CN102907180B - 使用脉冲传热流体流动的等离子体处理设备中的温度控制 - Google Patents

使用脉冲传热流体流动的等离子体处理设备中的温度控制 Download PDF

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Publication number
CN102907180B
CN102907180B CN201180019903.9A CN201180019903A CN102907180B CN 102907180 B CN102907180 B CN 102907180B CN 201180019903 A CN201180019903 A CN 201180019903A CN 102907180 B CN102907180 B CN 102907180B
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China
Prior art keywords
transfer fluid
heat
valve
temperature
chuck
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CN201180019903.9A
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English (en)
Chinese (zh)
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CN102907180A (zh
Inventor
哈密迪·塔瓦索里
逍平·周
沙恩·C·尼维尔
道格拉斯·A·布池贝尔格尔
费纳多·M·斯李维亚
巴德·L·梅斯
蒂娜·琼
科坦·马哈德斯瓦拉萨瓦米
亚莎斯维尼·B·帕特
达·D·源
沃特·R·梅丽
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Applied Materials Inc
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Applied Materials Inc
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/20—Means for supporting or positioning the object or the material; Means for adjusting diaphragms or lenses associated with the support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32715—Workpiece holder
    • H01J37/32724—Temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/32908—Utilities
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32926—Software, data control or modelling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
    • H01J2237/2001—Maintaining constant desired temperature

Landscapes

  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Drying Of Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Plasma Technology (AREA)
CN201180019903.9A 2010-06-08 2011-06-03 使用脉冲传热流体流动的等离子体处理设备中的温度控制 Active CN102907180B (zh)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US35277910P 2010-06-08 2010-06-08
US61/352,779 2010-06-08
US36223210P 2010-07-07 2010-07-07
US61/362,232 2010-07-07
US13/111,334 US8916793B2 (en) 2010-06-08 2011-05-19 Temperature control in plasma processing apparatus using pulsed heat transfer fluid flow
US13/111,334 2011-05-19
PCT/US2011/039182 WO2011156239A2 (en) 2010-06-08 2011-06-03 Temperature control in plasma processing apparatus using pulsed heat transfer fluid flow

Publications (2)

Publication Number Publication Date
CN102907180A CN102907180A (zh) 2013-01-30
CN102907180B true CN102907180B (zh) 2015-09-16

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CN201180019903.9A Active CN102907180B (zh) 2010-06-08 2011-06-03 使用脉冲传热流体流动的等离子体处理设备中的温度控制

Country Status (6)

Country Link
US (2) US8916793B2 (enExample)
JP (1) JP6077995B2 (enExample)
KR (1) KR101801070B1 (enExample)
CN (1) CN102907180B (enExample)
TW (1) TWI445459B (enExample)
WO (1) WO2011156239A2 (enExample)

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US8580693B2 (en) * 2010-08-27 2013-11-12 Applied Materials, Inc. Temperature enhanced electrostatic chucking in plasma processing apparatus
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JP5973731B2 (ja) 2012-01-13 2016-08-23 東京エレクトロン株式会社 プラズマ処理装置及びヒータの温度制御方法
CN103369810B (zh) * 2012-03-31 2016-02-10 中微半导体设备(上海)有限公司 一种等离子反应器
CN104715992B (zh) * 2013-12-13 2018-02-09 中微半导体设备(上海)有限公司 一种等离子体处理腔室及其冷却装置
JP6374301B2 (ja) 2013-12-24 2018-08-15 東京エレクトロン株式会社 ステージ、ステージの製造方法、熱交換器
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JP6018606B2 (ja) * 2014-06-27 2016-11-02 東京エレクトロン株式会社 温度制御可能なステージを含むシステム、半導体製造装置及びステージの温度制御方法
JP5970040B2 (ja) * 2014-10-14 2016-08-17 東京エレクトロン株式会社 温度制御システム及び温度制御方法
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CN108257839B (zh) * 2016-12-29 2019-10-08 中微半导体设备(上海)股份有限公司 一种用于晶圆处理的反应腔
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US12278094B2 (en) * 2020-05-08 2025-04-15 Applied Materials, Inc. Methods and apparatus for processing a substrate
JP7560215B2 (ja) 2021-03-17 2024-10-02 東京エレクトロン株式会社 プラズマ処理装置
JP7668682B2 (ja) 2021-06-02 2025-04-25 東京エレクトロン株式会社 温度制御装置および基板処理装置
US12300464B2 (en) * 2021-10-25 2025-05-13 Advanced Energy Industries, Inc. Robust tensorized shaped setpoint waveform streaming control
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Also Published As

Publication number Publication date
US9214315B2 (en) 2015-12-15
TWI445459B (zh) 2014-07-11
JP2013534695A (ja) 2013-09-05
WO2011156239A3 (en) 2012-01-26
WO2011156239A2 (en) 2011-12-15
KR20130084221A (ko) 2013-07-24
KR101801070B1 (ko) 2017-11-24
CN102907180A (zh) 2013-01-30
JP6077995B2 (ja) 2017-02-08
US8916793B2 (en) 2014-12-23
TW201215248A (en) 2012-04-01
US20150316941A1 (en) 2015-11-05
US20120132397A1 (en) 2012-05-31

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