CN103021884A - Flat package part manufacturing process based on thin frame - Google Patents
Flat package part manufacturing process based on thin frame Download PDFInfo
- Publication number
- CN103021884A CN103021884A CN2012105273504A CN201210527350A CN103021884A CN 103021884 A CN103021884 A CN 103021884A CN 2012105273504 A CN2012105273504 A CN 2012105273504A CN 201210527350 A CN201210527350 A CN 201210527350A CN 103021884 A CN103021884 A CN 103021884A
- Authority
- CN
- China
- Prior art keywords
- framework
- plastic packaging
- slim
- glue
- technique
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
- H01L2224/92—Specific sequence of method steps
- H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
- H01L2224/9222—Sequential connecting processes
- H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
- H01L2224/92247—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Abstract
The invention relates to a flat package part manufacturing process based on a thin frame and belongs to the technical field of integrated circuit package. The flat package part manufacturing process uses the thin frame, a production process can be simplified in the production procedures to the most extent, and the cost and the rejection rate can be reduced. Then, a groove is formed on the frame by means of a corrosion method and then filled by means of a grinding and green paint brushing method, an effective drag preventing structure can be formed between a plastic packaging material manufactured through plastic package in one time and the frame, and the reliability of a package part is improved remarkably. The flat package part manufacturing process is easy to operate and high in production efficiency.
Description
Technical field
The present invention relates to a kind of flat packaging part manufacture craft based on slim framework, belong to the integrated antenna package technical field.
Background technology
Integrated circuit is the core of information industry and new and high technology, is the basis of economic development.Integrated antenna package is the chief component of IC industry, and its development is accompanied by the increase of its function and device count always and strides forward.From the nineties in 20th century, it has entered the development track of many number of pins, thin space, small-sized slimming.Carrier-free Background Grid array packages (being AAQFN) is for adapting to the fast-developing a kind of new packing forms that is born of electronic product, is that complete electronic set is realized microminaturization, lightweight, networked requisite product.
Carrier-free Background Grid array packages element, the bottom does not have soldered ball, pin directly is connected with pcb board during welding, with the electric and mechanical connection of PCB be by Printing Paste on the PCB pad, the solder joint that cooperates the SMT reflow soldering process to form is realized.This technology encapsulation can realize many pins, high density, small-sized slimming encapsulation under the same size condition, have the characteristics such as thermal diffusivity, electrical property and coplanarity are good.
The AAQFN encapsulating products is applicable on a large scale, the encapsulation of very lagre scale integrated circuit (VLSIC).The device great majority of AAQFN encapsulation are used for the high-grade consumer goods markets such as mobile phone, network and communications equipment, digital camera, microcomputer, notebook computer and various types of flat panel display.Grasp its core technology, possess mass production capabilities, will greatly dwindle the gap of domestic IC industry and international most advanced level, this product has wide market application foreground.
But because restrictions such as technical difficulty, the at present popularization of AAQFN product on market acquires a certain degree of difficulty, and especially aspect reliability, directly affects use and the life-span of product, become the research of technique difficult point of AAQFN packaging part.
Summary of the invention
The problem that exists in order to overcome above-mentioned prior art, the invention provides a kind of flat packaging part manufacture craft based on slim framework, it is more firm that the integrated circuit framework is combined with plastic-sealed body, is not affected by the external environment, directly improve the package reliability of product, and reduce to a certain extent cost.
The technical solution used in the present invention: a kind of flat packaging part manufacture craft based on slim framework, specifically carry out according to following steps;
The first step, attenuate: thickness thinning is 50 μ m～200 μ m, roughness Ra 0.10um～0.30um;
Second step, scribing: the above wafer of 150 μ m adopts common Q FN scribing process, and thickness uses double-pole scribing machine and technique thereof at the following wafer of 150 μ m;
The 3rd step, upper core: adopt core on the bonding die glue;
The 4th step, pressure welding;
The 5th step, a plastic packaging: carry out plastic packaging with traditional plastic packaging material;
The 6th step, rear curing;
The 7th step, slim framework back etched groove: use slim framework, do the part at the framework back side with liquor ferri trichloridi and window and etch partially, the formation groove, severity control is in half of frame thickness;
The 8th step, brushing, the lacquer of greenwashing;
The 9th step, rear curing, mill glue, tin, printing, separation of products, check, packing.
The 3rd step can adopt glue film (DAF) to replace bonding die glue in the described step; The 4th step, the 5th step, the 6th step, the 9th go on foot all identical with conventional AAQFN technique in the described step.
Beneficial effect of the present invention: use slim framework, simplification production technology that can be to a great extent in production procedure, reduce cost and reduce scrappage, then at the method formation groove of framework with corrosion, fill with the method for the lacquer of greenwashing after the first brushing again, and can between the plastic packaging material of a plastic packaging and framework, form more anti-traction structure, significantly improve the reliability of packaging part, and this method is easily gone, and production efficiency is high.
Description of drawings
Fig. 1 lead frame profile;
Product profile behind the core on Fig. 2;
Product profile after Fig. 3 pressure welding;
Plastic packaged products profile of Fig. 4;
Product profile behind Fig. 5 framework back etched;
Product profile after Fig. 6 brushing is greenwashed and coated with lacquer.
Among the figure: 1-lead frame, 2-bonding die glue, 3-chip, 4-bonding line, 5-plastic-sealed body, 6-etched recesses.
Embodiment
The present invention will be further described below in conjunction with drawings and Examples, understands to make things convenient for the technical staff.
Shown in Fig. 1-6: adopt method of the present invention to be used for single-chip package, product comprises lead frame 1, bonding die glue 2, chip 3, bonding line 4, plastic-sealed body 5, etched recesses 6; Its chips 3 links to each other by bonding die glue 2 with lead frame 1; bonding line 4 is directly got on the lead frame 1 from chip 3; bonding die glue 2 on the lead frame 1; it is chip 3 on the bonding die glue 2; bonding wire between the solder joint on the chip 3 and interior pin is bonding line 4; plastic-sealed body 5 has surrounded the integral body that lead frame 1, bonding die glue 2, chip 3, bonding line 4, etched recesses 6 have consisted of circuit; the bonding line 4 of 5 pairs of chips 3 of plastic-sealed body has played support and protective effect, and chip 3, bonding line 4, lead frame 1 have consisted of power supply and the signalling channel of circuit.
A kind of flat packaging part manufacture craft based on slim framework, specifically carry out according to following steps:
The first step, attenuate: thickness thinning is 100 μ m, roughness Ra 0.10um;
Second step, scribing: adopting thickness is the wafer of 100 μ m, uses double-pole scribing machine and technique thereof;
The 3rd step, upper core: adopt core on the bonding die glue 2;
The 4th step, pressure welding: identical with conventional AAQFN technique;
The 5th step, a plastic packaging: carry out plastic packaging with traditional plastic packaging material 9920, identical with conventional AAQFN technique;
The 6th step, rear curing: identical with conventional AAQFN technique;
The 7th step, slim framework back etched groove: use slim framework, do the part at the framework back side with liquor ferri trichloridi and window and etch partially, the formation groove, severity control is in half of frame thickness;
The 8th step, brushing, the lacquer of greenwashing;
The 9th step, rear curing, mill glue, tin, printing, separation of products, check, packing are identical with conventional AAQFN technique.
Embodiment 2
The first step, attenuate: thickness thinning is 130 μ m, roughness Ra 0.20um;
Second step, scribing: adopting thickness is the wafer of 130 μ m, uses double-pole scribing machine and technique thereof;
The 3rd step, upper core: adopt core on the bonding die glue 2;
The 4th step, pressure welding: identical with conventional AAQFN technique;
The 5th step, a plastic packaging: carry out plastic packaging with traditional plastic packaging material 9920, identical with conventional AAQFN technique;
The 6th step, rear curing: identical with conventional AAQFN technique;
The 7th step, slim framework back etched groove: use slim framework, do the part at the framework back side with liquor ferri trichloridi and window and etch partially, the formation groove, severity control is in half of frame thickness;
The 8th step, brushing, the lacquer of greenwashing;
The 9th step, rear curing, mill glue, tin, printing, separation of products, check, packing are identical with conventional AAQFN technique.
Embodiment 3
The first step, attenuate: thickness thinning is 170 μ m, roughness Ra 0.30um;
Second step, scribing: adopting thickness is the wafer of 170 μ m, identical with common Q FN scribing process;
The 3rd step, upper core: adopt core on the bonding die glue 2;
The 4th step, pressure welding: identical with conventional AAQFN technique;
The 5th step, a plastic packaging: carry out plastic packaging with traditional plastic packaging material 9920, identical with conventional AAQFN technique;
The 6th step, rear curing: identical with conventional AAQFN technique;
The 7th step, slim framework back etched groove: use slim framework, do the part at the framework back side with liquor ferri trichloridi and window and etch partially, the formation groove, severity control is in half of frame thickness;
The 8th step, brushing, the lacquer of greenwashing;
The 9th step, rear curing, mill glue, tin, printing, separation of products, check, packing are identical with conventional AAQFN technique.
The present invention describes by specific implementation process, without departing from the present invention, can also carry out various conversion and be equal to replacement patent of the present invention, therefore, patent of the present invention is not limited to disclosed specific implementation process, and should comprise the whole embodiments that fall in the Patent right requirement scope of the present invention.
Claims (3)
1. flat packaging part manufacture craft based on slim framework is characterized in that: specifically carry out according to following steps:
The first step, attenuate: thickness thinning is 50 μ m～200 μ m, roughness Ra 0.10um～0.30um;
Second step, scribing: the above wafer of 150 μ m adopts common Q FN scribing process, and thickness uses double-pole scribing machine and technique thereof at the following wafer of 150 μ m;
The 3rd step, upper core: adopt core on the bonding die glue;
The 4th step, pressure welding;
The 5th step, a plastic packaging: carry out plastic packaging with traditional plastic packaging material;
The 6th step, rear curing;
The 7th step, slim framework back etched groove: use slim framework, do the part at the framework back side with liquor ferri trichloridi and window and etch partially, the formation groove, severity control is in half of frame thickness;
The 8th step, brushing, the lacquer of greenwashing;
The 9th step, rear curing, mill glue, tin, printing, separation of products, check, packing.
2. a kind of flat packaging part manufacture craft based on slim framework according to claim 1 is characterized in that: the 3rd step can adopt glue film (DAF) to replace bonding die glue in the described step.
3. a kind of flat packaging part manufacture craft based on slim framework according to claim 1 is characterized in that: the 4th step in the described step, the 5th step, the 6th step, the 9th step are all identical with conventional AAQFN technique.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012105273504A CN103021884A (en) | 2012-12-10 | 2012-12-10 | Flat package part manufacturing process based on thin frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012105273504A CN103021884A (en) | 2012-12-10 | 2012-12-10 | Flat package part manufacturing process based on thin frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103021884A true CN103021884A (en) | 2013-04-03 |
Family
ID=47970345
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012105273504A Pending CN103021884A (en) | 2012-12-10 | 2012-12-10 | Flat package part manufacturing process based on thin frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103021884A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101697348A (en) * | 2009-10-11 | 2010-04-21 | 天水华天科技股份有限公司 | Small-carrier flat-four-side pin-less packaging part and preparation method thereof |
| CN102386106A (en) * | 2010-09-03 | 2012-03-21 | 宇芯（毛里求斯）控股有限公司 | Partially patterned lead frames and methods of making and using the same in semiconductor packaging |
| CN102738009A (en) * | 2012-06-13 | 2012-10-17 | 华天科技（西安）有限公司 | Manufacturing process of flat packaging piece of AAQFN framework product based on brushing |
| CN102738015A (en) * | 2012-06-05 | 2012-10-17 | 华天科技（西安）有限公司 | Secondary plastic packaging manufacturing process of AAQFN products based on corrosion and sand blasting |
| CN102738017A (en) * | 2012-06-13 | 2012-10-17 | 华天科技（西安）有限公司 | Secondary plastic package manufacturing process of AAQFN product based on sand blasting |
-
2012
- 2012-12-10 CN CN2012105273504A patent/CN103021884A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101697348A (en) * | 2009-10-11 | 2010-04-21 | 天水华天科技股份有限公司 | Small-carrier flat-four-side pin-less packaging part and preparation method thereof |
| CN102386106A (en) * | 2010-09-03 | 2012-03-21 | 宇芯（毛里求斯）控股有限公司 | Partially patterned lead frames and methods of making and using the same in semiconductor packaging |
| CN102738015A (en) * | 2012-06-05 | 2012-10-17 | 华天科技（西安）有限公司 | Secondary plastic packaging manufacturing process of AAQFN products based on corrosion and sand blasting |
| CN102738009A (en) * | 2012-06-13 | 2012-10-17 | 华天科技（西安）有限公司 | Manufacturing process of flat packaging piece of AAQFN framework product based on brushing |
| CN102738017A (en) * | 2012-06-13 | 2012-10-17 | 华天科技（西安）有限公司 | Secondary plastic package manufacturing process of AAQFN product based on sand blasting |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103474406A (en) | Copper-free flat packaging piece of AAQFN frame product and manufacturing process thereof | |
| CN102446882A (en) | Semiconductor PiP (package in package) system structure and manufacturing method thereof | |
| CN201226592Y (en) | Silicon microphone packaged by flexible circuit board | |
| CN103021882A (en) | Flat package part manufacture process based on grinding plastic package body | |
| CN103021883A (en) | Flat package part manufacturing process based on corrosion plastic package body | |
| CN102738009A (en) | Manufacturing process of flat packaging piece of AAQFN framework product based on brushing | |
| CN103021885A (en) | Flat package part manufacturing process based on sand blasting | |
| CN203260570U (en) | Carrier-free novel package based on frame corrosion bump | |
| CN102738015A (en) | Secondary plastic packaging manufacturing process of AAQFN products based on corrosion and sand blasting | |
| CN102738017A (en) | Secondary plastic package manufacturing process of AAQFN product based on sand blasting | |
| CN102738016A (en) | Framework carrier pore opening based AAQFN product secondary plastic packaging manufacturing technology | |
| CN102738018A (en) | Framework carrier pore opening and solder ball film sticking based AAQFN (quad flat no-lead) product secondary plastic packaging manufacturing technology | |
| CN2901576Y (en) | Ball grating array package structure | |
| CN103021875A (en) | Flat packaging part manufacturing process based on AAQFN frame product secondary plastic package | |
| CN103021995A (en) | Single chip packaging piece capable of realizing SMT (surface mount technology) on basis of cylindrical inductor and manufacturing technology of single chip packaging piece | |
| CN203521396U (en) | Copper-free flat packaging piece of AAQFN frame product | |
| CN103021884A (en) | Flat package part manufacturing process based on thin frame | |
| CN103325756A (en) | Multi-device SMT flat packaging piece based on frame and manufacturing process of multi-device SMT flat packaging piece | |
| CN203481191U (en) | Frame-based AAQFN package adopting pre-plastic-package optimization technology | |
| CN102738010A (en) | Technology for producing AAQFN framework product quad flat package on basis of sand blasting | |
| CN203103286U (en) | Single chip packaging piece capable of realizing SMT (surface mount technology) on basis of cylindrical inductor | |
| CN103050415A (en) | Sequential browning and green paint brushing-based flat package manufacturing process | |
| CN202772130U (en) | Packaging piece for single-chip packaging based on AAQFN | |
| CN203589000U (en) | Plastic packaging piece based on frameless CSP packaging back ball mounting | |
| CN104037093A (en) | Package part based on secondary exposure and secondary plastic package of AAQFN and manufacturing process thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130403 |