CN102991750A - Laminating machine and laminating method - Google Patents
Laminating machine and laminating method Download PDFInfo
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- CN102991750A CN102991750A CN2011102895900A CN201110289590A CN102991750A CN 102991750 A CN102991750 A CN 102991750A CN 2011102895900 A CN2011102895900 A CN 2011102895900A CN 201110289590 A CN201110289590 A CN 201110289590A CN 102991750 A CN102991750 A CN 102991750A
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- film
- substrate
- pad pasting
- adhesive tape
- overlay film
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B41/00—Arrangements for controlling or monitoring lamination processes; Safety arrangements
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/002—Measuring arrangements characterised by the use of optical techniques for measuring two or more coordinates
- G01B11/005—Measuring arrangements characterised by the use of optical techniques for measuring two or more coordinates coordinate measuring machines
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B41/00—Arrangements for controlling or monitoring lamination processes; Safety arrangements
- B32B2041/06—Starting the lamination machine or method
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
Abstract
The invention discloses a laminating machine and a laminating method, which are used for laminating on substrates. The laminating machine is characterized by comprising an optical detector, wherein before and after lamination on substrates, the optical detector is used for detecting fine particles on the substrates and air bubbles on the laminated substrates respectively. The situation of the attachment of dust fall to the substrates before lamination and the situation of the generation of the air bubbles on the laminated substrates are detected by using the optical detector, so that poorly-laminated substrates can be found in time, and the effect of increasing the total yield of substrate lamination is achieved.
Description
[technical field]
The present invention is particularly to carry out for the substrate of contact panel film layer and the film covering method of overlay film relevant for a kind of film layer and film covering method.
[background technology]
Because the progress of science and technology, such as computing machine, PDA, intelligent mobile phone or tablet PC etc. has the intelligent device of power and comes out of the stove one after another.Many intelligent devices are equipped with contact panel, come operative intelligence type device for the user with touch control manner.
Topmost assembly is glass in the product of contact panel; therefore before this product turnout (as with after the laser glass-cutting or in the glass gluing stage); need to paste layer protecting film at glass surface, cause glass dirty with the surface that prevents glass because of scratch or dust fall particulate etc.This layer protective film pastes to reach at needs on glass and can not produce bubble between pad pasting and glass behind the overlay film.
Known in the overlay film processing procedure, all be to check by operating personal mode with the naked eye whether the quality before and after the glass film reaches standard (whether dust fall or bubble are namely arranged).Yet, known artificial test mode easily causes criterion inconsistent and more not objective because of the factor such as different operating personnel, different time, work time-histories are long, therefore quality and the stability speech for overlay film is a disadvantageous factor, and then the yield of reduction glass film.
[summary of the invention]
The invention provides a kind of film layer and film covering method, utilize the detecting device of film layer to detect the situation that the dust fall of substrate before overlay film is attached to substrate with same standard, and the situation that detects the Bubble formation of substrate behind overlay film, promote by this quality of overlay film and stability with the overlay film yield of further raising substrate.
The invention provides a kind of film layer, comprise:
One overlay film platform is used for carrying at least one substrate for overlay film; And
One fluorescence detector is used for detecting the quality of this substrate on this overlay film platform before and after the overlay film.
Further, according to film layer of the present invention, wherein, this fluorescence detector comprises a plurality of optical coupling assemblies.
Further, according to film layer of the present invention, wherein, this overlay film platform further comprises:
One rotating mechanism; And
A plurality of bearing fixtures are arranged on this rotating mechanism, are used for respectively carrying this substrate.
Further, according to film layer of the present invention, further comprise:
One film carrier platform;
One volume film mechanism loads one and posts the adhesive tape of pad pasting, and carries this adhesive tape that posts pad pasting to this film carrier platform;
One inhales the film tool, is used for adsorbing and peels off the pad pasting on this film carrier platform, and this pad pasting is fitted in substrate on this bearing fixture;
One alignment sensor is detected the position of the pad pasting that this suction film tool adsorbs; And
But a program logic controller is controlled the running of this overlay film platform, this volume film mechanism and this suction film tool, and further controls this suction film tool according to the detecting result of this alignment sensor and carry out a location program; And produce a prompting message according to the testing result of this fluorescence detector.
Further, according to film layer of the present invention, wherein, this volume film mechanism comprises:
One membrane charging tray loads and scrolling goes out the adhesive tape that this posts pad pasting;
At least one cylinder is arranged at this membrane charging tray downstream, is used for supporting and carries this to post the adhesive tape of pad pasting; And
One reclaims charging tray, and scrolling reclaims this adhesive tape of having peeled off pad pasting.
Further, according to film layer of the present invention, further comprise:
One volume film mechanism is used for carrying and carries an adhesive tape that posts pad pasting;
One roller indenter device is used for peeling off the pad pasting in this volume film mechanism, so that this pad pasting roll extrusion is conformed to this substrate;
One header system controls the movement of this volume film mechanism and this roller indenter device;
One alignment sensor is detected in this volume film mechanism this and is posted the position of the adhesive tape of pad pasting; And
But a program logic controller is controlled the running of this overlay film platform and this header system, and further controls this header system according to the detecting result of this alignment sensor and carry out a location program; And produce a prompting message according to the testing result of this fluorescence detector.
Further, according to film layer of the present invention, wherein, this volume film mechanism comprises:
One membrane charging tray loads and scrolling goes out the adhesive tape that this posts pad pasting;
At least one cylinder is arranged at this membrane charging tray downstream, is used for carrying and carrying the adhesive tape that this posts pad pasting; And
One reclaims charging tray, and scrolling reclaims this adhesive tape of having peeled off pad pasting.
The invention provides a kind of film covering method, be applied to a film layer overlay film one substrate, the step of this film covering method comprises:
Carry out a pan feeding program; And
Before this substrate is carried out overlay film with after, see through the quality that a fluorescence detector detects this substrate automatically.
Further, according to film covering method of the present invention, wherein, the step of this execution pan feeding program further comprises:
Rotate an overlay film platform, with this substrate of pan feeding, wherein this overlay film platform comprises a plurality of bearing fixtures that are used for carrying this substrate; And
The adhesive tape of pad pasting posts in scrolling one volume film mechanism with pan feeding one.
Further, according to film covering method of the present invention, wherein, whether after the step of carrying out this pan feeding substrate, further automatically detecting this substrate through this fluorescence detector has dirty.
Further, according to film covering method of the present invention, further comprise:
Absorption is also peeled off this pad pasting;
Locate the position of this pad pasting that adsorbs; And
Paste this pad pasting in this substrate.
Further, according to film covering method of the present invention, wherein, fitting this pad pasting after this substrate, further see through this fluorescence detector automatically detect this substrate of overlay film whether bubble is arranged.
Further, according to film covering method of the present invention, wherein, the step of this execution pan feeding program further comprises:
A mobile overlay film platform is with this substrate of pan feeding; And
The adhesive tape of pad pasting posts in scrolling one volume film mechanism with pan feeding one.
Further, according to film covering method of the present invention, wherein, whether after the step of carrying out this pan feeding substrate, further automatically detecting this substrate through this fluorescence detector has dirty.
Further, according to film covering method of the present invention, further comprise:
Locate the position behind this adhesive tape pan feeding that posts pad pasting; And
Peel off also roll extrusion and fit this pad pasting in this substrate.
Further, according to film covering method of the present invention, wherein, fitting this pad pasting after this substrate, further see through this fluorescence detector automatically detect this substrate of overlay film whether bubble is arranged.
Further, according to film covering method of the present invention, further comprise: the testing result according to this fluorescence detector produces a prompting message.
[description of drawings]
Fig. 1 is the first embodiment block diagram of film layer of the present invention;
Fig. 2 is the first embodiment lateral plan of film layer of the present invention;
Fig. 3 is the first embodiment back view of film layer of the present invention;
Fig. 4 is the first embodiment birds-eye view of film layer of the present invention;
Fig. 5 is the first embodiment diagram of circuit of film covering method of the present invention;
Fig. 6 is the second embodiment block diagram of film layer of the present invention;
Fig. 7 is the second embodiment lateral plan of film layer of the present invention;
Fig. 8 is the second embodiment back view of film layer of the present invention;
Fig. 9 is the second embodiment birds-eye view of film layer of the present invention; And
Figure 10 is the second embodiment diagram of circuit of film covering method of the present invention.
[specific embodiment]
With reference to following examples, so that the enforcement aspect of film layer of the present invention and film covering method to be described.Wherein, film layer is broadly divided into undersized film layer and large-sized film layer, and so-called undersized film layer is applicable to for example overlay film of the substrate below 5 inch, and large-sized film layer is applicable to for example overlay film of the substrate of 5 to 15 inch.In addition, described substrate can such as being to adopt the materials such as glass, plastics, acryl, there is no at this and be limited.
Please refer to Fig. 1 to Fig. 4, be respectively the first embodiment block diagram, lateral plan, back view and the birds-eye view of film layer of the present invention.Wherein, the first embodiment is the actual enforcement aspect that for example is used for illustrating undersized film layer.
In Fig. 1 to Fig. 4, but film layer 20 includes an overlay film platform 22, a volume film mechanism 24, a film carrier platform 26, a suction film tool 28, an alignment sensor 30, a fluorescence detector 32 and a program logic controller 34.Wherein, but the running that program logic controller 34 is used for controlling overlay film platform 22, volume film mechanism 24 and inhales film tool 28.
But the position that film tools 28 move to film carrier platform 26 is inhaled in program logic controller 34 control, and with further absorption and peel off pad pasting, then control is inhaled film tool 28 and moved to bearing fixture 36 so that pad pasting is conformed on the substrate 38.
In addition, the alignment sensor 30 that present embodiment is designed, it is to detect the position of inhaling the pad pasting that film tool 28 adsorbs.And but program logic controller 34 is further controlled according to the detecting result of alignment sensor 30 and is inhaled film tool 28 and carry out a location program.Wherein, the alignment sensor 30 of present embodiment can for example be comprised of a groove limit switch and an optical fiber.
Moreover, fluorescence detector 32 is by several optical coupling assemblies (as: charge coupled device (CCD) (Charge Coupled Device, CCD)) 46 form, present embodiment is comprised of two optical coupling assemblies 46 for example, it is dirty to detect surperficial scratch on the substrate 38 that is seated in the not overlay film on the bearing fixture 36 or dust fall particulate etc. with one of them optical coupling assembly 46 by fluorescence detector 32, and detects the bubble on the substrate 38 of overlay film that is seated on the bearing fixture 36 by another optical coupling assembly 46 of fluorescence detector 32.After treating that arbitrary optical coupling assembly 46 detections are finished, but program logic controller 34 namely produces a prompting message according to the testing result of fluorescence detector 32.Thus, but the program logic controller 34 of present embodiment just can according to the testing result of fluorescence detector 32 (two optical coupling assemblies 46) judge substrate 38 before overlay film with after situation.
Framework from the above, come further casehistory with the birds-eye view of Fig. 4, four bearing fixtures 36 of present embodiment for example be placed in respectively 0 ° of rotating mechanism 23 (on), the position of 90 ° (right side), 180 ° (descending) and 270 ° (left sides); Two optical coupling assemblies 46 then are respectively designs above the position of 0 ° and 180 °.Thus, suppose that rotating mechanism 23 is each 90-degree rotations in a clockwise direction, then operating personal can be regularly takes out the substrate 38 of overlay film and puts the not substrate 38 of overlay film again at rotation to the bearing fixture 36 of 90 ° position; Relative, the optical coupling assembly 46 that is positioned at 180 ° position top is the substrates 38 that detect the not overlay film of rotation to the bearing fixture 36 of 180 ° position, and the optical coupling assembly 46 that is positioned at 0 ° top, position then is the substrate 38 that detects the overlay film of rotation to the bearing fixture 36 of 0 ° position; The substrate 38 of the not overlay film of rotation to the bearing fixture 36 of 270 ° position then is to carry out pad pasting for inhaling film tool 28.
So (for example the surface before substrate 38 overlay films has greater than the particulate more than the 1mm when bad when but program logic controller 34 is judged the quality of substrate 38 before or after overlay film according to testing result; Or produce bubble behind substrate 38 overlay films), but program logic controller 34 will send a prompting message (such as caution sound, flash of light etc.).
Fig. 5 is the first embodiment diagram of circuit of film covering method of the present invention.When the operating process of instruction diagram 5, the while is referring to figs. 1 to every assembly of the film layer 20 of Fig. 4.
At first, but program logic controller 34 carries out the program of opening initialization, but so that the parameters of program logic controller 34 internal preset is set (step S50).If but program logic controller 34 can't be finished opening initialization, then but program logic controller 34 sends prompting message (for example sending caution sound) with notice operating personal (step S52), but program logic controller 34 checked and keep in repair by operating personal, and after finishing repeated execution of steps S50.
After but program logic controller 34 is finished opening initialization, but program logic controller 34 is got back to reference position (step S54) according to default parameter control suction film tool 28.
But program logic controller 34 judges whether inhale film tool 28 gets back to reference position (step S58), if but program logic controller 34 judges that inhaling film tool 28 does not get back to reference position, then controlled with manual mode by operating personal and inhale film tool 28 (step S56), and carry out again step S54 and step S58.
Get back to reference position if but program logic controller 34 is judged suction film tool 28, but then the top (step S60) that film tools 28 move to film carrier platform 26 is inhaled in program logic controller 34 controls, that is the position that film tool 28 moves to the suction film is inhaled in control.In addition, but program logic controller 34 is also controlled the pan feeding program that the scrolling of volume film mechanism 24 posts the adhesive tape of pad pasting simultaneously, to carry this adhesive tape that posts pad pasting to film carrier platform 26.
After inhaling film tool 28 absorption pad pastings, but program logic controller 34 controls are inhaled film tool 28 and are moved (that is past overlay film locality moves) toward bearing fixture 36 directions, and but program logic controller 34 other control volume film mechanisms 24 come the scrolling adhesive tape, pad pasting can be peeled off on the one hand, namely so-called demoulding flow process; On the other hand, also can reclaim simultaneously the adhesive tape of peeling off pad pasting in reclaiming charging tray 44 (step S66).
Additional disclosure be, but if judging the adhesive tape that coating materials dish 40 loads, program logic controller 34 uses, then but program logic controller 34 will send prompting message, and suspend the present work of film layer 20, when waiting to rejudge the adhesive tape on the membrane charging tray 40, recover the running of film layer 20.
But program logic controller 34 controls are inhaled film tool 28 and are moved to overlay film position (step S68).During movement, can control inhale film tools 28 through alignment sensors 30 but program logic controller 34 is default, carry out a location program with the detecting result according to alignment sensor 30, so to guarantee follow-uply accurately pad pasting to be covered on substrate 38.In the present embodiment, whether alignment sensor 30 is for example to be used for detecting an orientation angle of inhaling the pad pasting that film tool 28 adsorbs, to finish by the location of whether confirming that detects orientation angle.And finish when inhaling film tool 28 location, and when moving to the overlay film position, but program logic controller 34 is further judged bearing fixture 36 whether put in place (step S69).
If the determination result is NO for step S69, represent that then bearing fixture 36 not yet puts in place, so repeated execution of steps S69, to wait for that bearing fixture 36 puts in place.Yet the steps flow chart before wait bearing fixture 36 puts in place can for example be the program of carrying out a pan feeding substrate 38.Specifically, inciting somebody to action not by operating personal, the substrate 38 of overlay film is seated in bearing fixture 36 (step S70).And then, but program logic controller 34 control rotating mechanisms 23 90-degree rotations will carry the bearing fixture 36 of the substrate 38 of overlay film not and move to one of them optical coupling assembly 46 below (step S72) of fluorescence detector 32.So, but program logic controller 34 is just controlled optical coupling assembly 46 and is automatically detected particulate on the substrate 38 of putting overlay film not, and judges the size of the particulate on the substrate 38 of overlay film not and quantity whether (step S74) up to specification according to the testing result of optical coupling assembly 46.
If the determination result is NO for step S74, but then program logic controller 34 sends prompting message (for example sending caution sound) with notice operating personal (step S76), by operating personal against regulation substrate 38 is taken out from bearing fixture 36.Then repeat step S70 and step thereafter thereof, again to carry out the flow process of pan feeding substrate 38.Otherwise if the judged result of step S74 is yes, but then program logic controller 34 is controlled again 90-degree rotation of rotating mechanisms 23, has the bearing fixture 36 that detects qualified substrate 38 to move to the position of preparing overlay film storing.At this moment, but program logic controller 34 can judge that bearing fixture 36 has put in place in the judgement of step S69.And then, but program logic controller 34 control suction film tools 28 carry out overlay film, pad pasting is covered on the substrate 38 (step S80) of qualified after testing not overlay film.
Then, but program logic controller 34 judge overlay film and whether finish (step S82).If the determination result is NO for step S82, then repeat step S82, to continue to carry out overlay film.If the judged result of step S82 is yes, but then program logic controller 34 control suction film tools 28 stop to adsorb pad pasting, and control suction film tool 28 leaves the substrate 38 (step S84) of overlay film.
After finishing overlay film, but program logic controller 34 is inhaled film tool 28 except control and is got back to reference position and repeated execution of steps S60 and the steps flow chart thereafter thereof, also synchro control rotating mechanism 23 90-degree rotation again moves to another optical coupling assembly 46 belows (step S86) of fluorescence detector 32 in order to storing there is the bearing fixture 36 of the substrate 38 of overlay film.And then control again bubble on the substrate 38 that this another optical coupling assembly 46 detects overlay film automatically, with the size of the bubble on the substrate 38 of judging overlay film according to the testing result of this another optical coupling assembly 46 and quantity whether (step S88) up to specification.
If the determination result is NO for step S88, represent that the bubble on the substrate 38 of overlay film exceeds regulation, so but program logic controller 34 sends prompting message (for example sending caution sound) with notice operating personal (step S90).If the judged result of step S88 is yes, perhaps step S90 sends after the prompting message, but program logic controller 34 control rotating mechanism 23 90-degree rotations (step S92) take out the substrate 38 (detection acceptance or rejection) of having finished overlay film for operating personal.And then re-execute again step S70 again to put another not substrate 38 of overlay film.
After implementing above-mentioned every step, carry out the work such as detection of particulates, overlay film and bubble detection to finish 20 pairs of substrates of undersized film layer of the present invention 38.Wherein, present embodiment sees through the design that film tool 28 and fluorescence detector 32 are inhaled in 22 collocation of overlay film platform, the automatic detection before and after can reaching substrate 38 overlay films, when repeating and continue to carry out above-mentioned every step, detect behind detection before the pan feeding of substrate 38, the overlay film, overlay film and the overlay film and carried out synchronously, use effectively promoting prouctiveness.
Please refer to Fig. 6 to Fig. 9, be respectively block diagram, lateral plan, back view and the birds-eye view of the second embodiment of film layer of the present invention.Wherein, the second embodiment is the actual enforcement aspect that for example is used for illustrating large-sized film layer.
In Fig. 6 to 9, large-sized film layer 100 includes an overlay film platform 102, a volume film mechanism 104, a roller indenter device 106, a header system 108, an alignment sensor 110, but a fluorescence detector 112 and a program logic controller (not shown, as to be installed in the below of film layer 100).But program logic controller is used for controlling the running of overlay film platform 102 and header system 108, and overlay film platform 102 wherein is to carry a substrate (not shown), and can be mobile on the outside and the lower horizontal ground of volume film mechanism 104.
In addition, the alignment sensor 110 of present embodiment design, it is to detect in the volume film mechanism 104 this to post the position of the adhesive tape of pad pasting.And but program logic controller further controls header system 108 according to the detecting result of alignment sensor 110 and carries out a location program, to guarantee the particularity of follow-up overlay film.Wherein, alignment sensor 110 forms (present embodiment is two optical fiber) by several optical fiber.
Moreover fluorescence detector 112 is comprised of several optical coupling assemblies (as: charge coupled device (CCD) (Charge Coupled Device, CCD)) 120, and present embodiment is to comprise for example two optical coupling assemblies 120.Fluorescence detector 112 is used for detecting the bubble on the substrates dirty and overlay film such as surperficial scratch on the substrate that is seated in the not overlay film on the overlay film platform 102 or dust fall particulate.And but program logic controller produces a prompting message (such as caution sound, flash of light etc.) according to the testing result of fluorescence detector 112.
In actual operation; but when program logic controller judge substrate before overlay film with after quality bad (producing bubble after for example the surface before the substrate overlay film has greater than the particulate more than the 1mm or substrate overlay film) time, but program logic controller will send a prompting message.By this, can automatically detect the demand of substrate situation when reaching before and after the overlay film.
Figure 10 is the second embodiment diagram of circuit of film covering method of the present invention.When the operating process of explanation Figure 10, the while is with reference to every assembly of the film layer 100 of figure 6 to Fig. 9.
At first, but program logic controller carries out the program of opening initialization, but so that the parameters of program logic controller internal preset is set (step S130).If but program logic controller can't be finished opening initialization, then but program logic controller sends prompting message (for example sending caution sound) with notice operating personal (step S132), by operating personal but program logic controller is carried out removal of obstacle, but and after finishing, re-execute step S130 by program logic controller.
After but program logic controller is finished opening initialization, but program logic controller is controlled header system 108 according to default parameter and is got back to reference position (step S134), wherein because being the modes that see through mechanism's interlock, header system 108 controls volume film mechanism 104 and roller indenter device 106, therefore when reference position was got back to by header system 108, volume film mechanism 104 and roller indenter device 106 can be got back to reference position equally.
Next, but program logic controller judge header system 108 and whether get back to reference position (step S138), if the determination result is NO for step S138, then repeat step S134, until reference position is got back to by header system 108.If the judged result of step S138 is yes, but then program logic controller sees through header system 108 and controls volume film mechanism 104 beginning membranes, with a pan feeding program (step S146) of the adhesive tape that carries out posting pad pasting.Particularly, header system 108 is adhesive tapes that control membrane charging tray 114 scrollings go out to post pad pasting, and the scrolling that charging tray 118 is reclaimed in control spurs the adhesive tape that posts pad pasting, and adhesive tape that full wafer posts pad pasting is carried by cylinder 116 supports and scrolling.In addition, reclaim charging tray 118 after pad pasting is peeled off, namely be used for reclaiming the adhesive tape of peeling off pad pasting.
Additional disclosure be that when header system 108 control membrane charging trays 114 scrollings go out adhesive tape, but whether program logic controller can further be judged the adhesive tape that coating materials dish 114 loads and use.If adhesive tape uses, but then program logic controller will send prompting message, and suspend the present work of film layer 100.Thus, operating personal can manually be controlled header system 108 (step S136) after changing adhesive tape, get back to reference position to allow the 108 execution in step S134 of header system.
When step S146 carries full wafer to post the adhesive tape of pad pasting, but further being detecting result according to alignment sensor 110, program logic controller carries out a location program (step S148).
The concrete locating procedure of present embodiment can utilize and shown in Figure 9 angle is set and direction is carried out following running explanation: at first, but that program logic controller sees through 108 control volume film mechanisms 104 of header system is mobile towards the direction (from left to right) of alignment sensor 110.Wherein, the alignment sensor 110 of present embodiment is for example to adopt two positions to design at the optical fiber of same level line, this horizon is the right edge that is parallel to overlay film platform 102, so that two optical fiber is used for detecting the same side of the pad pasting on the adhesive tape that volume film mechanism 104 carries.
Thus, when only having arbitrary optical fiber to detect pad pasting, represent that namely pad pasting is crooked with respect to overlay film platform 102, but program logic controller saw through that 108 control volume film mechanisms 104 of header system stop to move on and carried out the adjustment of horizontal direction rotation based on vertical axis this moment, so that two optical fiber all can detect pad pasting; And when two optical fiber all detect pad pasting, but program logic controller namely stops the adjustment of horizontal rotation through 108 control volume film mechanisms 104 of header system and move a predeterminable range towards the direction (from right to left) away from alignment sensor 110; Afterwards, it is mobile towards the direction (from left to right) of alignment sensor 110 that but program logic controller sees through 108 control volume film mechanisms 104 of header system again, and when two optical fiber detected the pad pasting that volume film mechanism 104 carries, control volume film mechanism 104 halted.By this, volume film mechanism 104 carries the adhesive tape that posts pad pasting to the overlay film position, and pad pasting also is in accurate position.
From the above, after step S148 finishes locating procedure, but program logic controller is further judged overlay film platform 102 whether put in place (step S163).If the determination result is NO for step S163, then represent overlay film platform 102 and not yet put in place, so repeated execution of steps S163, put in place to wait for overlay film platform 102.Yet the steps flow chart before wait overlay film platform 102 puts in place can for example be the program of carrying out a pan feeding substrate.Specifically, by operating personal will be not the substrate of overlay film be seated in overlay film platform 102 (step S156), the overlay film platform 102 of present embodiment can for example be to inhale vacuum mode to fix substrate.And then, but several optical coupling assemblies 120 of program logic controller control fluorescence detector 112 detect the particulate on the substrate of putting overlay film not automatically, and judge the size of the particulate on the substrate of overlay film not and quantity whether (step S160) up to specification according to the testing result of fluorescence detector 112.
If the determination result is NO for step S160, but then program logic controller sends prompting message (for example sending caution sound) with notice operating personal (step S162), by operating personal against regulation substrate is taken out from overlay film platform 102.Then repeat step S156 and step thereafter thereof, again to carry out the flow process of pan feeding substrate.Otherwise if the judged result of step S160 is yes, but then program logic controller control overlay film platform 102 moves to the overlay film position.But program logic controller can judge that overlay film platform 102 has put in place in the judgement of step S163 at this moment.And then, but program logic controller sees through header system 108 controls roller indenter device 106 the pad pasting ground roll of taking advantage of a situation is pressed on the substrate (step S164) of qualified after testing not overlay film.
Then, but program logic controller judge overlay film and whether finish (step S166).In simple terms, but program logic controller can judge length that whether the roll extrusion distance of roller indenter device 106 reaches a substrate and judge whether that overlay film finishes.If the determination result is NO for step S166, repeated execution of steps S164 then is to continue to carry out overlay film.If the judged result of step S166 is yes, but then program logic controller stops the roll extrusion pad pasting through header system 108 control roller indenter devices 106, and control roller indenter device 106 leaves the substrate of overlay film (step S168).
After finishing overlay film, but program logic controller except repeated execution of steps S134 control header system 108 get back to reference position and and then execution in step S134 steps flow chart thereafter, also synchro control overlay film platform 102 shifts out the overlay film position, also is about to several optical coupling assembly 120 belows (step S170) that the substrate of overlay film moves to fluorescence detector 112.Whether and then but program logic controller controls the bubble on the substrate that these optical coupling assemblies 120 detect overlay film automatically again, with the size of the bubble on the substrate of judging overlay film according to the testing result of fluorescence detector 112 and quantity (step S172) up to specification.
If the determination result is NO for step S172, represent that the bubble on the substrate of overlay film exceeds regulation, so but program logic controller sends prompting message (for example sending caution sound) with notice operating personal (step S176).If the judged result of step S172 is yes, perhaps step S176 sends after the prompting message, then operating personal takes out the substrate (detection acceptance or rejection) finished overlay film, but and and then make program logic controller re-execute step S156, with another substrate of overlay film not of pan feeding again.
After implementing above-mentioned every step, carry out the work such as detection of particulates, overlay film and bubble detection to finish 100 pairs of substrates of large-sized film layer of the present invention.
Advantage of the present invention provides a kind of film layer and film covering method, utilize the fluorescence detector of film layer to detect the situation that the dust fall of substrate before overlay film is attached to substrate, and the situation that detects the Bubble formation of substrate behind overlay film, in time find the bad substrate of overlay film, to reach the effect of the overall yield that improves the substrate overlay film, and film layer realizes that the precision of substrate overlay film is high, speed is fast, without bubble, reach simultaneously simple to operate, be convenient to management and the characteristics such as practical strong.
Although the present invention narrates as above with reference to preferred embodiment and illustrative accompanying drawing, precisely because should not be regarded as restricted person.Be familiar with this skill person the content of its form and concrete example is made various modifications, omission and variation, all do not leave the scope that claim of the present invention is advocated.
Claims (17)
1. film layer comprises:
One overlay film platform is used for carrying at least one substrate for overlay film; And
One fluorescence detector is used for detecting the quality of this substrate on this overlay film platform before and after the overlay film.
2. film layer as claimed in claim 1 is characterized in that, described fluorescence detector comprises a plurality of optical coupling assemblies.
3. film layer as claimed in claim 1 is characterized in that, described overlay film platform further comprises:
One rotating mechanism; And
A plurality of bearing fixtures are arranged on this rotating mechanism, are used for respectively carrying this substrate.
4. film layer as claimed in claim 3 is characterized in that, further comprises:
One film carrier platform;
One volume film mechanism loads one and posts the adhesive tape of pad pasting, and carries this adhesive tape that posts pad pasting to this film carrier platform;
One inhales the film tool, is used for adsorbing and peels off the pad pasting on this film carrier platform, and this pad pasting is fitted in substrate on this bearing fixture;
One alignment sensor is detected the position of the pad pasting that this suction film tool adsorbs; And
A but program logic controller, control the running of this overlay film platform, this volume film mechanism and this suction film tool, and further control this suction film tool according to the detecting result of this alignment sensor and carry out a location program, and produce a prompting message according to the testing result of this fluorescence detector.
5. film layer as claimed in claim 4 is characterized in that, described volume film mechanism comprises:
One membrane charging tray loads and scrolling goes out the adhesive tape that this posts pad pasting;
At least one cylinder is arranged at this membrane charging tray downstream, is used for supporting and carries this to post the adhesive tape of pad pasting; And
One reclaims charging tray, and scrolling reclaims this adhesive tape of having peeled off pad pasting.
6. film layer as claimed in claim 1 is characterized in that, further comprises:
One volume film mechanism is used for carrying and carries an adhesive tape that posts pad pasting;
One roller indenter device is used for peeling off the pad pasting in this volume film mechanism, so that this pad pasting roll extrusion is conformed to this substrate;
One header system controls the movement of this volume film mechanism and this roller indenter device;
One alignment sensor is detected in this volume film mechanism this and is posted the position of the adhesive tape of pad pasting; And
A but program logic controller, control the running of this overlay film platform and this header system, and further control this header system according to the detecting result of this alignment sensor and carry out a location program, and produce a prompting message according to the testing result of this fluorescence detector.
7. film layer as claimed in claim 6 is characterized in that, described volume film mechanism comprises:
One membrane charging tray loads and scrolling goes out the adhesive tape that this posts pad pasting;
At least one cylinder is arranged at this membrane charging tray downstream, is used for carrying and carrying the adhesive tape that this posts pad pasting; And
One reclaims charging tray, and scrolling reclaims this adhesive tape of having peeled off pad pasting.
8. film covering method is characterized in that step comprises:
Carry out a pan feeding program; And
Before a substrate is carried out overlay film with after, see through the quality that a fluorescence detector detects this substrate automatically.
9. film covering method as claimed in claim 8 is characterized in that, the step of this execution pan feeding program further comprises:
Rotate an overlay film platform, with this substrate of pan feeding, wherein this overlay film platform comprises a plurality of bearing fixtures that are used for carrying this substrate; And
The adhesive tape of pad pasting posts in scrolling one volume film mechanism with pan feeding one.
10. film covering method as claimed in claim 9 is characterized in that, whether after the step of carrying out this pan feeding substrate, further automatically detecting this substrate through this fluorescence detector has dirty.
11. film covering method as claimed in claim 9 is characterized in that, further comprises:
Absorption is also peeled off this pad pasting;
Locate the position of this pad pasting that adsorbs; And
Paste this pad pasting in this substrate.
12. film covering method as claimed in claim 11 is characterized in that, is fitting this pad pasting after this substrate, further see through this fluorescence detector automatically detect this substrate of overlay film whether bubble is arranged.
13. film covering method as claimed in claim 8 is characterized in that, the step of described execution pan feeding program further comprises:
A mobile overlay film platform is with this substrate of pan feeding; And
The adhesive tape of pad pasting posts in scrolling one volume film mechanism with pan feeding one.
14. film covering method as claimed in claim 13 is characterized in that, whether after the step of carrying out this pan feeding substrate, further automatically detecting this substrate through this fluorescence detector has dirty.
15. film covering method as claimed in claim 13 is characterized in that, further comprises:
Locate the position behind this adhesive tape pan feeding that posts pad pasting; And
Peel off also roll extrusion and fit this pad pasting in this substrate.
16. film covering method as claimed in claim 15 is characterized in that, is fitting this pad pasting after this substrate, further see through this fluorescence detector automatically detect this substrate of overlay film whether bubble is arranged.
17. film covering method as claimed in claim 8 is characterized in that, further comprises: the testing result according to this fluorescence detector produces a prompting message.
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201110289590.0A CN102991750B (en) | 2011-09-18 | 2011-09-18 | Laminating machine and laminating method |
TW101209137U TWM440936U (en) | 2011-09-18 | 2012-05-15 | Film laminating machine |
TW101117184A TWI565645B (en) | 2011-09-18 | 2012-05-15 | Film laminating machine and film laminating method |
JP2012202753A JP5731457B2 (en) | 2011-09-18 | 2012-09-14 | Film laminating apparatus and film laminating method |
KR1020120102649A KR101553359B1 (en) | 2011-09-18 | 2012-09-17 | Film lamination method and an apparatus for carrying out the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201110289590.0A CN102991750B (en) | 2011-09-18 | 2011-09-18 | Laminating machine and laminating method |
Publications (2)
Publication Number | Publication Date |
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CN102991750A true CN102991750A (en) | 2013-03-27 |
CN102991750B CN102991750B (en) | 2015-06-24 |
Family
ID=47717309
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Application Number | Title | Priority Date | Filing Date |
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CN201110289590.0A Expired - Fee Related CN102991750B (en) | 2011-09-18 | 2011-09-18 | Laminating machine and laminating method |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5731457B2 (en) |
KR (1) | KR101553359B1 (en) |
CN (1) | CN102991750B (en) |
TW (2) | TWI565645B (en) |
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CN110901036A (en) * | 2019-11-29 | 2020-03-24 | 无锡职业技术学院 | Positioning mechanism in numerical control film sticking machine |
CN111731555A (en) * | 2020-07-17 | 2020-10-02 | 宁波峰梅新能源汽车科技有限公司 | Automatic plane pad pasting equipment |
CN112090771A (en) * | 2020-08-28 | 2020-12-18 | 苏州天立达胶粘制品有限公司 | Assembly line AOI visual inspection machine |
CN112090771B (en) * | 2020-08-28 | 2021-11-26 | 苏州天立达精密科技股份有限公司 | Assembly line AOI visual inspection machine |
CN117645030A (en) * | 2024-01-29 | 2024-03-05 | 歌尔股份有限公司 | Film pasting device and processing equipment |
Also Published As
Publication number | Publication date |
---|---|
KR20130030730A (en) | 2013-03-27 |
JP2013063655A (en) | 2013-04-11 |
TW201313594A (en) | 2013-04-01 |
CN102991750B (en) | 2015-06-24 |
KR101553359B1 (en) | 2015-09-30 |
TWM440936U (en) | 2012-11-11 |
TWI565645B (en) | 2017-01-11 |
JP5731457B2 (en) | 2015-06-10 |
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Effective date of registration: 20160512 Address after: 361009, No. 199, Sakamoto Road, information photoelectric Park, torch hi tech Zone, Fujian, Xiamen Patentee after: TPK Touch Solutions (Xiamen) Inc. Address before: 361009 Fujian Province, Xiamen torch hi tech Zone information photoelectric park is Sakamoto Road No. 199 Patentee before: Ray-Star Technology (Xiamen) Inc. |
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