CN102983113B - 包括无源电部件的封装系统 - Google Patents

包括无源电部件的封装系统 Download PDF

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Publication number
CN102983113B
CN102983113B CN201210320807.4A CN201210320807A CN102983113B CN 102983113 B CN102983113 B CN 102983113B CN 201210320807 A CN201210320807 A CN 201210320807A CN 102983113 B CN102983113 B CN 102983113B
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Prior art keywords
bonding pads
electrical
electric connection
electrical bonding
connection structure
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CN201210320807.4A
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CN102983113A (zh
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阿伦·罗思
索南·艾瑞克
王超昊
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Taiwan Semiconductor Manufacturing Co TSMC Ltd
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Taiwan Semiconductor Manufacturing Co TSMC Ltd
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    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M3/00—Conversion of dc power input into dc power output
    • H02M3/02—Conversion of dc power input into dc power output without intermediate conversion into ac
    • H02M3/04—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters
    • H02M3/10—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
    • H02M3/145—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal
    • H02M3/155—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only
    • H02M3/156—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators
    • H02M3/158—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators including plural semiconductor devices as final control devices for a single load
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
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    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/5226—Via connections in a multilevel interconnection structure
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Abstract

一种封装系统包括设置在衬底上方的至少一个有源电路。钝化结构设置在所述至少一个有源电路上方。钝化结构具有至少一个开口，所述至少一个开口被配置成暴露至少一个第一电焊盘。至少一个无源电部件设置在钝化结构上方。至少一个无源电部件与至少一个第一电焊盘电耦合。本发明还提供了包括无源电部件的封装系统。

Description

包括无源电部件的封装系统
技术领域
一般而言，本发明涉及半导体领域，更具体而言，涉及包括无源电部件的封装系统。
背景技术
便携式器件诸如移动电话、笔记本电脑等得到了广泛的应用，并且配备有各种功能。例如，移动电话用于打电话、照相、访问互联网、发送和接收电子邮件、查看股市行情和体育比赛结果，以及作为个人数字助理(或PDA)和/或MP3播放器使用。
发明内容
为了解决现有技术中所存在的缺陷，根据本发明的一方面，提供了一种封装系统，包括：至少一个有源电路，设置在衬底上方；钝化结构，设置在所述至少一个有源电路上方，所述钝化结构具有至少一个开口，所述至少一个开口被配置成暴露至少一个第一电焊盘；以及至少一个无源电部件，设置在所述钝化结构上方，所述至少一个无源电部件与所述至少一个第一电焊盘电耦合。
在该封装系统中，所述至少一个无源电部件包括至少一个电容器、至少一个电感器、至少一个电阻器、或它们的任意组合。
该封装系统进一步包括：至少一条电导线，电耦合在所述至少一个无源电部件和所述至少一个第一电焊盘之间。
该封装系统进一步包括：至少一个电连接结构，设置在所述钝化结构的所述至少一个开口中；以及至少一个第二电焊盘，设置在所述至少一个电连接结构上方，其中，所述至少一个第一电焊盘通过所述至少一个电连接结构和所述至少一个第二电焊盘与所述至少一个无源电器件电耦合。
该封装系统进一步包括：至少一种粘合材料，设置在所述至少一个无源电部件和所述钝化结构之间。
该封装系统进一步包括：至少一个电连接结构，设置在所述钝化结构的所述至少一个开口中，所述至少一个电连接结构在所述钝化结构的表面上方连续地延伸，其中，所述至少一个第一电焊盘通过所述至少一个电连接结构与所述至少一个无源电部件电耦合。
在该封装系统中，所述至少一个无源电部件以阵列模式布置在所述钝化结构上方。
在该封装系统中，所述至少一个无源电部件包括第一组无源电部件和第二组无源电部件，所述第一组无源电部件以串联模式布置，而所述第二组无源电部件以并联模式布置。
根据本发明另一方面，提供了一种封装系统，包括：至少一个有源电路，设置在衬底上方；钝化结构，设置在所述至少一个有源电路上方，所述钝化结构具有暴露第一电焊盘的第一开口和暴露第二电焊盘的第二开口；以及第一无源电部件，设置在所述钝化结构上方，其中，所述第一无源电部件的第一节点与所述第一电焊盘电耦合，并且所述第一无源电部件的第二节点与所述第二电焊盘电耦合。
该封装系统进一步包括：第二无源电部件，设置在所述钝化结构上方并与所述第一无源电部件电耦合，其中，所述钝化结构具有暴露第三电焊盘的第三开口和暴露第四电焊盘的第四开口，所述第二无源电部件的第三节点与所述第三电焊盘电耦合，并且所述第二无源电部件的第四节点与所述第四电焊盘电耦合。
该封装系统中，所述第一无源电部件和所述第二无源电部件彼此以串联或并联模式电耦合。
该封装系统中，所述第一无源电部件和所述第二无源电部件均为电容器、电感器或电阻器。
该封装系统进一步包括：第一电导线，电耦合在所述第一电焊盘和所述第一节点之间；以及第二电导线，电耦合在所述第二电焊盘和所述第二节点之间。
该封装系统进一步包括：第一电连接结构，设置在所述第一开口中并与所述第一电焊盘电连接；第二电连接结构，设置在所述第二开口中并与所述第二电焊盘电连接；第五电焊盘，设置在所述第一电连接结构上方并且电耦合在所述第一电连接结构和所述第一节点之间；以及第六电焊盘，设置在所述第二电连接结构上方并且电耦合在所述第二电连接结构和所述第二节点之间。
该封装系统进一步包括：至少一种粘合材料，设置在所述第一无源电部件和所述钝化结构之间。
该封装系统进一步包括：第一电连接结构，设置在所述第一开口中，其中，所述第一电连接结构在所述钝化结构的表面上方连续地延伸并且电耦合在所述第一电焊盘和所述第一节点之间；以及第二电连接结构，设置在所述第二开口中，其中，所述第二电连接结构在所述钝化结构的表面上方连续地延伸并且电耦合在所述第二电焊盘和所述第二节点之间。
根据又一方面，提供了一种封装系统，包括：至少一个有源电路，设置在衬底上方；钝化结构，设置在所述至少一个有源电路上方，所述钝化结构具有暴露第一电焊盘的第一开口和暴露第二电焊盘的第二开口；第一电连接结构和第二电连接结构，分别设置在所述第一开口和所述第二开口中；以及第一表面贴装器件(SMD)电容器，设置在所述钝化结构上方，其中，所述第一SMD电容器分别通过所述第一电连接结构和所述第二电连接结构与所述第一电焊盘和所述第二电焊盘电耦合。
该封装系统进一步包括：第三电焊盘，设置在所述第一电连接结构上方并且电耦合在所述第一电连接结构和所述第一SMD电容器之间；第四电焊盘，设置在所述第二电连接结构上方并且电耦合在所述第二电连接结构和所述第一SMD电容器之间；以及至少一种粘合材料，设置在所述第一SMD电容器和所述钝化结构之间。
在该封装系统中，所述第一电连接结构和所述第二电连接结构在所述钝化结构的表面上方连续地延伸，并且所述第一SMD电容器设置在所述第一电连接结构和所述第二电连接结构之间。
该封装系统进一步包括：第二SMD电容器，设置在所述钝化结构上方并且以串联或并联模式与所述第一SMD电容器电耦合，其中，所述钝化结构具有暴露第五电焊盘的第三开口和暴露第六电焊盘的第四开口，并且所述第二SMD电容器与所述第五电焊盘和所述第六电焊盘电耦合。
附图说明
当结合附图进行阅读时，根据下面详细的描述来理解本发明。应该注意到，根据工业中的标准实践，对各种部件没有按比例绘制并且仅仅用于说明的目的。实际上，为了清楚讨论起见，各种部件的数量和尺寸可以被任意增大或减小。
图1是根据示例性封装系统的示意性俯视图。
图2A至图2C是沿着图1的剖面线A-A截取的各种示例性封装系统的示意性截面图。
图3A至图3E是各种示例性DC/DC转换器的示意图。
图3F是示例性电感式开关调节器的示意图。
具体实施方式
为了便于轻松携带，便携式器件通常通过小电池供电。电池被配置成根据便携式器件的类型提供约例如3.6V的电压水平。为了向便携式器件中的集成电路供电，将电池电压下调至较小电压，例如，1V。通常，采用具有电感器的DC/DC转换器来调节电池电压。
申请人已知的DC/DC转换器包括多个电感器。为了调节电池电压，电感器是分立的并接合在印刷电路板(PCB)上。引线接合电感器和PCB以与也接合在PCB上的其他电路电通信。申请人发现分立的电感器是昂贵的。此外，分立的电感器设置在PCB的某一区域上，在PCB上保留较大的占位面积。申请人还发现由于引线接合，DC/DC转换器的效率可能不能达到期望的水平。
可以理解为了实施本发明的不同部件，以下公开内容提供了许多不同的实施例或实例。在下面描述部件和布置的特定实例以简化本发明。当然这些仅是实例并不打算限定。此外，本发明可以在各个实例中重复参考数字和/或字母。这种重复是为了简明和清楚的目的，并且其本身并不指定所论述的各个实施例和/或配置之间的关系。再者，在随后的本发明中位于另一部件上、连接和/或耦合到另一部件的部件的形成可以包括其中部件以直接接触形成的实施例，并且也可以包括其中可以形成介于部件之间的额外的部件，使得部件可以不直接接触的实施例。此外，使用空间相对术语，例如“下”、“上”、“水平的”、“垂直的”、“上方”、“下方”、“向上”、“向下”、“顶部”、“底部”等及其派生词(例如，“水平地”、“向下地”、“向上地”等)以便于描述本发明的一个部件与另一个部件的关系。空间相对术语预期涵盖包括部件的器件的不同定向。
图1是示例性封装系统的示意性俯视图。在图1中，封装系统100包括设置在钝化结构(未标记)表面上方的多个无源电部件110。在一些实施例中，以阵列模式布置无源电部件110。在一些实施例中，至少两个无源电部件110以并联或串联模式彼此电连接起来。在其他实施例中，无源电部件110彼此电隔离。无源电部件110均可以是电容器、电感器或电阻器。
图2A是沿着图1的剖面线A-A截取的第一示例性封装系统的示意性截面图。在图2A中，封装系统100包括至少一个有源电路，例如，设置在衬底101上方的有源电路120。在一些实施例中，有源电路120包括至少一个开关、至少一个逻辑电路、至少一个控制器、至少一个模拟电路、至少一个混合信号电路、至少一个处理器、其他有源电路和/或它们的任意组合。
例如，封装系统100包括DC/DC转换器。有源电路120包括一个或多个开关，这些开关可通过操作将一个或多个无源电部件110彼此电连接起来。图3A至图3E是各种类型的示例性DC/DC转换器的示意图。在图3A中，有源电路120包括开关S1-S6，而无源电部件110包括电容器C1-C3。在图3B中，有源电路120包括开关S7-S15，而无源电部件110包括电容器C4-C6。在图3C中，有源电路120包括开关S16-S23，而无源电部件110包括电容器C7-C9。在图3D中，有源电路120包括开关S24-S33，而无源电部件110包括电容器C10-C14。在图3E中，有源电路120包括开关S34-S43，而无源电部件110包括电容器C15-C17。
在一些实施例中，电容器C1-C17均具有介于约100纳法拉(nF)至约5微法拉(μF)范围内的电容。通过使用图3A至图3E所示的各种DC/DC转换器中的一种，电池的输入电压(Vin)例如3.6V可以下调至约1V的输出电压(Vout)，将该输出电压供应至有源电路120。在一些实施例中，电容器C1-C17均为表面贴装器件(SMD)电容器。注意到上面结合图3A至图3E所述的各种类型的DC/DC转换器仅是示例性的。在一些实施例中，将无源电部件110和有源电路120布置成形成不同的DC/DC转换器。在其他实施例中，可以通过至少一个电感器代替电容器C1-C17中的至少一个。
在一些实施例中，封装系统100包括如图3F所示的感应式开关调节器。有源电路120包括开关S43和S44，这些开关可通过操作将电容器C18和电感器L中的一个或多个彼此电连接。注意到上面结合图3A至图3F所述的DC/DC转换器和感应式开关调节器仅是示例性的。本申请的范围不限于此。在一些实施例中，封装系统100包括升压开关调节器、降压转换器、其他类型的调节器或转换器、包括无源电部件的其他电路中的至少一种和/或它们的任意组合。
在一些实施例中，衬底101是由以下材料制成：元素半导体，包括晶体硅或晶体锗、多晶硅或非晶结构；化合物半导体，包括碳化硅、砷化镓、磷化镓、磷化铟、砷化铟和锑化铟；合金半导体，包括SiGe、GaAsP、AlInAs、AlGaAs、GaInAs、GaInP和GaInAsP；任何其他合适的材料；或它们的组合。在一个实施例中，合金半导体衬底具有梯度SiGe部件，其中Si和Ge成分从梯度SiGe部件的一个位置的一种比率变化为另一个位置的另一种比率。在另一个实施例中，在硅衬底上方形成合金SiGe。在又一个实施例中，SiGe衬底产生应变。在一些实施例中，半导体衬底具有绝缘体上半导体结构，诸如绝缘体上硅(SOI)结构。在一些实例中，半导体衬底包括掺杂的外延层或掩埋层。在其他实例中，化合物半导体衬底具有多层结构，或者衬底包括多层化合物半导体结构。
参照图2A，在有源电路120上方设置互连结构130。在一些实施例中，互连结构130包括至少一个介电层和至少一个电连接结构(未示出)。例如，互连结构130包括多个介电层和多层电连接结构。电连接结构均被夹在两个介电层之间。电连接结构被配置成在晶体管、二极管、器件、电路和/或有源电路120的其他电部件之间提供电连接。在一些实施例中，介电层和导电结构被布置成形成各种无源器件，例如，电容器、电阻器和/或电感器。
在一些实施例中，介电层包含诸如氧化硅、氮化硅、氮氧化硅、低介电常数(低k)介电材料、超低k介电材料、其他介电材料的至少一种材料和/或它们的任意组合。电连接结构包括诸如通孔塞、接触塞、镶嵌结构、双镶嵌结构、金属区域、金属线、金属板条、其他电连接结构的至少一种结构和/或它们的任意组合。在一些实施例中，通孔塞、接触塞、镶嵌结构、双镶嵌结构、金属区域、金属线和金属板条由诸如钨、铝、铜、钛、钽、氮化钛、氮化钽、硅化镍、硅化钴、其他适当的导电材料的至少一种材料和/或它们的组合制成。
再次参照图2A，在有源电路120上方设置钝化结构150。钝化结构150具有被配置用于分别暴露至少一个电焊盘(例如，电焊盘140a-140d)的至少一个开口，例如开口151a-151d。在一些实施例中，电焊盘140a-140d通过互连结构130与有源电路120电耦合。
在一些实施例中，电焊盘140a-140d由诸如铜(Cu)、铝(Al)、铝铜(AlCu)、铝硅铜(AlSiCu)、钨、铝、铜、钛、钽、氮化钛、氮化钽、硅化镍、硅化钴、其他导电材料的至少一种材料和/或它们的任意组合制成。在一些实施例中，电焊盘140a-140d各自均包括凸块底部金属化(UBM)层(未示出)。
在一些实施例中，钝化结构150包括至少一个介电层和/或至少一个聚合物层。介电层可以包括诸如氧化物、氮化物、氮氧化物、其他介电材料、和/或它们的任意组合的材料。聚合物层可以包括诸如热塑性、热固性、弹性体、配位聚合物、其他合适的聚合物和/或它们的任意组合的材料。在一些实施例中，钝化结构150是单层结构。在其他实施例中，钝化结构150是多层结构。
参照图2A，在钝化结构150上方设置无源电部件110a和110b。在一些实施例中，在相应的无源电部件110a和110b与钝化结构150之间设置粘合材料，例如环氧树脂(未示出)。施加粘合材料以促进无源电部件110a和110b与钝化结构150之间的物理连接。
再次参照图2A，无源电部件110a和110b与相应的电焊盘140a-140d电连接。例如，无源电部件110a分别通过引线161a和161b与电焊盘140a和140b电连接。无源电部件110b分别通过引线161c和161d与电焊盘140c和140d电连接。在一些实施例中，引线161a和161b与无源电部件110a的相对节点电连接，引线161c和161d与无源电部件110b的相对节点电连接。在一些实施例中，引线161a-161d由诸如金、铜、铝、锡、银、铅、其他金属材料的至少一种材料和/或它们的任意组合制成。
参照图2A，可以在印刷电路板(PCB)上方设置封装系统100。正如前面所提到的，无源电部件110a和110b设置在管芯的钝化结构150上方。无源电部件110a和110b不消耗PCB的任何空间，使得PCB上的更多空间可以被布置成容纳其他电路。无源电部件110a和110b在PCB上保留较少的占位面积或者不保留占位面积。
当无源电部件110a和110b设置在钝化结构150上方并通过电焊盘140a-140d与有源电路120电耦合时，能够增加无源电部件110a和110b与有源电路120之间的电通信速度。在一些实施例中，无源电部件110a和110b是SMD电容器，其比在PCB上使用和设置的分立电感器便宜。可以理想地降低制造封装系统100的成本。
图2B是沿着图1的剖面线A-A截取的第二示例性封装系统的示意性截面图。用相同的参考数字表示与图2A中的封装系统100的各项相同或相似的图2B中封装系统100的各项。在图2B中，封装系统100包括设置在钝化结构150的相应开口中的电连接结构166a-166d。在一些实施例中，电连接结构166a-166d均为通孔塞、接触塞、镶嵌结构、双镶嵌结构、金属区域、金属线、金属板条或一种其他电连接结构。在一些实施例中，通孔塞、接触塞、镶嵌结构、双镶嵌结构、金属区域、金属线和金属板条由诸如钨、铝、铜、钛、钽、氮化钛、氮化钽、硅化镍、硅化钴、其他适当的导电材料的至少一种材料和/或它们的任意组合制成。
参照图2B，例如电焊盘170a-170d的至少一个电焊盘分别设置在电连接结构166a-166d上方并且分别与电连接结构166a-166d电连接。电焊盘170a-170d彼此分离。在一些实施例中，电焊盘170a-170d由诸如铜(Cu)、铝(Al)、铝铜(AlCu)、铝硅酮(AlSiCu)、钨、钛、钽、氮化钛、氮化钽、硅化镍、硅化钴、其他导电材料的至少一种材料和/或它们的任意组合制成。
再次参照图2B，无源电部件110a设置在电焊盘170a和170b上方并与电焊盘170a和170b电连接。无源电部件110b设置在电焊盘170c和170d上方并与电焊盘170c和170d电连接。在一些实施例中，电焊盘170a和170b与无源电部件110a的相对节点电连接，并且电焊盘170c和170d与无源电部件110b的相对节点电连接。
在一些实施例中，分别地，粘合材料171a任选地设置在无源电部件110a和钝化结构150之间以及粘合材料171b任选地设置在无源电部件110b和钝化结构150之间。粘合材料171a设置在电焊盘170a和170b之间分离电焊盘170a和170b。粘合材料171b设置在电焊盘170c和170d之间并分离电焊盘170c和170d。在一些实施例中，粘合材料171a和171b可以包括诸如热固性树脂的材料以促进无源电部件110a和110b与钝化结构150之间的连接。
注意到在上面结合图2B所述的电连接结构166a-166d、电焊盘170a-170d、粘合材料171a和171b、和/或无源电部件110a和110b的配置仅是示例性的。本申请的范围不限于此。在一些实施例中，电连接结构166a-166d在钝化结构150的表面150a上方无间断地延伸。
图2C是沿着图1的剖面线A-A截取的第三示例性封装系统的示意性截面图。用相同的参考数字表示与图2A中的封装系统100的各项相同或相似的图2C中的封装系统100的各项。在图2C中，封装系统100包括设置在钝化结构150的相应开口中并在钝化结构150的表面150a上方无间断地延伸的电连接结构175a-175d。在一些实施例中，电连接结构175a-175d均为通孔塞、接触塞、镶嵌结构、双镶嵌结构、金属区域、金属线、金属板条或其他电连接结构中的一种。在一些实施例中，通孔塞、接触塞、镶嵌结构、双镶嵌结构、金属区域、金属线和金属板条由诸如钨、铝、铜、钛、钽、氮化钛、氮化钽、硅化镍、硅化钴、其他适当的导电材料的至少一种材料和/或它们的任意组合制成。
参照图2C，无源电部件110a设置在电连接结构175a和175b之间并与电连接结构175a和175b电连接。无源电部件110b设置在电连接结构175c和175d之间并与电连接结构175c和175d电连接。在一些实施例中，电连接结构175a和175b与无源电部件110a的相对节点电连接，并且电连接结构175c和175d与无源电部件110b的相对节点电连接。
在一些实施例中，无源电部件110a的顶面与电连接结构175a和175b的顶面基本齐平。在其他实施例中，无源电部件110a的顶面高于或低于电连接结构175a和175b的顶面。
注意到，尽管图2A至图2C的封装系统100示出无源电部件110a和110b直接设置在钝化结构150上或上方，但本申请的范围不限于此。在一些实施例中，其他介电层和/或材料设置在无源电部件110a和110b与钝化结构150之间。在其他实施例中，至少一个中介层和/或其他管芯设置在无源电部件110a和110b与钝化结构150之间。在又一些实施例中，至少一个中介层和/或其他管芯设置在无源电部件110a和110b上方。
在本申请的第一实施例中，一种封装系统包括设置在衬底上方的至少一个有源电路。钝化结构设置在至少一个有源电路上方。钝化结构具有至少一个开口，至少一个开口被配置成暴露至少一个第一电焊盘。至少一个无源电部件设置在钝化结构上方。至少一个无源电部件与至少一个第一电焊盘电连接。
在本申请的第二实施例中，一种封装系统包括设置在衬底上方的至少一个有源电路。钝化结构设置在所述至少一个有源电路上方。钝化结构具有暴露第一电焊盘的第一开口和暴露第二电焊盘的第二开口。第一电连接结构和第二电连接结构分别设置在第一开口和第二开口中。第一表面贴装器件(SMD)电容器设置在钝化结构上方。分别地，第一SMD电容器通过第一电连接结构与第一电焊盘电连接以及通过第二电连接结构与第二电焊盘电连接。
上面论述了若干实施例的部件，使得本领域技术人员可以更好地理解本发明的各个方面。本领域技术人员应该理解，他们可以很容易地使用本发明作为基础来设计或更改其他用于达到与本文所介绍实施例相同的目的和/或实现相同优点的工艺和结构。本领域技术人员还应该意识到，这些等效结构并不背离本发明的精神和范围，并且在不背离本发明的精神和范围的情况下，可以进行多种变化、替换以及改变。

Claims (20)

1.一种封装系统，包括：
至少一个有源电路，设置在衬底上方；
互连结构，设置在所述至少一个有源电路上方，并且至少一个第一电焊盘形成在所述互连结构的顶面处；
钝化结构，设置在所述互连结构上方，所述钝化结构具有至少一个开口，所述至少一个开口被配置成暴露所述至少一个第一电焊盘；以及
至少一个无源电部件，设置在所述钝化结构上方，所述至少一个无源电部件与所述至少一个第一电焊盘电耦合，并且通过所述互连结构与所述至少一个有源电路电连接。
2.根据权利要求1所述的封装系统，其中，所述至少一个无源电部件包括选自由电容器、电感器和电阻器所组成的组。
3.根据权利要求1所述的封装系统，进一步包括：
至少一条电导线，电耦合在所述至少一个无源电部件和所述至少一个第一电焊盘之间。
4.根据权利要求1所述的封装系统，进一步包括：
至少一个电连接结构，设置在所述钝化结构的所述至少一个开口中；以及
至少一个第二电焊盘，设置在所述至少一个电连接结构上方，其中，所述至少一个第一电焊盘通过所述至少一个电连接结构和所述至少一个第二电焊盘与所述至少一个无源电器件电耦合。
5.根据权利要求4所述的封装系统，进一步包括：
至少一种粘合材料，设置在所述至少一个无源电部件和所述钝化结构之间。
6.根据权利要求1所述的封装系统，进一步包括：
至少一个电连接结构，设置在所述钝化结构的所述至少一个开口中，所述至少一个电连接结构在所述钝化结构的表面上方连续地延伸，其中，所述至少一个第一电焊盘通过所述至少一个电连接结构与所述至少一个无源电部件电耦合。
7.根据权利要求1所述的封装系统，其中，所述至少一个无源电部件以阵列模式布置在所述钝化结构上方。
8.根据权利要求1所述的封装系统，其中，所述至少一个无源电部件包括第一组无源电部件和第二组无源电部件，所述第一组无源电部件以串联模式布置，而所述第二组无源电部件以并联模式布置。
9.一种封装系统，包括：
至少一个有源电路，设置在衬底上方；
互连结构，设置在所述至少一个有源电路上方，并且第一电焊盘和第二电焊盘形成在所述互连结构的顶面处；
钝化结构，设置在所述互连结构上方，所述钝化结构具有暴露所述第一电焊盘的第一开口和暴露所述第二电焊盘的第二开口，所述第一电焊盘和所述第二电焊盘通过所述互连结构与所述至少一个有源电路电连接；以及
第一无源电部件，设置在所述钝化结构上方，其中，所述第一无源电部件的第一节点与所述第一电焊盘电耦合，并且所述第一无源电部件的第二节点与所述第二电焊盘电耦合。
10.根据权利要求9所述的封装系统，进一步包括：
第二无源电部件，设置在所述钝化结构上方并与所述第一无源电部件电耦合，
其中，所述钝化结构具有暴露第三电焊盘的第三开口和暴露第四电焊盘的第四开口，所述第三电焊盘和所述第四电焊盘与所述至少一个有源电路电连接，
所述第二无源电部件的第一节点与所述第三电焊盘电耦合，并且所述第二无源电部件的第二节点与所述第四电焊盘电耦合。
11.根据权利要求10所述的封装系统，其中，所述第一无源电部件和所述第二无源电部件彼此以串联或并联模式电耦合。
12.根据权利要求10所述的封装系统，其中，所述第一无源电部件和所述第二无源电部件中的每一个都选自由电容器、电感器和电阻器所组成的组。
13.根据权利要求10所述的封装系统，进一步包括：
第一电导线，电耦合在所述第一电焊盘和所述第一节点之间；以及
第二电导线，电耦合在所述第二电焊盘和所述第二节点之间。
14.根据权利要求10所述的封装系统，进一步包括：
第一电连接结构，设置在所述第一开口中并与所述第一电焊盘电连接；
第二电连接结构，设置在所述第二开口中并与所述第二电焊盘电连接；
第五电焊盘，设置在所述第一电连接结构上方并且电耦合在所述第一电连接结构和所述第一节点之间；以及
第六电焊盘，设置在所述第二电连接结构上方并且电耦合在所述第二电连接结构和所述第二节点之间。
15.根据权利要求14所述的封装系统，进一步包括：
至少一种粘合材料，设置在所述第一无源电部件和所述钝化结构之间。
16.根据权利要求10所述的封装系统，进一步包括：
第一电连接结构，设置在所述第一开口中，其中，所述第一电连接结构在所述钝化结构的表面上方连续地延伸并且电耦合在所述第一电焊盘和所述第一节点之间；以及
第二电连接结构，设置在所述第二开口中，其中，所述第二电连接结构在所述钝化结构的表面上方连续地延伸并且电耦合在所述第二电焊盘和所述第二节点之间。
17.一种封装系统，包括：
至少一个有源电路，设置在衬底上方；
互连结构，设置在所述至少一个有源电路上方，并且第一电焊盘和第二电焊盘形成在所述互连结构的顶面处；
钝化结构，设置在所述至少一个有源电路上方，所述钝化结构具有暴露所述第一电焊盘的第一开口和暴露所述第二电焊盘的第二开口，所述第一电焊盘和所述第二电焊盘通过所述互连结构与所述至少一个有源电路电连接；
第一电连接结构和第二电连接结构，分别设置在所述第一开口和所述第二开口中；以及
第一表面贴装器件(SMD)电容器，设置在所述钝化结构上方，其中，所述第一表面贴装器件电容器分别通过所述第一电连接结构和所述第二电连接结构与所述第一电焊盘和所述第二电焊盘电耦合。
18.根据权利要求17所述的封装系统，进一步包括：
第三电焊盘，设置在所述第一电连接结构上方并且电耦合在所述第一电连接结构和所述第一表面贴装器件电容器之间；
第四电焊盘，设置在所述第二电连接结构上方并且电耦合在所述第二电连接结构和所述第一表面贴装器件电容器之间；以及
至少一种粘合材料，设置在所述第一表面贴装器件电容器和所述钝化结构之间。
19.根据权利要求17所述的封装系统，其中，所述第一电连接结构和所述第二电连接结构在所述钝化结构的表面上方连续地延伸，并且所述第一表面贴装器件电容器设置在所述第一电连接结构和所述第二电连接结构之间。
20.根据权利要求17所述的封装系统，进一步包括：
第二表面贴装器件电容器，设置在所述钝化结构上方并且以串联或并联模式与所述第一表面贴装器件电容器电耦合，其中，所述钝化结构具有暴露第五电焊盘的第三开口和暴露第六电焊盘的第四开口，并且所述第二表面贴装器件电容器与所述第五电焊盘和所述第六电焊盘电耦合。
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