CN202678304U - AAQFN product-based packaging member receiving secondary plastic packaging - Google Patents
AAQFN product-based packaging member receiving secondary plastic packaging Download PDFInfo
- Publication number
- CN202678304U CN202678304U CN2012202614358U CN201220261435U CN202678304U CN 202678304 U CN202678304 U CN 202678304U CN 2012202614358 U CN2012202614358 U CN 2012202614358U CN 201220261435 U CN201220261435 U CN 201220261435U CN 202678304 U CN202678304 U CN 202678304U
- Authority
- CN
- China
- Prior art keywords
- lead frame
- chip
- hole
- bonding
- packaging
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
Abstract
The utility model relates to a flat packaging member, particularly to an AAQFN product-based packaging member receiving secondary plastic packaging, belonging to the integrated circuit packaging technology field. The packaging member comprises a lead frame, a bonding sheet glue, a chip, a bonding line, a plastic-sealed body, an upper through hole, a lower through hole, and an etching groove, wherein the right side of the lead frame is provided with the upper through hole while the back side of the lead frame is provided with the lower through hole and the etching groove; the upper through hole and the lower through hole form a through hole; the lead frame is fixedly provided with the bonding sheet glue; the bonding sheet glue is fixedly provided with the chip; the chip and the lead frame are connected via the bonding sheet glue; the bonding line is directly arranged to the lead frame from the chip; the weld line between the solder joint upon the chip and the internal pins is the bonding line; the plastic-sealed body wraps the lead frame, the bonding sheet glue, the chip, and the bonding line to form a circuit; and the chip, the bonding line, and the lead frame form the power supply of the circuit and the signaling channel. The AAQFN product-based packaging member of the utility model makes the combination of the integrated circuit frame and the plastic-sealed body firmer and unaffected by the external environment, improves the packaging reliability of the product, and reduces the cost as well.
Description
Technical field
The utility model relates to a kind of flat packaging part, and especially a kind of packaging part of the secondary plastic packaging based on the AAQFN product belongs to the integrated antenna package technical field.
Background technology
Integrated circuit is the core of information industry and new and high technology, is the basis of economic development.Integrated antenna package is the chief component of IC industry, and its development is accompanied by the increase of its function and device count always and strides forward.From the nineties in 20th century, it has entered the development track of many number of pins, thin space, small-sized slimming.Carrier-free Background Grid array packages (being AAQFN) is for adapting to the fast-developing a kind of new packing forms that is born of electronic product, is that complete electronic set is realized microminaturization, lightweight, networked requisite product.
Carrier-free Background Grid array packages element, the bottom does not have soldered ball, pin directly is connected with pcb board during welding, with the electric and mechanical connection of PCB be by Printing Paste on the PCB pad, the solder joint that cooperates the SMT reflow soldering process to form is realized.This technology encapsulation can realize many pins, high density, small-sized slimming encapsulation under the same size condition, have the characteristics such as thermal diffusivity, electrical property and coplanarity are good.
The AAQFN encapsulating products is applicable on a large scale, the encapsulation of very lagre scale integrated circuit (VLSIC).The device great majority of AAQFN encapsulation are used for the high-grade consumer goods markets such as mobile phone, network and communications equipment, digital camera, microcomputer, notebook computer and various types of flat panel display.Grasp its core technology, possess mass production capabilities, will greatly dwindle the gap of domestic IC industry and international most advanced level, this product has wide market application foreground.
But because restrictions such as technical difficulty, the at present popularization of AAQFN product on market acquires a certain degree of difficulty, and especially aspect reliability, directly affects use and the life-span of product, become the research of technique difficult point of AAQFN packaging part.
The utility model content
The problem that exists in order to overcome above-mentioned prior art; the utility model provides a kind of packaging part of the secondary plastic packaging based on the AAQFN product; it is more firm that the integrated circuit framework is combined with plastic-sealed body; be not affected by the external environment; directly improve the package reliability of product, can effectively prevent flash simultaneously, protection tin ball; thereby expose easier welding of certain tin sphere area, and reduce cost.
To achieve these goals, the utility model adopts to such an extent that technical scheme is: packaging part comprises lead frame 1, bonding die glue 2, chip 3, bonding line 4, plastic-sealed body 5, upper through hole 6, lower through-hole 7, etched recesses 8; Lead frame 1 front is provided with through hole 6, the back side is provided with lower through-hole 7 and etched recesses 8, upper through hole 6 and lower through-hole 7 form through hole, fixing bonding die glue 2 on the lead frame 1, fixed chip 3 on the bonding die glue 2, chip 3 links to each other by bonding die glue 2 with lead frame 1, bonding line 4 is directly got on the lead frame 1 from chip 3, bonding wire between the solder joint on the chip 3 and interior pin is bonding line 4, plastic-sealed body 5 has surrounded lead frame 1, bonding die glue 2, chip 3, bonding line 4 forming circuits, power supply and the signalling channel of chip 3, bonding line 4, lead frame 1 forming circuit.
Described bonding line 4 is gold thread or copper cash; Described bonding die glue 2 can use glue film (DAF) to replace.
The beneficial effects of the utility model: the hole that the groove at the framework back side and frame carrier tow sides are established respectively forms stepped anti-traction structure when plastic packaging material is filled; Solved traditional ram frame after plastic packaging operation plastic packaging material is filled, because framework itself is smooth smooth, conjugation between plastic packaging material and the framework is low, the situation that layering very easily occurs, greatly reduce the occurrence probability of packaging part layering situation, greatly improve product reliability, be better than the plastic packaging effect of traditional AQQFN product; Technique is simple simultaneously, handled easily, and cost is low.
Description of drawings
Fig. 1 is structural representation of the present utility model;
Among the figure: 1-lead frame, 2-bonding die glue, 3-chip, 4-bonding line, 5-plastic-sealed body, the upper through hole of 6-, 7-lower through-hole, 8-etched recesses.
Embodiment
Below in conjunction with drawings and Examples the utility model is described further, understands to make things convenient for the technical staff.
As shown in Figure 1: packaging part comprises that packaging part comprises lead frame 1, bonding die glue 2, chip 3, bonding line 4, plastic-sealed body 5, upper through hole 6, lower through-hole 7, etched recesses 8; Lead frame 1 front is provided with through hole 6, the back side is provided with lower through-hole 7 and etched recesses 8, upper through hole 6 and lower through-hole 7 form through hole, fixing bonding die glue 2 on the lead frame 1, fixed chip 3 on the bonding die glue 2, chip 3 links to each other by bonding die glue 2 with lead frame 1, bonding line 4 is directly got on the lead frame 1 from chip 3, bonding wire between the solder joint on the chip 3 and interior pin is bonding line 4, plastic-sealed body 5 has surrounded lead frame 1, bonding die glue 2, chip 3, bonding line 4 forming circuits, power supply and the signalling channel of chip 3, bonding line 4, lead frame 1 forming circuit.
Described bonding line 4 is gold thread or copper cash; Described bonding die glue 2 can use glue film (DAF) to replace.
The tradition ram frame is after plastic packaging operation plastic packaging material is filled, because framework itself is smooth smooth, the conjugation between plastic packaging material and the framework is low, the situation of layering very easily occurs, and the packaging part reliability can not be guaranteed.The plastic package process different from the past that the utility model adopts, the hole that the groove at the framework back side and frame carrier tow sides are established respectively, when being filled, plastic packaging material forms stepped anti-traction structure, between framework and plastic packaging material, green lacquer, form effectively anti-traction structure, greatly reduce the occurrence probability of packaging part layering situation, greatly improve product reliability, be better than the plastic packaging effect of traditional AQQFN product.
Claims (3)
1. packaging part based on the secondary plastic packaging of AAQFN product, it is characterized in that: packaging part comprises lead frame, bonding die glue, chip, bonding line, plastic-sealed body, upper through hole, lower through-hole, etched recesses; The lead frame front is provided with through hole, the back side is provided with lower through-hole and etched recesses, upper through hole and lower through-hole form through hole, fixing bonding die glue on the lead frame, fixed chip on the bonding die glue, chip links to each other by bonding die glue with lead frame, bonding line is directly got on the lead frame from chip, bonding wire between the solder joint on the chip and interior pin is bonding line, plastic-sealed body has surrounded lead frame, bonding die glue, chip, bonding line forming circuit, power supply and the signalling channel of chip, bonding line, lead frame forming circuit.
2. the packaging part of a kind of secondary plastic packaging based on the AAQFN product according to claim 1, it is characterized in that: described bonding line is gold thread or copper cash.
3. the packaging part of a kind of secondary plastic packaging based on the AAQFN product according to claim 1, it is characterized in that: described bonding die glue is replaced with glue film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012202614358U CN202678304U (en) | 2012-06-05 | 2012-06-05 | AAQFN product-based packaging member receiving secondary plastic packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012202614358U CN202678304U (en) | 2012-06-05 | 2012-06-05 | AAQFN product-based packaging member receiving secondary plastic packaging |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202678304U true CN202678304U (en) | 2013-01-16 |
Family
ID=47499186
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012202614358U Expired - Lifetime CN202678304U (en) | 2012-06-05 | 2012-06-05 | AAQFN product-based packaging member receiving secondary plastic packaging |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202678304U (en) |
-
2012
- 2012-06-05 CN CN2012202614358U patent/CN202678304U/en not_active Expired - Lifetime
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130116 |
|
| CX01 | Expiry of patent term |