KR101399521B1 - 연마 패드 및 그 제조 방법, 및 유리 기판의 제조 방법 - Google Patents

연마 패드 및 그 제조 방법, 및 유리 기판의 제조 방법 Download PDF

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Publication number
KR101399521B1
KR101399521B1 KR1020127026775A KR20127026775A KR101399521B1 KR 101399521 B1 KR101399521 B1 KR 101399521B1 KR 1020127026775 A KR1020127026775 A KR 1020127026775A KR 20127026775 A KR20127026775 A KR 20127026775A KR 101399521 B1 KR101399521 B1 KR 101399521B1
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KR
South Korea
Prior art keywords
polishing
polyurethane foam
value
polishing pad
glass substrate
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KR1020127026775A
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English (en)
Korean (ko)
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KR20120139798A (ko
Inventor
아키노리 사토
노부요시 이시자카
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도요 고무 고교 가부시키가이샤
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Publication of KR20120139798A publication Critical patent/KR20120139798A/ko
Application granted granted Critical
Publication of KR101399521B1 publication Critical patent/KR101399521B1/ko
Assigned to 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드 reassignment 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드 권리의 전부이전등록 Assignors: 도요 고무 고교 가부시키가이샤
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/24—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass
    • B24B7/241—Methods

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Polyurethanes Or Polyureas (AREA)
KR1020127026775A 2010-05-10 2011-03-22 연마 패드 및 그 제조 방법, 및 유리 기판의 제조 방법 Active KR101399521B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2010108506A JP5426469B2 (ja) 2010-05-10 2010-05-10 研磨パッドおよびガラス基板の製造方法
JPJP-P-2010-108506 2010-05-10
PCT/JP2011/056704 WO2011142177A1 (ja) 2010-05-10 2011-03-22 研磨パッドおよびその製造方法、ならびにガラス基板の製造方法

Publications (2)

Publication Number Publication Date
KR20120139798A KR20120139798A (ko) 2012-12-27
KR101399521B1 true KR101399521B1 (ko) 2014-05-27

Family

ID=44914234

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020127026775A Active KR101399521B1 (ko) 2010-05-10 2011-03-22 연마 패드 및 그 제조 방법, 및 유리 기판의 제조 방법

Country Status (7)

Country Link
US (1) US8979611B2 (https=)
JP (1) JP5426469B2 (https=)
KR (1) KR101399521B1 (https=)
CN (1) CN102883857B (https=)
SG (1) SG185031A1 (https=)
TW (1) TWI429504B (https=)
WO (1) WO2011142177A1 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6338946B2 (ja) * 2014-06-30 2018-06-06 東芝メモリ株式会社 研磨装置、及び研磨方法
CN104385120B (zh) * 2014-10-16 2017-06-30 中国科学院化学研究所 聚氨酯抛光垫的制备方法
KR101945878B1 (ko) * 2017-07-11 2019-02-11 에스케이씨 주식회사 연마층과 유사 경도를 갖는 윈도우를 포함하는 연마패드
KR102638363B1 (ko) * 2018-12-03 2024-02-19 주식회사 쿠라레 연마층용 폴리우레탄, 연마층 및 연마 패드
US11717932B2 (en) * 2018-12-14 2023-08-08 Xia Tai Xin Semiconductor (Qing Dao) Ltd. Polyurethane polishing pad and composition for manufacturing the same
KR102298111B1 (ko) * 2019-11-15 2021-09-03 에스케이씨솔믹스 주식회사 재생 폴리올을 포함하는 폴리우레탄 연마패드 및 이의 제조방법
KR102206485B1 (ko) * 2020-03-17 2021-01-22 에스케이씨 주식회사 연마패드 및 이를 이용한 반도체 소자의 제조방법

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008087797A1 (ja) 2007-01-15 2008-07-24 Toyo Tire & Rubber Co., Ltd. 研磨パッド及びその製造方法
JP2009214275A (ja) 2008-03-12 2009-09-24 Toyo Tire & Rubber Co Ltd 研磨パッド
JP2009291854A (ja) 2008-06-03 2009-12-17 Nitta Haas Inc 研磨パッド

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6860802B1 (en) 2000-05-27 2005-03-01 Rohm And Haas Electric Materials Cmp Holdings, Inc. Polishing pads for chemical mechanical planarization
US6736709B1 (en) 2000-05-27 2004-05-18 Rodel Holdings, Inc. Grooved polishing pads for chemical mechanical planarization
US6454634B1 (en) 2000-05-27 2002-09-24 Rodel Holdings Inc. Polishing pads for chemical mechanical planarization
JP4615813B2 (ja) 2000-05-27 2011-01-19 ローム アンド ハース エレクトロニック マテリアルズ シーエムピー ホウルディングス インコーポレイテッド 化学機械平坦化用の研磨パッド
US6749485B1 (en) 2000-05-27 2004-06-15 Rodel Holdings, Inc. Hydrolytically stable grooved polishing pads for chemical mechanical planarization
JP3490431B2 (ja) * 2000-06-13 2004-01-26 東洋ゴム工業株式会社 ポリウレタン発泡体の製造方法、ポリウレタン発泡体及び研磨シート
CN100496896C (zh) * 2000-12-01 2009-06-10 东洋橡膠工业株式会社 研磨垫
US7195539B2 (en) * 2003-09-19 2007-03-27 Cabot Microelectronics Coporation Polishing pad with recessed window
DE602005007125D1 (de) 2004-09-17 2008-07-10 Jsr Corp Chemisch-mechanisches Polierkissen und chemisch-mechanisches Polierverfahren
JP2006114885A (ja) 2004-09-17 2006-04-27 Jsr Corp 化学機械研磨パッド及び化学機械研磨方法
US7871309B2 (en) * 2004-12-10 2011-01-18 Toyo Tire & Rubber Co., Ltd. Polishing pad
JP2006334745A (ja) * 2005-06-03 2006-12-14 Inoac Corp 研磨用吸着パッド及びその製造方法
JP4261586B2 (ja) * 2007-01-15 2009-04-30 東洋ゴム工業株式会社 研磨パッドの製造方法
WO2008093850A1 (ja) * 2007-02-01 2008-08-07 Kuraray Co., Ltd. 研磨パッド及び研磨パッドの製造方法
TWI411495B (zh) * 2007-08-16 2013-10-11 Cabot Microelectronics Corp 拋光墊

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008087797A1 (ja) 2007-01-15 2008-07-24 Toyo Tire & Rubber Co., Ltd. 研磨パッド及びその製造方法
JP2009214275A (ja) 2008-03-12 2009-09-24 Toyo Tire & Rubber Co Ltd 研磨パッド
JP2009291854A (ja) 2008-06-03 2009-12-17 Nitta Haas Inc 研磨パッド

Also Published As

Publication number Publication date
CN102883857B (zh) 2015-04-01
US20130078892A1 (en) 2013-03-28
KR20120139798A (ko) 2012-12-27
TW201139060A (en) 2011-11-16
SG185031A1 (en) 2012-11-29
TWI429504B (zh) 2014-03-11
JP5426469B2 (ja) 2014-02-26
CN102883857A (zh) 2013-01-16
WO2011142177A1 (ja) 2011-11-17
JP2011235389A (ja) 2011-11-24
US8979611B2 (en) 2015-03-17

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