JP5731457B2 - Film laminating apparatus and film laminating method - Google Patents

Film laminating apparatus and film laminating method Download PDF

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Publication number
JP5731457B2
JP5731457B2 JP2012202753A JP2012202753A JP5731457B2 JP 5731457 B2 JP5731457 B2 JP 5731457B2 JP 2012202753 A JP2012202753 A JP 2012202753A JP 2012202753 A JP2012202753 A JP 2012202753A JP 5731457 B2 JP5731457 B2 JP 5731457B2
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Prior art keywords
film
circuit board
laminating
programmable logic
position
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JP2013063655A (en
Inventor
林坤榮
▲劉曉▼冬
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瑞世▲達▼科技(廈門)有限公司
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Priority to CN201110289590.0A priority patent/CN102991750B/en
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B41/00Arrangements for controlling or monitoring lamination processes; Safety arrangements
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical means
    • G01B11/002Measuring arrangements characterised by the use of optical means for measuring two or more coordinates
    • G01B11/005Measuring arrangements characterised by the use of optical means for measuring two or more coordinates coordinate measuring machines
    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B41/00Arrangements for controlling or monitoring lamination processes; Safety arrangements
    • B32B2041/06Starting the lamination machine or method
    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices

Description

  The present disclosure relates to a method for laminating a film and an apparatus for performing the method, and more particularly to a method for laminating a film on a circuit board of a touch panel.

  With advances in science and technology, intelligent devices with powerful functions such as computers, PDAs (Personal Digital Assistance), intelligent mobile phones or flat panel computers are gradually emerging. Many intelligent devices include a touch panel for a user to operate the device using some touch method.

  An important component in the touch panel is glass. Therefore, before shipment of these products (eg after cutting glass using a laser or process of glass lamination), smudginess of the glass surface due to scratches and dust on it. In order to prevent this, the cover film layer is required to cover the glass surface with a thin film. Furthermore, it is necessary for the cover film layer in which the film is covered on the glass to avoid the formation of bubbles between the cover film and the glass after lamination.

Chinese Patent Application No. 1309559 Specification China Utility Model Notice No. 201291630 Specification

  Traditionally, during the manufacturing process of laminating films, the operator must check whether the quality before and after laminating the glass meets the criteria (ie whether dust or bubbles are present). Is examined with the naked eye. However, known artificial inspection methods use inconsistent and relatively insensitive criteria due to factors such as different operators, different hours and length of overtime, etc. Will be used. This affects the stability and quality of the laminated film. Therefore, the yield rate of the laminated film on glass is reduced.

  The present disclosure utilizes a detection device on a film laminating apparatus for detecting the state of dust attached to a circuit board before film lamination and the state of bubbles generated on the circuit board after film lamination. The present invention relates to a method for laminating a film on a circuit board of a touch panel. As a result, the present disclosure can improve the stability and quality of the laminated film and further increase the yield rate of the laminated film on the circuit board.

  The present disclosure provides a film laminating apparatus comprising a laminating platform and a photodetector. The film laminating platform is used to carry at least one circuit board for laminating films. The photodetector is used to detect the quality of the circuit board on the laminating platform before and after laminating the film.

  According to embodiments of the present disclosure, the photodetector comprises a plurality of optically connected components.

  According to an embodiment of the present disclosure, the laminate platform includes a rotation mechanism and a plurality of carriers. The plurality of transport tools are arranged on the rotation mechanism and used to transport the circuit board alone.

According to the embodiment of the present disclosure, the film laminating apparatus further includes a loading table, a roll mechanism, an inhaler, a position detector, and a programmable logic control device.
The roll mechanism inputs an adhesive tape to which the film is attached, and transfers the adhesive tape to the input table. The inhaler is used for inhaling and removing the film from the adhesive tape on the loading table and attaching the film to the circuit board on the carrier. The position detector detects the position of the film sucked by the inhaler. The programmable logic controller controls operations of the laminating platform, the roll mechanism, and the inhaler. The programmable logic control device further controls the inhaler to perform position adjustment processing based on the detection result of the position detector, and generates notification information based on the detection result of the photodetector.

  According to the embodiment of the present disclosure, the roll mechanism further includes an intake plate, at least one roller, and a reuse plate. The take-in plate throws out the adhesive tape with the film attached thereto. The roller is disposed under the capture plate, and supports and transfers an adhesive tape to which the film is attached. The reuse plate is wound up to reuse the adhesive tape from which the film has been removed.

According to an embodiment of the present disclosure, the film laminating apparatus further includes a roll mechanism, a wheel rotating device, a header system, a position detector, and a programmable logic control device. The roll mechanism is used for transferring and feeding the adhesive tape with the film attached thereto. The wheel rotation device is used to apply pressure to remove the film from the adhesive tape on the roll mechanism and to attach the film to the circuit board.
The header system controls operations of the roll mechanism and the wheel rotation device. The said position detector detects the position of the adhesive tape in which the said film in the said roll mechanism was affixed. The programmable logic controller controls the operation of the laminating platform and the header system. The programmable logic control device controls the header system to perform position adjustment processing based on the detection result of the position detector, and generates notification information based on the detection result of the photodetector.

  According to an embodiment of the present disclosure, the roll mechanism further includes an intake plate, at least one roller, and a reuse plate. The take-in plate throws out the adhesive tape with the film attached thereto. The roller is disposed below the take-in plate, and transfers and feeds an adhesive tape to which the film is attached. The reuse plate is wound up to reuse the adhesive tape from which the film has been removed.

  The present disclosure provides a film laminating method applied to a film laminating apparatus for laminating a film on a circuit board. The method performs a capture process and automatically detects the quality of the circuit board via a photodetector before and after laminating the film on the circuit board.

  According to an embodiment of the present disclosure, in the step of performing the capturing process, a laminate platform including a plurality of transporting tools for transporting the circuit board is rotated to capture the circuit board, and the film is attached. The roll mechanism is rotated to take in the adhered adhesive tape.

  According to the embodiment of the present disclosure, after the step of taking in the circuit board, it is executed to automatically detect whether or not the circuit board is contaminated via the photodetector.

  According to an embodiment of the present disclosure, the method further includes the step of inhaling and removing the film from the adhesive tape, adjusting the position of the inhaled film, and attaching the film to the circuit board.

  According to an embodiment of the present disclosure, after the film is attached to the circuit board, the next step is to determine whether air bubbles are present on the circuit board to which the film is attached via the photodetector. Detect automatically.

  According to an embodiment of the present disclosure, in the step of executing the capturing process, the laminate platform is moved to capture the circuit board, and the roll mechanism is rotated to capture the adhesive tape to which the film is attached.

  According to an embodiment of the present disclosure, after the step of taking in the circuit board, the next step automatically detects whether or not the circuit board is contaminated via the photodetector.

  According to an embodiment of the present disclosure, the method includes attaching the film to the circuit board, adjusting the position of the taken-in adhesive tape, removing the film from the adhesive tape, and attaching the film to the circuit board. To apply pressure.

  According to an embodiment of the present disclosure, after the film is attached to the circuit board, the next step is to determine whether air bubbles are present on the circuit board to which the film is attached via the photodetector. Detect automatically.

  According to an embodiment of the present disclosure, the method generates notification information based on a detection result by the photodetector.

  According to the present invention, the stability and quality of the laminated film can be improved, and the yield rate of the laminated film on the circuit board can be further increased.

FIG. 1 is a structural diagram of a first embodiment of a film laminating apparatus according to the present disclosure. FIG. 2 is a side view of the first embodiment of the film laminating apparatus according to the present disclosure. FIG. 3 is a rear view of the first embodiment of the film laminating apparatus according to the present disclosure. FIG. 4 is a top view of the first embodiment of the film laminating apparatus according to the present disclosure. FIG. 5A is a flowchart of the first embodiment of the film laminating method according to the present disclosure. FIG. 5B is a flowchart of the first embodiment of the film laminating method according to the present disclosure. FIG. 6 is a structural diagram of the second embodiment of the film laminating apparatus according to the present disclosure. FIG. 7 is a side view of the second embodiment of the film laminating apparatus according to the present disclosure. FIG. 8 is a rear view of the second embodiment of the film laminating apparatus according to the present disclosure. FIG. 9 is a top view of the second embodiment of the film laminating apparatus according to the present disclosure. FIG. 10A is a flowchart of a second embodiment of the film laminating method according to the present disclosure. FIG. 10B is a flowchart of the second embodiment of the film laminating method according to the present disclosure.

For a better understanding of the features and technical contents of the present disclosure, reference will now be made in detail to the present disclosure and the accompanying drawings. The accompanying drawings, however, are not used to limit the scope of the present disclosure, but are shown for illustrative purposes only.
The following description is integrated into the drawings to embody the forms of the present disclosure.

  With reference to the preferred embodiments, the implementation of a film laminating apparatus and film laminating method will be described. The film laminating apparatus is realized using a small-scale film laminating apparatus or a large-scale film laminating apparatus. A so-called small-scale film laminating apparatus is suitable for laminating a film on a circuit board of 5 inches or less, for example. Also, so-called large scale film laminating equipment is suitable for laminating films on, for example, 5 to 15 inch circuit boards. The circuit board described above includes, but is not limited to, a material such as glass, plastic, or acrylic.

  1 to 4 show a structural view, a side view, a rear view, and a top view, respectively, according to the first embodiment of the film laminating apparatus according to the present disclosure. Moreover, the first embodiment is used to describe a small scale film laminating apparatus.

  As shown in FIGS. 1 to 4, the film laminating apparatus 20 includes a laminating platform 22, a rolling mechanism 24, a loading platform 26, an inhaling tool 28, and position detection. A positioning sensor 30, an optical detector 32, and a programmable logical controller 34 are provided. Programmable logic controller 34 is used to control the operation of laminate platform 22, roll mechanism 24 and inhaler 28.

  The laminating platform 22 includes a rotating mechanism 23 and a plurality of carrying tools 36. The present embodiment illustrates four carriers 36. The carrying tool 36 is arranged on the rotation mechanism 23 and is used for carrying the circuit board 38. The programmable logic controller 34 controls the rotation mechanism 23 of the laminating platform 22 every 90 degrees so that the circuit board 38 is independently carried by each carrier 36 and detected or laminated in order.

  The roll mechanism 24 includes an importing plate 40, at least one roller 42, and a recycling plate 44. The take-in plate 40 loads and rolls out an adhesive tape (for example, a release film) having a film attached on the loading table 26. The roller 42 is disposed under the capture plate 40 and supports and transfers the adhesive tape to which the film is attached. The reuse plate 44 rolls the tape so that the adhesive tape from which the film is removed is reused. In particular, the programmable logic controller 34 controls the capture plate 40 to roll out the adhesive tape with the film attached. Then, the adhesive tape is transferred to adjust the position of the loading table 26 via the rotating roller 42. Therefore, the programmable logic control device 34 controls the reuse plate 44 in order to reuse the adhesive tape from which the film has been removed via the roller 42. When the programmable logic controller 34 predicts that the adhesive tape loaded by the roll mechanism 24 has been used up, the programmable logic controller 34 notifies the operator that the adhesive tape is to be replaced (indicating message). For example, a warning sound, warning light, etc.) are generated.

  The programmable logic controller 34 controls the inhaler 28 to adjust the input table 26 to inhale and remove the film from the adhesive tape. Next, the inhaler 28 adjusts the carrier 36 to attach the film to the circuit board 38.

  Furthermore, the position detector 30 is designed in this embodiment to be used for detecting the position of the film sucked by the inhaler 28. The programmable logic controller 34 can further control the inhaler 28 to perform a positioning procedure based on the detection result of the position detector 30. At this time, the position detector 30 of the present embodiment includes a hollow stop switch and an optical fiber.

  In addition, the photodetector 32 is designed using a plurality of optically connected components 46 (such as a charge-coupled device (CCD), for example). As illustrated, the photodetector 32 according to the present embodiment is designed using two optically connected components 46. The first optically connected component 46 causes the film laminator 20 to detect dirt, scratches or dust on the surface of the circuit board 38 disposed on the carrier 36. At this point, the circuit board 38 is not laminated with a film (hereinafter referred to as an uncovered circuit board 38). On the other hand, the second optically connected component 46 causes the film laminating apparatus 20 to detect bubbles on the circuit board 38 on which the film disposed on the carrier 36 is laminated. When detected by any one of the two optically connected components 46, the programmable logic controller 34 generates notification information based on the detection result of the photodetector 32. As a result, the programmable logic control device 34 of this embodiment can determine the state before and after laminating the film on the circuit board 38 based on the detection result of the photodetector 32.

  Based on the configuration described above, the top view of FIG. 4 shows four transports arranged at 0 degrees (upper), 90 degrees (right), 180 degrees (lower), and 270 degrees (left) of the rotation mechanism 23. The tool 36 is shown. Two optically connected components 46 are placed at 0 degrees and 180 degrees above. Therefore, it is assumed that the rotation mechanism 23 rotates at an angle of 90 degrees in the clockwise direction, and the operator acquires the circuit board 38 on which the film is laminated on the carrier 36 rotated to the position of 90 degrees. Another non-cover circuit board 38 can be installed. Similarly, the optically connected component 46 located at the 180 degree position is used to detect the uncovered circuit board 38 on the carrier 36 rotated to the 180 degree position. The optically connected component 46 installed at the 0 degree position includes a circuit board 38 on which the film is laminated on the carrier 36 rotated to the 0 degree position, and an inhaler 28 for attaching the film. Is used to detect the uncovered circuit board 38 on the carrier 36 rotated to a position of 270 degrees toward

  The programmable logic controller 34 determines the quality of the circuit board 38 before and after laminating the film based on the detection result (for example, dust on the surface of the circuit board 38 or bubbles generated in the circuit board after film lamination). In this case, the programmable logic controller 34 generates notification information such as a warning sound or warning light.

  5A and 5B show a flowchart of the first embodiment of the film laminating method according to the present disclosure.

  The programmable logic control device 34 executes an initialization process for presetting various parameters in the programmable logic control device 34 (step S50). If the programmable logic control device 34 has not finished the initialization process, the programmable logic control device 34 generates notification information such as an alarm sound to notify the operator (step S52). At this time, the operator checks and repairs the programmable logic controller 34 and causes the programmable logic controller 34 to repeat step 50 after the check and repair are completed.

  After the programmable logic control device 34 finishes the initialization process, the programmable logic control device 34 controls the inhaler 28 to return to the initial position based on the preset parameter (step S54).

  The programmable logic control device 34 determines whether or not the inhaler 28 has returned to the initial position (step S58). When the programmable logic controller 34 determines that the inhaler 28 has not returned to the initial position, the operator controls the inhaler 28 by a manual operation for returning to the initial position (step S56), and the programmable logic controller 34 Step S54 and step S58 are repeated.

  When the programmable logic control device 34 determines that the suction tool 28 has returned to the initial position, the programmable logic control device 34 controls the suction tool 28 so as to align with the upper side of the loading table 26 (step S60). That is, the programmable logic control device 34 controls the inhaler 28 so as to move to the position of the film to be inhaled. In addition, the programmable logic controller 34 controls the rotation of the roll mechanism 24 at the same time, and performs a capturing process for capturing the adhesive tape with the film attached thereto. Then, the programmable logic control device 34 transfers the adhesive tape to which the film has been attached to the loading table 26.

  After the inhaler 28 is moved to the upper side of the input table 26, the programmable logic control device 34 controls the inhaler 28 so as to descend toward the input table 26, and the inhaler 28 is applied to the film attached to the adhesive tape. Touch (step S62). Then, the programmable logic control device 34 controls the inhaler 28 to inhale the film by the same approach as the vacuum suction (step S64).

  After the inhaler 28 has inhaled the film, the programmable logic controller 34 controls the inhaler 28 by moving the inhaler 28 toward the carrier 36 (ie, the inhaler 28 laminates the film). Move to position). On the other hand, the programmable logic control device 34 controls the roll mechanism 24 to rotate the adhesive tape. In one form, the film is removed through a manufacturing process for removal, and the adhesive tape from which the film has been removed is simultaneously reused by the reuse plate 44 (step S66).

  As a supplementary explanation, when the programmable logic control device 34 determines that the adhesive tape loaded by the take-in plate 40 has been used up, the programmable logic control device 34 indicates that the film laminating device 20 should stop its operation. The notification information shown is generated. When the adhesive tape of the take-in plate 40 is detected again, the film laminating apparatus 20 resumes its operation.

  The programmable logic control device 34 controls the operation of the inhaler 28 to the position where the film is laminated (step S68). During movement, the programmable logic controller 34 is preset to control the inhaler 28 to pass through the position detector 30 and position detector to ensure the accuracy of laminating the film on the circuit board 38. The position adjustment process is executed based on the 30 detection results. In the present embodiment, the position detector 30 is used to detect an angle for adjusting the position of the film sucked by the suction tool 28, for example. Therefore, the position detector 30 can determine whether or not the position adjustment process ends by detecting the angle for adjusting the position. When the suction device 28 finishes the position adjustment and moves to the position where the film is laminated, the programmable logic control device 34 determines whether or not the transport device 36 is in a fixed position (step S69).

  If the result of step S69 is “NO”, it means that the transporting device 36 is not in a fixed position. Therefore, step S69 is repeatedly executed until the transporting device 36 is in a fixed position. In mounting, a process of taking in the circuit board 38 is performed before the carrier 36 is put in place. In particular, the operator places the non-cover circuit board 38 on the carrier 36 (step S70). Next, the programmable logic controller 34 moves the carrier 36 carrying the uncovered circuit board 38 down to one side of the component 46 of the optically connected photodetector 32 at 90 degrees. The rotation mechanism 23 is controlled to rotate (step S72). Therefore, the programmable logic controller 34 controls the component 46 that is optically connected to automatically detect dust on the non-covered circuit board 38, and determines the size of the dust particles on the non-covered circuit board 38. Based on the detection result detected by the component 46 whose amount is optically connected, it is determined whether or not the criterion is satisfied (step S74).

  If the determination result in step S74 is “NO”, the programmable logic control device 34 generates notification information (for example, a warning sound) to notify the operator (step S76). The operator obtains a circuit board 38 that does not satisfy the standard from the carrier 36. And in order to perform the process which takes in the circuit board 38, step S70 and a subsequent step are repeated again. On the other hand, if the decision result in the step S74 is “YES”, the programmable logic control device 34 rotates the carrier 36 on which the circuit board 38 is arranged to a position for laminating the film to 90 degrees in order to move again. The rotation mechanism 23 is controlled. At this time, the programmable logic control device 34 can determine that the transporter 36 has been placed at a fixed position during the determination period of step S69. Next, the programmable logic control device 34 controls the inhaler 28 so as to perform film lamination for attaching the film to the non-cover circuit board 38 through which the detection has passed (step S80).

  Next, the programmable logic controller 34 determines whether or not the film lamination has been completed (step S82). If the result of step S82 is “NO”, step S82 continues to repeat the lamination. If the result of step S82 is “YES”, the programmable logic controller 34 controls the inhaler 28 to stop the inhalation of the film and moves the inhaler 28 away from the circuit board 38 on which the film is laminated. Control (step S84).

  After the film lamination is complete, except for controlling the inhaler 28 to return to the initial position and repeatedly performing step S60 and subsequent processing steps, the programmable logic controller 34 again turns 90 degrees. The rotation mechanism 23 is controlled to rotate (step S86). Here, the rotation mechanism 23 is used to move the carrier 36 in which the circuit board 38 on which the film is laminated is arranged below the component 46 of the optically connected photodetector 32. In addition, the programmable logic controller 34 controls the optically connected components 46 to automatically detect air bubbles on the film laminated circuit board 38 and the film laminated circuit board 38. It is determined whether or not the size and number of the bubbles above satisfy the standard based on the detection result of the optically connected component 46 (step S88).

  When the determination result of step S88 is “NO”, the bubbles on the circuit board 38 on which the film is laminated exceed the defined standard. Then, the programmable logic control device 34 generates notification information (such as a warning sound) for notifying the operator (step S90). If the determination result in step S88 is “YES”, or after step S90, the programmable logic controller 34 controls the rotation mechanism 23 to rotate by an angle of 90 degrees (step S92), and the film is laminated. The circuit board 38 is preset for the operator to obtain (regardless of whether or not the detection has passed). And step S70 is performed in order to arrange other non-cover circuit boards 38.

  After executing the above steps, the small-scale film laminating apparatus 20 of the present disclosure finishes the operations of dust detection, film lamination, and bubble detection for the circuit board 38. Therefore, this embodiment constitutes a design for the laminating platform 22, the inhaler 28 and the photodetector 32, except that automatic detection before and after laminating the film on the circuit board 38 can be achieved. If the above steps are performed repeatedly in succession, circuit board capture, film pre-lamination detection, film lamination and film post-lamination detection can be performed simultaneously. Therefore, the present embodiment can effectively increase the production speed.

  6 to 9 show a structural view, a side view, a rear view, and a top view of a second embodiment of the film laminating apparatus according to the present disclosure. The second embodiment is used for the description of a large-scale film laminating apparatus.

  As shown in FIGS. 6 to 9, the large-scale film laminating apparatus 100 includes a laminating platform 102, a rolling mechanism 104, a wheel-rolling device 106, a header system 108, Positioning sensor 110, photodetector 112, and programmable logic control device (not shown, disposed directly below film laminating device 100). The programmable logic controller is used to control the operation of the laminating platform 102 and the header system 108. The laminating platform 102 is used to carry a circuit board (not shown) and can move horizontally to the outer side of the roll mechanism 104 and downward.

  The header system 108 is used to control the operation of the roll mechanism 104 and the wheel rotation device 106 through the movement method of the mechanical linkage mechanism. The roll mechanism 104 includes an intake plate 114, at least one roller 116, and a reuse plate 118. The take-in plate 114 inputs and sweeps out an adhesive tape (for example, a release film) to which a film is attached. The roller 116 is disposed under the capture plate 114, and transfers and feeds the adhesive tape to which the film is attached to a position where the film is laminated. The reuse plate 118 is wound up to reuse the adhesive tape from which the film has been removed. More specifically, the header system 108 controls the roll mechanism 104 to transfer and feed the adhesive tape with the film attached to the position where the film is laminated, and the wheel rotation device to move to the initial position. Control 106 and wait for the film to be laminated. The header system 108 uses a method of wheel-rolling lamination to remove the film from the adhesive tape on the roll mechanism 104 and attach the film to the circuit board carried by the laminate platform 102. The wheel rotation device 106 is controlled.

  In addition, the position detector 110 designed in the present embodiment is used to detect the position of the adhesive tape to which the film on the roll mechanism 104 is attached. The programmable logic controller controls the header system 108 to perform the alignment process based on the detection result of the position detector 110 in order to ensure the accuracy of laminating the film. The position detector 110 is composed of a plurality of optical fibers. In this embodiment, two optical fibers are shown by way of example.

  In addition, the photodetector 112 comprises a plurality of optically connected components 120 (eg, CCDs). As shown, this embodiment is designed with two optically connected components 120. The photodetector 112 is used, for example, to detect dirt such as scratches or dust on the surface of an uncovered circuit board disposed on the laminate platform 102, or air bubbles on a circuit board laminated with a film. It is done. The programmable logic control device generates notification information (for example, warning sound, warning light, etc.) based on the detection result of the photodetector 112.

  Specifically, when it is determined that the quality of the circuit board is poor before and after film lamination, the programmable logic control device generates notification information. Therefore, the requirement of automatically detecting the state of the circuit board before and after film lamination can be achieved.

  10A and 10B show a flowchart of a second embodiment of the film laminating method according to the present disclosure. The configuration of the film laminating apparatus 100 shown in FIG. 6 to FIG. 9 describes the operating process of FIG.

  The programmable logic control device executes an initialization process for presetting various parameters in the programmable logic control device 34 (step S130). If the programmable logic control device has not completed the initialization process, the programmable logic control device generates notification information (such as an alarm sound) to inform the operator (step S132). The operator performs troubleshooting for the programmable logic control device, and after completing the failure inspection, causes the programmable logic control device to execute step S130 again.

  After the programmable logic control device finishes the initialization process, the programmable logic control device controls the header system 108 to return to the initial position based on the preset parameters (step S134). The header system 108 controls the operation of the roll mechanism 104 and the wheel rotation device 106 through the movement method of the mechanical link mechanism. Therefore, when the header system 108 returns to the initial position, the roll mechanism 104 and the wheel rotation device 106 similarly return away from the initial position.

  Thereafter, the programmable logic control device determines whether the header system 108 has returned to the initial position (step S138). When the determination result of step S138 is “NO”, step S134 is repeatedly executed until the header system 108 returns to the initial position. If the determination result in step S138 is “YES”, the programmable logic control device controls the header system 108 to start capturing the film in order to perform processing for capturing the adhesive tape to which the film is attached. The roll mechanism 104 is controlled (step S146). In particular, the header system 108 controls the capture plate 114 to sweep out the adhesive tape with the film attached and controls the reuse plate 118 to wind up to draw the adhesive tape with the film attached thereto. . In this case, the entire adhesive tape to which the film is attached is transferred via the support of the roller 116 and the shaft. In addition, after the film is removed from the adhesive tape, the reuse plate 118 reuses the adhesive tape from which the film has been removed.

  In other embodiments, when the header system 108 controls the capture plate 114 to sweep out the adhesive tape, the programmable logic controller determines whether the adhesive tape loaded by the capture plate 114 has been used up. . When the adhesive tape is used up, the programmable logic control device generates notification information indicating that the film laminating device 100 should stop its operation. Therefore, the operator controls the header system 108 by manual operation after replacing the adhesive tape in order to cause the header system 108 to execute step S134 and return to the initial position (step S136).

  When step S146 is executed to transfer the adhesive tape with the film attached thereto, the programmable logic control device performs position adjustment processing based on the detection result of the position detector 110 (step S148).

  The position adjustment process defined in this embodiment will be described through the subsequent operation of the specification using the setting of the direction and viewing angle of the film laminating apparatus 100 shown in FIG. First, the programmable logic controller controls the roll mechanism 104 to move toward the position detector 110 (from left to right) by controlling the header system 108. The position detector 110 of this embodiment is designed so that two optical fibers are positioned on the same horizontal line. The horizontal line is parallel to the right side of the laminate platform 102 and allows the two sides of the optical tape to detect the same side of the adhesive tape film introduced by the roll mechanism 104.

  Therefore, only if any one of the optical fibers detects the film means that the film is tilted compared to the laminate platform 102. At this point, the programmable logic controller controls the header system 108 to cease proceding continuously and to adapt to make the film detectable to two optical fibers. The roll mechanism 104 is controlled to begin to rotate horizontally based on the axis. When two optical fibers detect the film, the programmable logic controller stops horizontal rotation and controls the header system 108 to move away from the position detector 110 by a preset distance (from right to left). The roll mechanism 104 is controlled to move to. Next, the programmable logic controller controls the roll mechanism 104 to move again toward the position detector 110 (from left to right) by controlling the header system 108. When the two optical fibers detect a film introduced by the roll mechanism 104, the roll mechanism 104 is controlled to stop the procedure. Thereby, the roll mechanism 104 transfers the adhesive tape to which the film is attached to a position where the film is laminated, and the film is also placed at an accurate position.

  Based on the above description, after the position adjustment process is completed in step S148, the programmable logic control device determines whether or not the laminate platform 102 is in a fixed position (step S163). If the determination result in step S163 is “NO”, it indicates that the laminate platform 102 has not yet been placed in place. Then, Step S163 is repeatedly executed until the laminate platform 102 is placed at a fixed position. Before the laminate platform 102 is put in place, the process of capturing the circuit board is performed. In particular, the operator places an uncovered circuit board on the laminate platform 102 (step S156). The laminate platform 102 of this embodiment is designed to be inhaled in a vacuum to secure the circuit board. The programmable logic controller then controls the plurality of optically connected components 120 of the photodetector 112 to automatically detect dust on the non-cover circuit board. In addition, the programmable logic control device determines whether or not the size and amount of dust on the non-cover circuit board satisfy a criterion based on the detection result of the photodetector 112 (step S160).

  When the determination result of step S160 is “NO”, the programmable logic control device generates notification information (for example, a warning sound) to notify the operator (step S162). The operator acquires a circuit board that does not satisfy the standard from the laminate platform 102, and repeats step S156 and subsequent steps in order to perform the process of taking in the circuit board again. On the other hand, if the decision result in the step S160 is “YES”, the programmable logic control device controls the laminating platform 102 to adjust the film laminating position. At this time, the programmable logic control device in the determination in step S163 determines that the laminate platform 102 has been installed at a fixed position. Thereafter, the programmable logic control device controls the wheel rotation device 106 that rotates and applies pressure to attach the film to the non-cover circuit board by controlling the header system 108 (step S164).

  Next, the programmable logic control device determines whether or not the film lamination is finished (step S166). The programmable logic control device determines whether the film lamination is finished by determining the rotation distance of the wheel rotation device 106. When the determination result of step S166 is “NO”, step S164 is repeatedly executed to continuously laminate the film. If the determination result in step S166 is "YES", the programmable logic controller stops rotating and laminating and controls the header system 108 to move the wheel away from the circuit board on which the film is laminated. The rotating device 106 is controlled (step S168).

  Apart from repeatedly performing step S134, which controls the header system 108 to return to the initial position, and subsequent steps, after the film has been laminated, the programmable logic controller is responsible for laminating the film. In order to move the printed circuit board to the bottom surface of the optically connected component 120 of the photodetector 112, the laminating platform 102 is controlled to exit from the position where the film is laminated (step S170). In addition, the programmable logic controller can determine whether the size and amount of bubbles on the circuit board on which the film is laminated meet the criteria based on the detection results of the photodetector 112. The optically connected component 120 is automatically controlled so as to detect air bubbles on the circuit board (step S172).

  If the determination result in step S172 is “NO”, it indicates that the bubbles on the circuit board on which the film is laminated exceed the specification. Therefore, the programmable logic control device generates notification information (such as a warning sound) for notifying the operator (step S176). If the determination result in step S172 is “YES”, or after step S176 generates notification information, the operator obtains the circuit board on which the film is laminated (regardless of whether the detection is successful), In order to capture another non-covered circuit board, the programmable logic controller is caused to execute step S156 again.

  After performing the various above-described steps, the large-scale film laminating apparatus 100 finishes performing dust detection, film lamination, and bubble detection operations for the circuit board.

  The present disclosure provides an apparatus and method for laminating films. By detecting the state of dust adhered to the circuit board before laminating the film, by using the photodetector of the film laminating apparatus, and detecting bubbles generated in the circuit board after laminating the film, By rapidly increasing the yield of laminating a film on a circuit board, a circuit board on which an incomplete film is laminated is quickly found. Furthermore, the film laminating apparatus achieves the avoidance of bubbles on the circuit board on which the film is laminated with high accuracy and high speed, and achieves the features of simple operation, easy management, and strong feasibility.

  While specific embodiments have been shown and described, various changes and modifications may be made thereto without departing from the spirit and scope of the present disclosure. Accordingly, it is understood that this disclosure is described by way of illustration and not limitation.

DESCRIPTION OF SYMBOLS 20 Film laminating apparatus 22 Laminating platform 23 Rotating mechanism 24 Roll mechanism 26 Loading stand 28 Inhaler 30 Position detector 32 Photo detector 34 Programmable logic control device 36 Carrier 38 Circuit board 40 Intake plate 42 Roller 44 Reuse board 46 Parts DESCRIPTION OF SYMBOLS 100 Large film laminating apparatus 102 Laminating platform 104 Roll mechanism 106 Wheel rotating apparatus 108 Header system 110 Position detector 112 Photodetector 114 Capture plate 116 Roller 118 Reuse plate 120 Parts

Claims (12)

  1. And laminate platform carrying a single circuit board from the first position to the second position even without low,
    In the first position, a first detection part for detecting the quality of said circuit substrate before laminating the film, in the second position, prior SL circuit board after being the film Gala laminate-quality A second detection component for detecting a light detector;
    A film laminating apparatus comprising:
  2. Detection by the first detection component for the first circuit board before laminating the film and detection by the second detection component for the second circuit board after laminating the film are performed simultaneously. Ru
    The film laminating apparatus according to claim 1.
  3. The laminate platform is
    A rotation mechanism;
    A plurality of carriers arranged on the rotating mechanism,
    The film laminating apparatus according to claim 1, wherein the plurality of carriers carry the circuit board.
  4. Input platform,
    A roll mechanism for charging the adhesive tape to which the film is affixed, and transferring the adhesive tape to the input table;
    A suction Nyugu said on the turned table removed by suction the film from the adhesive tape, laminating the film to the circuit board on the carrying device,
    A position detector for detecting the position of the film sucked by the inhaler;
    A programmable logic controller for controlling the operation of the laminating platform, the roll mechanism and the inhaler;
    With
    The programmable logic controller is
    Further controlling the inhaler to perform position adjustment processing based on the detection result of the position detector;
    The film laminating apparatus according to claim 3, wherein notification information is generated based on a detection result of the photodetector.
  5. The roll mechanism is
    And taking plate out can sweep to put an adhesive tape in which the film is stuck to the closing stage,
    At least one roller disposed downstream from the capture plate with respect to the transport direction of the adhesive tape and rotating to support and transfer the adhesive tape to which the film is attached;
    A recycling plate that is wound up to reuse the adhesive tape from which the film has been removed;
    The film laminating apparatus according to claim 4.
  6. A first detection step of detecting the quality of at least one circuit board by a first detection component at a first position;
    A laminating step of laminating a film on the circuit board after the first detecting step;
    After the laminating step, a second detecting step of detecting the quality of the circuit board on which the film is laminated by a second detection component at a second position where the circuit board is transported;
    A film laminating method in which the programmable logic control device executes .
  7.   The programmable logic controller is
      The first detection step by the first detection component for the first circuit board before laminating the film, and the second detection component by the second detection component for the second circuit board after the film is laminated. Simultaneously execute the second detection step
      The film laminating method according to claim 6.
  8. La Mi sulfonates platform carrying the said second position said circuit board from said first position, comprising the steps of rotating to capture the circuit board,
    Rotating the roll mechanism to take the adhesive tape with the film affixed to a position where the film is laminated ;
    The film laminating method according to claim 6 or 7, wherein the programmable logic control device further executes .
  9. Inhale and remove the film from the adhesive tape,
    Adjust the position of the inhaled film,
    Laminating the film on the circuit board
    The film laminating method according to claim 8 , wherein the programmable logic control device further executes .
  10. In the first detection step,
    The film laminating method according to claim 8, wherein after the circuit board is taken in, whether or not the circuit board is contaminated is detected through the first detection component.


  11. In the second detection step,
    After laminating the film to the circuit board, film laminate according to claim 9, wherein the film is whether air bubbles circuit board laminated present, it detects through the second detection part Method.
  12. Generating the notification information based on the first detection part and the second detection part of the detection result
    The film laminating method according to claim 6 or 7 , wherein the programmable logic control device further executes .
JP2012202753A 2011-09-18 2012-09-14 Film laminating apparatus and film laminating method Expired - Fee Related JP5731457B2 (en)

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CN201110289590.0A CN102991750B (en) 2011-09-18 2011-09-18 Laminating machine and laminating method

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Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103318451B (en) * 2013-07-02 2015-08-05 江苏科瑞恩自动化科技有限公司 A kind of automatic film coating
CN104340392A (en) * 2013-07-29 2015-02-11 昌硕科技(上海)有限公司 Envelope device
CN104340406A (en) * 2013-07-29 2015-02-11 昌硕科技(上海)有限公司 Gluing device
CN103723300B (en) * 2013-12-10 2016-01-20 周俊雄 Ventilated membrane chip mounter
CN103879587B (en) * 2014-03-14 2016-04-20 东莞市上川自动化设备有限公司 A kind of Full-automatic film sticking machine
CN103950602B (en) * 2014-04-22 2016-05-25 苏州博智电子科技有限公司 A kind of CD-ROM drive surface automatic film-laminating device
CN104176309A (en) * 2014-08-19 2014-12-03 苏州赛腾精密电子有限公司 Three-axis linkage turnover film sticking mechanism
CN104150011A (en) * 2014-08-25 2014-11-19 昆山迈致治具科技有限公司 Automatic sticking film machine
CN104308889B (en) * 2014-09-16 2016-09-21 傅潍 A kind of pad pasting cutting machine
CN104386510A (en) * 2014-10-30 2015-03-04 昆山迈致治具科技有限公司 Transport unit for Mylar paper
CN104724312A (en) * 2015-03-23 2015-06-24 惠州Tcl移动通信有限公司 Film pasting device
CN105151385B (en) * 2015-07-09 2016-05-18 濠玮电子科技(惠州)有限公司 A kind of chain transmission type automatic film applicator and film coating process thereof
CN104944202B (en) * 2015-07-22 2017-03-08 苏州市万祥电器成套有限公司 Electronic component automatic detection envelope material device
CN105292657B (en) * 2015-11-12 2017-07-18 东莞市领恒智能自动化有限公司 A kind of vision positioning mobile phone auxiliary material mounting system
CN105314154A (en) * 2015-11-16 2016-02-10 太原风华信息装备股份有限公司 Turnover device for large-size laminating machine
CN105485546B (en) * 2015-12-31 2019-03-05 广东长天精密设备科技有限公司 A kind of gluing strip device
CN105786248A (en) * 2016-02-25 2016-07-20 成都亨通兆业精密机械有限公司 Automatic assembling device for touch screen production
CN108093629A (en) * 2016-12-27 2018-05-29 深圳市柔宇科技有限公司 Application of a surface device and applying method
CN106628343A (en) * 2016-12-30 2017-05-10 大连益盛达智能科技有限公司 Automatic adhesion mechanism for pull tape of full-automatic backlight machine
TWI668158B (en) * 2017-03-14 2019-08-11 萬潤科技股份有限公司 Component bonding method and device
CN106966208B (en) * 2017-03-15 2019-01-22 广东天机工业智能系统有限公司 The orderly distribution equipment of production line

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001124660A (en) * 1999-10-25 2001-05-11 Horiba Ltd Inspection method and inspection device of defect and foreign matter for flat panel flat display device
JP3837320B2 (en) * 2001-11-07 2006-10-25 ソニー株式会社 Optical disc laminating device
TWM241154U (en) * 2003-07-09 2004-08-21 Univ Nat Taiwan Science Tech Appearance detecting equipment of components
TWI245731B (en) * 2003-12-26 2005-12-21 Sentelic Corp Pasting-film/testing equipment
CN1309559C (en) * 2004-01-06 2007-04-11 升达科技股份有限公司 Pasting/detecting equipment pasting device and detecting device thereof
JP2007171622A (en) * 2005-12-22 2007-07-05 Sharp Corp Method of manufacturing display device and display device
CN1908638A (en) * 2006-08-24 2007-02-07 上海交通大学 Optical detecting instrument of defects in glass
JP2009186497A (en) * 2008-02-01 2009-08-20 Sharp Corp Apparatus for manufacturing liquid crystal display panel and method of manufacturing liquid crystal display panel
TWI369898B (en) * 2008-06-30 2012-08-01 Chung Shan Inst Of Science
CN201222145Y (en) * 2008-07-16 2009-04-15 上海索广电子有限公司 Automatic gumming machine for touch screen
TWI352053B (en) * 2009-03-16 2011-11-11 Chroma Ate Inc
CN101870380B (en) * 2009-04-24 2012-10-10 中茂电子(深圳)有限公司 Protecting method and film sticking equipment of optical elements
WO2011071231A2 (en) * 2009-12-08 2011-06-16 Han Dong Hee Film adhering device and adhering method
CN201960799U (en) * 2011-01-27 2011-09-07 深圳市东方亮彩精密技术有限公司 Automatic sticking film machine for front and back of mobile phone shell
CN202271629U (en) * 2011-09-18 2012-06-13 瑞世达科技(厦门)有限公司 Film laminating machine

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TWI565645B (en) 2017-01-11
CN102991750A (en) 2013-03-27
TW201313594A (en) 2013-04-01
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KR20130030730A (en) 2013-03-27
TWM440936U (en) 2012-11-11
KR101553359B1 (en) 2015-09-30

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