CN102883857B - 研磨垫以及玻璃基板的制造方法 - Google Patents

研磨垫以及玻璃基板的制造方法 Download PDF

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Publication number
CN102883857B
CN102883857B CN201180022832.8A CN201180022832A CN102883857B CN 102883857 B CN102883857 B CN 102883857B CN 201180022832 A CN201180022832 A CN 201180022832A CN 102883857 B CN102883857 B CN 102883857B
Authority
CN
China
Prior art keywords
polishing
value
polishing pad
polyurethane foam
glass substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201180022832.8A
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English (en)
Chinese (zh)
Other versions
CN102883857A (zh
Inventor
佐藤彰则
石坂信吉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Electronic Materials Holding Inc
Original Assignee
Toyo Tire and Rubber Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyo Tire and Rubber Co Ltd filed Critical Toyo Tire and Rubber Co Ltd
Publication of CN102883857A publication Critical patent/CN102883857A/zh
Application granted granted Critical
Publication of CN102883857B publication Critical patent/CN102883857B/zh
Active legal-status Critical Current
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/24—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass
    • B24B7/241—Methods

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Polyurethanes Or Polyureas (AREA)
CN201180022832.8A 2010-05-10 2011-03-22 研磨垫以及玻璃基板的制造方法 Active CN102883857B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2010108506A JP5426469B2 (ja) 2010-05-10 2010-05-10 研磨パッドおよびガラス基板の製造方法
JP2010-108506 2010-05-10
PCT/JP2011/056704 WO2011142177A1 (ja) 2010-05-10 2011-03-22 研磨パッドおよびその製造方法、ならびにガラス基板の製造方法

Publications (2)

Publication Number Publication Date
CN102883857A CN102883857A (zh) 2013-01-16
CN102883857B true CN102883857B (zh) 2015-04-01

Family

ID=44914234

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201180022832.8A Active CN102883857B (zh) 2010-05-10 2011-03-22 研磨垫以及玻璃基板的制造方法

Country Status (7)

Country Link
US (1) US8979611B2 (https=)
JP (1) JP5426469B2 (https=)
KR (1) KR101399521B1 (https=)
CN (1) CN102883857B (https=)
SG (1) SG185031A1 (https=)
TW (1) TWI429504B (https=)
WO (1) WO2011142177A1 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6338946B2 (ja) * 2014-06-30 2018-06-06 東芝メモリ株式会社 研磨装置、及び研磨方法
CN104385120B (zh) * 2014-10-16 2017-06-30 中国科学院化学研究所 聚氨酯抛光垫的制备方法
KR101945878B1 (ko) * 2017-07-11 2019-02-11 에스케이씨 주식회사 연마층과 유사 경도를 갖는 윈도우를 포함하는 연마패드
KR102638363B1 (ko) * 2018-12-03 2024-02-19 주식회사 쿠라레 연마층용 폴리우레탄, 연마층 및 연마 패드
US11717932B2 (en) * 2018-12-14 2023-08-08 Xia Tai Xin Semiconductor (Qing Dao) Ltd. Polyurethane polishing pad and composition for manufacturing the same
KR102298111B1 (ko) * 2019-11-15 2021-09-03 에스케이씨솔믹스 주식회사 재생 폴리올을 포함하는 폴리우레탄 연마패드 및 이의 제조방법
KR102206485B1 (ko) * 2020-03-17 2021-01-22 에스케이씨 주식회사 연마패드 및 이를 이용한 반도체 소자의 제조방법

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001096434A1 (en) * 2000-06-13 2001-12-20 Toyo Tire & Rubber Co., Ltd. Process for producing polyurethane foam, polyurethane foam, and abrasive sheet
JP2006334745A (ja) * 2005-06-03 2006-12-14 Inoac Corp 研磨用吸着パッド及びその製造方法
WO2008093850A1 (ja) * 2007-02-01 2008-08-07 Kuraray Co., Ltd. 研磨パッド及び研磨パッドの製造方法
CN101583464A (zh) * 2007-01-15 2009-11-18 东洋橡胶工业株式会社 研磨垫及其制造方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6860802B1 (en) 2000-05-27 2005-03-01 Rohm And Haas Electric Materials Cmp Holdings, Inc. Polishing pads for chemical mechanical planarization
US6736709B1 (en) 2000-05-27 2004-05-18 Rodel Holdings, Inc. Grooved polishing pads for chemical mechanical planarization
US6454634B1 (en) 2000-05-27 2002-09-24 Rodel Holdings Inc. Polishing pads for chemical mechanical planarization
JP4615813B2 (ja) 2000-05-27 2011-01-19 ローム アンド ハース エレクトロニック マテリアルズ シーエムピー ホウルディングス インコーポレイテッド 化学機械平坦化用の研磨パッド
US6749485B1 (en) 2000-05-27 2004-06-15 Rodel Holdings, Inc. Hydrolytically stable grooved polishing pads for chemical mechanical planarization
CN100496896C (zh) * 2000-12-01 2009-06-10 东洋橡膠工业株式会社 研磨垫
US7195539B2 (en) * 2003-09-19 2007-03-27 Cabot Microelectronics Coporation Polishing pad with recessed window
DE602005007125D1 (de) 2004-09-17 2008-07-10 Jsr Corp Chemisch-mechanisches Polierkissen und chemisch-mechanisches Polierverfahren
JP2006114885A (ja) 2004-09-17 2006-04-27 Jsr Corp 化学機械研磨パッド及び化学機械研磨方法
US7871309B2 (en) * 2004-12-10 2011-01-18 Toyo Tire & Rubber Co., Ltd. Polishing pad
WO2008087797A1 (ja) 2007-01-15 2008-07-24 Toyo Tire & Rubber Co., Ltd. 研磨パッド及びその製造方法
TWI411495B (zh) * 2007-08-16 2013-10-11 Cabot Microelectronics Corp 拋光墊
JP5248152B2 (ja) * 2008-03-12 2013-07-31 東洋ゴム工業株式会社 研磨パッド
JP2009291854A (ja) * 2008-06-03 2009-12-17 Nitta Haas Inc 研磨パッド

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001096434A1 (en) * 2000-06-13 2001-12-20 Toyo Tire & Rubber Co., Ltd. Process for producing polyurethane foam, polyurethane foam, and abrasive sheet
CN1602321A (zh) * 2000-06-13 2005-03-30 东洋橡膠工业株式会社 生产聚氨酯泡沫塑料的方法,聚氨酯泡沫塑料和磨光片
JP2006334745A (ja) * 2005-06-03 2006-12-14 Inoac Corp 研磨用吸着パッド及びその製造方法
CN101583464A (zh) * 2007-01-15 2009-11-18 东洋橡胶工业株式会社 研磨垫及其制造方法
WO2008093850A1 (ja) * 2007-02-01 2008-08-07 Kuraray Co., Ltd. 研磨パッド及び研磨パッドの製造方法

Also Published As

Publication number Publication date
US20130078892A1 (en) 2013-03-28
KR20120139798A (ko) 2012-12-27
TW201139060A (en) 2011-11-16
SG185031A1 (en) 2012-11-29
TWI429504B (zh) 2014-03-11
JP5426469B2 (ja) 2014-02-26
KR101399521B1 (ko) 2014-05-27
CN102883857A (zh) 2013-01-16
WO2011142177A1 (ja) 2011-11-17
JP2011235389A (ja) 2011-11-24
US8979611B2 (en) 2015-03-17

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C41 Transfer of patent application or patent right or utility model
TR01 Transfer of patent right

Effective date of registration: 20160914

Address after: Delaware

Patentee after: ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, Inc.

Address before: Osaka City, Osaka of Japan

Patentee before: TOYO TIRE & RUBBER Co.,Ltd.

CP03 Change of name, title or address

Address after: Delaware, USA

Patentee after: DuPont Electronic Materials Holdings Co.,Ltd.

Country or region after: U.S.A.

Address before: Delaware, USA

Patentee before: ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, Inc.

Country or region before: U.S.A.

CP03 Change of name, title or address