TW201313594A - Film laminating machine and film laminating method - Google Patents

Film laminating machine and film laminating method Download PDF

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Publication number
TW201313594A
TW201313594A TW101117184A TW101117184A TW201313594A TW 201313594 A TW201313594 A TW 201313594A TW 101117184 A TW101117184 A TW 101117184A TW 101117184 A TW101117184 A TW 101117184A TW 201313594 A TW201313594 A TW 201313594A
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film
substrate
tape
platform
optical detector
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TW101117184A
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Chinese (zh)
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TWI565645B (en
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Kun-Rung Lin
Xiao-dong LIU
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Ray Star Technology Xiamen Inc
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B41/00Arrangements for controlling or monitoring lamination processes; Safety arrangements
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • G01B11/002Measuring arrangements characterised by the use of optical techniques for measuring two or more coordinates
    • G01B11/005Measuring arrangements characterised by the use of optical techniques for measuring two or more coordinates coordinate measuring machines
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B41/00Arrangements for controlling or monitoring lamination processes; Safety arrangements
    • B32B2041/06Starting the lamination machine or method
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices

Abstract

The present invention relates to a film laminating machine and a film laminating method, which are used for laminating a film on a piece of substrate. The film laminating machine comprises an optical detector for detecting particles on the substrate before laminating the film and detecting bubbles on the substrate after the film is laminated on the substrate. By using the optical detector to detect the conditions of dusts attached to and bubbles generated on substrate before and after laminating a film on the substrate, the substrate that are poor in laminated films can be detected timely so that the overall yield rate of laminating film can be improved.

Description

覆膜機及覆膜方法 Laminating machine and film coating method

本發明有關於一種覆膜機及覆膜方法,特別有關於針對觸控面板之基板進行覆膜之覆膜機及覆膜方法。 The present invention relates to a laminating machine and a laminating method, and more particularly to a laminating machine and a laminating method for laminating a substrate of a touch panel.

由於科技的進步,例如電腦、PDA、智慧型手機或平板電腦等具有強大功能的智慧型裝置紛紛出爐。許多智慧型裝置安裝有觸控面板,以供使用者以觸控方式來操作智慧型裝置。 Thanks to advances in technology, smart devices such as computers, PDAs, smart phones or tablets have been released. Many smart devices are equipped with a touch panel for the user to operate the smart device in a touch manner.

觸控面板之產品中最主要的元件是玻璃,因此在該產品出貨之前(如以雷射切割玻璃之後或在玻璃貼合階段),需要在玻璃表面上貼覆一層保護膜,以防止玻璃的表面因刮傷或落塵微粒等造成玻璃髒污。這層保護膜貼覆在玻璃上需要達到在覆膜後不能在貼膜與玻璃之間產生氣泡。 The most important component of the touch panel product is glass, so before the product is shipped (such as after laser cutting glass or during the glass bonding stage), it is necessary to apply a protective film on the glass surface to prevent the glass. The surface of the surface is stained by scratches or dust particles. This protective film is applied to the glass so that it is impossible to generate bubbles between the film and the glass after the film is coated.

習知在覆膜製程中,皆是由操作人員用肉眼的方式來檢查玻璃覆膜前後的品質是否達到標準(即是否有落塵或氣泡)。然而,習知的人為檢查方式容易因為不同操作人員、不同時間、工作時程過長等因素而造成判斷標準不一致且較不客觀,因此對於覆膜的品質及穩定性而言是一個不利的因素,進而降低玻璃覆膜的良率。 In the laminating process, it is customary for the operator to check whether the quality of the glass film before and after the film is up to standard (ie, whether there is dust or bubbles). However, the conventional human inspection method is easy to be inconsistent and less objective due to factors such as different operators, different time, and long working time, so it is an unfavorable factor for the quality and stability of the film. , thereby reducing the yield of the glass film.

本發明提供一種覆膜機及覆膜方法,利用覆膜機之檢測裝 置以同一標準來檢測基板在覆膜前之落塵附著在基板的情況,以及檢測基板在覆膜後之氣泡產生的情況,藉此提升覆膜的品質及穩定性以進一步提高基板的覆膜良率。 The invention provides a laminating machine and a laminating method, which utilize the testing device of the laminating machine The same standard is used to detect the adhesion of the substrate to the substrate before the film is deposited, and to detect the occurrence of bubbles after the film is coated, thereby improving the quality and stability of the film to further improve the film coverage of the substrate. rate.

本發明係提供一種覆膜機,包含:一覆膜平台,用來承載至少一基板以供覆膜;及一光學檢測器,用來檢測覆膜前後該覆膜平台上的該基板的品質。 The present invention provides a film laminating machine comprising: a film coating platform for carrying at least one substrate for coating; and an optical detector for detecting the quality of the substrate on the filming platform before and after the film coating.

根據本發明之覆膜機,其中,該光學檢測器包含複數個光學耦合元件。 A laminator according to the present invention, wherein the optical detector comprises a plurality of optical coupling elements.

根據本發明之覆膜機,其中,該覆膜平台進一步包含:一旋轉機構;及複數個承載治具,設置於該旋轉機構上,分別用來承載該基板。 The film laminating machine according to the present invention, wherein the film-coated platform further comprises: a rotating mechanism; and a plurality of bearing fixtures disposed on the rotating mechanism for respectively carrying the substrate.

根據本發明之覆膜機,進一步包含:一載膜平台;一捲膜機構,裝載一貼有貼膜之膠帶,並且輸送該貼有貼膜之膠帶至該載膜平台;一吸膜治具,用來吸附並剝離該載膜平台上的貼膜,並將該貼膜貼合於該承載治具上的基板;一定位感測器,偵測該吸膜治具所吸附之貼膜的位置;以及一可程式邏輯控制器,控制該覆膜平台、該捲膜機構及該 吸膜治具的運作,並且進一步根據該定位感測器的偵測結果來控制該吸膜治具進行一定位程序;以及根據該光學檢測器的檢測結果來產生一提示訊息。 The film laminating machine according to the present invention further comprises: a film loading platform; a film winding mechanism, loading a tape attached with the film, and conveying the tape attached with the film to the carrier film platform; The film on the carrier film platform is adsorbed and peeled off, and the film is attached to the substrate on the bearing fixture; a positioning sensor is used to detect the position of the film adsorbed by the film holder; and a logic controller that controls the filming platform, the film winding mechanism, and the The operation of the suction jig, and further controlling the film jig to perform a positioning process according to the detection result of the positioning sensor; and generating a prompt message according to the detection result of the optical detector.

根據本發明之覆膜機,其中,該捲膜機構包含:一出膜料盤,裝載並捲動出該貼有貼膜之膠帶;至少一滾筒,設置於該出膜料盤下游,用來支撐及輸送該貼有貼膜之膠帶;以及一回收料盤,捲動回收該已剝離貼膜之膠帶。 The film laminating machine according to the present invention, wherein the film winding mechanism comprises: a film discharging tray for loading and rolling the tape attached with the film; at least one roller disposed downstream of the film discharging tray for supporting And conveying the tape with the film attached; and a recycling tray for rolling and recovering the tape of the peeled film.

根據本發明之覆膜機,進一步包含:一捲膜機構,用來輸送及承載一貼有貼膜之膠帶;一滾輪壓頭裝置,用來剝離該捲膜機構上的貼膜,以將該貼膜滾壓貼合至該基板;一標頭系統,控制該捲膜機構及該滾輪壓頭裝置的移動;一定位感測器,偵測該捲膜機構上的該貼有貼膜之膠帶的位置;以及一可程式邏輯控制器,控制該覆膜平台及該標頭系統的運作,並且進一步根據該定位感測器的偵測結果來控制該標頭系統進行一定位程序;以及根據該光學檢測器的檢測結果來產生一提示訊息。 The laminating machine according to the present invention further comprises: a film winding mechanism for conveying and carrying a tape attached with a film; and a roller pressing device for peeling off the film on the film winding mechanism to roll the film Pressing the substrate to the substrate; a header system for controlling the movement of the film winding mechanism and the roller head device; and a positioning sensor for detecting the position of the film-attached tape on the film winding mechanism; a programmable logic controller for controlling the operation of the filming platform and the header system, and further controlling the header system to perform a positioning procedure according to the detection result of the positioning sensor; and according to the optical detector The result is detected to generate a prompt message.

根據本發明之覆膜機,其中,該捲膜機構包含:一出膜料盤,裝載並捲動出該貼有貼膜之膠帶;至少一滾筒,設置於該出膜料盤下游,用來輸送及承載該 貼有貼膜之膠帶;以及一回收料盤,捲動回收該已剝離貼膜之膠帶。 The film laminating machine according to the present invention, wherein the film winding mechanism comprises: a film discharging tray for loading and rolling the tape attached with the film; at least one roller disposed downstream of the film discharging tray for conveying And carrying the a tape attached with a film; and a recycling tray for rolling the tape of the peeled film.

本發明係提供一種覆膜方法,應用於一覆膜機覆膜一基板該覆膜方法之步驟包括:執行一入料程序;及在對該基板進行覆膜之前與後,透過一光學檢測器自動檢測該基板的品質。 The invention provides a film coating method, which is applied to a film of a laminator film. The method of laminating the film comprises: performing a feeding process; and passing an optical detector before and after laminating the substrate The quality of the substrate is automatically detected.

根據本發明之覆膜方法,其中,該執行入料程序之步驟進一步包含:旋轉一覆膜平台,以入料該基板,其中該覆膜平台包含複數個用來承載該基板的承載治具;及捲動一捲膜機構,以入料一貼有貼膜之膠帶。 The film coating method according to the present invention, wherein the step of performing the feeding process further comprises: rotating a filming platform to feed the substrate, wherein the filming platform comprises a plurality of bearing fixtures for carrying the substrate; And rolling a film mechanism to feed the tape with the film attached.

根據本發明之覆膜方法,其中,在執行該入料基板之步驟後,進一步透過該光學檢測器自動檢測該基板是否有髒污。 According to the film coating method of the present invention, after the step of performing the feeding of the substrate, the optical detector is further used to automatically detect whether the substrate is dirty.

根據本發明之覆膜方法,進一步包含:吸附並剝離該貼膜;定位該所吸附之貼膜的位置;及貼覆該貼膜於該基板。 The film coating method according to the present invention further comprises: adsorbing and peeling off the film; positioning the position of the adsorbed film; and attaching the film to the substrate.

根據本發明之覆膜方法,其中,在貼合該貼膜於該基板之後,進一步透過該光學檢測器自動檢測該已覆膜之基板是否有氣泡。 According to the film coating method of the present invention, after the film is attached to the substrate, the substrate of the film is automatically detected by the optical detector to detect whether there is a bubble.

根據本發明之覆膜方法,其中,該執行入料程序之步驟進 一步包含:移動一覆膜平台,以入料該基板;及捲動一捲膜機構,以入料一貼有貼膜之膠帶。 The film coating method according to the present invention, wherein the step of performing the feeding process is advanced One step includes: moving a laminating platform to feed the substrate; and rolling a roll of film mechanism to feed a tape with a film attached thereto.

根據本發明之覆膜方法,其中,在執行該入料基板之步驟後,進一步透過該光學檢測器自動檢測該基板是否有髒污。 According to the film coating method of the present invention, after the step of performing the feeding of the substrate, the optical detector is further used to automatically detect whether the substrate is dirty.

根據本發明之覆膜方法,進一步包含:定位該貼有貼膜之膠帶入料後的位置;及剝離並滾壓貼合該貼膜於該基板。 The film coating method according to the present invention further includes: positioning a position of the tape to which the film is attached, and peeling and rolling the film on the substrate.

根據本發明之覆膜方法,其中,在貼合該貼膜於該基板之後,進一步透過該光學檢測器自動檢測該已覆膜之基板是否有氣泡。 According to the film coating method of the present invention, after the film is attached to the substrate, the substrate of the film is automatically detected by the optical detector to detect whether there is a bubble.

根據本發明之覆膜方法,進一步包含:根據該光學檢測器的檢測結果來產生一提示訊息。 According to the film coating method of the present invention, the method further comprises: generating a prompt message according to the detection result of the optical detector.

參考以下實施例,以說明本發明之覆膜機及覆膜方法的實施態樣。其中,覆膜機大致可分為小尺寸之覆膜機及大尺寸之覆膜機,所謂的小尺寸之覆膜機適用於例如5英吋以下之基板的覆膜,大尺寸之覆膜機適用於例如5至15英吋之基板的覆膜。此外,所述的基板可例如是採用玻璃、塑膠、壓克力等材質,在此並無加以限制。 The following examples are given to illustrate the embodiment of the laminator and the lamination method of the present invention. Among them, the laminating machine can be roughly classified into a small-sized laminating machine and a large-sized laminating machine, and the so-called small-sized laminating machine is suitable for a film of a substrate of, for example, 5 inches or less, and a large-sized laminating machine. It is suitable for a film of, for example, a substrate of 5 to 15 inches. In addition, the substrate may be made of, for example, glass, plastic, acryl or the like, and is not limited herein.

請參考圖1至圖4,分別為本發明之覆膜機的第一實施例立體圖、側視圖、後視圖及俯視圖。其中,第一實施例是例 如用來說明小尺寸之覆膜機的實際實施態樣。 Please refer to FIG. 1 to FIG. 4 , which are respectively a perspective view, a side view, a rear view and a plan view of a first embodiment of the laminating machine of the present invention. Wherein the first embodiment is an example For example, it is used to illustrate the actual implementation of a small-sized laminating machine.

在圖1至圖4中,覆膜機20包含有一覆膜平台22、一捲膜機構24、一載膜平台26、一吸膜治具28、一定位感測器30、一光學檢測器32及一可程式邏輯控制器34。其中,可程式邏輯控制器34用來控制覆膜平台22、捲膜機構24及吸膜治具28的運作。 In FIG. 1 to FIG. 4, the laminating machine 20 includes a filming platform 22, a film winding mechanism 24, a film loading platform 26, a suction film fixture 28, a positioning sensor 30, and an optical detector 32. And a programmable logic controller 34. Among them, the programmable logic controller 34 is used to control the operation of the filming platform 22, the film winding mechanism 24 and the suction film fixture 28.

覆膜平台22包含一旋轉機構23及數個承載治具36(本實施例為四個承載治具36)。其中,該等承載治具36設置於旋轉機構23上,分別用來承載一塊基板38。可程式邏輯控制器34控制覆膜平台22的旋轉機構23以每次旋轉90度的方式進行運作,使得個別置放在每一承載治具36上的基板38得以依序進行檢測或覆膜。 The filming platform 22 includes a rotating mechanism 23 and a plurality of bearing fixtures 36 (four bearing fixtures 36 in this embodiment). The bearing fixtures 36 are disposed on the rotating mechanism 23 for respectively carrying a substrate 38. The programmable logic controller 34 controls the rotating mechanism 23 of the film-laying platform 22 to operate at 90 degrees per revolution so that the substrates 38 individually placed on each of the carrier fixtures 36 are sequentially detected or coated.

捲膜機構24包含有一出膜料盤40、滾筒42及一回收料盤44。出膜料盤40裝載及捲動出貼有貼膜(例如離型膜)之膠帶至載膜平台26之位置處。滾筒42設置於出膜料盤40的下游,用來支撐及輸送貼有貼膜之膠帶。回收料盤44捲動回收已剝離貼膜之膠帶。具體來講,可程式邏輯控制器34控制出膜料盤40捲動出貼有貼膜之膠帶,並經由滾筒42捲動而輸送至載膜平台26之位置處,並控制回收料盤44經由滾筒42捲動回收已剝離貼膜之膠帶。其中,當可程式邏輯控制器34判斷出捲膜機構24所裝載之膠帶用完時,可程式邏輯控制器34將發出一提示訊息(如警示聲音、閃光 等),以通知操作人員進行膠帶之更換。 The film winding mechanism 24 includes a film discharge tray 40, a drum 42 and a recovery tray 44. The film discharge tray 40 loads and rolls the tape to which the film (for example, a release film) is attached to the position of the carrier film platform 26. The drum 42 is disposed downstream of the film discharge tray 40 for supporting and conveying the tape to which the film is attached. The recovery tray 44 is rolled to recover the tape of the peeled film. Specifically, the programmable logic controller 34 controls the film discharge tray 40 to roll out the tape attached with the film, and is conveyed to the position of the carrier film platform 26 via the roller 42 and controls the recovery tray 44 via the roller. 42 scrolling to recover the tape that has been peeled off. Wherein, when the programmable logic controller 34 determines that the tape loaded by the film winding mechanism 24 is used up, the programmable logic controller 34 will send a prompt message (such as a warning sound, a flash). Etc) to inform the operator to replace the tape.

可程式邏輯控制器34控制吸膜治具28移動至載膜平台26之位置處,以進一步吸附並剝離貼膜,然後控制吸膜治具28移動至承載治具36以將貼膜貼合至基板38上。 The programmable logic controller 34 controls the film holder 28 to move to the position of the carrier film platform 26 to further adsorb and peel the film, and then controls the film holder 28 to move to the carrier fixture 36 to bond the film to the substrate 38. on.

此外,本實施例所設計的定位感測器30,其是用來偵測吸膜治具28所吸附之貼膜的位置。而可程式邏輯控制器34根據定位感測器30的偵測結果來進一步控制吸膜治具28進行一定位程序。其中,本實施例的定位感測器30可例如由一凹槽限位元開關及一光纖組成。 In addition, the positioning sensor 30 designed in this embodiment is used to detect the position of the film adsorbed by the suction film fixture 28. The programmable logic controller 34 further controls the film holder 28 to perform a positioning process based on the detection result of the positioning sensor 30. The positioning sensor 30 of the embodiment may be composed of, for example, a groove limit switch and an optical fiber.

再者,光學檢測器32係由數個光學耦合元件(如:電荷耦合裝置(Charge Coupled Device,CCD))46組成,本實施例舉例是由兩個光學耦合元件46所組成,以由光學檢測器32的其中一個光學耦合元件46檢測置放在承載治具36上之未覆膜的基板38上之表面刮傷或落塵微粒等髒污,而由光學檢測器32的另一個光學耦合元件46檢測置放在承載治具36上之經覆膜之基板38上之氣泡。待任一光學耦合元件46檢測完成之後,可程式邏輯控制器34即根據光學檢測器32的檢測結果來產生一提示訊息。如此一來,本實施例之可程式邏輯控制器34便可根據光學檢測器32(兩個光學耦合元件46)的檢測結果來判斷基板38在覆膜前與後的狀況。 Furthermore, the optical detector 32 is composed of a plurality of optical coupling elements (eg, Charge Coupled Device (CCD)) 46. This embodiment is exemplified by two optical coupling elements 46 for optical detection. One of the optical coupling elements 46 of the device 32 detects surface scratches or dust particles, etc., placed on the uncoated substrate 38 on the carrier jig 36, and the other optical coupling element 46 of the optical detector 32. Air bubbles placed on the substrate 38 of the film carrying the jig 36 are detected. After the detection of any of the optical coupling elements 46 is completed, the programmable logic controller 34 generates a prompt message based on the detection result of the optical detector 32. In this way, the programmable logic controller 34 of the present embodiment can determine the condition of the substrate 38 before and after the film coating based on the detection results of the optical detector 32 (the two optical coupling elements 46).

承上所述之架構,以圖4之俯視圖來進一步舉例說明,本實施例的四個承載治具36例如是分別置放於旋轉機構23 的0°(上)、90°(右)、180°(下)及270°(左)之位置;而兩個光學耦合元件46則分別是設計在0°及180°之位置的上方。如此一來,假設旋轉機構23是以順時針方向每次旋轉90度,則操作人員即可固定地在旋轉至90°之位置的承載治具36上來取出已覆膜之基板38並再置放未覆膜之基板38;相對的,位於180°之位置上方的光學耦合元件46是用來檢測旋轉至180°之位置的承載治具36上的未覆膜之基板38,而位於0°之位置上方的光學耦合元件46則是用來檢測旋轉至0°之位置的承載治具36上的已覆膜之基板38;而旋轉至270°之位置的承載治具36上的未覆膜之基板38則是供吸膜治具28進行貼膜。 With the above-described structure, further illustrated by the top view of FIG. 4, the four bearing fixtures 36 of the present embodiment are respectively placed on the rotating mechanism 23, for example. The positions of 0° (top), 90° (right), 180° (bottom), and 270° (left); and the two optical coupling elements 46 are designed to be positioned above 0° and 180°, respectively. In this way, assuming that the rotating mechanism 23 is rotated 90 degrees in the clockwise direction, the operator can remove the coated substrate 38 and reposition it on the bearing fixture 36 that is fixedly rotated to 90°. The uncoated substrate 38; oppositely, the optical coupling element 46 above the 180° position is used to detect the uncoated substrate 38 on the carrying fixture 36 rotated to a position of 180°, at 0° The optical coupling element 46 above the position is used to detect the coated substrate 38 on the carrying fixture 36 rotated to a position of 0°; and the uncoated film on the carrying fixture 36 rotated to a position of 270°. The substrate 38 is provided with a film holder 28 for filming.

於是當可程式邏輯控制器34根據檢測結果判斷出基板38在覆膜前或後的品質不良時(例如基板38覆膜前的表面有大於1mm以上的微粒;或基板38覆膜後產生氣泡),可程式邏輯控制器34將發出一提示訊息(如警示聲音、閃光等)。 Then, when the programmable logic controller 34 determines, based on the detection result, that the substrate 38 has poor quality before or after the film coating (for example, the surface of the substrate 38 before the film is coated has particles larger than 1 mm or more; or the substrate 38 is bubbled after filming) The programmable logic controller 34 will issue a prompt message (such as a warning sound, a flash, etc.).

圖5為本發明之覆膜方法的第一實施例流程圖。在說明圖5之操作流程時,同時參考圖1至圖4之覆膜機20的各項組件。 Figure 5 is a flow chart showing a first embodiment of the film coating method of the present invention. In explaining the operational flow of FIG. 5, reference is made to the various components of the laminator 20 of FIGS. 1-4.

首先,可程式邏輯控制器34進行開機初始化之程序,以對可程式邏輯控制器34內部預設的各項參數進行設定(步驟S50)。若可程式邏輯控制器34無法完成開機初始化,則可程式邏輯控制器34發出提示訊息(例如發出警示聲音)以 通知操作人員(步驟S52),由操作人員對可程式邏輯控制器34進行檢查及維修,並於完成後重複執行步驟S50。 First, the programmable logic controller 34 performs a boot initialization process to set various parameters preset within the programmable logic controller 34 (step S50). If the programmable logic controller 34 is unable to complete the power-on initialization, the programmable logic controller 34 issues a prompt message (eg, sounds a warning). The operator is notified (step S52), the operator can check and repair the programmable logic controller 34, and after completion, step S50 is repeatedly executed.

在可程式邏輯控制器34完成開機初始化後,可程式邏輯控制器34根據所預設之參數控制吸膜治具28回到起始位置(步驟S54)。 After the programmable logic controller 34 completes the power-on initialization, the programmable logic controller 34 controls the film fixture 28 to return to the home position based on the preset parameters (step S54).

可程式邏輯控制器34判斷吸膜治具28是否回到起始位置(步驟S58),若可程式邏輯控制器34判斷吸膜治具28未回到起始位置,則由操作人員以手動方式來進行控制吸膜治具28(步驟S56),並再進行步驟S54及步驟S58。 The programmable logic controller 34 determines whether the film holder 28 has returned to the home position (step S58), and if the programmable logic controller 34 determines that the film holder 28 has not returned to the home position, the operator manually The suction film fixture 28 is controlled (step S56), and steps S54 and S58 are performed again.

若可程式邏輯控制器34判斷吸膜治具28回到起始位置,則可程式邏輯控制器34控制吸膜治具28移動至載膜平台26之上方(步驟S60),亦即控制吸膜治具28移動至吸膜的位置處。另外,可程式邏輯控制器34亦同時控制捲膜機構24之捲動來進行一貼有貼膜之膠帶的一入料程序,以輸送該貼有貼膜之膠帶至載膜平台26。 If the programmable logic controller 34 determines that the film holder 28 has returned to the home position, the programmable logic controller 34 controls the film holder 28 to move above the carrier film platform 26 (step S60), that is, control the film. The jig 28 is moved to the position of the suction film. In addition, the programmable logic controller 34 also controls the scrolling of the film winding mechanism 24 to perform a feeding process of a film-attached tape to transport the tape-attached tape to the carrier film platform 26.

在吸膜治具28移動至載膜平台26之上方後,可程式邏輯控制器34控制吸膜治具28朝載膜平台26下降,使吸膜治具28觸碰膠帶上之貼膜(步驟S62)。進而控制吸膜治具28以吸真空方式吸附貼膜(步驟S64)。 After the film holder 28 is moved over the film carrier platform 26, the programmable logic controller 34 controls the film holder 28 to descend toward the carrier film platform 26, so that the film holder 28 touches the film on the tape (step S62). ). Further, the suction film jig 28 is controlled to suction the film by vacuum suction (step S64).

吸膜治具28吸附貼膜後,可程式邏輯控制器34控制吸膜治具28往承載治具36方向移動(亦即往覆膜位置方向移動),並且可程式邏輯控制器34另控制捲膜機構24來捲動 膠帶,一方面可將貼膜剝離,也就是所謂的脫膜流程;另一方面,亦可同時回收已剝離貼膜之膠帶於回收料盤44(步驟S66)。 After the film holder 28 adsorbs the film, the programmable logic controller 34 controls the film holder 28 to move toward the carrier fixture 36 (ie, moves toward the film position), and the programmable logic controller 34 controls the film roll. Agency 24 to scroll On the one hand, the tape can be peeled off, that is, the so-called stripping process; on the other hand, the tape of the peeled film can be simultaneously recovered in the recovery tray 44 (step S66).

附帶說明的是,若可程式邏輯控制器34判斷出膜料盤40所裝載之膠帶已使用完,則可程式邏輯控制器34將發出提示訊息,並暫停覆膜機20目前之工作,待重新判斷到出膜料盤40上的膠帶時,恢復覆膜機20的運作。 Incidentally, if the programmable logic controller 34 determines that the tape loaded on the film tray 40 has been used up, the programmable logic controller 34 will issue a prompt message and suspend the current work of the laminator 20 to be renewed. When the tape on the film feed tray 40 is judged, the operation of the film laminator 20 is resumed.

可程式邏輯控制器34控制吸膜治具28移動至覆膜位置(步驟S68)。在移動期間,可程式邏輯控制器34預設會控制吸膜治具28經過定位感測器30,以根據定位感測器30的偵測結果來進行一定位程序,如此以確保後續能精確地將貼膜貼覆於基板38。在本實施例中,定位感測器30是例如用來偵測吸膜治具28所吸附之貼膜的一定位角,以藉由偵測到定位角的與否來確認定位是否完成。而當吸膜治具28定位完成,並且移動至覆膜位置時,可程式邏輯控制器34進一步判斷承載治具36是否到位(步驟S69)。 The programmable logic controller 34 controls the suction jig 28 to move to the film position (step S68). During the movement, the programmable logic controller 34 presets to control the suction fixture 28 to pass the positioning sensor 30 to perform a positioning procedure according to the detection result of the positioning sensor 30, so as to ensure that the subsequent precision can be accurately The film is attached to the substrate 38. In the present embodiment, the positioning sensor 30 is, for example, used to detect a positioning angle of the film adsorbed by the film holder 28 to confirm whether the positioning is completed by detecting the positioning angle. When the positioning of the film holder 28 is completed and moved to the film position, the programmable logic controller 34 further determines whether the carrier jig 36 is in place (step S69).

若步驟S69的判斷結果為否,則表示承載治具36尚未到位,因此重複執行步驟S69,以等待承載治具36到位。然而,在等待承載治具36到位之前的步驟流程,可例如是執行一入料基板38的程序。具體來說,由操作人員將未覆膜之基板38置放在承載治具36(步驟S70)。進而,可程式邏輯控制器34控制旋轉機構23旋轉90度,將承載有未覆膜 之基板38的承載治具36移動至光學檢測器32的其中一個光學耦合元件46下方(步驟S72)。於是,可程式邏輯控制器34便控制光學耦合元件46來自動檢測置未覆膜之基板38上的微粒,並根據光學耦合元件46的檢測結果來判斷未覆膜之基板38上之微粒的大小及數量是否符合規定(步驟S74)。 If the result of the determination in step S69 is NO, it indicates that the carrier fixture 36 is not yet in place, so step S69 is repeatedly executed to wait for the bearing fixture 36 to be in place. However, the flow of steps before waiting for the load fixture 36 to be in place may be, for example, a process of executing a feed substrate 38. Specifically, the uncoated substrate 38 is placed on the carrier jig 36 by the operator (step S70). Further, the programmable logic controller 34 controls the rotating mechanism 23 to rotate 90 degrees, and will carry the uncoated film. The carrier jig 36 of the substrate 38 is moved under one of the optical coupling elements 46 of the optical detector 32 (step S72). Then, the programmable logic controller 34 controls the optical coupling element 46 to automatically detect the particles on the uncoated substrate 38, and determines the size of the particles on the uncoated substrate 38 based on the detection result of the optical coupling element 46. And whether the quantity meets the regulations (step S74).

若步驟S74的判斷結果為否,則可程式邏輯控制器34發出提示訊息(例如發出警示聲音)以通知操作人員(步驟S76),由操作人員將不符合規定之基板38從承載治具36取出。然後重複進行步驟S70及其爾後之步驟,以再次執行入料基板38的流程。反之,若步驟S74的判斷結果為是,則可程式邏輯控制器34控制旋轉機構23再次旋轉90度,將置放有檢測合格之基板38的承載治具36移動至準備覆膜的位置處。此時,可程式邏輯控制器34在步驟S69的判斷上,即可判斷承載治具36已到位。緊接著,可程式邏輯控制器34控制吸膜治具28進行覆膜,以將貼膜貼覆於經檢測合格的未覆膜之基板38(步驟S80)。 If the result of the determination in the step S74 is negative, the programmable logic controller 34 issues a prompt message (for example, a warning sound) to notify the operator (step S76), and the operator removes the non-compliant substrate 38 from the carrier fixture 36. . Then, the step S70 and the subsequent steps are repeated to perform the flow of the feed substrate 38 again. On the other hand, if the result of the determination in the step S74 is YES, the programmable logic controller 34 controls the rotation mechanism 23 to rotate again by 90 degrees, and moves the bearing jig 36 on which the substrate 38 having passed the inspection is placed to the position at which the film is prepared. At this time, the programmable logic controller 34 can judge that the carrier fixture 36 is in place at the judgment of step S69. Next, the programmable logic controller 34 controls the film holder 28 to apply a film to adhere the film to the uncoated substrate 38 (step S80).

接著,可程式邏輯控制器34判斷覆膜是否完成(步驟S82)。若步驟S82的判斷結果為否,則重複進行步驟S82,以持續進行覆膜。若步驟S82的判斷結果為是,則可程式邏輯控制器34控制吸膜治具28停止吸附貼膜,並控制吸膜治具28離開已覆膜之基板38(步驟S84)。 Next, the programmable logic controller 34 determines whether the film is completed (step S82). If the result of the determination in the step S82 is NO, the step S82 is repeated to continue the film coating. If the result of the determination in the step S82 is YES, the programmable logic controller 34 controls the suction jig 28 to stop the adsorption of the film, and controls the film holder 28 to leave the coated substrate 38 (step S84).

在完成覆膜後,可程式邏輯控制器34除了控制吸膜治具28回到起始位置並重複執行步驟S60及其爾後的步驟流程之外,亦同步控制旋轉機構23再一次旋轉90度,用以將置放有已覆膜之基板38的承載治具36移動至光學檢測器32的另一個光學耦合元件46下方(步驟S86)。進而再控制該另一個光學耦合元件46自動檢測已覆膜之基板38上的氣泡,以根據該另一個光學耦合元件46的檢測結果來判斷已覆膜之基板38上之氣泡的大小及數量是否符合規定(步驟S88)。 After the film is completed, the programmable logic controller 34 controls the rotating mechanism 23 to rotate again by 90 degrees, in addition to controlling the film holder 28 to return to the initial position and repeating the step S60 and the subsequent steps. The carrier jig 36 on which the coated substrate 38 is placed is moved below the other optical coupling element 46 of the optical detector 32 (step S86). Further controlling the other optical coupling element 46 to automatically detect the bubble on the coated substrate 38 to determine whether the size and number of bubbles on the coated substrate 38 are based on the detection result of the other optical coupling element 46. The rule is met (step S88).

若步驟S88的判斷結果為否,表示已覆膜之基板38上的氣泡超出規定,於是可程式邏輯控制器34發出提示訊息(例如發出警示聲音)以通知操作人員(步驟S90)。若步驟S88的判斷結果為是,或者步驟S90發出提示訊息之後,可程式邏輯控制器34控制旋轉機構23旋轉90度(步驟S92),以供操作人員取出已完成覆膜之基板38(檢測合格或不合格)。進而再重新執行步驟S70以重新置放另一未覆膜之基板38。 If the result of the determination in the step S88 is NO, it indicates that the bubble on the substrate 38 of the film is out of specification, and the programmable logic controller 34 issues a prompt message (for example, a warning sound) to notify the operator (step S90). If the result of the determination in the step S88 is YES, or after the prompt message is sent in the step S90, the programmable logic controller 34 controls the rotating mechanism 23 to rotate by 90 degrees (step S92), so that the operator can take out the substrate 38 on which the film has been completed. Or unqualified). Further, step S70 is re-executed to reposition another uncoated substrate 38.

實施上述各項步驟後,以完成本發明之小尺寸之覆膜機20對基板38進行微粒檢測、覆膜及氣泡檢測等工作。其中,本實施例透過覆膜平台22搭配吸膜治具28及光學檢測器32的設計,除了可以達到基板38覆膜前後的自動檢測之外,在重複且持續執行上述各項步驟時,基板38的入料、覆膜前檢測、覆膜及覆膜後檢測得以同步進行,藉以有效地提升生產效能。 After performing the above steps, the substrate 38 is subjected to microparticle detection, film coating, bubble detection, and the like in the small-sized laminator 20 of the present invention. In the present embodiment, the design of the film-receiving device 22 and the optical detector 32 is matched with the film-receiving platform 22, and the substrate can be repeatedly and continuously executed, in addition to the automatic detection before and after the filming of the substrate 38. The feeding, pre-filming, laminating and post-filming inspections of 38 can be carried out simultaneously, thereby effectively improving production efficiency.

請參考圖6至圖9,分別為本發明之覆膜機的第二實施例之立體圖、側視圖、後視圖及俯視圖。其中,第二實施例是例如用來說明大尺寸之覆膜機的實際實施態樣。 Please refer to FIG. 6 to FIG. 9 , which are respectively a perspective view, a side view, a rear view and a plan view of a second embodiment of the laminating machine of the present invention. Among them, the second embodiment is, for example, a practical embodiment for explaining a large-sized laminating machine.

在圖6至9中,大尺寸之覆膜機100包含有一覆膜平台102、一捲膜機構104、一滾輪壓頭裝置106、一標頭系統108、一定位感測器110,一光學檢測器112及一可程式邏輯控制器(未圖示,裝設於覆膜機100的下方)。可程式邏輯控制器用來控制覆膜平台102及標頭系統108的運作,其中的覆膜平台102是用來承載一基板(未圖示),並可在捲膜機構104的外側與下方水平地移動。 In FIGS. 6 to 9, the large-sized laminating machine 100 includes a laminating platform 102, a film winding mechanism 104, a roller pressing device 106, a header system 108, a positioning sensor 110, and an optical inspection. The device 112 and a programmable logic controller (not shown, mounted under the laminator 100). The programmable logic controller is used to control the operation of the filming platform 102 and the header system 108, wherein the filming platform 102 is used to carry a substrate (not shown) and can be horizontally outside and below the film winding mechanism 104. mobile.

標頭系統108進一步是透過機構連動的方式來控制捲膜機構104及滾輪壓頭裝置106的運作。其中,捲膜機構104包含有一出膜料盤114、滾筒116及一回收料盤118。出膜料盤114裝載並捲動出貼有貼膜(例如離型膜)之膠帶。滾筒116設置於出膜料盤114的下游,用來輸送及承載貼有貼膜之膠帶至一覆膜位置。回收料盤118捲動回收已剝離貼膜之膠帶。更具體來講,標頭系統108控制捲膜機構104輸送及承載一貼有貼膜之膠帶至一覆膜位置處,並且控制滾輪壓頭裝置106移動至一待滾壓貼合的起始位置處,以進一步控制滾輪壓頭裝置106利用滾壓貼合的方式將捲膜機構104上的貼膜剝離,並將貼膜貼覆至覆膜平台102所承載的基板上。 The header system 108 further controls the operation of the film winding mechanism 104 and the roller head unit 106 by means of interlocking mechanisms. The film winding mechanism 104 includes an ejection film tray 114, a roller 116 and a recovery tray 118. The film discharge tray 114 loads and rolls the tape to which the film (for example, a release film) is attached. The drum 116 is disposed downstream of the film discharge tray 114 for conveying and carrying the tape attached to the film to a film position. The recovery tray 118 is rolled to recover the tape of the peeled film. More specifically, the header system 108 controls the film winding mechanism 104 to transport and carry a tape attached to the film to a film position, and controls the roller head device 106 to move to a starting position to be rolled. In order to further control the roller indenter device 106, the film on the film winding mechanism 104 is peeled off by roll bonding, and the film is attached to the substrate carried by the filming platform 102.

此外,本實施例設計的定位感測器110,其是用來偵測捲 膜機構104上的該貼有貼膜之膠帶的位置。而可程式邏輯控制器根據定位感測器110的偵測結果來進一步控制標頭系統108進行一定位程序,以確保後續覆膜的精確性。其中,定位感測器110係由數個光纖組成(本實施例是兩個光纖)。 In addition, the positioning sensor 110 designed in this embodiment is used to detect the volume. The position of the film-attached tape on the film mechanism 104. The programmable logic controller further controls the header system 108 to perform a positioning procedure based on the detection result of the positioning sensor 110 to ensure the accuracy of the subsequent coating. The positioning sensor 110 is composed of a plurality of optical fibers (this embodiment is two optical fibers).

再者,光學檢測器112係由數個光學耦合元件(如:電荷耦合裝置(Charge Coupled Device,CCD))120組成,本實施例是舉例包含兩個光學耦合元件120。光學檢測器112用來檢測置放在覆膜平台102上的未覆膜之基板上的表面刮傷或落塵微粒等髒污以及已覆膜之基板上的氣泡。而可程式邏輯控制器根據光學檢測器112的檢測結果來產生一提示訊息(如警示聲音、閃光等)。 Furthermore, the optical detector 112 is composed of a plurality of optical coupling elements (eg, Charge Coupled Device (CCD)) 120, which is exemplified by two optical coupling elements 120. The optical detector 112 is used to detect surface scratches or dust particles on the uncoated substrate placed on the film-coated platform 102, and air bubbles on the coated substrate. The programmable logic controller generates a prompt message (such as a warning sound, a flash, etc.) based on the detection result of the optical detector 112.

在實際運作上,當可程式邏輯控制器判斷出基板在覆膜前與後的品質不良(例如基板覆膜前的表面有大於1mm以上的微粒或基板覆膜後產生氣泡)時,可程式邏輯控制器將發出一提示訊息。藉此,以達到覆膜前後時能自動檢測基板狀況的需求。 In actual operation, when the programmable logic controller determines that the substrate is inferior in quality before and after the film coating (for example, particles having a surface larger than 1 mm or a film after the substrate is coated), the programmable logic The controller will send a message. Thereby, the need to automatically detect the condition of the substrate before and after the film coating is achieved.

圖10為本發明之覆膜方法的第二實施例流程圖。在說明圖10之操作流程時,同時參考圖6至圖9之覆膜機100的各項組件。 Figure 10 is a flow chart showing a second embodiment of the film coating method of the present invention. In explaining the operational flow of FIG. 10, reference is made to the various components of the laminator 100 of FIGS. 6-9.

首先,可程式邏輯控制器進行開機初始化之程序,以對可程式邏輯控制器內部預設的各項參數進行設定(步驟S130)。若可程式邏輯控制器無法完成開機初始化,則可程 式邏輯控制器發出提示訊息(例如發出警示聲音)以通知操作人員(步驟S132),由操作人員對可程式邏輯控制器進行障礙排除,並於完成後由可程式邏輯控制器重新執行步驟S130。 First, the programmable logic controller performs a boot initialization process to set various parameters preset in the programmable logic controller (step S130). If the programmable logic controller cannot complete the boot initialization, The logic controller issues a prompt message (for example, an alert sound) to notify the operator (step S132), the operator removes the obstacle to the programmable logic controller, and after completion, the step S130 is re-executed by the programmable logic controller.

在可程式邏輯控制器完成開機初始化後,可程式邏輯控制器根據所預設之參數控制標頭系統108回到起始位置(步驟S134),其中由於標頭系統108是透過機構連動的方式控制捲膜機構104及滾輪壓頭裝置106,因此當標頭系統108回到起始位置時,捲膜機構104及滾輪壓頭裝置106同樣會回到起始位置。 After the programmable logic controller completes the power-on initialization, the programmable logic controller controls the header system 108 to return to the home position according to the preset parameters (step S134), wherein the header system 108 is controlled by the linkage mechanism. The film winding mechanism 104 and the roller head device 106, therefore, when the leader system 108 is returned to the home position, the film winding mechanism 104 and the roller head device 106 will also return to the home position.

接下來,可程式邏輯控制器判斷標頭系統108是否回到起始位置(步驟S138),若步驟S138的判斷結果為否,則重複進行步驟S134,直到標頭系統108回到起始位置。若步驟S138的判斷結果為是,則可程式邏輯控制器透過標頭系統108來控制捲膜機構104開始出膜,以進行一貼有貼膜之膠帶的一入料程序(步驟S146)。具體而言,標頭系統108是控制出膜料盤114捲動出貼有貼膜之膠帶,並控制回收料盤118的捲動來拉動貼有貼膜之膠帶,使整片貼有貼膜之膠帶藉由滾筒116支撐及捲動而進行輸送。此外,回收料盤118在貼膜已剝離之後,也就是用來回收已剝離貼膜之膠帶。 Next, the programmable logic controller determines whether the header system 108 has returned to the home position (step S138). If the result of the determination in step S138 is negative, step S134 is repeated until the header system 108 returns to the home position. If the result of the determination in the step S138 is YES, the programmable logic controller controls the film winding mechanism 104 to start filming through the header system 108 to perform a feeding process of the tape attached to the film (step S146). Specifically, the header system 108 controls the film ejection tray 114 to roll out the tape attached with the film, and controls the rolling of the recovery tray 118 to pull the tape attached with the film, so that the entire film is attached with the film. The roller 116 supports and rolls to convey. In addition, the recovery tray 118 is used to recover the tape of the peeled film after the film has been peeled off.

附帶說明的是,當標頭系統108控制出膜料盤114捲動出膠帶時,可程式邏輯控制器可進一步判斷出膜料盤114所裝 載的膠帶是否使用完。若膠帶已使用完,則可程式邏輯控制器將發出提示訊息,並暫停覆膜機100目前之工作。如此一來,操作人員可在更換膠帶之後進行手動控制標頭系統108(步驟S136),以讓標頭系統108執行步驟S134而回到起始位置。 Incidentally, when the header system 108 controls the film tray 114 to roll out the tape, the programmable logic controller can further determine that the film tray 114 is loaded. Whether the loaded tape is used up. If the tape has been used, the programmable logic controller will issue a message and suspend the current work of the laminator 100. In this way, the operator can manually control the header system 108 after replacing the tape (step S136) to cause the header system 108 to perform step S134 and return to the home position.

當步驟S146輸送整片貼有貼膜之膠帶時,可程式邏輯控制器進一步是根據定位感測器110的偵測結果來進行一定位程序(步驟S148)。 When the entire tape is attached with the film tape in step S146, the programmable logic controller further performs a positioning process according to the detection result of the positioning sensor 110 (step S148).

本實施例具體的定位程序可利用圖9所示的設置角度及方向來進行以下的運作說明:首先,可程式邏輯控制器透過標頭系統108控制捲膜機構104朝定位感測器110之方向(由左至右)移動。其中,本實施例的定位感測器110是例如採用兩個位在同一水平線的光纖來設計,該水平線是平行於覆膜平台102的右側邊,使得兩個光纖得以用來偵測捲膜機構104所承載之膠帶上的貼膜的同一側邊。 The specific positioning procedure of this embodiment can use the set angle and direction shown in FIG. 9 to perform the following operation description: First, the programmable logic controller controls the direction of the film winding mechanism 104 toward the positioning sensor 110 through the header system 108. Move from left to right. The positioning sensor 110 of the present embodiment is designed, for example, by using two optical fibers positioned at the same horizontal line. The horizontal line is parallel to the right side of the coating platform 102, so that two optical fibers can be used to detect the film winding mechanism. The same side of the film on the tape carried by 104.

如此一來,當只有任一光纖偵測到貼膜時,即表示貼膜相對於覆膜平台102係呈歪斜,此時可程式邏輯控制器透過標頭系統108控制捲膜機構104停止繼續前進並基於垂直軸來進行水平方向自轉之調整,使得兩個光纖皆能偵測到貼膜;而當兩個光纖皆偵測到貼膜時,可程式邏輯控制器即透過標頭系統108控制捲膜機構104停止水平自轉之調整並朝遠離定位感測器110之方向(由右至左)移動一預設距離;之後, 可程式邏輯控制器再透過標頭系統108控制捲膜機構104朝定位感測器110之方向(由左至右)移動,並在兩個光纖偵測到捲膜機構104所承載的貼膜時,控制捲膜機構104停止前進。藉此,捲膜機構104即是輸送貼有貼膜之膠帶至覆膜位置,並且貼膜亦處於精確的位置。 In this way, when only the optical fiber detects the film, it means that the film is skewed relative to the filming platform 102, and at this time, the programmable logic controller controls the film winding mechanism 104 to stop moving forward through the header system 108 and is based on The vertical axis adjusts the horizontal rotation so that both fibers can detect the film; and when both fibers detect the film, the programmable logic controller controls the film winding mechanism 104 to stop through the header system 108. The horizontal rotation is adjusted and moved a distance away from the positioning sensor 110 (from right to left) by a predetermined distance; after that, The programmable logic controller then controls the movement of the film winding mechanism 104 toward the positioning sensor 110 (from left to right) through the header system 108, and when the two optical fibers detect the film carried by the film winding mechanism 104, The film roll mechanism 104 is controlled to stop moving forward. Thereby, the film winding mechanism 104 transports the tape attached to the film to the film position, and the film is also in a precise position.

承上所述,在步驟S148完成定位程序之後,可程式邏輯控制器進一步判斷覆膜平台102是否到位(步驟S163)。若步驟S163的判斷結果為否,則代表覆膜平台102尚未到位,因此重複執行步驟S163,以等待覆膜平台102到位。然而,在等待覆膜平台102到位之前的步驟流程,可例如是執行一入料基板的程序。具體來說,由操作人員將未覆膜之基板置放在覆膜平台102(步驟S156),本實施例的覆膜平台102可例如是以吸真空方式來固定基板。進而,可程式邏輯控制器控制光學檢測器112的數個光學耦合元件120自動檢測置未覆膜之基板上的微粒,並根據光學檢測器112的檢測結果來判斷未覆膜之基板上之微粒的大小及數量是否符合規定(步驟S160)。 As described above, after the positioning procedure is completed in step S148, the programmable logic controller further determines whether the filming platform 102 is in place (step S163). If the result of the determination in step S163 is NO, it means that the laminating platform 102 is not yet in place, so step S163 is repeatedly executed to wait for the laminating platform 102 to be in place. However, the step flow before waiting for the laminating platform 102 to be in place may be, for example, a process of executing a feed substrate. Specifically, the uncoated substrate is placed on the coating platform 102 by the operator (step S156), and the coating platform 102 of the present embodiment can fix the substrate, for example, by vacuum suction. Further, the programmable logic controller controls the plurality of optical coupling elements 120 of the optical detector 112 to automatically detect the particles on the uncoated substrate, and determines the particles on the uncoated substrate according to the detection result of the optical detector 112. Whether the size and the number are in compliance with the regulations (step S160).

若步驟S160的判斷結果為否,則可程式邏輯控制器發出提示訊息(例如發出警示聲音)以通知操作人員(步驟S162),由操作人員將不符合規定之基板從覆膜平台102上取出。然後重複進行步驟S156及其爾後之步驟,以再次執行入料基板的流程。反之,若步驟S160的判斷結果為是, 則可程式邏輯控制器控制覆膜平台102移動至覆膜位置。此時可程式邏輯控制器在步驟S163的判斷上,即可判斷覆膜平台102已到位。緊接著,可程式邏輯控制器透過標頭系統108來控制滾輪壓頭裝置106將貼膜順勢地滾壓於經檢測合格的未覆膜之基板(步驟S164)。 If the result of the determination in the step S160 is NO, the programmable logic controller issues a prompt message (for example, an alert sound) to notify the operator (step S162), and the operator removes the non-compliant substrate from the filming platform 102. Then, the step S156 and the subsequent steps are repeated to perform the flow of the substrate to be fed again. On the other hand, if the result of the determination in step S160 is YES, The programmable logic controller then controls the lamination platform 102 to move to the lamination position. At this time, the programmable logic controller can judge that the laminating platform 102 is in place in the judgment of step S163. Next, the programmable logic controller controls the roller ram device 106 to roll the film to the untested uncoated substrate by the header system 108 (step S164).

接著,可程式邏輯控制器判斷覆膜是否完成(步驟S166)。簡單來說,可程式邏輯控制器可判斷滾輪壓頭裝置106的滾壓距離是否達到一個基板的長度來判斷是否覆膜完成。若步驟S166的判斷結果為否,則重複執行步驟S164,以持續進行覆膜。若步驟S166的判斷結果為是,則可程式邏輯控制器透過標頭系統108控制滾輪壓頭裝置106停止滾壓貼膜,並控制滾輪壓頭裝置106離開已覆膜之基板(步驟S168)。 Next, the programmable logic controller determines whether the film is completed (step S166). Briefly, the programmable logic controller can determine whether the rolling distance of the roller ram device 106 reaches the length of one substrate to determine whether the film is completed. If the result of the determination in the step S166 is NO, the step S164 is repeatedly executed to continue the film coating. If the result of the determination in the step S166 is YES, the programmable logic controller controls the roller indenter device 106 to stop the rolling film through the header system 108, and controls the roller indenter device 106 to leave the coated substrate (step S168).

在完成覆膜後,可程式邏輯控制器除了重複執行步驟S134來控制標頭系統108回到起始位置並進而執行步驟S134爾後的步驟流程之外,亦同步控制覆膜平台102移出覆膜位置,亦即將已覆膜之基板移動至光學檢測器112的數個光學耦合元件120下方(步驟S170)。進而可程式邏輯控制器再控制該等光學耦合元件120自動檢測已覆膜的基板上之氣泡,以根據光學檢測器112的檢測結果來判斷已覆膜之基板上之氣泡的大小及數量是否符合規定(步驟S172)。 After the film is completed, the programmable logic controller synchronously controls the filming platform 102 to move out of the film position, in addition to repeatedly performing step S134 to control the header system 108 to return to the starting position and further performing the step flow after step S134. That is, the substrate that has been coated is moved below the plurality of optical coupling elements 120 of the optical detector 112 (step S170). The programmable logic controller then controls the optical coupling elements 120 to automatically detect the bubbles on the coated substrate to determine whether the size and number of bubbles on the coated substrate are consistent according to the detection result of the optical detector 112. It is prescribed (step S172).

若步驟S172的判斷結果為否,表示已覆膜之基板上的氣泡超出規定,於是可程式邏輯控制器發出提示訊息(例如發 出警示聲音)以通知操作人員(步驟S176)。若步驟S172的判斷結果為是,或者步驟S176發出提示訊息之後,則操作人員取出已完成覆膜之基板(檢測合格或不合格),並進而使可程式邏輯控制器重新執行步驟S156,以重新入料另一未覆膜之基板。 If the result of the determination in the step S172 is negative, it indicates that the bubble on the substrate of the film is out of specification, and then the programmable logic controller issues a prompt message (for example, sending A warning sound is issued to notify the operator (step S176). If the result of the determination in step S172 is YES, or after the prompt message is sent in step S176, the operator takes out the substrate on which the film has been completed (test pass or fail), and then causes the programmable logic controller to re-execute step S156 to re- Feed another uncoated substrate.

實施上述各項步驟後,以完成本發明之大尺寸之覆膜機100對基板進行微粒檢測、覆膜及氣泡檢測等工作。 After performing the above steps, the film laminator 100 of the large size of the present invention performs the operations of particle detection, film coating, and bubble detection on the substrate.

本發明之優點係提供一種覆膜機及覆膜方法,利用覆膜機之光學檢測器來檢測基板在覆膜前之落塵附著在基板的情況,以及檢測基板在覆膜後之氣泡產生的情況,及時發現覆膜不良之基板,以達到提高基板覆膜之總體良率的效果,並且覆膜機實現基板覆膜之精度高、速度快、無氣泡,同時達到操作簡單、便於管理及實用強等特點。 An advantage of the present invention is to provide a laminating machine and a laminating method, which use an optical detector of a laminating machine to detect the adhesion of a substrate to a substrate before the film is deposited, and to detect the occurrence of bubbles after the film is coated. The substrate with poor film coverage is found in time to achieve the effect of improving the overall yield of the substrate film, and the film laminating machine realizes high precision, high speed and no bubble of the substrate film, and at the same time, the operation is simple, easy to manage and practical. Features.

雖然本發明已參照較佳具體例及舉例性附圖敘述如上,惟其應不被視為係限制性者。熟悉本技藝者對其形態及具體例之內容做各種修改、省略及變化,均不離開本發明之申請專利範圍之所主張範圍。 The present invention has been described above with reference to the preferred embodiments and the accompanying drawings, and should not be considered as limiting. Various modifications, omissions and changes may be made without departing from the scope of the invention.

20‧‧‧覆膜機 20‧‧‧Laminating machine

22‧‧‧覆膜平台 22‧‧‧Laminating platform

23‧‧‧旋轉機構 23‧‧‧Rotating mechanism

24‧‧‧捲膜機構 24‧‧‧filming mechanism

26‧‧‧載膜平台 26‧‧‧membrane platform

28‧‧‧吸膜治具 28‧‧‧Dip film fixture

30‧‧‧定位感測器 30‧‧‧ Positioning Sensor

32‧‧‧光學檢測器 32‧‧‧Optical detector

34‧‧‧可程式邏輯控制器 34‧‧‧Programmable Logic Controller

36‧‧‧承載治具 36‧‧‧bearing fixture

38‧‧‧基板 38‧‧‧Substrate

40‧‧‧出膜料盤 40‧‧‧film tray

42‧‧‧滾筒 42‧‧‧Roller

44‧‧‧回收料盤 44‧‧‧Recycling tray

46‧‧‧光學耦合元件 46‧‧‧Optical coupling elements

100‧‧‧覆膜機 100‧‧‧Laminating machine

102‧‧‧覆膜平台 102‧‧‧Laminating platform

104‧‧‧捲膜機構 104‧‧‧filming mechanism

106‧‧‧滾輪壓頭裝置 106‧‧‧Roller head device

108‧‧‧標頭系統 108‧‧‧Header system

110‧‧‧定位感測器 110‧‧‧ Positioning Sensor

112‧‧‧光學檢測器 112‧‧‧Optical detector

114‧‧‧出膜料盤 114‧‧‧film tray

116‧‧‧滾筒 116‧‧‧Roller

118‧‧‧回收料盤 118‧‧‧Recycling tray

120‧‧‧光學耦合元件 120‧‧‧Optical coupling elements

圖1為本發明之覆膜機的第一實施例立體圖;圖2為本發明之覆膜機的第一實施例側視圖;圖3為本發明之覆膜機的第一實施例後視圖;圖4為本發明之覆膜機的第一實施例俯視圖; 圖5為本發明之覆膜方法的第一實施例流程圖;圖6為本發明之覆膜機的第二實施例立體圖;圖7為本發明之覆膜機的第二實施例側視圖;圖8為本發明之覆膜機的第二實施例後視圖;圖9為本發明之覆膜機的第二實施例俯視圖;以及圖10為本發明之覆膜方法的第二實施例流程圖。 1 is a perspective view of a first embodiment of a laminating machine of the present invention; FIG. 2 is a side view of a first embodiment of a laminating machine of the present invention; Figure 4 is a plan view showing a first embodiment of the laminating machine of the present invention; Figure 5 is a flow chart of a first embodiment of the laminating machine of the present invention; Figure 6 is a perspective view of a second embodiment of the laminating machine of the present invention; Figure 7 is a side view of a second embodiment of the laminating machine of the present invention; Figure 8 is a rear view of a second embodiment of the laminating machine of the present invention; Figure 9 is a plan view of a second embodiment of the laminating machine of the present invention; and Figure 10 is a flow chart of a second embodiment of the laminating method of the present invention. .

20‧‧‧覆膜機 20‧‧‧Laminating machine

22‧‧‧覆膜平台 22‧‧‧Laminating platform

23‧‧‧旋轉機構 23‧‧‧Rotating mechanism

24‧‧‧捲膜機構 24‧‧‧filming mechanism

26‧‧‧載膜平台 26‧‧‧membrane platform

28‧‧‧吸膜治具 28‧‧‧Dip film fixture

30‧‧‧定位感測器 30‧‧‧ Positioning Sensor

32‧‧‧光學檢測器 32‧‧‧Optical detector

34‧‧‧可程式邏輯控制器 34‧‧‧Programmable Logic Controller

36‧‧‧承載治具 36‧‧‧bearing fixture

38‧‧‧基板 38‧‧‧Substrate

40‧‧‧出膜料盤 40‧‧‧film tray

42‧‧‧滾筒 42‧‧‧Roller

44‧‧‧回收料盤 44‧‧‧Recycling tray

46‧‧‧光學耦合元件 46‧‧‧Optical coupling elements

Claims (17)

一種覆膜機,包含:一覆膜平台,用來承載至少一基板以供覆膜;及一光學檢測器,用來檢測覆膜前後該覆膜平台上的該基板的品質。 A laminating machine comprising: a laminating platform for carrying at least one substrate for coating; and an optical detector for detecting the quality of the substrate on the laminating platform before and after the lamination. 如申請專利範圍第1項所述之覆膜機,其中,該光學檢測器包含複數個光學耦合元件。 The laminator of claim 1, wherein the optical detector comprises a plurality of optical coupling elements. 如申請專利範圍第1項所述之覆膜機,其中,該覆膜平台進一步包含:一旋轉機構;及複數個承載治具,設置於該旋轉機構上,分別用來承載該基板。 The laminating machine of claim 1, wherein the laminating platform further comprises: a rotating mechanism; and a plurality of bearing jigs disposed on the rotating mechanism for respectively carrying the substrate. 如申請專利範圍第3項所述之覆膜機,進一步包含:一載膜平台;一捲膜機構,裝載一貼有貼膜之膠帶,並且輸送該貼有貼膜之膠帶至該載膜平台;一吸膜治具,用來吸附並剝離該載膜平台上的貼膜,並將該貼膜貼合於該承載治具上的基板;一定位感測器,偵測該吸膜治具所吸附之貼膜的位置;以及一可程式邏輯控制器,控制該覆膜平台、該捲膜機構及該吸膜治具的運作,並且進一步根據該定位感測器的偵測結果 來控制該吸膜治具進行一定位程序,以及根據該光學檢測器的檢測結果來產生一提示訊息。 The laminating machine according to claim 3, further comprising: a film loading platform; a film winding mechanism, loading a tape attached with a film, and conveying the tape with the film attached to the film loading platform; a film absorbing tool for adsorbing and peeling off the film on the carrier film platform, and bonding the film to the substrate on the bearing fixture; and a positioning sensor for detecting the film adsorbed by the film absorbing tool And a programmable logic controller for controlling the operation of the filming platform, the film winding mechanism and the suction film fixture, and further detecting the detection result of the positioning sensor The film holder is controlled to perform a positioning process, and a prompt message is generated according to the detection result of the optical detector. 如申請專利範圍第4項所述之覆膜機,其中,該捲膜機構包含:一出膜料盤,裝載並捲動出該貼有貼膜之膠帶;至少一滾筒,設置於該出膜料盤下游,用來支撐及輸送該貼有貼膜之膠帶;以及一回收料盤,捲動回收該已剝離貼膜之膠帶。 The film laminating machine of claim 4, wherein the film winding mechanism comprises: a film discharging tray, loading and rolling the tape attached with the film; at least one roller disposed on the film discharging material Downstream of the disk, used to support and transport the tape attached with the film; and a recycling tray to roll back the tape of the peeled film. 如申請專利範圍第1項所述之覆膜機,進一步包含:一捲膜機構,用來輸送及承載一貼有貼膜之膠帶;一滾輪壓頭裝置,用來剝離該捲膜機構上的貼膜,以將該貼膜滾壓貼合至該基板;一標頭系統,控制該捲膜機構及該滾輪壓頭裝置的移動;一定位感測器,偵測該捲膜機構上的該貼有貼膜之膠帶的位置;以及一可程式邏輯控制器,控制該覆膜平台及該標頭系統的運作,並且進一步根據該定位感測器的偵測結果來控制該標頭系統進行一定位程序,以及根據該光學檢測器的檢測結果來產生一提示訊息。 The laminating machine according to claim 1, further comprising: a film winding mechanism for conveying and carrying a tape attached with a film; and a roller pressing device for peeling off the film on the film winding mechanism Rolling the film to the substrate; a header system for controlling movement of the film winding mechanism and the roller head device; and a positioning sensor for detecting the film on the film winding mechanism a position of the tape; and a programmable logic controller that controls the operation of the filming platform and the heading system, and further controls the heading system to perform a positioning process according to the detection result of the positioning sensor, and A prompt message is generated based on the detection result of the optical detector. 如申請專利範圍第6項所述之覆膜機,其中,該捲膜機構包含:一出膜料盤,裝載並捲動出該貼有貼膜之膠帶; 至少一滾筒,設置於該出膜料盤下游,用來輸送及承載該貼有貼膜之膠帶;以及一回收料盤,捲動回收該已剝離貼膜之膠帶。 The film laminating machine of claim 6, wherein the film winding mechanism comprises: a film discharging tray, loading and rolling the tape attached with the film; At least one roller disposed downstream of the film discharge tray for conveying and carrying the tape attached with the film; and a recovery tray for rolling and recovering the tape of the peeled film. 一種覆膜方法,其步驟包括:執行一入料程序;及在對一基板進行覆膜之前與後,透過一光學檢測器自動檢測該基板的品質。 A film coating method comprising the steps of: performing a feeding process; and automatically detecting the quality of the substrate through an optical detector before and after coating a substrate. 如申請專利範圍第8項所述之覆膜方法,其中,該執行入料程序之步驟進一步包含:旋轉一覆膜平台,以入料該基板,其中該覆膜平台包含複數個用來承載該基板的承載治具;及捲動一捲膜機構,以入料一貼有貼膜之膠帶。 The film coating method of claim 8, wherein the step of performing the feeding process further comprises: rotating a filming platform to feed the substrate, wherein the filming platform comprises a plurality of materials for carrying the The bearing fixture of the substrate; and a roll of film mechanism is rolled to feed the tape with the film attached. 如申請專利範圍第9項所述之覆膜方法,其中,在執行該入料基板之步驟後,進一步透過該光學檢測器自動檢測該基板是否有髒污。 The film coating method according to claim 9, wherein after the step of performing the feeding of the substrate, the optical detector is further used to automatically detect whether the substrate is dirty. 如申請專利範圍第9項所述之覆膜方法,進一步包含:吸附並剝離該貼膜;定位該所吸附之貼膜的位置;及貼覆該貼膜於該基板。 The film coating method according to claim 9, further comprising: adsorbing and peeling the film; positioning the position of the adsorbed film; and attaching the film to the substrate. 如申請專利範圍第11項所述之覆膜方法,其中,在貼合該貼膜於該基板之後,進一步透過該光學檢測器自動檢測該已覆膜之基板是否有氣泡。 The film coating method according to claim 11, wherein after the film is bonded to the substrate, the optical detector is further used to automatically detect whether the substrate of the film has bubbles. 如申請專利範圍第8項所述之覆膜方法,其中,該執行入料程序之步驟進一步包含:移動一覆膜平台,以入料該基板;及捲動一捲膜機構,以入料一貼有貼膜之膠帶。 The film coating method of claim 8, wherein the step of performing the feeding process further comprises: moving a laminating platform to feed the substrate; and rolling a film mechanism to feed one Tape attached to the film. 如申請專利範圍第13項所述之覆膜方法,其中,在執行該入料基板之步驟後,進一步透過該光學檢測器自動檢測該基板是否有髒污。 The film coating method according to claim 13, wherein after the step of performing the feeding substrate, the optical detector is further used to automatically detect whether the substrate is dirty. 如申請專利範圍第13項所述之覆膜方法,進一步包含:定位該貼有貼膜之膠帶入料後的位置;及剝離並滾壓貼合該貼膜於該基板。 The film coating method according to claim 13, further comprising: positioning a position of the tape to which the film is attached; and peeling and rolling the film on the substrate. 如申請專利範圍第15項所述之覆膜方法,其中,在貼合該貼膜於該基板之後,進一步透過該光學檢測器自動檢測該已覆膜之基板是否有氣泡。 The film coating method according to claim 15, wherein after the film is attached to the substrate, the optical detector is further used to automatically detect whether the substrate of the film has bubbles. 如申請專利範圍第8項所述之覆膜方法,進一步包含:根據該光學檢測器的檢測結果來產生一提示訊息。 The film coating method of claim 8, further comprising: generating a prompt message according to the detection result of the optical detector.
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