CN102931119A - 用于处理衬底表面的叶片模块 - Google Patents

用于处理衬底表面的叶片模块 Download PDF

Info

Publication number
CN102931119A
CN102931119A CN2011104554756A CN201110455475A CN102931119A CN 102931119 A CN102931119 A CN 102931119A CN 2011104554756 A CN2011104554756 A CN 2011104554756A CN 201110455475 A CN201110455475 A CN 201110455475A CN 102931119 A CN102931119 A CN 102931119A
Authority
CN
China
Prior art keywords
fluid
module
storage element
substrate
framework
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2011104554756A
Other languages
English (en)
Chinese (zh)
Inventor
安吉秀
张承逸
崔钟春
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MMTECH CO Ltd
Original Assignee
MMTECH CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MMTECH CO Ltd filed Critical MMTECH CO Ltd
Publication of CN102931119A publication Critical patent/CN102931119A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Weting (AREA)
CN2011104554756A 2011-08-09 2011-12-30 用于处理衬底表面的叶片模块 Pending CN102931119A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2011-0079136 2011-08-09
KR1020110079136A KR101252753B1 (ko) 2011-08-09 2011-08-09 기판 표면처리용 블레이드 모듈

Publications (1)

Publication Number Publication Date
CN102931119A true CN102931119A (zh) 2013-02-13

Family

ID=47645892

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2011104554756A Pending CN102931119A (zh) 2011-08-09 2011-12-30 用于处理衬底表面的叶片模块

Country Status (3)

Country Link
KR (1) KR101252753B1 (ko)
CN (1) CN102931119A (ko)
TW (1) TW201308444A (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103871938A (zh) * 2014-03-31 2014-06-18 上海华力微电子有限公司 用于清洗半导体晶圆的清洗槽

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102031719B1 (ko) * 2019-02-26 2019-10-14 이중호 디스플레이 패널 세정용 아쿠아나이프

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1627993A (zh) * 2002-06-05 2005-06-15 住友精密工业株式会社 喷嘴装置及具有喷嘴装置的基板处理装置
KR20070102030A (ko) * 2006-04-13 2007-10-18 엘지.필립스 엘시디 주식회사 기판세정장치 및 그 세정방법
KR20090046042A (ko) * 2007-11-05 2009-05-11 세메스 주식회사 에어 분사 장치
KR101021931B1 (ko) * 2008-11-26 2011-03-16 주식회사 엠엠테크 복합형 에칭 장치 및 이를 이용한 에칭 시스템

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4409901B2 (ja) * 2003-09-30 2010-02-03 住友精密工業株式会社 残液除去装置
KR20110015804A (ko) * 2009-08-10 2011-02-17 주식회사 케이씨텍 에어나이프의 공기공급장치

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1627993A (zh) * 2002-06-05 2005-06-15 住友精密工业株式会社 喷嘴装置及具有喷嘴装置的基板处理装置
KR20070102030A (ko) * 2006-04-13 2007-10-18 엘지.필립스 엘시디 주식회사 기판세정장치 및 그 세정방법
KR20090046042A (ko) * 2007-11-05 2009-05-11 세메스 주식회사 에어 분사 장치
KR101021931B1 (ko) * 2008-11-26 2011-03-16 주식회사 엠엠테크 복합형 에칭 장치 및 이를 이용한 에칭 시스템

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103871938A (zh) * 2014-03-31 2014-06-18 上海华力微电子有限公司 用于清洗半导体晶圆的清洗槽
CN103871938B (zh) * 2014-03-31 2016-10-12 上海华力微电子有限公司 用于清洗半导体晶圆的清洗槽

Also Published As

Publication number Publication date
KR101252753B1 (ko) 2013-04-09
TW201308444A (zh) 2013-02-16
KR20130016927A (ko) 2013-02-19

Similar Documents

Publication Publication Date Title
JP5544000B2 (ja) 基板表面処理システム
CN102674700A (zh) 玻璃基板蚀刻方法、玻璃薄板及玻璃基板蚀刻装置
US20040182887A1 (en) Dispenser for discharging liquid material
KR100966214B1 (ko) 도포 장치
CN102931119A (zh) 用于处理衬底表面的叶片模块
US8308894B2 (en) Substrate etching apparatus
CN102915940A (zh) 具有紧凑结构的基板表面处理系统及基板表面处理方法
KR100695576B1 (ko) 평판 디스플레이용 유리기판의 외면삭감 방법
US8791026B2 (en) Method and apparatus for treating silicon substrate
CN109407387A (zh) 显影装置及基板显影方法
JP2013162119A (ja) 基板エッチング装置
US20070146425A1 (en) Ink jet apparatus and ink jetting method
KR101141155B1 (ko) 기판 처리 장치
KR101085429B1 (ko) 노즐유닛의 교체가 용이한 식각 장치
CN101643150A (zh) 基板浮起装置
JP3663448B2 (ja) 毛管現象を用いる塗工装置
KR101904027B1 (ko) 기판 처리 장치
JP5248847B2 (ja) マイクロパッチコーティング方法
KR100884600B1 (ko) 저점성 용액 도포장치
KR200305052Y1 (ko) 슬릿형 유체 분사 장치
KR20130015886A (ko) 기판 표면처리 시스템 및 기판 표면처리 방법
KR20120051841A (ko) 분사 수단을 구비하는 침전 타입 식각 장치
KR20120034423A (ko) 표면을 에칭할 수 있는 실리콘 기판의 처리 장치
KR101212804B1 (ko) 콤팩트한 구조를 갖는 실리콘 기판의 처리 장치
KR101261235B1 (ko) 피에조밸브를 이용한 액정 공급장치

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C05 Deemed withdrawal (patent law before 1993)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20130213