosensitive unit may be placed on the chip base, and a lead may be linked with a pin on the magnetosensitive unit 30.
Preferably, the pre-treatment is further performed on the primary plastic packaging precursor before plastic packaging, specifically, surface dust of the magnetic sensing unit 30 is removed, and plasma cleaning is performed on the primary busbar 10 and the lead frame 21, so that surface energy is improved, and adhesion performance is enhanced.
S103: the primary molding precursor is subjected to primary molding, and a primary molded body 50 is obtained.
The structural shape of the primary plastic package body 50 may refer to fig. 2, after the primary plastic package, the integrated frame is firmly fixed by the primary plastic package body 50 after being cooled and solidified, and the relative positions of the primary busbar 10 and the secondary area are not supported by the integrated frame itself, but are supported by the primary plastic package body 50.
Taking plastic packaging by using an epoxy plastic packaging material as an example, before a specific plastic packaging process, the unopened epoxy plastic packaging material can be placed in a room temperature environment (20-25 ℃ and 50-70% RH) for about 16 hours to return to the temperature for material awakening, and then a material taking cake is started to be unsealed, so that the plastic packaging material after awakening is generally used up within 24 hours, and the potential reliability hazard caused by over-period use is prevented.
The specific process for the first plastic packaging comprises the following steps: before plastic packaging, the injection mold is heated, and the proper mold temperature is selected according to the characteristics of the epoxy plastic packaging material, and is generally 160-200 ℃. And meanwhile, the primary busbar 10 and the lead frame 21 are subjected to preheating treatment, the preheating temperature is 150-160 ℃, the preheating time is about 60-80 s, and then the primary busbar and the lead frame are placed into a primary plastic package die. The epoxy plastic packaging material after material awakening also needs to be subjected to preheating treatment, wherein the preheating temperature is 80-100 ℃ and the preheating time is 20-30 s. Putting the preheated epoxy plastic packaging material into a preset position in a high-temperature mold cavity, and melting the epoxy plastic packaging material after mold closing; injecting the plastic package material in a molten state into the cavity through a flow channel, maintaining the pressure for a period of time, and exhausting through a preset exhaust hole to improve the phenomenon of trapped air.
After the first plastic packaging is finished, the flash around the first plastic packaging body 50 can be further cut off, so that the magnetic core 40 can be assembled in a later period and the second plastic packaging is facilitated.
S104: cutting the preset position of the primary plastic package body 50, and cutting off the connecting ribs.
And an opening is formed in the primary plastic package body 50, and cutting is performed through a preset position of the primary plastic package body 50, so that the connecting ribs inside the primary plastic package body 50 are cut off, and electric isolation between the primary busbar 10 and the secondary area is obtained.
S105: the magnetism collecting core 40 is fixed on the primary plastic package body 50 for cutting off the connecting ribs, and a secondary plastic package precursor is obtained.
The magnetic core 40 is mainly composed of soft magnetic materials including, but not limited to, iron-nickel alloy, ferrite, silicon steel, nanocrystalline, amorphous, etc.
And the magnetic core 40 is fixedly connected with the primary plastic package body 50, so that relative displacement between the magnetic core 40 and the primary plastic package body 50 in the subsequent secondary plastic package is avoided, and the position of the magnetic sensitive element in the magnetic field is further influenced.
As a preferred embodiment, the present step includes:
and adhering the magnet core 40 to a preset position of the primary plastic package body 50 for cutting off the connecting ribs to obtain a secondary plastic package precursor.
The gluing is quick and convenient, the cost is low, and the method is suitable for mass production. Further, the dispensing material used for fixing the magnetic core 40 and the primary molding body 50 is an epoxy resin, which has the characteristics of high heat resistance, low expansion coefficient, low viscosity, etc. The epoxy resin has better penetration and self-leveling capacity as the adhesive, and can penetrate into tiny gaps and realize full filling. Meanwhile, the epoxy adhesive has good adhesive force to the magnetic core made of metal and the primary plastic package body 50, and can effectively prevent delamination and hollowness between interfaces in the packaging process of the subsequent secondary plastic package. Specifically, the magnetic core 40 is fixed by applying an adhesive, and is heated and cured in an atmosphere of about 150 ℃ for about 60 minutes under a nitrogen atmosphere.
Still further, the step may further include:
and fixing the magnetic core 40 on the limiter of the primary plastic package body 50 for cutting off the connecting ribs to obtain a secondary plastic package front object.
In the preferred embodiment, a limiter is preset on the primary plastic package body 50, the limiter can be matched with the magnetic core 40 to limit the assembly position of the magnetic core 40, and meanwhile, the limiter plays a role in positioning the magnetic core 40, and when the primary plastic package body 50 completely wraps the integrated frame, the relative position of the magnetic core 40 and the magnetic sensitive unit 30 is ensured to be consistent with the preset condition.
S106: and performing secondary plastic packaging on the secondary plastic packaging precursor to obtain the plastic packaging current detection device.
In the following example, the specific flow of this step includes: before plastic packaging, the injection mold is heated, and the proper mold temperature is selected according to the characteristics of the epoxy plastic packaging material, and is generally 160-200 ℃. And meanwhile, the primary plastic package body 50 and the magnetic core 40 are subjected to preheating treatment, the preheating temperature is 150-160 ℃, the preheating time is about 60-80 s, and then the primary plastic package body and the magnetic core are placed into a secondary plastic package die. The epoxy plastic packaging material after material awakening also needs to be subjected to preheating treatment, wherein the preheating temperature is 80-100 ℃ and the preheating time is 20-30 s. Putting the preheated epoxy plastic packaging material into a preset position in a high-temperature mold cavity, and melting the epoxy plastic packaging material after mold closing; injecting the plastic package material in a molten state into the cavity through a flow channel, maintaining the pressure for a period of time, and exhausting through a preset exhaust hole to improve the phenomenon of trapped air.
In order to protect the pins of the plastic package current detection device from being knocked and damaged in the previous step, the electrical pins 11 of the primary busbar 10 in the integrated frame and the electrical pins 22 of the secondary area can be connected through connecting ribs, so that the structural strength of the pins with fragile relative structures is enhanced, and after the second plastic package, the connecting ribs between the pins can be cut off, so that the pins enter a to-be-operated state. Of course, different software burning programs can be configured according to different application scenes and performance requirements of the plastic package current detection device, and the series application development is realized.
Further, the raw material of the first plastic package and/or the second plastic package is epoxy resin. The epoxy resin has the characteristics of high heat resistance, high modulus, high heat conduction, low thermal expansion coefficient, low water absorption and the like, and the epoxy resin is used as a plastic package material to effectively protect components such as the magnetic sensitive unit 30 and the like in the plastic package current detection device from being damaged by external vibration and the like, and simultaneously assist the heat dissipation generated in the work of the magnetic core 40 and the primary busbar 10.
As shown in fig. 2, the second plastic packaging is used to fix the magnetic core 40 and the primary plastic packaging body 50, and after the second plastic packaging, the electrical pins 11 of the primary busbar 10 and the electrical pins 22 of the secondary area are still exposed to wait for connection with an external circuit.
After the second plastic packaging, further performing subsequent other treatments to obtain the plastic packaging current detection device, which specifically comprises:
a1: and performing secondary plastic packaging on the secondary plastic packaging precursor to obtain a secondary plastic packaging body 60.
A2: and (3) performing post-curing on the secondary plastic package body 60 to obtain the plastic package current detection device.
In the preferred embodiment, the secondary plastic package body 60 obtained after plastic package is further processed, rather than being directly used as the plastic package current detection device, specifically, the secondary plastic package body 60 is post-cured in a constant temperature environment, the temperature is about 175 ℃, and the time is about 6 hours.
Further, after post-curing, further processing may be performed, including:
b1: and (5) post-curing the secondary plastic package body 60 to obtain a cured plastic package body.
B2: and aging and annealing the solidified plastic package body to obtain the plastic package current detection device.
The post-cured chip-level current sensor device can be subjected to certain stress, so that the performance of the device can be adversely affected, and in the preferred embodiment, the cured plastic package body is further subjected to subsequent treatment.
And (3) continuing aging and annealing treatment on the cured plastic package body, wherein the specific aging conditions are as follows: in the air environment, the temperature is kept constant at about 150 ℃ and the duration is about 3 hours, so that the internal stress is further released.
Further, after the second plastic packaging, the process of obtaining the plastic packaging current detection device includes:
c1: and performing secondary plastic packaging on the secondary plastic packaging precursor to obtain a secondary plastic packaging body 60.
C2: and electroplating the electric pins 11 of the primary busbar 10 and the electric pins 22 of the secondary side area of the secondary plastic package body 60 to obtain the plastic package current detection device.
In the preferred embodiment, the secondary plastic package body 60 is continuously processed, specifically, pins exposed out of the secondary plastic package body 60 are electroplated, so that the welding performance is improved, the plastic package current detection device can be subjected to surface mounting welding, and most other current detection devices in the related art are subjected to plug-in mounting, so that the plastic package current detection device provided by the invention can be applied to more use scenes, and the universality is widened. Referring to fig. 3, fig. 3 is an external structure diagram of a specific embodiment of the plastic package current detection device after completion, it can be seen that the electrical pins 11 and 22 after bending and the secondary plastic package body 60 have the same extending direction, and can be attached to the surface of the tested device.
Also, the thickness of the primary busbar 10 ranges from 0.5 mm to 1.0 mm, including any of the end points, such as 0.50 mm, 0.88 mm to 1.0 mm. The primary busbar 10 provided by the invention can greatly reduce the heating condition of the primary busbar 10 in the thickness range, and can improve the upper limit of current detection while ensuring the normal operation of the device.
The manufacturing method of the plastic package current detection device provided by the invention comprises the steps of preparing an integrated frame; the integrated frame comprises a primary busbar 10, connecting ribs and a secondary area; the secondary side region comprises an electric pin 22 and a lead frame 21; the primary busbar 10 is electrically connected with the secondary area only through the connecting ribs; fixing the magnetic sensing unit 30 in the lead frame 21, and electrically connecting the magnetic sensing unit 30 with the lead frame 21 to obtain a primary plastic package precursor; performing primary plastic packaging on the primary plastic packaging precursor to obtain a primary plastic packaging body 50; cutting the preset position of the primary plastic package body 50, and cutting off the connecting ribs; fixing the magnetic core 40 on the primary plastic package body 50 for cutting off the connecting ribs to obtain a secondary plastic package precursor; and performing secondary plastic packaging on the secondary plastic packaging precursor to obtain the plastic packaging current detection device. According to the invention, the primary busbar 10 and the secondary area are integrated into the integrated frame, the relative positions of the primary busbar 10 and the secondary area are fixed through the connecting ribs, then the primary plastic packaging is carried out, after the plastic packaging, the primary plastic packaging body 50 is used for providing support and fixing for the primary busbar 10 and the secondary area instead of the connecting ribs, the relative positions of the primary busbar 10 and the secondary area are kept accurate and are not changed due to external influence, then the secondary plastic packaging is carried out, the relative positions of the magnetic core 40 and the primary busbar 10 and the secondary area are fixed, and are not changed due to external influence, the relative positions of all components are fixed, so that the measurement accuracy and the working stability of the plastic packaging current detection device are greatly improved, in addition, the finally obtained plastic packaging current detection device is wrapped by the plastic packaging body, only pins for connecting an external circuit are reserved outside, the installation form of the plastic packaging current detection device on a tested circuit is greatly widened, the application scene is promoted, the usability is promoted, the component occupation degree is simplified, and the production flow is reduced.
On the basis of the first embodiment, the plastic packaging process in the present invention is further limited, so as to obtain a second embodiment, and a flow chart of the second embodiment is shown in fig. 4, including:
s201: preparing an integrated frame; the integrated frame comprises a primary busbar 10, connecting ribs and a secondary area; the secondary side region comprises an electric pin 22 and a lead frame 21; the primary busbar 10 is electrically connected with the secondary area only through the connecting ribs.
S202: the magnetically sensitive unit 30 is fixed in the lead frame 21, and the magnetically sensitive unit 30 is electrically connected with the lead frame 21, so as to obtain a primary plastic package precursor.
S203: and performing primary plastic packaging on a plurality of the primary plastic packaging precursors by using a first multi-hole die to obtain a plurality of primary plastic packaging bodies 50.
S204: cutting the preset position of the primary plastic package body 50, and cutting off the connecting ribs.
S205: the magnetism collecting core 40 is fixed on the primary plastic package body 50 for cutting off the connecting ribs, and a secondary plastic package precursor is obtained.
S206: and performing secondary plastic packaging on the plurality of secondary plastic packaging precursors by using a second multi-hole die to obtain a plurality of plastic packaging current detection devices.
The difference between the present embodiment and the above embodiment is that the method is defined by the plastic package medium, and the other steps are the same as those of the above embodiment, and are not repeated here.
In this embodiment, the multi-hole mold is used for plastic packaging, so that a plurality of plastic packaging bodies, such as a mold frame 4 holes, are simultaneously produced, and 32 magnetic sensing units 30 are arranged on one lead frame 21, so that 128 magnetic sensing units 30 can be simultaneously produced by one mold, and the monitoring of 128 current sites is used for greatly improving the production efficiency.
In addition, the plastic packaging steps executed by the first multi-hole die and the second multi-hole die are different, corresponding plastic packaging bodies are different, and the hole numbers on the first multi-hole die and the second multi-hole die can be the same or different. The schematic structural diagram of the multiple plastic package current detection devices after the second plastic package in the second multi-hole mold is shown in fig. 5.
The invention also provides a plastic package current detection device, which is obtained by the manufacturing method of the plastic package current detection device. The manufacturing method of the plastic package current detection device provided by the invention comprises the steps of preparing an integrated frame; the integrated frame comprises a primary busbar 10, connecting ribs and a secondary area; the secondary side region comprises an electric pin 22 and a lead frame 21; the primary busbar 10 is electrically connected with the secondary area only through the connecting ribs; fixing the magnetic sensing unit 30 in the lead frame 21, and electrically connecting the magnetic sensing unit 30 with the lead frame 21 to obtain a primary plastic package precursor; performing primary plastic packaging on the primary plastic packaging precursor to obtain a primary plastic packaging body 50; cutting the preset position of the primary plastic package body 50, and cutting off the connecting ribs; fixing the magnetic core 40 on the primary plastic package body 50 for cutting off the connecting ribs to obtain a secondary plastic package precursor; and performing secondary plastic packaging on the secondary plastic packaging precursor to obtain the plastic packaging current detection device. According to the invention, the primary busbar 10 and the secondary area are integrated into the integrated frame, the relative positions of the primary busbar 10 and the secondary area are fixed through the connecting ribs, then the primary plastic packaging is carried out, after the plastic packaging, the primary plastic packaging body 50 is used for providing support and fixing for the primary busbar 10 and the secondary area instead of the connecting ribs, the relative positions of the primary busbar 10 and the secondary area are kept accurate and are not changed due to external influence, then the secondary plastic packaging is carried out, the relative positions of the magnetic core 40 and the primary busbar 10 and the secondary area are fixed, and are not changed due to external influence, the relative positions of all components are fixed, so that the measurement accuracy and the working stability of the plastic packaging current detection device are greatly improved, in addition, the finally obtained plastic packaging current detection device is wrapped by the plastic packaging body, only pins for connecting an external circuit are reserved outside, the installation form of the plastic packaging current detection device on a tested circuit is greatly widened, the application scene is promoted, the usability is promoted, the component occupation degree is simplified, and the production flow is reduced.
In this specification, each embodiment is described in a progressive manner, and each embodiment is mainly described in a different point from other embodiments, so that the same or similar parts between the embodiments are referred to each other. For the device disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant points refer to the description of the method section.
It should be noted that in this specification, relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
The manufacturing method of the plastic package current detection device and the plastic package current detection device provided by the invention are described in detail. The principles and embodiments of the present invention have been described herein with reference to specific examples, the description of which is intended only to facilitate an understanding of the method of the present invention and its core ideas. It should be noted that it will be apparent to those skilled in the art that various modifications and adaptations of the invention can be made without departing from the principles of the invention and these modifications and adaptations are intended to be within the scope of the invention as defined in the following claims.
Claims (10)
1. The manufacturing method of the plastic package current detection device is characterized by comprising the following steps of:
preparing an integrated frame; the integrated frame comprises a primary side busbar, connecting ribs and a secondary side area; the secondary side area comprises an electric pin and a lead frame; the primary side busbar is electrically connected with the secondary side area only through the connecting ribs;
fixing the magnetic sensing unit in the lead frame, and electrically connecting the magnetic sensing unit with the lead frame to obtain a primary plastic package precursor;
performing primary plastic packaging on the primary plastic packaging precursor to obtain a primary plastic packaging body;
cutting the preset position of the primary plastic package body, and cutting off the connecting ribs;
fixing the magnet core on a primary plastic package body for cutting off the connecting ribs to obtain a secondary plastic package front object;
and performing secondary plastic packaging on the secondary plastic packaging precursor to obtain the plastic packaging current detection device.
2. The method for manufacturing the plastic package current detection device according to claim 1, wherein the fixing the poly-magnet core on the primary plastic package body for cutting off the connecting ribs to obtain the secondary plastic package precursor comprises:
and adhering the magnet core to a preset position of the primary plastic package body for cutting off the connecting ribs to obtain a secondary plastic package precursor.
3. The method for manufacturing the plastic package current detection device according to claim 1, wherein the fixing the poly-magnet core on the primary plastic package body for cutting off the connecting ribs to obtain the secondary plastic package precursor comprises:
and fixing the magnet core on a limiter of the primary plastic package body for cutting off the connecting ribs to obtain a secondary plastic package front object.
4. The method for manufacturing the plastic package current detection device according to claim 1, wherein the step of performing the second plastic package on the secondary plastic package precursor to obtain the plastic package current detection device comprises:
performing secondary plastic packaging on the secondary plastic packaging precursor to obtain a secondary plastic packaging body;
and performing post-curing on the secondary plastic package body to obtain the plastic package current detection device.
5. The method for manufacturing a plastic package current detection device according to claim 1, wherein the post-curing the secondary plastic package body to obtain the plastic package current detection device comprises:
post-curing the secondary plastic package body to obtain a cured plastic package body;
and aging and annealing the solidified plastic package body to obtain the plastic package current detection device.
6. The method for manufacturing the plastic package current detection device according to claim 1, wherein the preparing the integrated frame comprises:
preparing a rigid integrated frame; the primary side busbar in the rigid integrated frame and the secondary side area are fixed in relative positions.
7. The method of manufacturing a plastic package current detecting device according to claim 1, wherein the raw material of the first plastic package and/or the second plastic package is epoxy resin.
8. The method of claim 1, wherein the thickness of the primary busbar ranges from 0.5 mm to 1.0 mm, inclusive.
9. The method for manufacturing a plastic package current detection device according to any one of claims 1 to 8, wherein the performing the first plastic package on the primary plastic package precursor to obtain a primary plastic package body includes:
performing primary plastic packaging on the plurality of primary plastic packaging precursors by using a first multi-hole die to obtain a plurality of primary plastic packaging bodies;
and/or
The second plastic packaging of the secondary plastic packaging precursor is carried out to obtain a plastic packaging current detection device, which comprises the following steps:
and performing secondary plastic packaging on the plurality of secondary plastic packaging precursors by using a second multi-hole die to obtain a plurality of plastic packaging current detection devices.
10. A plastic package current detecting device, characterized in that the plastic package current detecting device is a plastic package current detecting device obtained by the manufacturing method of the plastic package current detecting device according to any one of claims 1 to 9.
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