CN103762212A - 应用于开关型调节器的集成电路组件 - Google Patents
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Abstract
公开了一种应用于开关型调节器的集成电路组件,包括:引线框,具有多个引脚和第一基底;第一和第二功率器件芯片,分别在正面具有第一和第三电极,在背面具有第二电极;控制芯片,正面具有第一和第二驱动电极以及多个输入输出电极;其中,第一功率器件芯片的第一电极通过导电凸块电连接到第一基底上,第二功率器件芯片的第二电极附着在第一基底上并与第一基底形成电连接;第一功率器件芯片的第三电极和第二功率器件芯片的第三电极分别电连接到第一驱动电极和第二驱动电极;第一功率器件芯片的第二电极和第二功率器件芯片的第一电极分别电连接到引线框的引脚。该集成电路组件可以减小键合线引入的寄生电阻和功耗,并且利用大面积的基底改善散热。
Description
技术领域
本发明涉及半导体封装组件,更具体地涉及应用于开关型调节器的集成电路组件。
背景技术
开关型调节器,例如直流-直流变换器,用来给各种各样的电系统提供稳定的电压源。低电源设备中(如手提电脑、手机等)电池管理尤其需要高效率的直流-直流变换器。开关型调节器把输入直流电压转换成高频率电压,然后将高频输出电压进行滤波进而转换成直流输出电压。开关型调节器的一部分可以集成在一个封装组件中。
随着电子元件的小型化、轻量化以及多功能化的需求的增加,希望在应用于开关型调节器的集成电路组件中集成更多的元件,同时减小封装尺寸。除了集成电路芯片之外,应用于开关型调节器的集成电路组件还可以包含传统的分立元件,例如电感和功率器件。这样可以尽可能减少外围元件的使用。在这种封装组件中,集成电路芯片和分立元件的配置及其连接方法对封装组件的尺寸和性能具有至关重要的影响。
图1示出了典型的开关型调节器10的电路示意图。该开关型调节器包括控制级和功率级。控制级包括控制芯片U1。功率级包括功率器件Q1和Q2。功率器件例如为场效应晶体管或者双极型晶体管。功率器件Q1和Q2串联在输入电压Vin和地GND之间,其中间节点作为输出端Lx。控制芯片U1的输入输出电极连接至输入输出电极IOs,其驱动电极连接至功率器件Q1和Q2的各自栅电极,用于控制功率器件Q1和Q2的导通和断开,从而产生输出电压。
在功率器件Q1和Q2均为N型金属氧化物半导体场效应晶体管(N-MOSFET)的情形下,高压侧功率器件Q1的漏电极连接至输入电压Vin,低压侧功率器件Q2的源电极连接至地GND。功率器件Q1的源电极与功率器件Q2的漏电极相连,作为输出端Lx。
在功率器件Q1和Q2均为P型金属氧化物半导体场效应晶体管(P-MOSFET)的情形下,高压侧功率器件Q1的源电极连接至输入电压Vin,低压侧功率器件Q2的漏电极连接至地GND。功率器件Q1的漏电极与功率器件Q2的源电极相连,作为输出端Lx。
可以将开关型调节器10的控制芯片U1以及功率器件Q1和Q2封装在一个封装料中,形成集成电路组件。
在现有技术的应用于开关型调节器的集成电路组件中,功率器件Q1和Q2面朝上安装在引线框上,然后利用键合线将功率器件Q1和Q2的各自一个电极连接到公共的引脚LX上。键合线的使用引入了附加的寄生电阻,导致能量损耗,并且不利于功率器件Q1和Q2的散热。
因此,期望进一步减小应用于开关型调节器的集成电路组件的功耗以及改善其散热。
发明内容
有鉴于此,本发明的目的在于提供一种应用于开关型调节器的集成电路组件,以解决现有技术中由于键合线的使用而对其性能造成不利影响的问题。
根据本发明,提供一种应用于开关型调节器的集成电路组件,包括:引线框,其具有多个引脚和第一基底;第一功率器件芯片,其正面具有第一电极和第三电极,背面具有第二电极;第二功率器件芯片,其正面具有第一电极和第三电极,背面具有第二电极;控制芯片,其正面具有第一驱动电极和第二驱动电极以及多个输入输出电极;其中,所述第一功率器件芯片的第一电极通过导电凸块电连接到所述第一基底上,所述第二功率器件芯片的第二电极附着在所述第一基底上并与所述第一基底形成电连接,所述第一基底作为开关引脚;所述第一驱动电极电连接到所述第一功率器件芯片的第三电极,以及所述第二驱动电极电连接到第二功率器件芯片的第三电极;第一功率器件芯片的第二电极和所述第二功率器件芯片的第一电极分别电连接到所述引线框的各个引脚。
优选地,在所述的集成电路组件中,所述多个引脚包括第一引脚,所述第一驱动电极电连接到所述第一引脚,并且,所述第一功率器件芯片的第三电极通过导电凸块电连接到所述第一引脚。
优选地,在所述的集成电路组件中,所述第一驱动电极通过键合线电连接到所述第一引脚。
优选地,在所述的集成电路组件中,所述多个引脚包括第二引脚,所述的集成电路组件还包括封装料,在所述封装料内部,所述第一引脚电连接所述第二引脚,所述第一驱动电极经由所述第二引脚电连接至所述第一引脚。
优选地,在所述的集成电路组件中,所述多个引脚包括第二引脚,所述的集成电路组件还包括封装料,在所述封装料外部,所述第一引脚电连接所述第二引脚,所述第一驱动电极经由所述第二引脚电连接至所述第一引脚。
优选地,在所述的集成电路组件中,所述第一功率器件芯片的第二电极通过铝带或者铜夹电连接到所述引线框的一个输入电压引脚,所述第二功率器件芯片的第一电极通过键合线电连接到所述引线框的一个接地引脚。
优选地,在所述的集成电路组件中,所述第三电极为栅电极,所述第一电极为源电极,且所述第二电极为漏电极。
优选地,在所述的集成电路组件中,所述第三电极为栅电极,所述第一电极为漏电极,且所述第二电极为源电极。
优选地,在所述的集成电路组件中,所述引线框还包括第二基底,所述控制芯片的背面通过绝缘层附着在所述第二基底上,其正面的第一驱动电极、第二驱动电极和多个输入输出电极通过一组键合线分布电连接到所述第一功率器件芯片的栅电极、所述第二功率器件芯片的栅电极和所述引线框的各个引脚。
优选地,在所述的集成电路组件中,所述控制芯片的背面通过绝缘层附着在所述第二功率器件芯片的正面,并暴露出所述第二功率器件芯片的所述第一电极的至少一部分和所述第三电极的至少一部分。
优选地,在所述的集成电路组件中,所述控制芯片倒装在所述引线框上。
优选地,所述的集成电路组件还包括封装料,所述封装料覆盖控制芯片、第一功率器件芯片、第二功率器件芯片和引线框。
在根据本发明的应用于开关型调节器的集成电路组件中,第一功率器件芯片的第一电极通过导电凸块电连接到第一基底上,第二功率器件芯片的第二电极附着在第一基底上并与第一基底形成电连接。第一基底作为开关引脚。由于功率器件芯片与开关引脚之间的连接不需要使用键合线,因此减小了寄生电阻,并且相应地减小了功耗。在集成电路组件尺寸允许的范围内,第一基底的面积可以尽可能大。第一功率器件芯片的源电极和第二功率器件芯片的漏电极与基底的大面积接触有利于热耗散。
附图说明
通过以下参照附图对本发明实施例的描述,本发明的上述以及其他目的、特征和优点将更为清楚,在附图中:
图1示出了典型的开关型调节器的电路示意图;
图2示出根据本发明的第一实施例的应用于开关型调节器的集成电路组件的示意性结构图;
图3示出根据本发明的第二实施例的应用于开关型调节器的集成电路组件的示意性结构图;以及
图4示出根据本发明的第三实施例的应用于开关型调节器的集成电路组件的示意性结构图。
具体实施方式
以下将参照附图更详细地描述本发明的各种实施例。在各个附图中,相同的元件采用相同或类似的附图标记来表示。
为了清楚起见,附图中的各个部分没有按比例绘制。为了简明起见,可以在一幅图中描述经过数个步骤后获得的组件结构。此外,还可能省略某些公知的细节,例如,在所有的附图中未示出焊料,在一些附图中未示出用于支撑引线框的支撑材料和/或外部框架。
应当理解,在描述组件结构时,当将一层、一个区域称为位于另一层、另一个区域“上面”或“上方”时,可以指直接位于另一层、另一个区域上面,或者在其与另一层、另一个区域之间还包含其它的层或区域。并且,如果将器件翻转,该一层、一个区域将位于另一层、另一个区域“下面”或“下方”。如果为了描述直接位于另一层、另一个区域上面的情形,本文将采用“直接在……上面”或“在……上面并与之邻接”的表述方式。
在下文中描述了本发明的许多特定的细节,例如集成电路组件的结构、材料、尺寸、处理工艺和技术,以便更清楚地理解本公开。但正如本领域的技术人员能够理解的那样,可以不按照这些特定的细节来实现本公开。
图2示出根据本发明的第一实施例的应用于开关型调节器的集成电路组件100的示意性结构图。在该集成电路组件100中,两个功率器件芯片和一个控制芯片140安装在引线框110上。应当注意,该集成电路组件100可以包括更多的晶体管和/或集成电路。
引线框110包括用于外部连接的引脚、用于内部连接的引脚、以及用于支撑芯片的基底。用于外部连接的引脚与图1所示的开关型调节器10的输入输出电极相对应,包括输入输出引脚IOs、输入电压引脚Vin和接地引脚GND。用于内部连接的引脚包括栅极引脚GATE1,在封装料内部或外部延伸,用于将集成电路组件100内部的器件彼此电连接。基底SUB用于支撑控制芯片140。
在该实施例中,高压侧功率器件芯片120的漏电极朝上放置。在高压侧功率器件芯片120的上表面,漏电极经由铝带或者铜夹151与输入电压引脚Vin相连接。在高压侧功率器件芯片120的下表面,高压侧功率器件芯片120的源电极经由导电凸块121连接至基底LX,基底LX还作为开关引脚。此外,在高压侧功率器件芯片120的下表面,高压侧功率器件芯片120的栅电极经由导电凸块122连接至栅极引脚GATE1,进而栅极引脚GATE1经由键合线152连接至控制芯片140的一个驱动电极。
低压侧功率器件芯片130的漏电极朝下放置。在低压侧功率器件芯片130的上表面,低压侧功率器件芯片130的源电极经由键合线152连接至接地引脚,栅电极经由键合线152连接至控制芯片140的另一个驱动电极。在低压侧功率器件芯片130的下表面,漏电极例如利用导电粘接剂粘接在基底LX上。
控制芯片140面朝上放置。进一步地,控制芯片140的底部利用绝缘粘接剂附着在基底SUB上。控制芯片140的输入输出电极经由键合线152与输入输出引脚IOs相连接。控制芯片140的一个驱动电极经由键合线152与一个驱动电极引脚(未示出)电连接。然后,该驱动电极引脚与栅极引脚GATE1相连接,使得控制芯片140的一个驱动电极与高压侧功率器件芯片120的栅电极相连接。控制芯片140的另一个驱动电极经由键合线152直接与低压侧功率器件芯片130的栅电极电连接。
封装料160覆盖高压侧功率器件芯片120、低压侧功率器件芯片130和控制芯片140。引线框110的外部引脚的端部和/或底部从封装料160中露出,用于提供集成电路组件100与外部电路(例如电路板)的电连接。引线框110的基底从封装料160的底部露出。引线框110的内部引脚位于封装料160的内部。可选地,引线框110的内部引脚也可以从封装料160中露出。在所述封装料的内部或外部,引线框110的一个驱动电极引脚与栅极引脚GATE1相连接,使得控制芯片140的一个驱动电极经由驱动电极引脚电连接至栅极引脚GATE1。
在第一实施例中,集成电路组件100的高压侧功率器件芯片120的源电极与低压侧功率器件芯片130的漏电极附着在公共的基底LX上。该基底LX作为开关引脚。由于功率器件芯片与开关引脚之间的连接不需要使用键合线,因此减小了寄生电阻,并且相应地减小了功耗。在组件尺寸允许的范围内,基底LX的面积可以尽可能大。高压侧功率器件芯片120的源电极和低压侧功率器件芯片130的漏电极与基底LX的大面积接触有利于热耗散。
图3示出根据本发明的第二实施例的应用于开关型调节器的集成电路组件200的示意性结构图。在该集成电路组件200中,两个功率器件芯片和一个控制芯片140安装在引线框110上。应当注意,该集成电路组件200可以包括更多的晶体管和/或集成电路。
第二实施例与第一实施例的不同之后在于控制芯片140堆叠在低压侧功率器件芯片130上。控制芯片140面朝上放置。进一步地,控制芯片140的底部利用绝缘粘接剂附着在低压侧功率器件芯片130的一侧表面上。在该侧表面上设置栅电极和源电极,并且控制芯片140露出栅电极的至少一部分和源电极的至少一部分,用于电连接。从而,引线框110可以省去基底SUB。
根据第二实施例的集成电路组件200的其他部分与根据第一实施例的集成电路组件100相同。
在第二实施例中,由于控制芯片140堆叠在低压侧功率器件芯片130上,因此可以进一步减小集成电路组件的占用面积。
图4示出根据本发明的第三实施例的应用于开关型调节器的集成电路组件300的示意性结构图。在该集成电路组件300中,两个功率器件芯片和一个控制芯片140安装在引线框110上。应当注意,该集成电路组件300可以包括更多的晶体管和/或集成电路。
第三实施例与第一实施例的不同之后在于控制芯片140倒装安装在引线框110上。进一步地,半导体芯片140包括内部电路、与内部电路电连接的各自的导电凸块141。控制芯片140面朝下放置。进一步地,控制芯片140的导电凸块141与引线框110的相应引脚形成焊料互连。具体地,控制芯片140的输入输出电极与引线框110的输入输出引脚IOs形成焊料互连。在封装料160的内部,栅极引脚GATE1可以延伸到控制芯片140下方。控制芯片140的一个驱动电极与栅极引脚GATE1形成焊料互连,从而与高压侧功率器件芯片120的栅电极相连接。引线框110包括附加的栅极引脚GATE2。控制芯片140的另一个驱动电极与栅极引脚GATE2形成焊料互连,进而经由键合线152与低压侧功率器件芯片130的栅电极电连接。
根据第三实施例的集成电路组件300的其他部分与根据第一实施例的集成电路组件100相同。
在第三实施例中,由于控制芯片140倒装安装在引线框110上,因此可以进一步减少键合线的使用,从而减小了寄生电阻,并且相应地减小了功耗。
在上述的第一至第三实施例,高压侧功率器件120和低压侧功率器件130均为N型器件,例如N-MOSFET。该N-MOSFET的正面具有源电极和栅电极,背面具有漏电极。
在替代的实施例中,高压侧功率器件120和低压侧功率器件130可以均为P型器件,例如P-MOSFET。该P-MOSFET的正面具有漏电极和栅电极,背面具有源电极。
在该替代的实施例中,高压侧功率器件芯片120的源电极连接至输入电压引脚Vin,低压侧功率器件芯片Q2的漏电极连接至接地引脚GND。在高压侧功率器件芯片120的下表面,漏电极经由导电凸块121连接至基底LX。在低压侧功率器件芯片130的下表面,漏电极例如利用导电粘接剂粘接在基底LX上。基底LX还作为开关引脚。
应当说明的是,在本文中,诸如第一和第二等之类的关系术语仅仅用来将一个实体或者操作与另一个实体或操作区分开来,而不一定要求或者暗示这些实体或操作之间存在任何这种实际的关系或者顺序。而且,术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含,从而使得包括一系列要素的过程、方法、物品或者设备不仅包括那些要素,而且还包括没有明确列出的其他要素,或者是还包括为这种过程、方法、物品或者设备所固有的要素。在没有更多限制的情况下,由语句“包括一个……”限定的要素,并不排除在包括所述要素的过程、方法、物品或者设备中还存在另外的相同要素。
依照本发明的实施例如上文所述,这些实施例并没有详尽叙述所有的细节,也不限制该发明仅为所述的具体实施例。显然,根据以上描述,可作很多的修改和变化。本说明书选取并具体描述这些实施例,是为了更好地解释本发明的原理和实际应用,从而使所属技术领域技术人员能很好地利用本发明以及在本发明基础上的修改使用。本发明仅受权利要求书及其全部范围和等效物的限制。
Claims (12)
1.一种应用于开关型调节器的集成电路组件,包括:
引线框,其具有多个引脚和第一基底;
第一功率器件芯片,其正面具有第一电极和第三电极,背面具有第二电极;
第二功率器件芯片,其正面具有第一电极和第三电极,背面具有第二电极;
控制芯片,其正面具有第一驱动电极和第二驱动电极以及多个输入输出电极;
其中,所述第一功率器件芯片的第一电极通过导电凸块电连接到所述第一基底上,所述第二功率器件芯片的第二电极附着在所述第一基底上并与所述第一基底形成电连接,所述第一基底作为开关引脚;
所述第一驱动电极电连接到所述第一功率器件芯片的第三电极,以及所述第二驱动电极电连接到第二功率器件芯片的第三电极;
所述第一功率器件芯片的第二电极和所述第二功率器件芯片的第一电极分别电连接到所述引线框的各个引脚。
2.根据权利要求1所述的集成电路组件,其中,所述多个引脚包括第一引脚,所述第一驱动电极电连接到所述第一引脚,并且,所述第一功率器件芯片的第三电极通过导电凸块电连接到所述第一引脚。
3.根据权利要求2所述的集成电路组件,其中,所述第一驱动电极通过键合线电连接到所述第一引脚。
4.根据权利要求2所述的集成电路组件,其中,所述多个引脚包括第二引脚,所述集成电路组件还包括封装料,在所述封装料内部,所述第一引脚电连接所述第二引脚,所述第一驱动电极经由所述第二引脚电连接至所述第一引脚。
5.根据权利要求2所述的集成电路组件,其中,所述多个引脚包括第二引脚,所述集成电路组件还包括封装料,在所述封装料外部,所述第一引脚电连接所述第二引脚,所述第一驱动电极经由所述第二引脚电连接至所述第一引脚。
6.根据权利要求1至5中任一项所述的集成电路组件,其中所述第一功率器件芯片的第二电极通过铝带或者铜夹电连接到所述引线框的一个输入电压引脚,所述第二功率器件芯片的第一电极通过键合线电连接到所述引线框的一个接地引脚。
7.根据权利要求6所述的集成电路组件,所述第三电极为栅电极,所述第一电极为源电极,且所述第二电极为漏电极。
8.根据权利要求6所述的集成电路组件,所述第三电极为栅电极,所述第一电极为漏电极,且所述第二电极为源电极。
9.根据权利要求1至5中任一项所述的集成电路组件,其中所述引线框还包括第二基底,所述控制芯片的背面通过绝缘层附着在所述第二基底上,其正面的第一驱动电极、第二驱动电极和多个输入输出电极通过一组键合线分布电连接到所述第一功率器件芯片的栅电极、所述第二功率器件芯片的栅电极和所述引线框的各个引脚。
10.根据权利要求1至5中任一项所述的集成电路组件,所述控制芯片的背面通过绝缘层附着在所述第二功率器件芯片的正面,并暴露出所述第二功率器件芯片的所述第一电极的至少一部分和所述第三电极的至少一部分。
11.根据权利要求1至5中任一项所述的集成电路组件,所述控制芯片倒装在所述引线框上。
12.根据权利要求1所述的集成电路组件,还包括封装料,所述封装料覆盖控制芯片、第一功率器件芯片、第二功率器件芯片和引线框。
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