CN102782831B - 静电吸盘 - Google Patents

静电吸盘 Download PDF

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Publication number
CN102782831B
CN102782831B CN201180012562.2A CN201180012562A CN102782831B CN 102782831 B CN102782831 B CN 102782831B CN 201180012562 A CN201180012562 A CN 201180012562A CN 102782831 B CN102782831 B CN 102782831B
Authority
CN
China
Prior art keywords
electrode
groove
ceramic
electrostatic chuck
interarea
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201180012562.2A
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English (en)
Chinese (zh)
Other versions
CN102782831A (zh
Inventor
堀裕明
板仓郁夫
穴田和辉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toto Ltd
Original Assignee
Toto Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=44673208&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=CN102782831(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Toto Ltd filed Critical Toto Ltd
Publication of CN102782831A publication Critical patent/CN102782831A/zh
Application granted granted Critical
Publication of CN102782831B publication Critical patent/CN102782831B/zh
Active legal-status Critical Current
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H10P72/722—Details of electrostatic chucks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/15—Devices for holding work using magnetic or electric force acting directly on the work
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T279/00—Chucks or sockets
    • Y10T279/23—Chucks or sockets with magnetic or electrostatic means

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Jigs For Machine Tools (AREA)
CN201180012562.2A 2010-03-26 2011-03-23 静电吸盘 Active CN102782831B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2010073689 2010-03-26
JP2010-073689 2010-03-26
JP2011061737A JP5218865B2 (ja) 2010-03-26 2011-03-18 静電チャック
JP2011-061737 2011-03-18
PCT/JP2011/057040 WO2011118659A1 (ja) 2010-03-26 2011-03-23 静電チャック

Publications (2)

Publication Number Publication Date
CN102782831A CN102782831A (zh) 2012-11-14
CN102782831B true CN102782831B (zh) 2015-02-18

Family

ID=44673208

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201180012562.2A Active CN102782831B (zh) 2010-03-26 2011-03-23 静电吸盘

Country Status (6)

Country Link
US (1) US8848335B2 (https=)
JP (1) JP5218865B2 (https=)
KR (1) KR101429591B1 (https=)
CN (1) CN102782831B (https=)
TW (1) TWI471974B (https=)
WO (1) WO2011118659A1 (https=)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5972630B2 (ja) * 2011-03-30 2016-08-17 日本碍子株式会社 静電チャックの製法
JP5992375B2 (ja) 2013-08-08 2016-09-14 株式会社東芝 静電チャック、載置プレート支持台及び静電チャックの製造方法
DE102014008030A1 (de) * 2014-05-28 2015-12-03 Berliner Glas Kgaa Herbert Kubatz Gmbh & Co Verfahren zur Herstellung einer elektrostatischen Haltevorrichtung
JP6424049B2 (ja) * 2014-09-12 2018-11-14 株式会社日立ハイテクノロジーズ プラズマ処理装置
JP6346855B2 (ja) * 2014-12-25 2018-06-20 東京エレクトロン株式会社 静電吸着方法及び基板処理装置
JP6520160B2 (ja) * 2015-02-02 2019-05-29 住友大阪セメント株式会社 静電チャック装置
JP6124156B2 (ja) * 2015-04-21 2017-05-10 Toto株式会社 静電チャックおよびウェーハ処理装置
US10340171B2 (en) 2016-05-18 2019-07-02 Lam Research Corporation Permanent secondary erosion containment for electrostatic chuck bonds
JP2019523989A (ja) 2016-06-01 2019-08-29 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 静電チャック及び静電チャックのための製造方法
US11069553B2 (en) * 2016-07-07 2021-07-20 Lam Research Corporation Electrostatic chuck with features for preventing electrical arcing and light-up and improving process uniformity
US10910195B2 (en) 2017-01-05 2021-02-02 Lam Research Corporation Substrate support with improved process uniformity
JP6832171B2 (ja) * 2017-01-24 2021-02-24 東京エレクトロン株式会社 プラズマ処理装置のチャンバ本体の内部のクリーニングを含むプラズマ処理方法
US10147610B1 (en) 2017-05-30 2018-12-04 Lam Research Corporation Substrate pedestal module including metallized ceramic tubes for RF and gas delivery
US11289355B2 (en) 2017-06-02 2022-03-29 Lam Research Corporation Electrostatic chuck for use in semiconductor processing
US10190216B1 (en) 2017-07-25 2019-01-29 Lam Research Corporation Showerhead tilt mechanism
US11469084B2 (en) 2017-09-05 2022-10-11 Lam Research Corporation High temperature RF connection with integral thermal choke
JP7308254B2 (ja) * 2018-02-19 2023-07-13 日本特殊陶業株式会社 保持装置
JP6504532B1 (ja) * 2018-03-14 2019-04-24 Toto株式会社 静電チャック
JP6903135B2 (ja) 2018-04-05 2021-07-14 ラム リサーチ コーポレーションＬａｍ Ｒｅｓｅａｒｃｈ Ｃｏｒｐｏｒａｔｉｏｎ 冷却ガス区画および対応する溝ならびに単極静電クランプ電極パターンを備える静電チャック
US11183368B2 (en) 2018-08-02 2021-11-23 Lam Research Corporation RF tuning systems including tuning circuits having impedances for setting and adjusting parameters of electrodes in electrostatic chucks
KR102618849B1 (ko) * 2019-01-24 2023-12-28 교세라 가부시키가이샤 정전 척
JP6729735B1 (ja) * 2019-03-05 2020-07-22 Toto株式会社 静電チャック
US20210159107A1 (en) * 2019-11-21 2021-05-27 Applied Materials, Inc. Edge uniformity tunability on bipolar electrostatic chuck
JP7548664B2 (ja) * 2020-03-02 2024-09-10 東京エレクトロン株式会社 静電チャックの製造方法、静電チャック及び基板処理装置
JP7817996B2 (ja) * 2020-10-01 2026-02-19 ラム リサーチ コーポレーション 延伸静電チャック電極を備える高温台座
US11776794B2 (en) 2021-02-19 2023-10-03 Applied Materials, Inc. Electrostatic chuck assembly for cryogenic applications
TWI785522B (zh) * 2021-03-08 2022-12-01 台灣積體電路製造股份有限公司 靜電夾具的操作方法和靜電夾具
CN115050682B (zh) * 2021-03-08 2026-03-17 台湾积体电路制造股份有限公司 静电夹具的操作方法和静电夹具
CN114899138B (zh) * 2022-05-11 2025-12-23 北京华卓精科科技股份有限公司 一种耐蚀静电卡盘及其制造方法
JP7343069B1 (ja) 2023-03-27 2023-09-12 Toto株式会社 静電チャック
JP7545603B1 (ja) 2024-03-07 2024-09-04 日本特殊陶業株式会社 保持部材
CN118219388B (zh) * 2024-03-26 2025-10-10 君原电子科技(海宁)有限公司 一种静电卡盘陶瓷板干压成型方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6134096A (en) * 1995-09-06 2000-10-17 Ngk Insulators, Ltd. Electrostatic chuck
JP2002231799A (ja) * 2001-02-06 2002-08-16 Toto Ltd 静電チャック、静電チャックの吸着表面に形成された凹部への放電防止方法、およびその静電チャックを用いた基板固定加熱冷却装置
US6992876B1 (en) * 1999-07-08 2006-01-31 Lam Research Corporation Electrostatic chuck and its manufacturing method
CN101010791A (zh) * 2004-06-28 2007-08-01 京瓷株式会社 静电卡盘

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5822171A (en) 1994-02-22 1998-10-13 Applied Materials, Inc. Electrostatic chuck with improved erosion resistance
EP0692156A1 (en) * 1994-01-31 1996-01-17 Applied Materials, Inc. Electrostatic chuck with conformal insulator film
US5810933A (en) 1996-02-16 1998-09-22 Novellus Systems, Inc. Wafer cooling device
KR20040070008A (ko) * 2003-01-29 2004-08-06 쿄세라 코포레이션 정전척
US20090086400A1 (en) 2007-09-28 2009-04-02 Intevac, Inc. Electrostatic chuck apparatus
JP4974873B2 (ja) * 2007-12-26 2012-07-11 新光電気工業株式会社 静電チャック及び基板温調固定装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6134096A (en) * 1995-09-06 2000-10-17 Ngk Insulators, Ltd. Electrostatic chuck
US6992876B1 (en) * 1999-07-08 2006-01-31 Lam Research Corporation Electrostatic chuck and its manufacturing method
JP2002231799A (ja) * 2001-02-06 2002-08-16 Toto Ltd 静電チャック、静電チャックの吸着表面に形成された凹部への放電防止方法、およびその静電チャックを用いた基板固定加熱冷却装置
CN101010791A (zh) * 2004-06-28 2007-08-01 京瓷株式会社 静电卡盘

Also Published As

Publication number Publication date
KR101429591B1 (ko) 2014-08-12
CN102782831A (zh) 2012-11-14
TWI471974B (zh) 2015-02-01
WO2011118659A1 (ja) 2011-09-29
JP5218865B2 (ja) 2013-06-26
US8848335B2 (en) 2014-09-30
KR101429591B9 (ko) 2025-09-25
TW201138020A (en) 2011-11-01
US20130027838A1 (en) 2013-01-31
JP2011222977A (ja) 2011-11-04
KR20120120415A (ko) 2012-11-01

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