CN102906300B - 溅射靶到背衬材料的非连续接合 - Google Patents
溅射靶到背衬材料的非连续接合 Download PDFInfo
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- CN102906300B CN102906300B CN201180025119.9A CN201180025119A CN102906300B CN 102906300 B CN102906300 B CN 102906300B CN 201180025119 A CN201180025119 A CN 201180025119A CN 102906300 B CN102906300 B CN 102906300B
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- 239000000463 material Substances 0.000 title claims abstract description 124
- 238000005477 sputtering target Methods 0.000 title claims abstract description 47
- 238000004381 surface treatment Methods 0.000 claims abstract description 39
- 238000000034 method Methods 0.000 claims description 92
- 238000009736 wetting Methods 0.000 claims description 55
- 229910000679 solder Inorganic materials 0.000 claims description 40
- 238000003466 welding Methods 0.000 claims description 40
- 230000008569 process Effects 0.000 claims description 35
- 229910052751 metal Inorganic materials 0.000 claims description 24
- 230000032798 delamination Effects 0.000 claims description 23
- 230000000712 assembly Effects 0.000 claims description 21
- 238000000429 assembly Methods 0.000 claims description 21
- 239000002184 metal Substances 0.000 claims description 21
- 238000004544 sputter deposition Methods 0.000 claims description 19
- 230000005496 eutectics Effects 0.000 claims description 16
- 229910052738 indium Inorganic materials 0.000 claims description 14
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical group [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 14
- 239000007788 liquid Substances 0.000 claims description 11
- 230000008646 thermal stress Effects 0.000 claims description 10
- 238000005488 sandblasting Methods 0.000 claims description 8
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 claims description 7
- 238000005422 blasting Methods 0.000 claims description 7
- 235000011089 carbon dioxide Nutrition 0.000 claims description 7
- 239000004568 cement Substances 0.000 claims description 7
- 239000002131 composite material Substances 0.000 claims description 7
- 238000003851 corona treatment Methods 0.000 claims description 7
- 238000007750 plasma spraying Methods 0.000 claims description 7
- 238000000227 grinding Methods 0.000 claims description 6
- 238000005728 strengthening Methods 0.000 claims description 5
- 230000008859 change Effects 0.000 claims description 3
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 12
- 239000010935 stainless steel Substances 0.000 description 10
- 229910001220 stainless steel Inorganic materials 0.000 description 10
- 238000001816 cooling Methods 0.000 description 8
- 229910045601 alloy Inorganic materials 0.000 description 7
- 239000000956 alloy Substances 0.000 description 7
- 238000000059 patterning Methods 0.000 description 7
- 239000013077 target material Substances 0.000 description 7
- 239000011787 zinc oxide Substances 0.000 description 6
- 238000004070 electrodeposition Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- 230000004927 fusion Effects 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 230000035882 stress Effects 0.000 description 5
- 230000001680 brushing effect Effects 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 230000002708 enhancing effect Effects 0.000 description 4
- 229910052719 titanium Inorganic materials 0.000 description 4
- 229910001316 Ag alloy Inorganic materials 0.000 description 3
- 229910000846 In alloy Inorganic materials 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 229910001128 Sn alloy Inorganic materials 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 229910052787 antimony Inorganic materials 0.000 description 3
- 229910052797 bismuth Inorganic materials 0.000 description 3
- 230000003750 conditioning effect Effects 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000009940 knitting Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910001092 metal group alloy Inorganic materials 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 238000007669 thermal treatment Methods 0.000 description 3
- 229910052718 tin Inorganic materials 0.000 description 3
- 238000002525 ultrasonication Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 229910052725 zinc Inorganic materials 0.000 description 3
- 239000011701 zinc Substances 0.000 description 3
- 229910001020 Au alloy Inorganic materials 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 239000011344 liquid material Substances 0.000 description 2
- 230000013011 mating Effects 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- -1 such as Inorganic materials 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000002860 competitive effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 238000010849 ion bombardment Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000009996 mechanical pre-treatment Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 238000004062 sedimentation Methods 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000002604 ultrasonography Methods 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
Description
Claims (30)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP10005319 | 2010-05-21 | ||
EP10005319.8 | 2010-05-21 | ||
US34413110P | 2010-05-28 | 2010-05-28 | |
US61/344,131 | 2010-05-28 | ||
PCT/EP2011/058335 WO2011144759A1 (en) | 2010-05-21 | 2011-05-23 | Non-continuous bonding of sputtering target to backing material |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102906300A CN102906300A (zh) | 2013-01-30 |
CN102906300B true CN102906300B (zh) | 2016-04-13 |
Family
ID=42735572
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201180025119.9A Active CN102906300B (zh) | 2010-05-21 | 2011-05-23 | 溅射靶到背衬材料的非连续接合 |
Country Status (7)
Country | Link |
---|---|
US (1) | US9932667B2 (zh) |
EP (1) | EP2572013B1 (zh) |
JP (1) | JP5840679B2 (zh) |
KR (2) | KR20180006464A (zh) |
CN (1) | CN102906300B (zh) |
TW (1) | TWI544099B (zh) |
WO (1) | WO2011144759A1 (zh) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105483625B (zh) * | 2014-10-07 | 2018-01-02 | Jx金属株式会社 | 溅射靶 |
JP6744323B2 (ja) * | 2015-03-18 | 2020-08-19 | ユミコア | リチウム含有遷移金属酸化物ターゲット |
JP5909006B1 (ja) * | 2015-03-23 | 2016-04-26 | Jx金属株式会社 | 円筒型スパッタリングターゲット及びその製造方法 |
US10604836B2 (en) | 2015-05-15 | 2020-03-31 | Materion Corporation | Methods for surface preparation of sputtering target |
JP6095824B2 (ja) * | 2016-03-24 | 2017-03-15 | Jx金属株式会社 | 円筒型スパッタリングターゲット及びその製造方法 |
CN116240511A (zh) * | 2023-03-17 | 2023-06-09 | 广州市尤特新材料有限公司 | 一种增加靶材附着力的加工工艺 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57188680A (en) * | 1981-05-16 | 1982-11-19 | Kemisuton:Kk | Target for sputtering and production thereof |
JPS6447864A (en) * | 1987-08-17 | 1989-02-22 | Seiko Epson Corp | Method for joining sputtering target |
JPH028364A (ja) * | 1988-06-24 | 1990-01-11 | Matsushita Electric Ind Co Ltd | スパッタ用ターゲット及びその製造方法 |
JP2634678B2 (ja) * | 1989-06-15 | 1997-07-30 | 日立金属株式会社 | スパッタリング用ターゲット組立体およびその製造方法 |
US5282943A (en) * | 1992-06-10 | 1994-02-01 | Tosoh Smd, Inc. | Method of bonding a titanium containing sputter target to a backing plate and bonded target/backing plate assemblies produced thereby |
US5836506A (en) * | 1995-04-21 | 1998-11-17 | Sony Corporation | Sputter target/backing plate assembly and method of making same |
US5857611A (en) * | 1995-08-16 | 1999-01-12 | Sony Corporation | Sputter target/backing plate assembly and method of making same |
WO2004038062A2 (en) * | 2002-10-21 | 2004-05-06 | Cabot Corporation | Method of forming a sputtering target assembly and assembly made therefrom |
US20050016833A1 (en) * | 2003-04-17 | 2005-01-27 | Shannon Lynn | Plasma sprayed indium tin oxide target for sputtering |
US20050061857A1 (en) * | 2003-09-24 | 2005-03-24 | Hunt Thomas J. | Method for bonding a sputter target to a backing plate and the assembly thereof |
DE102004060423B4 (de) | 2004-12-14 | 2016-10-27 | Heraeus Deutschland GmbH & Co. KG | Rohrtarget und dessen Verwendung |
DE102006009749A1 (de) | 2006-03-02 | 2007-09-06 | FNE Forschungsinstitut für Nichteisen-Metalle Freiberg GmbH | Targetanordnung |
KR101171769B1 (ko) | 2007-01-05 | 2012-08-07 | 삼성코닝정밀소재 주식회사 | 스퍼터링용 타겟 장치 |
JP5194460B2 (ja) * | 2007-01-26 | 2013-05-08 | 東ソー株式会社 | 円筒形スパッタリングターゲット及びその製造方法 |
JP2009242915A (ja) * | 2008-03-31 | 2009-10-22 | Mitsubishi Materials Corp | スパッタリングターゲット及びその製造方法 |
JP5387118B2 (ja) * | 2008-06-10 | 2014-01-15 | 東ソー株式会社 | 円筒形スパッタリングターゲット及びその製造方法 |
JP5309978B2 (ja) * | 2008-08-20 | 2013-10-09 | 東ソー株式会社 | 円筒形スパッタリングターゲットの製造方法 |
CN101543924A (zh) * | 2009-03-12 | 2009-09-30 | 宁波江丰电子材料有限公司 | 靶材与背板的焊接方法 |
CN101648307A (zh) * | 2009-05-08 | 2010-02-17 | 宁波江丰电子材料有限公司 | 靶材组件的制作方法 |
-
2011
- 2011-04-25 TW TW100114292A patent/TWI544099B/zh active
- 2011-05-23 EP EP11721034.4A patent/EP2572013B1/en active Active
- 2011-05-23 WO PCT/EP2011/058335 patent/WO2011144759A1/en active Application Filing
- 2011-05-23 US US13/699,311 patent/US9932667B2/en active Active
- 2011-05-23 KR KR1020177037853A patent/KR20180006464A/ko not_active Ceased
- 2011-05-23 KR KR1020127033242A patent/KR20130113955A/ko not_active Ceased
- 2011-05-23 JP JP2013510645A patent/JP5840679B2/ja active Active
- 2011-05-23 CN CN201180025119.9A patent/CN102906300B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
CN102906300A (zh) | 2013-01-30 |
TW201204856A (en) | 2012-02-01 |
US20130118898A1 (en) | 2013-05-16 |
US9932667B2 (en) | 2018-04-03 |
EP2572013B1 (en) | 2017-01-04 |
KR20130113955A (ko) | 2013-10-16 |
WO2011144759A1 (en) | 2011-11-24 |
JP5840679B2 (ja) | 2016-01-06 |
KR20180006464A (ko) | 2018-01-17 |
EP2572013A1 (en) | 2013-03-27 |
TWI544099B (zh) | 2016-08-01 |
JP2013529253A (ja) | 2013-07-18 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20180222 Address after: No. 27-9, Baijia Industrial Park, Gaoxin District, Qingyuan City, Guangdong Province, Qingyuan Pilot Materials Co., Ltd. D workshop Patentee after: Pilot film material (Guangdong) Co., Ltd. Address before: Brussels Patentee before: Umicore NV |
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EE01 | Entry into force of recordation of patent licensing contract | ||
EE01 | Entry into force of recordation of patent licensing contract |
Application publication date: 20130130 Assignee: Pilot film materials Co.,Ltd. Assignor: Leading film materials (Guangdong) Co.,Ltd. Contract record no.: X2021440000141 Denomination of invention: Discontinuous bonding of sputtering target to backing material Granted publication date: 20160413 License type: Common License Record date: 20210730 |